CN102437055A - Production method for squashed patch plastic package diode based on axial diode production line - Google Patents
Production method for squashed patch plastic package diode based on axial diode production line Download PDFInfo
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- CN102437055A CN102437055A CN201110418353XA CN201110418353A CN102437055A CN 102437055 A CN102437055 A CN 102437055A CN 201110418353X A CN201110418353X A CN 201110418353XA CN 201110418353 A CN201110418353 A CN 201110418353A CN 102437055 A CN102437055 A CN 102437055A
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Abstract
The invention discloses a production method for a squashed patch plastic package diode based on an axial diode production line. The production method comprises the following flows of: chip testing; assembling with a lead frame; sintering; acid cleaning; surface sizing; baking; plastic packaging; post curing; waste removing; squashing; molding by trimming; electroplating; lettering testing; external inspecting; packaging; QA (quality assurance) inspecting; and warehousing. The conventional axial diode production line is used, and through mold matching processes such as plastic package and the like, the production of the squashed patch plastic package diode is realized, and another expensive special production line of the squashed patch plastic package diode is not needed to be purchased; and a large number of the squashed patch plastic package diodes can be produced to meet social requirements, a lot of money and time are saved for enterprises, and the production cost can be reduced.
Description
Technical field
The present invention relates to a kind of production method of flattening the paster plastic package diode, relate in particular to a kind of production method of the flattening paster plastic package diode based on the axial diode production line.
Background technology
In numerous electronic components, axially plastic package diode is the element on basis, is widely used in the every field.But needs along with the production of miniaturization of electronic products, automation; Demand to the paster plastic package diode increases year by year; Because paster plastic package diode production line is with axially the plastic package diode apparatus for production line is different fully; Realize the updating and upgrading of a product, have only and drop into another paster plastic package diode production line again, need substantial contribution (production line about 2,000,000) and time.This has not only hindered enterprise provides a large amount of paster plastic package diodes, can not satisfy the demand of society, and needs waste enterprise's substantial contribution and time.So, can utilize existing axial plastic package diode production line, through the process matched therewith of moulds such as plastic packaging; Realize flattening the production of paster plastic package diode; Also be the problem that numerous electronic component factory pays close attention to most, but up to the present, also do not have the report of Related product and production method.
Number of patent application is the patent of invention of " 200610161418.6 "; A kind of paster diode with new structure and manufacturing approach thereof are disclosed; Comprise thick copper sheet and scale copper that equal in length and parallel interval are provided with; The middle part on plane is welded with diode chip for backlight unit on the scale copper; Be welded with between the last plane of diode chip for backlight unit and thick copper sheet and be connected copper sheet, thick copper sheet, scale copper, the diode chip for backlight unit of welding fabrication and be connected copper sheet together by envelope in body of epoxy resin, the bottom surface of only thick copper sheet and scale copper and the bottom surface of body of epoxy resin at grade, the both ends of the surface of thick copper sheet and scale copper respectively with the both ends of the surface of body of epoxy resin at grade.In this patent; Only relate to the technical scheme that improves the copper sheet utilance; Do not drop into another paster plastic package diode production line again and cause the problem that increases cost, loses time for axial plastic package diode manufacturing enterprise about utilizing axial plastic package diode production line to produce the description of stamp-mounting-paper diode, can't solving equally.
Summary of the invention
The object of the invention just is to provide in order to address the above problem a kind of production method of the flattening paster plastic package diode based on the axial diode production line.
In order to achieve the above object, the present invention has adopted following technical scheme:
The present invention includes following flow process: chip testing → with lead frame assembling → sintering → pickling → gluing → baking → plastic packaging → after solidify → go and give up → flatten → Trim Molding → plating → lettering test → outer inspection → packing → QA check → warehouse-in.
