CN102437063A - Manufacturing method of flip chip with liquid salient points - Google Patents
Manufacturing method of flip chip with liquid salient points Download PDFInfo
- Publication number
- CN102437063A CN102437063A CN201110382009XA CN201110382009A CN102437063A CN 102437063 A CN102437063 A CN 102437063A CN 201110382009X A CN201110382009X A CN 201110382009XA CN 201110382009 A CN201110382009 A CN 201110382009A CN 102437063 A CN102437063 A CN 102437063A
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- chip
- liquid
- dams
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- salient points
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10125—Reinforcing structures
- H01L2224/10126—Bump collar
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
- H01L2224/11444—Manufacturing methods by blanket deposition of the material of the bump connector in gaseous form
- H01L2224/1145—Physical vapour deposition [PVD], e.g. evaporation, or sputtering
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- H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
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- H01L2224/1147—Manufacturing methods using a lift-off mask
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- H01L2224/118—Post-treatment of the bump connector
- H01L2224/11848—Thermal treatments, e.g. annealing, controlled cooling
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- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/13105—Gallium [Ga] as principal constituent
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/81141—Guiding structures both on and outside the body
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110382009XA CN102437063A (en) | 2011-11-25 | 2011-11-25 | Manufacturing method of flip chip with liquid salient points |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110382009XA CN102437063A (en) | 2011-11-25 | 2011-11-25 | Manufacturing method of flip chip with liquid salient points |
Publications (1)
Publication Number | Publication Date |
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CN102437063A true CN102437063A (en) | 2012-05-02 |
Family
ID=45985057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201110382009XA Pending CN102437063A (en) | 2011-11-25 | 2011-11-25 | Manufacturing method of flip chip with liquid salient points |
Country Status (1)
Country | Link |
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CN (1) | CN102437063A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105336829A (en) * | 2015-09-28 | 2016-02-17 | 厦门市三安光电科技有限公司 | Flip chip light-emitting diode structure and manufacturing method thereof |
CN105489727A (en) * | 2016-01-18 | 2016-04-13 | 厦门市三安光电科技有限公司 | Bonded electrode structure of flip light-emitting diode (LED) chip, and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000088883A (en) * | 1998-09-09 | 2000-03-31 | Micronics Japan Co Ltd | Electric connecting device for electronic parts and manufacture thereof |
US20020100973A1 (en) * | 2000-06-08 | 2002-08-01 | Salman Akram | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
CN101194373A (en) * | 2005-06-09 | 2008-06-04 | 飞利浦拉米尔德斯照明设备有限责任公司 | Method of removing the growth substrate of a semiconductor light-emitting device |
-
2011
- 2011-11-25 CN CN201110382009XA patent/CN102437063A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000088883A (en) * | 1998-09-09 | 2000-03-31 | Micronics Japan Co Ltd | Electric connecting device for electronic parts and manufacture thereof |
US20020100973A1 (en) * | 2000-06-08 | 2002-08-01 | Salman Akram | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
CN101194373A (en) * | 2005-06-09 | 2008-06-04 | 飞利浦拉米尔德斯照明设备有限责任公司 | Method of removing the growth substrate of a semiconductor light-emitting device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105336829A (en) * | 2015-09-28 | 2016-02-17 | 厦门市三安光电科技有限公司 | Flip chip light-emitting diode structure and manufacturing method thereof |
WO2017054612A1 (en) * | 2015-09-28 | 2017-04-06 | 厦门市三安光电科技有限公司 | Flip-chip light emitting diode structure and manufacturing method |
CN105336829B (en) * | 2015-09-28 | 2018-09-11 | 厦门市三安光电科技有限公司 | Inverted light-emitting diode (LED) structure and preparation method thereof |
US10205057B2 (en) | 2015-09-28 | 2019-02-12 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Flip-chip light emitting diode and fabrication method |
CN105489727A (en) * | 2016-01-18 | 2016-04-13 | 厦门市三安光电科技有限公司 | Bonded electrode structure of flip light-emitting diode (LED) chip, and manufacturing method thereof |
CN105489727B (en) * | 2016-01-18 | 2018-06-19 | 厦门市三安光电科技有限公司 | The bonding electrode structure and production method of flip LED chips |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: GUO FENG Free format text: FORMER OWNER: SHENZHEN GRADUATE SCHOOL OF PEKING UNIVERSITY Effective date: 20130107 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518055 SHENZHEN, GUANGDONG PROVINCE TO: 511400 GUANGZHOU, GUANGDONG PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20130107 Address after: 511400 Guangdong city of Guangzhou province Panyu District agile Yahu in Building 1, No. 602 Applicant after: Guo Feng Address before: 518055 Guangdong city in Shenzhen Province, Nanshan District City Xili Shenzhen University North Campus Applicant before: Shenzhen Graduate School of Peking University |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120502 |
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RJ01 | Rejection of invention patent application after publication |