CN102446894A - High-performance metal-oxide-metal capacitor and manufacturing method thereof - Google Patents
High-performance metal-oxide-metal capacitor and manufacturing method thereof Download PDFInfo
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Abstract
The invention relates to a high-performance metal-oxide-metal capacitor and a manufacturing method thereof. The purpose that a film with two kinds of k values exists in the same metal dielectric layer is realized by selectively photoetching the metal dielectric layer, a non-MOM (Metal-Oxide-Metal) region is filled with a low-k medium, and an MOM region is filled with a high-k medium, therefore the high-performance metal-oxide-metal capacitor is realized, the chip area is saved, and the cost is reduced; meanwhile, the high-performance metal-oxide-metal capacitor and the manufacturing method thereof are adaptive to the traditional process.
Description
Technical field
The present invention relates to a kind of MOM (metal-oxide-metal) electric capacity and preparation method thereof, belong to the integrated circuit manufacturing, relate in particular to a kind of high-performance metal-oxide-metal capacitance and preparation method thereof.
Background technology
Along with constantly dwindling of cmos device size; The dielectric constant k of the interconnected used dielectric medium of its back segment also constantly reduces; People also constantly seeking new dielectric material, have developed into FSG, SiOC from initial simple silicon dioxide, up to the ultralow k film of 45nm node porous once.
Structural representation with reference to the genus-oxide-metal capacitance of figure 1 and prior art illustrated in fig. 2; Wherein, in order better to describe, Fig. 1 has divided copper-connection zone 1 and metal-oxide-metal capacitor regions 1; Fig. 2 is the sectional view at A-A ' line place among Fig. 1; Can find that in copper-connection zone 1 and the metal-oxide-metal capacitor regions 2, what all adopt is low K value film 3.
Present technical development is, along with the reduction of film k value, the capacitor C of integrated identical size just needs bigger area (C ∝ K) in interconnection, and the waste of area has just increased the cost of manufacture of chip.
Therefore, provide a kind of and can effectively improve the metal-oxide-metal capacitive property, interconnection structure adopts the structure of low K film just to seem particularly important simultaneously.
Summary of the invention
The objective of the invention is is to realize high k and low k film with photoetching optionally, thereby on high k film, realizes high-performance MOM, and can keep the superiority of the low k of conventional interconnect.
The present invention discloses a kind of high-performance metal-oxide-metal capacitance, wherein, comprising:
Be formed on the first low-K dielectric layer film on first etching barrier layer, be coated with the first dielectric layer film on the said first low-K dielectric layer film, the said first dielectric layer film comprises the first high K value zone and the first low K value zone;
Be formed on the second low-K dielectric layer film on second etching barrier layer, be coated with the second dielectric layer film on the said second low-K dielectric layer film, the said second dielectric layer film comprises the second high K value zone and the second low K value zone;
Said second etching barrier layer covers the said first dielectric layer film, and the said second high K value zone is positioned at the vertical top in the said first high K value zone, and the said second low K value zone is positioned at the vertical top in the said first low K value zone;
The said first high K value zone in the said first dielectric layer film and the first low K value zone are respectively arranged with metal filled some lower groove; The second high K value zone in the said second dielectric layer film and the second low K value zone are respectively arranged with metal filled some grooves of going up, corresponding at least lower groove of groove in the vertical direction on each;
The contact hole that vertically runs through the second low-K dielectric layer film and second etching barrier layer, each contact hole overlap with one second last groove in the vertical direction that hangs down in the K value zone respectively, and contact is positioned at the vertically lower groove of below of said contact hole.
Above-mentioned high-performance metal-oxide-metal capacitance, wherein, the material in the said first high K value zone is USG; FSG, BD, a kind of among BD1 or the BDII; The material in the said first low-K dielectric layer film and the said first low K value zone is USG; FSG, BD, among BD1 or the BDII than low a kind of of the regional K value of the said first high K value.
Above-mentioned high-performance metal-oxide-metal capacitance; Wherein, The said first high K value zone is identical with the material in the second high K value zone; The said first low K value zone is identical with the material in the second low K value zone, and the said first low-K dielectric layer film is identical with the material of the second low-K dielectric layer film.
Above-mentioned high-performance metal-oxide-metal capacitance, wherein, the said first low-K dielectric layer film is identical with the said second low-K dielectric layer film thickness, and the said first dielectric layer film is identical with the thickness of the second dielectric layer film.