In the said flow process; Said chip testing, check and put in storage and on the axial diode production line, accomplish with lead frame assembling, sintering, pickling, gluing, baking, back curing, plating, lettering test, outer inspection, packing, QA; Said plastic packaging is accomplished on plastic package die; Said go to give up accomplish on the useless mould going, said flattening is accomplished flattening on the mould, said Trim Molding is accomplished on the Trim Molding mould.
In the said flow process; The method of said plastic packaging is: with 50 diodes is an assembly; Said 50 diodes first end lead-in wire is in the same way linked together through the first plastic packaging bar, said 50 diodes second end lead-in wire is in the same way linked together through the second plastic packaging bar.
In the said flow process, the method for said flattening is: it is that 0.18-0.20mm, width are 3mm that the lead-in wire at the diode two ends behind the plastic packaging is flattened to thickness.
Beneficial effect of the present invention is:
The present invention utilizes existing axial diode production line; Through mould process matched therewiths such as plastic packagings, realized flattening the production of paster plastic package diode, need not purchase expensive flattening paster plastic package diode special production line in addition; Not only can produce a large amount of flattening paster plastic package diodes; Satisfying social needs, and can practice thrift substantial contribution and time, reduce production costs for enterprise.
Description of drawings
Fig. 1 is the product structure sketch map of plastic packaging flow process among the present invention;
Fig. 2 is the product structure sketch map that goes useless flow process among the present invention;
Fig. 3 is the product structure sketch map that flattens flow process among the present invention;
Fig. 4 is the product structure sketch map of Trim Molding flow process among the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is made further specific descriptions:
The present invention includes following flow process: chip testing → with lead frame assembling → sintering → pickling → gluing → baking → plastic packaging → after solidify → go and give up → flatten → Trim Molding → plating → lettering test → outer inspection → packing → QA check → warehouse-in.In the said flow process; Said chip testing, check and put in storage and on the axial diode production line, accomplish with lead frame assembling, sintering, pickling, gluing, baking, back curing, plating, lettering test, outer inspection, packing, QA; Said plastic packaging is accomplished on plastic package die; Said go to give up accomplish on the useless mould going, said flattening is accomplished flattening on the mould, said Trim Molding is accomplished on the Trim Molding mould.
By on can know; Emphasis of the present invention be on the basis of the production technology of axial diode, increase plastic packaging, go to give up, flattening, this several roads flow process of Trim Molding; And utilize plastic package die, remove useless mould, flatten mould, the Trim Molding mould is accomplished, thereby realize the production of flattening stamp-mounting-paper diode.Below in conjunction with accompanying drawing with regard to plastic packaging, go to give up, flattening, this several roads flow process of Trim Molding describe:
As shown in Figure 1; The method of said plastic packaging is: with 50 diodes 1 is an assembly; 50 diodes 1, first end lead-in wire 2 is in the same way linked together through the first plastic packaging bar 4,50 diodes 1, second end lead-in wire 3 is in the same way linked together through the second plastic packaging bar 5.Be convenient to the carrying out of later stage operation like this.
As shown in Figure 2, said going in the useless flow process washed out the waste material of gate portions.
As shown in Figure 3, the method for said flattening is: first end at 1 two ends of the diode behind plastic packaging lead-in wire, 2 and second end is gone between 3, and to flatten to thickness be that 0.18-0.20mm, width are 3mm.
As shown in Figure 4, in the said Trim Molding flow process, first end at diode 1 two ends lead-in wire, 2 and second end, the 3 unnecessary parts that go between are cut away, promptly obtain 50 and independently flatten the paster plastic package diode.
Claims (4)
1. production method based on the flattening paster plastic package diode of axial diode production line is characterized in that: comprise following flow process: chip testing → with lead frame assembling → sintering → pickling → gluing → baking → plastic packaging → after solidify → go and give up → flatten → Trim Molding → plating → lettering test → outer inspection → packing → QA check → warehouse-in.
