CN102448256A - Circuit forming process - Google Patents
Circuit forming process Download PDFInfo
- Publication number
- CN102448256A CN102448256A CN2010105055040A CN201010505504A CN102448256A CN 102448256 A CN102448256 A CN 102448256A CN 2010105055040 A CN2010105055040 A CN 2010105055040A CN 201010505504 A CN201010505504 A CN 201010505504A CN 102448256 A CN102448256 A CN 102448256A
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- CN
- China
- Prior art keywords
- carrier
- circuit
- line layer
- processing procedure
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a circuit forming process, which comprises the following steps of: arranging a plurality of glue dots on one surface of a carrier; adhering an electronic element onto each glue dot; forming protective layers on the surface on which the glue dots are arranged; forming a circuit path between the protective layers; forming a circuit layer in the circuit path; and removing the protective layers. By the process, the circuit layer is uniform or complete, and the electronic elements and the carrier which are combined can have low impedance so as to avoid power waste.
Description
Technical field
The present invention relates to a kind of circuit and form processing procedure, it provides a kind of electronic component and carrier is mutually combined, the impedance after combining with reduction, and the method that can save power.
Background technology
Existing soldered mode, it is coated with an insulating barrier on an aluminium sheet, and printed circuit on insulating barrier is coated with scolding tin again on circuit, again with electronic parts holder circuit place, then this aluminium sheet is sent in the reflow stove, to accomplish the program of welding.
But existing soldered mode has disadvantage:
1, the combination of aluminium sheet, insulating barrier, circuit and scolding tin, the impedance of the electronic product that it can cause accomplishing is big, and waste power.
2, when tin cream got in the reflow stove, the scaling powder in the tin cream received under the influence of factors such as hot melt, surface tension and temperature rising, and scaling powder is evaporation therefore, and caused the even or incomplete situation of scolding tin crawling on circuit to produce.
3, when scolding tin when inhomogeneous or incomplete situation produces on circuit, and then it is relatively poor to cause selling picture, thus need the labor manual work carry out the program of circuit arrangement, and its production cost and selling charges are remained high.
Summary of the invention
Because above-mentioned shortcoming, the present invention provides a kind of circuit in the welding manner innovation to form processing procedure, in the hope of overcoming the difficult point of prior art.
For reaching above-mentioned purpose, the technological means that the present invention adopted forms processing procedure for a kind of circuit is provided, and its step includes:
Fixed electronic element: the one side at a carrier is provided with a plurality of glue points, the sticking electronic component that is provided with in each glue point place;
Protective layer is set: the one side that is provided with this electronic component at carrier is formed with a protective layer, and in protective layer, is formed with a plurality of circuit paths;
Line layer is set: carrier is sprayed scaling powder, and carrier is handled with wicking, so that be formed with line layer in the circuit path, the circuit series of strata are electrically connected electronic component; And
Remove protective layer: remove protective layer, with surface, line layer and the electronic component that exposes carrier.
The present invention can further include: this leveling line layer of step that between the step that line layer and removal protective layer are set, further has the leveling line layer: will accomplish the carrier that wicking is handled; With the unnecessary tin material of hot air leveling carrier, and make the surfacing of line layer.
During enforcement, glue point is with the one side of screen painting at carrier, and glue point is formed by high temperature resistant viscose glue.
During enforcement, electronic component is LED.
During enforcement, carrier is the ceramic heat-dissipating body, and carrier is one of column, solid or irregularly shaped body.
Hold the above, circuit of the present invention forms processing procedure, and it has following advantage:
1, the electronic product of accomplishing through processing procedure of the present invention, its impedance is less, so can avoid power dissipation.
2, can make and be able to evenly or complete through the formed line layer of tin material,, and reduce the program of manual sorting circuit, can save production cost, and reduce selling charges so that it sells picture is preferable.
3, the present invention can use the carrier of multiple unlike material, shape and specification, through the present invention multiple electronic component and variety carrier is mutually combined.
Description of drawings
Fig. 1 is the flow chart that circuit of the present invention forms processing procedure.
Fig. 2 is the carrier of fixed electronic element of the present invention and the stereo appearance figure of half tone.
Fig. 3 is the electronic component and the carrier-bound partial schematic diagram of fixed electronic element of the present invention.
Fig. 4 is the partial sectional view that protective layer is set of the present invention.
Fig. 5 is the sketch map that line layer is set of the present invention.
Fig. 6 is the partial sectional view that line layer is set of the present invention.
Fig. 7 is the stereo appearance figure behind the removal protective layer of the present invention.
