CN102433043A - 环氧树脂和硅树脂固化涂层和封装的脱除剂及制备方法 - Google Patents
环氧树脂和硅树脂固化涂层和封装的脱除剂及制备方法 Download PDFInfo
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107099052A (zh) * | 2017-04-25 | 2017-08-29 | 桂林电子科技大学 | 一种固化环氧树脂溶解剂及其应用方法 |
CN110229554A (zh) * | 2019-07-12 | 2019-09-13 | 浙江九合金属表面处理技术有限公司 | 碱性环保脱漆剂及其使用方法 |
CN110318067A (zh) * | 2019-07-09 | 2019-10-11 | 清华大学 | 可回收利用的电催化电极、制备和回收方法 |
CN110408260A (zh) * | 2019-08-15 | 2019-11-05 | 紫光宏茂微电子(上海)有限公司 | 一种剥离pcb板防焊漆的化学试剂及剥离方法 |
Citations (4)
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WO1993010196A1 (en) * | 1991-11-12 | 1993-05-27 | Ebbe Damgaard Larsen | Composition for stripping enameled or painted surfaces and method for its manufacture |
CN100999627A (zh) * | 2007-01-12 | 2007-07-18 | 大连三达奥克化学有限公司 | 水基脱漆剂 |
CN101323723A (zh) * | 2008-07-25 | 2008-12-17 | 东南大学 | 用于脱除聚硅氧烷漆的环保型水性脱漆剂 |
WO2011041837A1 (en) * | 2009-10-08 | 2011-04-14 | Smart Family Holdings Pty Ltd | Graffiti removal composition and method |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO1993010196A1 (en) * | 1991-11-12 | 1993-05-27 | Ebbe Damgaard Larsen | Composition for stripping enameled or painted surfaces and method for its manufacture |
CN100999627A (zh) * | 2007-01-12 | 2007-07-18 | 大连三达奥克化学有限公司 | 水基脱漆剂 |
CN101323723A (zh) * | 2008-07-25 | 2008-12-17 | 东南大学 | 用于脱除聚硅氧烷漆的环保型水性脱漆剂 |
WO2011041837A1 (en) * | 2009-10-08 | 2011-04-14 | Smart Family Holdings Pty Ltd | Graffiti removal composition and method |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107099052A (zh) * | 2017-04-25 | 2017-08-29 | 桂林电子科技大学 | 一种固化环氧树脂溶解剂及其应用方法 |
CN110318067A (zh) * | 2019-07-09 | 2019-10-11 | 清华大学 | 可回收利用的电催化电极、制备和回收方法 |
CN110229554A (zh) * | 2019-07-12 | 2019-09-13 | 浙江九合金属表面处理技术有限公司 | 碱性环保脱漆剂及其使用方法 |
CN110408260A (zh) * | 2019-08-15 | 2019-11-05 | 紫光宏茂微电子(上海)有限公司 | 一种剥离pcb板防焊漆的化学试剂及剥离方法 |
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Owner name: TIANJIN DEGAO HUACHENG NEW MATERIAL CO., LTD. Free format text: FORMER NAME: TIANJIN DEGAO CHEMICAL ELECTRONIC MATERIALS CO., LTD. |
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Address after: 300451, Tianjin Binhai New Area, Tanggu new North Road, 4668, innovation and Innovation Park, No. 13 workshop Patentee after: TECORE SYNCHEM, Inc. Address before: 300451, Binhai New Area, Tanggu new North Road, 4668, innovation and entrepreneurship Park, 31-A-,, B Patentee before: TIANJIN DEGAO HUACHENG ELECTRONIC MATERIAL Co.,Ltd. |
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Denomination of invention: Remover for epoxy resin and silicone resin curing coating and packaging and its preparation method Effective date of registration: 20220323 Granted publication date: 20130612 Pledgee: Tianjin Kerong Financing Guarantee Co.,Ltd. Pledgor: TECORE SYNCHEM, Inc. Registration number: Y2022120000011 |
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Date of cancellation: 20230403 Granted publication date: 20130612 Pledgee: Tianjin Kerong Financing Guarantee Co.,Ltd. Pledgor: TECORE SYNCHEM, Inc. Registration number: Y2022120000011 |