Background technology
Along with the extensive use of microelectronic device, for the overvoltage that prevents to introduce from mains side, thunder and lightning for example, various lightning protection devices and obtain to use widely.The lightning protection device of final stage seems more important.Wherein using in a large number all over the world with Anti-thunder power socket.Because the lightning protection power distributor is usually placed on the table or on the floor, the fire incident that causes owing to this lightning protection device seems quite serious.
Arrival from Electrification Age; People are for ease with the power consumption equipment energized; Designed and very used widely the socket and the plug of fast insert-pull mode, and socket has been made into the movably socket of wall mounted mounting means, band extending wire, wherein on the socket of various secured fashions; Add pcb board, and on pcb board, increased overcurrent switch, overvoltage crowbar, remote control switching circuit etc.In order to make socket have lightning protection function, people in circuit parallel connection piezo-resistance (hereinafter to be referred as MOV), and the Thermal Cutoffs element that adopts connects with MOV, and two devices are drawn close, and the employing heat-shrinkable T bush tightens, and catches fire to prevent MOV; But true in this mounting means can not effectively prevent catching fire of MOV.
Description of drawings
Accompanying drawing 1 is a broken section structure chart of the present invention
Accompanying drawing 2 is circuit diagrams of the present invention
Accompanying drawing 3a is a cut-away view of the present invention
Accompanying drawing 3b is the built-in parts disassembly diagram of the present invention
Accompanying drawing 4 is composition diagrams of the built-in components A of the present invention
Accompanying drawing 5 is composition diagrams of the built-in part B of the present invention
Embodiment
Further narrate below in conjunction with accompanying drawing 1 to 5 specific embodiments of the invention, therein, what stated is for preferred embodiment purpose of the present invention is described, rather than in order to limit above-mentioned purpose.
As shown in the figure 2, present embodiment be built in the integrated full mould protection module in the socket, the MOV of an alloy-type temperature fuse of series connection constitutes first modular assembly, like the 301A among Fig. 3 a between L-N; And respectively having adopted a MOV between the L-G, N-G, the alloy-type temperature fuse of connecting jointly again after these two MOV parallel connections constitutes second modular assembly, like the 301B among Fig. 3 a.
Shown in Fig. 3 b, the first modular assembly 301A and the second modular assembly 301B spatially misplace mutually and aggregate into one 301, reduce whole volume to greatest extent, to satisfy the demand of volume miniaturization; First, second modular assembly combination back 301 is built in the shell 302, adopts epoxy resin, silicones, inorganic filler to wait the embedding remaining space inside, like needs, also available base plate carries out the encapsulation of shell oral area.
The part of the first modular assembly 301A shown in Figure 4 with form structure, on the ceramic nude film 401 of MOV, applied conductive silver layer 402A, the 402B on two sides, and then formed the electrical characteristic of MOV; Adopt tin solder that electrode 403,404 weld respectively and conductive silver layer 402A, 402B last; And the lead-in wire 405 that is welding the lead-in wire 406 of Thermal Cutoffs on the electrode 404 and externally extending; The lead-in wire 406 of Thermal Cutoffs is two surfaces having crossed over MOV after the bending, and is assembled into complete Thermal Cutoffs at the outside and heat-sensitive alloy 408, another lead-in wire 407 that externally extends of Thermal Cutoffs, the disconnected agent 409 of fluxing, shell 410, the joint filling material 411 of the electrode 403 of MOV; The shell of this Thermal Cutoffs will be near the electrode on the MOV 403.
As shown in Figure 5, the part of the second modular assembly 301B and composition structure, last at ceramic nude film 501A, the 501B of two MOV, apply conductive silver layer 502A, 502B and 502C, the 502D on two sides respectively, and then formed the electrical characteristic of MOV; Adopt tin solder that electrode 503,504A, 504B, 505 welds respectively and conductive silver layer 502A, 502B, 502C, 502D last, make MOV501A, electrode 504A, electrode 504B, MOV501B, electrode 505 form stepped construction; Wherein electrode 504A and 504B are the structures of the doubling of a disjunctor; And the lead-in wire 512 that in doubling, is welding the lead-in wire 506 of Thermal Cutoffs in the heart and externally extending; The lead-in wire 506 of Thermal Cutoffs is with two surfaces having crossed over MOV501A after the bending; And the heat-sensitive alloy 508 of the outside of the electrode on MOV501A 503 and Thermal Cutoffs, another lead-in wire 507 that externally extends, the disconnected agent 509 of fluxing, shell 510, joint filling material 511 be assembled into complete Temperature protection, and the shell of this Thermal Cutoffs will be near the electrode that is welding on the MOV501A 503; Then welding the lead-in wire 513,514 that externally extends on the electrode 503,505 respectively.