Above-mentioned high-performance metal-oxide-metal capacitance; Wherein, Said first low-K dielectric layer film and the said second low-K dielectric layer film thickness span are 1000 ~ 10000A, and the said first dielectric layer film and the second dielectric layer film thickness span are 1000 ~ 10000A.
According to another aspect of the present invention, also disclose the manufacture method of a kind of high-performance metal-oxide-metal capacitance, wherein, comprise the steps:
Provide one be deposited with first etching barrier layer wafer;
The deposit first low-K dielectric layer film on said first etching barrier layer;
The deposit first dielectric layer film covers the said first low-K dielectric layer film, and the said first dielectric layer film comprises the first high K value zone and the first low K value zone;
Hang down in the K value zone respectively the some lower groove of etching in the first high K value zone and first of the said first dielectric layer film and fill metal;
The said first dielectric layer film of chemical-mechanical planarization;
Deposit second etching barrier layer covers the said first dielectric layer film;
The deposit second low-K dielectric layer film on said second etching barrier layer;
The deposit second dielectric layer film covers the said second low-K dielectric layer film; The said second dielectric layer film comprises the second high K value zone and the second low K value zone; The said second high K value zone is positioned at the vertical top in the said first high K value zone, and the said second low K value zone is positioned at the vertical top in the said first low K value zone;
In the second high K value zone of the said second dielectric layer film and the second low K value zone, distinguish etching some on groove, groove in the vertical direction lower groove of correspondence at least on each;
Etching contact hole in the second low-K dielectric layer film below the second low K value zone, said contact hole overlaps with one second last groove in the vertical direction that hangs down in the K value zone, and contact is positioned at its vertically lower groove of below;
On said, fill metal in groove and the said contact hole;
The said second dielectric layer film of chemical-mechanical planarization.
Above-mentioned manufacture method, wherein, the process of the making of the said first dielectric layer film comprises the steps:
Deposit the one K value dielectric material covers the said first low-K dielectric layer film;
Etching is removed the said K value dielectric material of part, and etching terminates in the said first low-K dielectric layer film, is positioned at the first low-K dielectric layer film exposure that a K value dielectric material is removed the part below;
Deposit the 2nd K value dielectric material covers a said K value dielectric material and the said first low-K dielectric layer film exposed portions;
Said the 2nd a K value dielectric material of chemical-mechanical planarization and a said K value dielectric material expose a said K value dielectric material.
Above-mentioned manufacture method, wherein, the process of the making of the said second dielectric layer film comprises the steps:
Deposit the one K value dielectric material covers the said second low-K dielectric layer film;
Etching is removed the said K value dielectric material of part, and etching terminates in the said second low-K dielectric layer film, is positioned at the second low-K dielectric layer film exposure that a K value dielectric material is removed the part below;
Deposit the 2nd K value dielectric material covers a said K value dielectric material and the said second low-K dielectric layer film exposed portions;
Said the 2nd a K value dielectric material of chemical-mechanical planarization and a said K value dielectric material expose a said K value dielectric material.
Above-mentioned manufacture method, wherein, a said K value dielectric material is USG, FSG, BD, a kind of among BD1 or the BDII, said the 2nd K value dielectric material is USG, FSG, BD, among BD1 or the BDII than low a kind of of a said K value dielectric material K value.
Above-mentioned manufacture method, wherein, the said first low-K dielectric layer film is identical with the said second low-K dielectric layer film thickness, and the said first dielectric layer film is identical with the thickness of the second dielectric layer film.
Above-mentioned manufacture method, wherein, said first low-K dielectric layer film and the said second low-K dielectric layer film thickness span are 1000 ~ 10000A, and the said first dielectric layer film and the second dielectric layer film thickness span are 1000 ~ 10000A.
The present invention carries out the photoetching etching to metal dielectric layer and is implemented in there being two kinds of k value films in one deck metal dielectric layer through selective; Non-MOM zone is filled with low k dielectric; Make the MOM zone adopt high K medium; Realize high performance metal-oxide-metal electric capacity, saved chip area, reduced cost.