Description of reference numerals: A-fixed electronic element; B-is provided with protective layer; C-is provided with line layer; D-flattens line layer; E-removes protective layer; The 1-carrier; 10-glue point; The 11-electronic component; The 2-half tone; The 3-protective layer; The 30-circuit path; The 4-line layer.
Embodiment
Below through particular specific embodiment execution mode of the present invention is described, having common knowledge in the affiliated technical field can understand other advantages of the present invention and effect easily by the content that this specification disclosed.
Please cooperate with reference to shown in Figure 1, the present invention relates to a kind of circuit and form processing procedure, its step includes:
Fixed electronic element A: please cooperate with reference to shown in Figure 2,, be printed with a plurality of glue points 10 with half tone 12 in the one side of a carrier 1; Glue point 10 is formed by high temperature resistant viscose glue; Please cooperate with reference to shown in Figure 3, put at each glue that 10 places are sticking to be provided with an electronic component 11, electronic component 11 can be LED.Carrier 1 can be one of column, solid or irregularly shaped body, and carrier 1 can be the ceramic heat-dissipating body.
Protective layer B is set: please cooperate with reference to shown in Figure 4, the one side that is provided with electronic component 11 at carrier 1 is formed with a protective layer 3, in protective layer 3, is formed with a plurality of circuit paths 30.
Line layer C is set: please cooperate with reference to figure 5 and shown in Figure 6, carrier 1 sprayed scaling powder, and this carrier 1 is handled with wicking, make to be formed with line layer 4 in the circuit path, line layer 4 is electrically connected electronic components 11.
Leveling line layer D: will accomplish the carrier 1 of wicking processing, and, and make the surfacing of line layer 4 with the unnecessary tin material of hot air leveling carrier 1.
Remove protective layer E: please cooperate with reference to shown in Figure 7, remove protective layer 3, with surface, the line layer 4 and electronic component 11 that exposes carrier 1.
More than shown in be merely the preferred embodiments of the present invention, only be illustrative for the purpose of the present invention, and nonrestrictive.Understand the common knowledge personnel of this professional skill field tool, in spirit that claim of the present invention limited and scope, can carry out many changes, revise it, even equivalent change, but all will fall in protection scope of the present invention.
Claims (7)
1. a circuit forms processing procedure, it is characterized in that its step includes:
Fixed electronic element: the one side at a carrier is provided with a plurality of glue points, the sticking electronic component that is provided with in each glue point place;
Protective layer is set: the one side that is provided with this electronic component at this carrier is formed with a protective layer, and in this protective layer, is formed with a plurality of circuit paths;
Line layer is set: this carrier is sprayed scaling powder, and this carrier is handled with wicking, so that be formed with line layer in this circuit path, this line layer is electrically connected this electronic component; And
Remove protective layer: remove this protective layer, with surface, this line layer and this electronic component that exposes this carrier.
2. circuit as claimed in claim 1 forms processing procedure; It is characterized in that; The step that between this is provided with the step of line layer and this removal protective layer, further has the leveling line layer; This flattens line layer: will accomplish this carrier that wicking is handled, and with the unnecessary tin material of this carrier of hot air leveling, and make the surfacing of this line layer.
3. circuit as claimed in claim 1 forms processing procedure, it is characterized in that this glue point is with the one side of screen painting in this carrier.
4. circuit as claimed in claim 3 forms processing procedure, it is characterized in that this glue point is formed by high temperature resistant viscose glue.
5. circuit as claimed in claim 1 forms processing procedure, it is characterized in that this electronic component is LED.
6. circuit as claimed in claim 1 forms processing procedure, it is characterized in that this carrier is the ceramic heat-dissipating body.
7. circuit as claimed in claim 6 forms processing procedure, it is characterized in that this carrier is one of column, solid or irregularly shaped body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105055040A CN102448256A (en) | 2010-10-11 | 2010-10-11 | Circuit forming process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105055040A CN102448256A (en) | 2010-10-11 | 2010-10-11 | Circuit forming process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102448256A true CN102448256A (en) | 2012-05-09 |
Family
ID=46010174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105055040A Pending CN102448256A (en) | 2010-10-11 | 2010-10-11 | Circuit forming process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102448256A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201351834Y (en) * | 2008-12-31 | 2009-11-25 | 深圳高力特通用电气有限公司 | LED down lamp |
| TWM381175U (en) * | 2009-12-22 | 2010-05-21 | Li-Yu Lin | Improved ceramic radiator structure |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
-
2010
- 2010-10-11 CN CN2010105055040A patent/CN102448256A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201351834Y (en) * | 2008-12-31 | 2009-11-25 | 深圳高力特通用电气有限公司 | LED down lamp |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| TWM381175U (en) * | 2009-12-22 | 2010-05-21 | Li-Yu Lin | Improved ceramic radiator structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120509 |