CN102431262A - Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate - Google Patents
Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate Download PDFInfo
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- CN102431262A CN102431262A CN2011102862659A CN201110286265A CN102431262A CN 102431262 A CN102431262 A CN 102431262A CN 2011102862659 A CN2011102862659 A CN 2011102862659A CN 201110286265 A CN201110286265 A CN 201110286265A CN 102431262 A CN102431262 A CN 102431262A
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- Prior art keywords
- polytetrafluoroethylene
- aluminium base
- aluminum
- ptfe
- copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a manufacturing method of a polytetrafluoroethylene aluminum-based copper-clad plate. The method comprises the steps of: step 1, first making a medium layer by dipping alkali-free glass cloth in a polytetrafluoroethylene dispersion liquid; step 2, then coating the two sides of the medium layer with an aluminum plate and a copper foil layer respectively, thus obtaining a polytetrafluoroethylene aluminum-based copper-clad plate, which not only has high heat dissipation and good shielding property, but also can realize high frequency, microwave and other performances.
Description
Technical field
The present invention relates to the preparation method of the aluminium base copper coated foil plate of a kind of polytetrafluoroethylene (PTFE).
Background technology
Aluminium base in the market copper coated foil plate medium is to constitute with epoxy resin or modified epoxy, and this plate can't satisfy the demand of telecommunications aspect to high frequencyization, microwave technology.
Summary of the invention
The invention provides the preparation method of the aluminium base copper coated foil plate of a kind of polytetrafluoroethylene (PTFE), the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE) that it is made is high, the advantages of good shielding performance of thermal diffusivity not only, and can realize performances such as high frequencyization and microwave technology.
The present invention has adopted following technical scheme: the preparation method of the aluminium base copper coated foil plate of a kind of polytetrafluoroethylene (PTFE), and it may further comprise the steps: step 1, at first make dielectric layer, dielectric layer is immersed in the polytetrafluoroethyldispersion dispersion through alkali-free glass cloth and makes; Step 2 is covered with the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE) of aluminium base and copper foil layer system then respectively on the two sides of dielectric layer.
Aluminium base is covered with one deck at least in the step 2 of the present invention.Copper foil layer is covered with one deck at least in the step 2 of the present invention.The mass ratio of aluminium base, dielectric layer and copper foil layer is 3-7:2-6:1 in the step 2 of the present invention.
The present invention has following beneficial effect: preparation method of the present invention is simple, and cost is lower.Dielectric layer of the present invention two sides is respectively aluminium base and copper foil layer; Dielectric layer can be a polytetrafluoroethyldispersion dispersion dipping alkali-free glass cloth, utilizes polytetrafluoroethylene film modification dielectric constant or dipping polytetrafluoroethyldispersion dispersion and ceramic powder amalgam, changes dielectric constant; Because the thermal conductivity factor of aluminium base and copper foil layer is greater than 2.8; Thermal resistance is less than 2.0, has therefore that thermal diffusivity is good, shielding properties is excellent, and excellent comprehensive performances such as high frequencyization and microwave technology.
The specific embodiment
The invention provides the preparation method of the aluminium base copper coated foil plate of a kind of polytetrafluoroethylene (PTFE), it may further comprise the steps: step 1, at first make dielectric layer, and dielectric layer is immersed in the polytetrafluoroethyldispersion dispersion through alkali-free glass cloth and makes; Step 2; Be covered with the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE) of aluminium base and copper foil layer system then respectively on the two sides of dielectric layer; Aluminium base is covered with one deck at least, and present embodiment is covered with one deck, and copper foil layer is covered with one deck at least; Present embodiment is covered with one deck, and the mass ratio of aluminium base, dielectric layer and copper foil layer is 3-7:2-6:1.
Claims (4)
1. the preparation method of the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE), it may further comprise the steps:
Step 1 is at first made dielectric layer, and dielectric layer is immersed in the polytetrafluoroethyldispersion dispersion through alkali-free glass cloth and makes;
Step 2 is covered with the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE) of aluminium base and copper foil layer system then respectively on the two sides of dielectric layer.
2. the preparation method of the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE) according to claim 1 is characterized in that aluminium base is covered with one deck at least in the step 2.
3. the preparation method of the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE) according to claim 1 is characterized in that copper foil layer is covered with one deck at least in the step 2.
4. the preparation method of the aluminium base copper coated foil plate of polytetrafluoroethylene (PTFE) according to claim 1, the mass ratio that it is characterized in that aluminium base in the step 2, dielectric layer and copper foil layer is 3-7:2-6:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102862659A CN102431262A (en) | 2011-09-25 | 2011-09-25 | Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102862659A CN102431262A (en) | 2011-09-25 | 2011-09-25 | Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102431262A true CN102431262A (en) | 2012-05-02 |
Family
ID=45979769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102862659A Pending CN102431262A (en) | 2011-09-25 | 2011-09-25 | Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102431262A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701950A (en) * | 2005-06-23 | 2005-11-30 | 朱德明 | Metal based board with copper foil coated compound medium |
| CN101564918A (en) * | 2009-05-19 | 2009-10-28 | 顾根山 | Metal-based composite medium copper-clad foil plate |
| CN101913272A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Aluminum-base composite medium copper-clad laminate |
-
2011
- 2011-09-25 CN CN2011102862659A patent/CN102431262A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701950A (en) * | 2005-06-23 | 2005-11-30 | 朱德明 | Metal based board with copper foil coated compound medium |
| CN101564918A (en) * | 2009-05-19 | 2009-10-28 | 顾根山 | Metal-based composite medium copper-clad foil plate |
| CN101913272A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Aluminum-base composite medium copper-clad laminate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Wangling Insulating Material Plant, Taizhou Assignor: Gu Genshan Contract record no.: 2012320000793 Denomination of invention: Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate License type: Exclusive License Open date: 20120502 Record date: 20120615 |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120502 |