Description of drawings
Through reading the detailed description of non-limiting example being done with reference to following accompanying drawing, it is more obvious that the present invention and characteristic thereof, profile and advantage will become.Mark identical in whole accompanying drawings is indicated identical part.Painstakingly proportionally do not draw accompanying drawing, focus on illustrating purport of the present invention.In the accompanying drawings, for cheer and bright, the part parts have been amplified.
Fig. 1 is the vertical view of the metal-oxide-metal electric capacity of prior art;
Fig. 2 is the sectional view at A-A ' line place among Fig. 1;
Fig. 3 shows according to of the present invention, the structural representation of a kind of high-performance metal-oxide-metal capacitance;
Fig. 4 a to Fig. 4 e shows according to of the present invention, each step of the manufacture method of the first dielectric layer film in a kind of high-performance metal-oxide-metal capacitance; And
Fig. 5 a and Fig. 5 b show and on the first dielectric layer film, make each step of groove.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further elaborated.Embodiment described herein only is used to explain the present invention, and is not used in qualification protection scope of the present invention.
According to of the present invention, the structural representation of a kind of high-performance metal-oxide-metal capacitance is in order to improve the performance of electric capacity, at copper-connection zone 1 and the different dielectric material of MOM (metal-oxide-metal) zone 2 employings with reference to shown in Figure 3.Particularly, electric capacity of the present invention comprises:
Be formed on the first low-K dielectric layer film 203 on first etching barrier layer 101; Be coated with the first dielectric layer film 201 on the said first low-K dielectric layer film 203, the said first dielectric layer film 201 comprises the 211 and first low K value zone 221, the first high K value zone;
Be formed on the second low-K dielectric layer film 204 on second etching barrier layer 102; Be coated with the second dielectric layer film 202 on the said second low-K dielectric layer film 204, the said second dielectric layer film 202 comprises the 212 and second low K value zone 222, the second high K value zone;
Said second etching barrier layer 102 covers the said first dielectric layer film 201, and the said second high K value zone 212 is positioned at the vertical top in the said first high K value zone 211, and the said second low K value zone 222 is positioned at the vertical top in the said first low K value zone 221;
The 211 and first low K value zone 221, the said first high K value zone in the said first dielectric layer film 201 is respectively arranged with metal filled some lower groove 301; The 212 and second low K value zone 222, the second high K value zone in the said second dielectric layer film 202 is respectively arranged with metal filled some grooves 302 of going up, corresponding at least lower groove 301 of groove 302 in the vertical directions on each;
The contact hole 303 that vertically runs through the second low-K dielectric layer film 204 and second etching barrier layer 102; Each contact hole 303 overlaps with one second last groove 302 in the vertical directions that hang down in the K value zone 222 respectively, and contact is positioned at the vertically lower groove 301 of below of said contact hole 303.
Particularly, in high-performance metal-oxide of the present invention-metal capacitance, the material in the said first high K value zone 211 is USG; FSG, BD, a kind of among BD1 or the BDII; The material in the said first low-K dielectric layer film 203 and the said first low K value zone 221 is USG; FSG, BD, among BD1 or the BDII than low a kind of of the regional 211K value of the said first high K value.
More particularly; The said first high K value zone 211 is identical with the material in the second high K value zone 212; The said first low K value zone 221 is identical with the material in the second low K value zone 222; The said first low-K dielectric layer film 203 is identical with the material of the second low-K dielectric layer film 204, and preferably, the material of the said first low-K dielectric layer film 203, the second low-K dielectric layer film, 204, the first low K value zone, the 221 and second low K value regional 222 all adopts with a kind of.
In a specific embodiment, the said first dielectric layer film 201 is identical with the said second dielectric layer film, 202 thickness, the said first low-K dielectric layer film 203 identical with the thickness of the second low-K dielectric layer film 204.
Preferably, the said first dielectric layer film 201 is 1000 ~ 10000A with the said second dielectric layer film, 202 thickness spans, and said first low-K dielectric layer film 203 and the second low-K dielectric layer film, 204 thickness spans are 1000 ~ 10000A.
