CN102427670A - Method for thinning copper layer of printed circuit board - Google Patents
Method for thinning copper layer of printed circuit board Download PDFInfo
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- CN102427670A CN102427670A CN2011103510905A CN201110351090A CN102427670A CN 102427670 A CN102427670 A CN 102427670A CN 2011103510905 A CN2011103510905 A CN 2011103510905A CN 201110351090 A CN201110351090 A CN 201110351090A CN 102427670 A CN102427670 A CN 102427670A
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- copper layer
- etching
- printed circuit
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Abstract
The invention relates to a method for thinning a copper layer of a printed circuit board. The method is characterized by: covering a dry film on two sides of the printed circuit board and forming a via hole cloak film covering the via hole; using an etching potion to react with a copper layer except the region which is covered by the via hole cloak film; thinning the copper layer; removing the film, washing and drying. Through controlling etching time, the copper layer can be thinned to a required thickness for one time. The via hole cloak film formed by the dry film covers the via hole and prevent the etching potion from entering into the via hole. The etching potion can not react with the copper layers of an orifice corner and an inner wall of the via hole so that the copper layer of the orifice corner of the via hole can maintain the original thickness and damage of the copper layer of the via hole can be avoided. Because there is not traction of a frictional force, the thin printed circuit is not deformed. Therefore, the method for thinning the copper layer can be used in the printed circuit board with various kinds of thicknesses.
Description
Technical field
The present invention relates to a kind of manufacturing approach of printed circuit board (PCB), relate in particular to a kind of attenuate copper layer method of printed circuit board (PCB).
Background technology
As depicted in figs. 1 and 2; Present printed circuit board (PCB) 01 (being called for short PCB) normally adopts the two sides all to be coated with the copper-clad plate of copper layer 02; Printed circuit board (PCB) 01 is provided with a plurality of vias 03, and the inwall of via 03 is electroplate with copper layer 04, to be communicated with the copper layer 02 on printed circuit board (PCB) 01 two sides.
In the manufacture process of above-mentioned printed circuit board (PCB) 01, often need subtract thin copper layer 02, to reduce the difficulty that circuit is made, improve the fineness of line pattern.At present, mainly adopt the mode of nog plate to subtract thin copper layer 02.As shown in Figure 3, utilize the polish-brush 05 (or abrasive band) that is installed on the forcing press that printed circuit board (PCB) 01 lip-deep copper layer 02 is ground, make printed circuit board (PCB) 01 lip-deep copper layer 021 attenuation to form thin copper layer, to reach specification requirement.
Above-mentionedly subtract the technology of thin copper layer through the nog plate mode, its process equipment is simple, and cost is lower.But, above-mentionedly subtracting the technology of thin copper layer 02 through the nog plate mode, its working (machining) efficiency is lower, and each grinding only can be removed the copper layer of 1～3 micron thick, and each printed circuit board (PCB) 01 needs to grind 2～3 times usually; In addition, as shown in Figure 4, the copper layer 02 that the most important thing is via 03 corner is easily by wear down, even place, the aperture of via 03 copper layer 02 is worn through.Because the copper layer 02 of via 03 corner is by wear down, the copper layer 02 at this place is fracture easily in welding process, causes the via 03 can't conducting; In addition, state the technology that subtracts thin copper layer 02 through the nog plate mode and have limitation, can't be applied to the printed circuit board (PCB) of thickness less than 0.4mm, because in the nog plate process, this type of thin printed circuit board (PCB) 01 receives the traction of frictional force, and its size can gross distortion.
Summary of the invention
The technical problem that the present invention will solve provides a kind of attenuate copper layer method of printed circuit board (PCB); The attenuate copper layer method of this printed circuit board (PCB) is applicable to the printed circuit board (PCB) of all thickness; Can be thinned to desired thickness with the copper layer on the printed circuit board surface is disposable, and avoid the damage of via place copper layer.The technical scheme that adopts is following:
A kind of attenuate copper layer method of printed circuit board (PCB) is characterized in that comprising the steps:
Step 1, on the two sides of printed circuit board (PCB), respectively cover one deck dry film;
Step 3, the copper layer that adopts etching liquid medicine that via is covered outside the film institute overlay area carry out etching, through the control etching period, the copper layer are thinned to desired thickness;
Step 4, remove via and cover film;
Above-mentioned via is covered film should be able to cover via fully, promptly is that the size of via coverage film needs the size greater than via.
Etching liquid medicine and copper layer react, and make the copper layer be thinned, and through the control etching period, disposable the copper layer are thinned to desired thickness; And cover film via is covered by the via that dry film forms; It is inner to stop etching liquid medicine to get into via; Etching liquid medicine can't react with the turning, aperture of via and the copper layer of inwall; Thereby make the copper layer of aperture corner of via keep original thickness, avoid the damage of via place copper layer; Owing to there is not the traction of frictional force, can not cause thin printed circuit distortion, therefore this method that subtracts thin copper layer can be applicable to the printed circuit board (PCB) of all thickness.
