Background technology
Along with the extensive use of microelectronic device, for the overvoltage that prevents from introducing from mains side, thunder and lightning for example, various lightning protection devices and obtain application widely.The lightning protection device of final stage seems more important.Wherein with Anti-thunder power socket, using in a large number all over the world.Because lightning protection power source socket is usually placed on the table or on floor, the fire incident causing due to this lightning protection device seems quite serious.
Arrival from Electrification Age; people are in order to switch on power power consumption equipment easily; socket and the plug of fast insert-pull mode have been designed and have used very widely; and by socket be made into wall fixed installation mode, with the movably socket of extending wire; wherein on the socket of various secured fashions; added pcb board, and on pcb board, increased excess flow switch, overvoltage crowbar, remote control switching circuit etc.In order to make socket have lightning protection function, people are in parallel piezo-resistance (hereinafter to be referred as MOV) in circuit, and the Thermal Cutoffs element adopting connects with MOV, and two devices are drawn close, and adopts heat-shrinkable T bush to tighten, to prevent that MOV from catching fire; But true in this mounting means can not effectively prevent catching fire of MOV.
Accompanying drawing explanation
Accompanying drawing 1 is broken section structure chart of the present invention
Accompanying drawing 2 is circuit diagrams of the present invention
Accompanying drawing 3a is cut-away view of the present invention
Accompanying drawing 3b is the built-in parts disassembly diagram of the present invention
Accompanying drawing 4 is composition diagrams of the built-in components A of the present invention
Accompanying drawing 5 is composition diagrams of the built-in part B of the present invention
Embodiment
Below in conjunction with 1 to 5 pair of the specific embodiment of the present invention of accompanying drawing, further narrate, therein, what state is for preferred embodiment object of the present invention is described, rather than in order to limit above-mentioned object.
As shown in the figure 2, the present embodiment be built in the integrated full mould protection module in socket, the MOV of the alloy-type temperature fuse of connecting between L-N, forms the first modular assembly, as the 301A in Fig. 3 a; And between L-G, N-G, respectively having adopted a MOV, the alloy-type temperature fuse of jointly connecting again after these two MOV parallel connections, forms the second modular assembly, as the 301B in Fig. 3 a.
As shown in Figure 3 b, the first modular assembly 301A and the second modular assembly 301B spatially misplace and aggregate into one 301 mutually, reduce to greatest extent whole volume, to meet the demand of volume miniaturization; First, second modular assembly combination rear 301 is built in shell 302, adopts epoxy resin, silicones, inorganic filler etc. to carry out embedding remaining space inside, if required, also available base plate carries out the encapsulation of shell oral area.
Shown in Fig. 4 the first modular assembly 301A part and form structure, on the ceramic nude film 401 of MOV, applied conductive silver layer 402A, the 402B on two sides, and then formed the electrical characteristic of MOV; Adopt tin solder that electrode 403,404 weld respectively and conductive silver layer 402A, 402B on, and on electrode 404, welding lead-in wire 406 and the lead-in wire 405 to extension of Thermal Cutoffs, two surfaces of MOV crossed over bending afterwards by the lead-in wire 406 of Thermal Cutoffs, and at the outside of electrode 403 of MOV and the heat-sensitive alloy of Thermal Cutoffs 408, another is assembled into complete Thermal Cutoffs to the lead-in wire 407 of extension, the disconnected agent 409 of fluxing, shell 410, joint filling material 411; The shell of this Thermal Cutoffs is by the electrode near on MOV 403.
As shown in Figure 5, the part of the second modular assembly 301B and composition structure, on ceramic nude film 501A, the 501B of two MOV, applied respectively conductive silver layer 502A, 502B and 502C, the 502D on two sides, and then formed the electrical characteristic of MOV; Adopt tin solder that electrode 503,504A, 504B, 505 welds respectively and conductive silver layer 502A, 502B, 502C, 502D upper, make MOV501A, electrode 504A, electrode 504B, MOV501B, electrode 505 form stepped construction; Wherein electrode 504A and 504B are the structures of the doubling of a disjunctor, and in doubling, welding in the heart lead-in wire 506 and the lead-in wire 512 to extension of Thermal Cutoffs, two surfaces of MOV501A crossed over bending afterwards by the lead-in wire 506 of Thermal Cutoffs, and the outside of the electrode on MOV501A 503 and the heat-sensitive alloy of Thermal Cutoffs 508, another is assembled into complete Temperature protection to the lead-in wire 507 of extension, the disconnected agent 509 of fluxing, shell 510, joint filling material 511, the shell of this Thermal Cutoffs is by the electrode near welding on MOV501A 503; On electrode 503,505, welding respectively the lead-in wire 513,514 to extension.