The present invention is selective to be carried out the photoetching etching to metal dielectric layer and is implemented in there being two kinds of k value films in one deck metal dielectric layer, and non-MOM zone is filled with low k dielectric.Below realization of the present invention is elaborated; Wherein, Do not do for prior art processes such as etching, chemical-mechanical planarizations and to be described in detail; The technology that how to adopt photoresist to carry out etching is not emphasis of the present invention, and those skilled in the art can combine the said processing step of existing techniques in realizing.With reference to figure 3, and combine Fig. 4 a to Fig. 4 e and Fig. 5 a, Fig. 5 b, the performing step of the inventive method is:
Provide one be deposited with first etching barrier layer 101 wafer;
The deposit first low-K dielectric layer film 203 on said first etching barrier layer 101;
The deposit first dielectric layer film 201 covers the said first low-K dielectric layer film 203, and the said first dielectric layer film 201 comprises the 211 and first low K value zone 221, the first high K value zone;
Some lower groove 301 of etching and fill metal respectively in 211 and the first low K value regional 221 of the first high K value zone of the said first dielectric layer film 201;
The said first dielectric layer film 201 of chemical-mechanical planarization;
Deposit second etching barrier layer 102 covers the said first dielectric layer film 201;
The deposit second low-K dielectric layer film 204 on said second etching barrier layer 102;
The deposit second dielectric layer film 202 covers the said second low-K dielectric layer film 204; The said second dielectric layer film 202 comprises the 212 and second low K value zone 222, the second high K value zone; The said second high K value zone 212 is positioned at the vertical top in the said first high K value zone 211, and the said second low K value zone 222 is positioned at the vertical top in the said first low K value zone 221;
In 212 and the second low K value zone 222, second high K value zone of the said second dielectric layer film 202 the difference etching some on groove 302, groove 302 in the vertical directions lower groove 301 of correspondence at least on each;
On said, fill metal in groove 302 and the said contact hole 303;
The said second dielectric layer film 202 of chemical-mechanical planarization.
Combine again to show according to of the present invention with reference to figure 4a to Fig. 4 e; Each step of a kind of high-performance metal-oxide-metal capacitance manufacture method; Fig. 4 a to Fig. 4 e shows the manufacture method of the individual layer dielectric layer film in high-performance metal-oxide of the present invention-metal capacitance, and the making that another layer dielectric layer is thin can realize with reference to figure 4a to Fig. 4 e.
The process of the making of the said first dielectric layer film 201 comprises the steps:
Deposit the one K value dielectric material 401 covers the said first low-K dielectric layer film 203;
Etching is removed the said K value dielectric material 401 of part, and etching terminates in the said first low-K dielectric layer film 203, is positioned at the first low-K dielectric layer film, 203 exposures that a K value dielectric material 401 is removed the part below;
Deposit the 2nd K value dielectric material 402 covers a said K value dielectric material 401 and the said first low-K dielectric layer film, 203 exposed portions;
Said the 2nd K value dielectric material 402 and a said K value dielectric material 401 of chemical-mechanical planarization exposes a said K value dielectric material 401.
Like this; Just obtained having the first dielectric layer film 201 of different K values areas of dielectric; In a preference, a K value dielectric material 401 adopts the K value little material of K value than the 2nd K value dielectric material 402, like this; Copper-connection zone 1 usefulness a K value dielectric material 401 is as dielectric medium, again at regional 2 usefulness the 2nd K value dielectric material 402 of MOM as dielectric medium.
In a variant; The one K value dielectric material 401 adopts the K value big material of K value than the 2nd K value dielectric material 402; Just form the first high K value zone, 211, the two K value dielectric materials 402 with reference to figure 3, the one K value dielectric materials 401 and just formed the first low K value zone 221.
Further, the process of the making of the said second dielectric layer film 202 comprises the steps:
Deposit the one K value dielectric material 401 covers the said second low-K dielectric layer film 204;
Etching is removed the said K value dielectric material 401 of part, and etching terminates in the said second low-K dielectric layer film 204, is positioned at the second low-K dielectric layer film, 204 exposures that a K value dielectric material 401 is removed the part below;
Deposit the 2nd K value dielectric material 402 covers a said K value dielectric material 401 and the said second low-K dielectric layer film, 204 exposed portions;
Said the 2nd K value dielectric material 402 and a said K value dielectric material 401 of chemical-mechanical planarization exposes a said K value dielectric material 401.