2. the production method of the flattening paster plastic package diode based on the axial diode production line according to claim 1; It is characterized in that: in the said flow process; Said chip testing, check and put in storage and on the axial diode production line, accomplish with lead frame assembling, sintering, pickling, gluing, baking, back curing, plating, lettering test, outer inspection, packing, QA; Said plastic packaging is accomplished on plastic package die; Said go to give up accomplish on the useless mould going, said flattening is accomplished flattening on the mould, said Trim Molding is accomplished on the Trim Molding mould.
3. the production method of the flattening paster plastic package diode based on the axial diode production line according to claim 1; It is characterized in that: in the said flow process; The method of said plastic packaging is: with 50 diodes is an assembly; Said 50 diodes first end lead-in wire is in the same way linked together through the first plastic packaging bar, said 50 diodes second end lead-in wire is in the same way linked together through the second plastic packaging bar.
4. the production method of the flattening paster plastic package diode based on the axial diode production line according to claim 1; It is characterized in that: in the said flow process, the method for said flattening is: it is that 0.18-0.20mm, width are 3mm that the lead-in wire at the diode two ends behind the plastic packaging is flattened to thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110418353XA CN102437055A (en) | 2011-12-14 | 2011-12-14 | Production method for squashed patch plastic package diode based on axial diode production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110418353XA CN102437055A (en) | 2011-12-14 | 2011-12-14 | Production method for squashed patch plastic package diode based on axial diode production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102437055A true CN102437055A (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110418353XA Pending CN102437055A (en) | 2011-12-14 | 2011-12-14 | Production method for squashed patch plastic package diode based on axial diode production line |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037097A (en) * | 2014-05-23 | 2014-09-10 | 南通皋鑫科技开发有限公司 | Glue layer coating method of plastic packagedaxial diode |
| CN106129049A (en) * | 2016-07-26 | 2016-11-16 | 苏州查斯特电子有限公司 | A kind of matrix form rectifier bridge stack diode |
| CN107359133A (en) * | 2017-07-27 | 2017-11-17 | 重庆平伟实业股份有限公司 | Diode feeding, flatten, rib cutting integrated shaping machine |
| CN113030677A (en) * | 2021-02-26 | 2021-06-25 | 东莞市中之电子科技有限公司 | Surface mount diode test equipment and test method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1606141A (en) * | 2003-10-06 | 2005-04-13 | 罗姆股份有限公司 | Lead frame making method, semiconductor device making method and semiconductor device |
| CN201898150U (en) * | 2010-10-29 | 2011-07-13 | 中山市晶明光电科技有限公司 | Light emitting diode support |
| CN102237275A (en) * | 2010-05-05 | 2011-11-09 | 如皋市易达电子有限责任公司 | Novel method for manufacturing chip diode |
-
2011
- 2011-12-14 CN CN201110418353XA patent/CN102437055A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1606141A (en) * | 2003-10-06 | 2005-04-13 | 罗姆股份有限公司 | Lead frame making method, semiconductor device making method and semiconductor device |
| CN102237275A (en) * | 2010-05-05 | 2011-11-09 | 如皋市易达电子有限责任公司 | Novel method for manufacturing chip diode |
| CN201898150U (en) * | 2010-10-29 | 2011-07-13 | 中山市晶明光电科技有限公司 | Light emitting diode support |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037097A (en) * | 2014-05-23 | 2014-09-10 | 南通皋鑫科技开发有限公司 | Glue layer coating method of plastic packagedaxial diode |
| CN104037097B (en) * | 2014-05-23 | 2016-12-07 | 南通皋鑫科技开发有限公司 | A kind of plastic sealed axial diode glue-line coating method |
| CN106129049A (en) * | 2016-07-26 | 2016-11-16 | 苏州查斯特电子有限公司 | A kind of matrix form rectifier bridge stack diode |
| CN107359133A (en) * | 2017-07-27 | 2017-11-17 | 重庆平伟实业股份有限公司 | Diode feeding, flatten, rib cutting integrated shaping machine |
| CN113030677A (en) * | 2021-02-26 | 2021-06-25 | 东莞市中之电子科技有限公司 | Surface mount diode test equipment and test method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120502 |