CN102435790B - 测试适配器及其与待测器件光学对准和热耦合的实现方法 - Google Patents
测试适配器及其与待测器件光学对准和热耦合的实现方法 Download PDFInfo
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- CN102435790B CN102435790B CN201110241567.4A CN201110241567A CN102435790B CN 102435790 B CN102435790 B CN 102435790B CN 201110241567 A CN201110241567 A CN 201110241567A CN 102435790 B CN102435790 B CN 102435790B
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- 230000000712 assembly Effects 0.000 claims abstract description 5
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/858,424 US8456185B2 (en) | 2010-08-17 | 2010-08-17 | Test adapter and method for achieving optical alignment and thermal coupling thereof with a device under test |
US12/858,424 | 2010-08-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102435790A CN102435790A (zh) | 2012-05-02 |
CN102435790B true CN102435790B (zh) | 2015-01-21 |
Family
ID=45593568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110241567.4A Active CN102435790B (zh) | 2010-08-17 | 2011-08-17 | 测试适配器及其与待测器件光学对准和热耦合的实现方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8456185B2 (zh) |
CN (1) | CN102435790B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7762822B2 (en) | 2005-04-27 | 2010-07-27 | Aehr Test Systems | Apparatus for testing electronic devices |
US10031177B2 (en) | 2015-08-18 | 2018-07-24 | Juniper Networks, Inc. | Methods and apparatus for optical transceiver calibration and test |
KR102495427B1 (ko) * | 2017-03-03 | 2023-02-02 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 |
US10910786B2 (en) * | 2018-07-23 | 2021-02-02 | University Of Maryland, College Park | Laser cavity optical alignment |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5389873A (en) * | 1992-06-05 | 1995-02-14 | Mitsubishi Denki Kabushiki Kaisha | Pressure contact chip and wafer testing device |
US6424533B1 (en) * | 2000-06-29 | 2002-07-23 | International Business Machines Corporation | Thermoelectric-enhanced heat spreader for heat generating component of an electronic device |
US6910812B2 (en) * | 2001-05-15 | 2005-06-28 | Peregrine Semiconductor Corporation | Small-scale optoelectronic package |
US7042563B2 (en) * | 2000-12-21 | 2006-05-09 | Credence Systems Corporation | Optical coupling for testing integrated circuits |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5412330A (en) * | 1993-06-16 | 1995-05-02 | Tektronix, Inc. | Optical module for an optically based measurement system |
US5498973A (en) | 1994-12-22 | 1996-03-12 | International Business Machines Corporation | Apparatus for testing semiconductor laser devices |
US6248604B1 (en) | 1999-09-14 | 2001-06-19 | Lucent Technologies, Inc. | Method for design and development of a semiconductor laser device |
WO2001078138A1 (en) * | 2000-04-07 | 2001-10-18 | Advanced Micro Devices, Inc. | Flip chip semiconductor device including a compliant support for supporting a heat sink |
US6501260B1 (en) | 2000-12-15 | 2002-12-31 | Corning Incorporated | Bar tester |
US6797936B1 (en) | 2002-01-03 | 2004-09-28 | Opto Electronic Systems, Inc. | Automated laser diode testing |
US6836014B2 (en) * | 2002-10-03 | 2004-12-28 | Credence Systems Corporation | Optical testing of integrated circuits with temperature control |
US7256879B2 (en) | 2003-12-11 | 2007-08-14 | Corning Incorporated | Semiconductor array tester |
KR20070110882A (ko) * | 2005-02-16 | 2007-11-20 | 어플라이드 머티어리얼스, 인코포레이티드 | Ic 칩에 대한 광 결합 |
-
2010
- 2010-08-17 US US12/858,424 patent/US8456185B2/en not_active Expired - Fee Related
-
2011
- 2011-08-17 CN CN201110241567.4A patent/CN102435790B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5389873A (en) * | 1992-06-05 | 1995-02-14 | Mitsubishi Denki Kabushiki Kaisha | Pressure contact chip and wafer testing device |
US6424533B1 (en) * | 2000-06-29 | 2002-07-23 | International Business Machines Corporation | Thermoelectric-enhanced heat spreader for heat generating component of an electronic device |
US7042563B2 (en) * | 2000-12-21 | 2006-05-09 | Credence Systems Corporation | Optical coupling for testing integrated circuits |
US6910812B2 (en) * | 2001-05-15 | 2005-06-28 | Peregrine Semiconductor Corporation | Small-scale optoelectronic package |
Also Published As
Publication number | Publication date |
---|---|
CN102435790A (zh) | 2012-05-02 |
US20120043984A1 (en) | 2012-02-23 |
US8456185B2 (en) | 2013-06-04 |
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Owner name: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) CORPORAT Free format text: FORMER OWNER: AVAGO TECHNOLOGIES ECBU IP Effective date: 20130502 |
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Effective date of registration: 20130502 Address after: Singapore Singapore Applicant after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: Singapore Singapore Applicant before: AGILENT TECHNOLOGIES, Inc. |
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Effective date of registration: 20201023 Address after: Singapore City Patentee after: Broadcom International Pte. Ltd. Address before: Singapore City Patentee before: Avago Technologies General IP (Singapore) Pte. Ltd. |
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Effective date of registration: 20230324 Address after: Singapore, Singapore Patentee after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: Singapore, Singapore Patentee before: Broadcom International Pte. Ltd. |