With reference to figure 5a and Fig. 5 b; Below specify the groove processing process in the first dielectric layer film 201, like Fig. 5 a, elder generation's some lower groove 301 of etching on the first dielectric layer film of forming by the 2nd a K value dielectric material 402 and a K value dielectric material 401 201; Etching terminates on the first low-K dielectric layer film 203; Wherein, part lower groove 301 is arranged in the 2nd K value dielectric material 402, and part lower groove 301 is arranged in a K value dielectric material 401.Carry out metal filled processing step then, generally fill copper to accomplish copper interconnection structure.Similarly, those skilled in the art combine prior art can realize the course of processing of groove in the second dielectric layer film 202, do not repeat them here.
Preferably, a said K value dielectric material 401 is USG, FSG, BD, a kind of among BD1 or the BDII, said the 2nd K value dielectric material 402 is USG, FSG, BD, among BD1 or the BDII than low a kind of of a said K value dielectric material 401K value.
In a specific embodiment, the said first dielectric layer film 201 is identical with the said second dielectric layer film, 202 thickness, and the said first low-K dielectric layer film 203 is identical with the thickness of the second low-K dielectric layer film 204.
Further; The said first dielectric layer film 201 is 1000 ~ 10000A with the said second dielectric layer film thickness, 202 spans, and said first low-K dielectric layer film 203 and the second low-K dielectric layer film, 204 thickness spans are 1000 ~ 10000A.
Those skilled in the art combine prior art and the foregoing description can realize said variant, and such variant does not influence flesh and blood of the present invention, does not repeat them here.
More than preferred embodiment of the present invention is described.It will be appreciated that the present invention is not limited to above-mentioned specific implementations, equipment of wherein not describing in detail to the greatest extent and structure are construed as with the common mode in this area to be implemented; Any those of ordinary skill in the art; Do not breaking away under the technical scheme scope situation of the present invention; All the method for above-mentioned announcement capable of using and technology contents are made many possible changes and modification to technical scheme of the present invention; Or being revised as the equivalent embodiment of equivalent variations, this does not influence flesh and blood of the present invention.Therefore, every content that does not break away from technical scheme of the present invention, all still belongs in the scope of technical scheme protection of the present invention any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (11)
1. high-performance metal-oxide-metal capacitance is characterized in that, comprising:
Be formed on the first low-K dielectric layer film on first etching barrier layer, be coated with the first dielectric layer film on the said first low-K dielectric layer film, the said first dielectric layer film comprises the first high K value zone and the first low K value zone;
Be formed on the second low-K dielectric layer film on second etching barrier layer, be coated with the second dielectric layer film on the said second low-K dielectric layer film, the said second dielectric layer film comprises the second high K value zone and the second low K value zone;
Said second etching barrier layer covers the said first dielectric layer film, and the said second high K value zone is positioned at the vertical top in the said first high K value zone, and the said second low K value zone is positioned at the vertical top in the said first low K value zone;
The said first high K value zone in the said first dielectric layer film and the first low K value zone are respectively arranged with metal filled some lower groove; The second high K value zone in the said second dielectric layer film and the second low K value zone are respectively arranged with metal filled some grooves of going up, corresponding at least lower groove of groove in the vertical direction on each;
The contact hole that vertically runs through the second low-K dielectric layer film and second etching barrier layer, each contact hole overlap with one second last groove in the vertical direction that hangs down in the K value zone respectively, and contact is positioned at the vertically lower groove of below of said contact hole.
2. high-performance metal-oxide according to claim 1-metal capacitance is characterized in that, the material in the said first high K value zone is USG; FSG, BD, a kind of among BD1 or the BDII; The material in the said first low-K dielectric layer film and the said first low K value zone is USG; FSG, BD, among BD1 or the BDII than low a kind of of the regional K value of the said first high K value.
3. high-performance metal-oxide according to claim 2-metal capacitance; It is characterized in that; The said first high K value zone is identical with the material in the second high K value zone; The said first low K value zone is identical with the material in the second low K value zone, and the said first low-K dielectric layer film is identical with the material of the second low-K dielectric layer film.
4. high-performance metal-oxide according to claim 1 and 2-metal capacitance; It is characterized in that; The said first low-K dielectric layer film is identical with the said second low-K dielectric layer film thickness, and the said first dielectric layer film is identical with the thickness of the second dielectric layer film.
5. high-performance metal-oxide according to claim 4-metal capacitance; It is characterized in that; Said first low-K dielectric layer film and the said second low-K dielectric layer film thickness span are 1000 ~ 10000A, and the said first dielectric layer film and the second dielectric layer film thickness span are 1000 ~ 10000A.
