CN101564918A - Metal-based composite medium copper-clad foil plate - Google Patents
Metal-based composite medium copper-clad foil plate Download PDFInfo
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- CN101564918A CN101564918A CNA2009100278891A CN200910027889A CN101564918A CN 101564918 A CN101564918 A CN 101564918A CN A2009100278891 A CNA2009100278891 A CN A2009100278891A CN 200910027889 A CN200910027889 A CN 200910027889A CN 101564918 A CN101564918 A CN 101564918A
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- metal
- copper
- based composite
- rutile
- foil plate
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Abstract
The invention discloses a metal-based composite medium copper-clad foil plate. A composite material layer is covered on a metal plate of the metal-based composite medium copper-clad foil plate, and a copper foil is covered on the composite material layer, wherein the composite material layer can be glass cloth with a polyfluortetraethylene coating, a mixture of polyfluortetraethylene and ceramics or rutile, or a mixture of polyfluortetraethylene, ceramics and rutile. The metal-based composite medium copper-clad foil plate meets the requirement of the development of electronic communication on high-frequency and microwave high-performance metal-based composite materials.
Description
Technical field
The present invention relates to a kind of metal-based composite medium copper-clad foil plate.
Background technology
To cover copper insulation board dielectric be to constitute with epoxy resin or anti-modified epoxy to Metal Substrate in the market, can't satisfy the demand of the development of telecommunications to the high-performance metal based composites of high frequencyization, microwave technology.
Summary of the invention
For addressing the above problem, the invention provides the high-performance metal based board with copper foil coated compound medium of a high frequencyization, microwave technology.
A kind of metal-based composite medium copper-clad foil plate of the present invention, mulching composite layer on its metallic plate covers Copper Foil on the composite layer; Composite layer can be the glass cloth that has polytetrafluorethylecoatings coatings, also can be the mixture of polytetrafluoroethylene (PTFE) and pottery or rutile, also can be the mixture of polytetrafluoroethylene (PTFE), pottery and rutile.
A kind of metal-based composite medium copper-clad foil plate of the present invention, the material of metallic plate is that the polytetrafluorethylecoatings coatings of copper, aluminium or iron, glass cloth is which floor is to tens layers, three layers of weight ratio are Metal Substrate: composite: Copper Foil=4-7: 2-5: 0.1-2, polytetrafluoroethylene (PTFE) is with pottery and rutile, anharmonic ratio ceramic or rutile separately is 5-7: 2-5 separately.
The present invention covers Copper Foil on composite layer: composite layer can be the glass cloth that has polytetrafluorethylecoatings coatings, also can be the mixture of polytetrafluoroethylene (PTFE) and pottery or rutile, also can be the mixture of polytetrafluoroethylene (PTFE), pottery and rutile.Can make composite layer that higher pyrolytic is arranged, improve its vitrification point, and then reach high-fire resistance, high-cooling property and high-k, dielectric constant is 2.25-10.2.Satisfy the demand of the development of telecommunications to the high-performance metal based composites of high frequencyization, microwave technology.
Description of drawings
Further specify below in conjunction with accompanying drawing and enforcement construction.
Accompanying drawing 1 is the structure chart of this development
The specific embodiment
Embodiment one, with reference to the accompanying drawings shown in, its preparation process also can be that polytetrafluoroethylene (PTFE), pottery and rutile mix in proportion for raw material are added tetrafluoroethene and pottery or rutile, dries for several times, sinters composite layer into; In proportion copper, aluminium or iron are carried out proportioning, copper, aluminium or fe-based surface are handled, with composite layer 2 and the sticking powder bonding of copper, aluminium or iron 1 usefulness heat conduction, composite layer and Copper Foil 3 carry out once molding formed.Three layers of weight ratio are controlled at Metal Substrate: the scope of composite: Copper Foil=4-7: 2-5: 0.1-2.Polytetrafluoroethylene (PTFE) is with pottery and rutile, weight ratio ceramic or rutile separately is controlled at 5-7 separately: the 2-5 scope.
Embodiment two, composite layer 2 are for being the glass cloth that has polytetrafluorethylecoatings coatings, and the polytetrafluorethylecoatings coatings of its glass cloth is which floor is to tens layers as requested.All the other preparation process are identical with embodiment one.