In order accurately the copper layer to be thinned to desired thickness; As preferred version of the present invention; It is characterized in that: in the said step 3, except that the control etching period, also cooperate control etching pressure, etching liquid medicine temperature and etching chemical concentration; Etching process is controlled, and the roughness control that makes copper laminar surface after the etching is in+/-1.0 μ m.In order to make evenness higher, preferably etching pressure is controlled in the scope of 5-20psi (pound/square inch); Etching liquid medicine temperature is controlled in 20-35 ℃ the scope; The etching chemical concentration is controlled in the scope of 10-20g/L.
In order to reach the simple purpose of technology,, it is characterized in that as the further preferred version of the present invention: in the step 2, said figure transfer technology comprise to dry film make public, development and laser-induced thermal etching.
In order to reach the purpose of copper layer attenuate better effects if, as the further preferred version of the present invention, it is characterized in that: in the said step 3, etching liquid medicine is sprayed onto the surface of copper layer through the mode of spray.Mode through spray is sprayed onto the copper laminar surface with etching liquid medicine; Can accumulate on the copper layer under the burden situation still less of etching liquid medicine; The copper layer is carried out even attenuate, further avoid etching liquid medicine corrosion via to cover the copper layer of film institute overlay area, attenuate better effects if.In other concrete scheme, can also printed circuit board (PCB) be dipped in the etching liquid medicine, the copper layer is carried out attenuate.
The present invention compared with prior art has following advantage: this method that subtracts thin copper layer is applicable to the printed circuit board (PCB) of all thickness; Can disposable copper layer on the printed circuit board surface be thinned to desired thickness, and avoid the damage of via place copper layer.
Description of drawings
Fig. 1 is existing a kind of two-sided covering copper layer and the front view that has the printed circuit board (PCB) of via;
Fig. 2 is the cutaway view of Fig. 1 along A-A;
Fig. 3 is the process schematic representation that available technology adopting nog plate mode subtracts thin copper layer;
Fig. 4 is after available technology adopting nog plate mode subtracts thin copper layer, the sketch map that the via turning is impaired;
Fig. 5 is in the preferred embodiment for the present invention, covers the sketch map of dry film in printed circuit board surface;
Fig. 6 is in the preferred embodiment for the present invention, forms the sketch map that via is covered film in the relevant position of via;
Fig. 7 is in the preferred embodiment for the present invention, at copper laminar surface spray etching liquid medicine, subtracts the sketch map of thin copper layer;
Fig. 8 is in the preferred embodiment for the present invention, subtract thin copper layer after, do not remove the sketch map that via is covered film;
Fig. 9 is in the preferred embodiment for the present invention, subtract thin copper layer after, and remove the sketch map after via is covered film.
Embodiment
Do further explanation below in conjunction with accompanying drawing and preferred implementation of the present invention.
The attenuate copper layer method of this printed circuit board (PCB) comprises the steps:
Step 1, as shown in Figure 5 respectively covers one deck dry film 3 on the surface of the copper layer 2 on printed circuit board (PCB) 1 two sides;
Step 3, like Fig. 7 and shown in Figure 8; At the surface sprinkling etching liquid medicine of copper layer 2, the copper layer that via is covered outside 5 overlay areas of film carries out etching, through the control etching period; And etching pressure is controlled at 20psi; Etching liquid medicine temperature is controlled at 35 ℃, the etching chemical concentration is controlled at 20g/L, the roughness control that makes copper layer 2 surface after the etching is in+/-1.0 μ m;
Step 4, as shown in Figure 9 is removed via and is covered film;
Etching liquid medicine and copper layer 2 react, and make copper layer 2 be thinned, and through the control etching period, are thinned to desired thickness with copper layer 2 is disposable; Cover and cover 5 pairs of vias 4 of film by the via that dry film 3 forms; Stop etching liquid medicine to get into via 4 inside; Etching liquid medicine can't react with the copper layer 2 at the turning, aperture of via 4 and the copper layer 6 of inwall; Thereby make the copper layer 2 of aperture corner of via 4 keep original thickness, avoid the damage of via 4 place's copper layers 2; Owing to there is not the traction of frictional force, can not cause thin printed circuit distortion, therefore this method that subtracts thin copper layer can be applicable to the printed circuit board (PCB) 1 of all thickness.
In other embodiments, etching pressure is controlled at 5psi, etching liquid medicine temperature is controlled in 20 ℃ the scope; The etching chemical concentration is controlled in the scope of 10g/L.
In other embodiments, etching pressure is controlled at 15psi, etching liquid medicine temperature is controlled in 18 ℃ the scope; The etching chemical concentration is controlled in the scope of 15g/L.
In other embodiments, can also printed circuit board (PCB) be dipped in the etching liquid medicine, the copper layer is carried out attenuate.