6. the manufacture method of high-performance metal-oxide-metal capacitance is characterized in that, comprises the steps:
Provide one be deposited with first etching barrier layer wafer;
The deposit first low-K dielectric layer film on said first etching barrier layer;
The deposit first dielectric layer film covers the said first low-K dielectric layer film, and the said first dielectric layer film comprises the first high K value zone and the first low K value zone;
Hang down in the K value zone respectively the some lower groove of etching in the first high K value zone and first of the said first dielectric layer film and fill metal;
The said first dielectric layer film of chemical-mechanical planarization;
Deposit second etching barrier layer covers the said first dielectric layer film;
The deposit second low-K dielectric layer film on said second etching barrier layer;
The deposit second dielectric layer film covers the said second low-K dielectric layer film; The said second dielectric layer film comprises the second high K value zone and the second low K value zone; The said second high K value zone is positioned at the vertical top in the said first high K value zone, and the said second low K value zone is positioned at the vertical top in the said first low K value zone;
In the second high K value zone of the said second dielectric layer film and the second low K value zone, distinguish etching some on groove, groove in the vertical direction lower groove of correspondence at least on each;
Etching contact hole in the second low-K dielectric layer film below the second low K value zone, said contact hole overlaps with one second last groove in the vertical direction that hangs down in the K value zone, and contact is positioned at its vertically lower groove of below;
On said, fill metal in groove and the said contact hole;
The said second dielectric layer film of chemical-mechanical planarization.
7. manufacture method according to claim 6 is characterized in that the process of the making of the said first dielectric layer film comprises the steps:
Deposit the one K value dielectric material covers the said first low-K dielectric layer film;
Etching is removed the said K value dielectric material of part, and etching terminates in the said first low-K dielectric layer film, is positioned at the first low-K dielectric layer film exposure that a K value dielectric material is removed the part below;
Deposit the 2nd K value dielectric material covers a said K value dielectric material and the said first low-K dielectric layer film exposed portions;
Said the 2nd a K value dielectric material of chemical-mechanical planarization and a said K value dielectric material expose a said K value dielectric material.
8. manufacture method according to claim 6 is characterized in that the process of the making of the said second dielectric layer film comprises the steps:
Deposit the one K value dielectric material covers the said second low-K dielectric layer film;
Etching is removed the said K value dielectric material of part, and etching terminates in the said second low-K dielectric layer film, is positioned at the second low-K dielectric layer film exposure that a K value dielectric material is removed the part below;
Deposit the 2nd K value dielectric material covers a said K value dielectric material and the said second low-K dielectric layer film exposed portions;
Said the 2nd a K value dielectric material of chemical-mechanical planarization and a said K value dielectric material expose a said K value dielectric material.
9. according to claim 7 or 8 described manufacture methods, it is characterized in that a said K value dielectric material is USG, FSG; BD, a kind of among BD1 or the BDII, said the 2nd K value dielectric material is USG; FSG, BD, among BD1 or the BDII than low a kind of of a said K value dielectric material K value.
10. manufacture method according to claim 6 is characterized in that, the said first low-K dielectric layer film is identical with the said second low-K dielectric layer film thickness, and the said first dielectric layer film is identical with the thickness of the second dielectric layer film.
11. manufacture method according to claim 10; It is characterized in that; Said first low-K dielectric layer film and the said second low-K dielectric layer film thickness span are 1000 ~ 10000A, and the said first dielectric layer film and the second dielectric layer film thickness span are 1000 ~ 10000A.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6617206B1 (en) * | 2000-06-07 | 2003-09-09 | Micron Technology, Inc. | Method of forming a capacitor structure |
| CN101192568A (en) * | 2006-11-24 | 2008-06-04 | 和舰科技(苏州)有限公司 | Integrate circuit 'metal-insulator-metal' capacitor structure and its manufacture method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6617206B1 (en) * | 2000-06-07 | 2003-09-09 | Micron Technology, Inc. | Method of forming a capacitor structure |
| CN101192568A (en) * | 2006-11-24 | 2008-06-04 | 和舰科技(苏州)有限公司 | Integrate circuit 'metal-insulator-metal' capacitor structure and its manufacture method |
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