Claims (5)
1, the compound matter matter of a kind of Metal Substrate copper coated foil plate, its metallic plate (1) is gone up mulching composite layer (2), and composite layer (2) is gone up and is covered Copper Foil (3); Composite layer (2) can be have polytetrafluorethylecoatings coatings glass cloth, also can be the mixture of polytetrafluoroethylene (PTFE) and pottery or rutile, also can be the mixture of polytetrafluoroethylene (PTFE), pottery and rutile.
2, metal-based composite medium copper-clad foil plate according to claim 1, the material that it is characterized in that metallic plate are copper, aluminium or iron.
3, metal-based composite medium copper-clad foil plate according to claim 1 is characterized in which floor or tens layers the polytetrafluorethylecoatings coatings of glass cloth be.
4, metal-based composite medium copper-clad foil plate according to claim 1 is characterized in that three layers of weight ratio are Metal Substrate: composite: Copper Foil=4-7: 2-5: 0.1-2.
5, metal-based composite medium copper-clad foil plate according to claim 1 is characterized in that polytetrafluoroethylene (PTFE) and pottery and rutile, weight ratio ceramic or rutile separately is 5-7: 2-5 separately.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100278891A CN101564918A (en) | 2009-05-19 | 2009-05-19 | Metal-based composite medium copper-clad foil plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100278891A CN101564918A (en) | 2009-05-19 | 2009-05-19 | Metal-based composite medium copper-clad foil plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101564918A true CN101564918A (en) | 2009-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009100278891A Pending CN101564918A (en) | 2009-05-19 | 2009-05-19 | Metal-based composite medium copper-clad foil plate |
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| CN (1) | CN101564918A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101905550A (en) * | 2010-07-16 | 2010-12-08 | 顾根山 | Copper-based composite dielectric copper-clad laminate |
| CN101913274A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Ferritic based composite-dielectric copper clad laminate |
| CN101913272A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Aluminum-base composite medium copper-clad laminate |
| CN101934610A (en) * | 2010-07-21 | 2011-01-05 | 顾根山 | Wide-dielectric-coefficient Ccopper foil plate covered with wide-dielectric-coefficient polyfluortetraethylene glass cloth and preparation method thereof |
| CN102371724A (en) * | 2011-09-25 | 2012-03-14 | 顾根山 | Polyfluortetraethylene aluminum base copper-clad laminate |
| CN102431262A (en) * | 2011-09-25 | 2012-05-02 | 顾根山 | Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate |
| CN104496268A (en) * | 2014-12-16 | 2015-04-08 | 中国电子科技集团公司第四十六研究所 | Preparation method of microwave composite dielectric substrate with high frequency and high dielectric property |
-
2009
- 2009-05-19 CN CNA2009100278891A patent/CN101564918A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101905550A (en) * | 2010-07-16 | 2010-12-08 | 顾根山 | Copper-based composite dielectric copper-clad laminate |
| CN101913274A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Ferritic based composite-dielectric copper clad laminate |
| CN101913272A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Aluminum-base composite medium copper-clad laminate |
| CN101934610A (en) * | 2010-07-21 | 2011-01-05 | 顾根山 | Wide-dielectric-coefficient Ccopper foil plate covered with wide-dielectric-coefficient polyfluortetraethylene glass cloth and preparation method thereof |
| CN102371724A (en) * | 2011-09-25 | 2012-03-14 | 顾根山 | Polyfluortetraethylene aluminum base copper-clad laminate |
| CN102431262A (en) * | 2011-09-25 | 2012-05-02 | 顾根山 | Manufacturing method of polytetrafluoroethylene aluminum-based copper-clad plate |
| CN104496268A (en) * | 2014-12-16 | 2015-04-08 | 中国电子科技集团公司第四十六研究所 | Preparation method of microwave composite dielectric substrate with high frequency and high dielectric property |
| CN104496268B (en) * | 2014-12-16 | 2016-06-08 | 中国电子科技集团公司第四十六研究所 | A kind of preparation method of high frequency high dielectric microwave composite medium substrate |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20091028 |