Claims (5)
1. the attenuate copper layer method of a printed circuit board (PCB) is characterized in that comprising the steps:
Step 1, on the two sides of printed circuit board (PCB), respectively cover one deck dry film;
Step 2, employing figure transfer technology form via in the relevant position of via and cover film, and removes other regional dry film;
Step 3, the copper layer that adopts etching liquid medicine that via is covered outside the film institute overlay area carry out etching, through the control etching period, the copper layer are thinned to desired thickness;
Step 4, remove via and cover film;
Step 5, printed circuit board (PCB) is washed, dried.
2. attenuate copper layer method as claimed in claim 1; It is characterized in that: in the said step 3; Except that the control etching period; Also cooperate control etching pressure, etching liquid medicine temperature and etching chemical concentration, etching process is controlled, the roughness control that makes copper laminar surface after the etching is in+/-1.0 μ m.
3. attenuate copper layer method as claimed in claim 2 is characterized in that: etching pressure is controlled in the scope of 5-20psi; Etching liquid medicine temperature is controlled in the scope of 20-35 ° of C; The etching chemical concentration is controlled in the scope of 10-20g/L.
The shape shifting process comprise to dry film make public, development and laser-induced thermal etching.
5. like claim 1 or 2 or 3 described attenuate copper layer methods, it is characterized in that: in the said step 3, etching liquid medicine is sprayed onto the surface of copper layer through the mode of spray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103510905A CN102427670A (en) | 2011-11-08 | 2011-11-08 | Method for thinning copper layer of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103510905A CN102427670A (en) | 2011-11-08 | 2011-11-08 | Method for thinning copper layer of printed circuit board |
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| CN102427670A true CN102427670A (en) | 2012-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103510905A Pending CN102427670A (en) | 2011-11-08 | 2011-11-08 | Method for thinning copper layer of printed circuit board |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104135825A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Copper reduction process for printed circuit board |
| CN104519667A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Technique for local copper thinning and precision circuit making of printed circuit boards |
| CN104883827A (en) * | 2015-06-05 | 2015-09-02 | 成都航天通信设备有限责任公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN105392288A (en) * | 2015-11-18 | 2016-03-09 | 江门崇达电路技术有限公司 | Method for manufacturing metalized blind holes on PCB |
| CN107493661A (en) * | 2017-08-04 | 2017-12-19 | 淳华科技(昆山)有限公司 | FPC line manufacturing process |
| CN107645830A (en) * | 2017-08-29 | 2018-01-30 | 深南电路股份有限公司 | Two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof |
| CN109246942A (en) * | 2018-10-19 | 2019-01-18 | 高德（江苏）电子科技有限公司 | A kind of processing technology of dry film cap bore removal printed wiring board surface layer copper thickness |
| CN110418519A (en) * | 2019-09-26 | 2019-11-05 | 博敏电子股份有限公司 | Multistage printed circuit board differentiation processing method of through holes and its printed circuit board |
| CN111148378A (en) * | 2020-01-09 | 2020-05-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of local thick copper plate |
| CN111935913A (en) * | 2020-07-30 | 2020-11-13 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| CN112822856A (en) * | 2020-12-30 | 2021-05-18 | 厦门柔性电子研究院有限公司 | Manufacturing method of thin double-sided flexible circuit board capable of improving wrinkles |
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| JPH06268355A (en) * | 1993-03-11 | 1994-09-22 | Mitsubishi Electric Corp | Printed wiring board and manufacture thereof |
| US20010032828A1 (en) * | 1997-11-12 | 2001-10-25 | International Business Machines Corporation | Manufacturing methods for printed circuit boards |
| CN1627189A (en) * | 2003-12-09 | 2005-06-15 | 富士胶片株式会社 | Dry film photo resist |
| CN1925725A (en) * | 2005-09-02 | 2007-03-07 | 日本梅克特隆株式会社 | Method for manufacturing circuit substrate |
| CN101102648A (en) * | 2006-07-04 | 2008-01-09 | 日东电工株式会社 | Through hole forming method and wiring circuit board manufacturing method |
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2011
- 2011-11-08 CN CN2011103510905A patent/CN102427670A/en active Pending
Patent Citations (5)
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|---|---|---|---|---|
| JPH06268355A (en) * | 1993-03-11 | 1994-09-22 | Mitsubishi Electric Corp | Printed wiring board and manufacture thereof |
| US20010032828A1 (en) * | 1997-11-12 | 2001-10-25 | International Business Machines Corporation | Manufacturing methods for printed circuit boards |
| CN1627189A (en) * | 2003-12-09 | 2005-06-15 | 富士胶片株式会社 | Dry film photo resist |
| CN1925725A (en) * | 2005-09-02 | 2007-03-07 | 日本梅克特隆株式会社 | Method for manufacturing circuit substrate |
| CN101102648A (en) * | 2006-07-04 | 2008-01-09 | 日东电工株式会社 | Through hole forming method and wiring circuit board manufacturing method |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104135825A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Copper reduction process for printed circuit board |
| CN104519667A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Technique for local copper thinning and precision circuit making of printed circuit boards |
| CN104883827A (en) * | 2015-06-05 | 2015-09-02 | 成都航天通信设备有限责任公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN105392288A (en) * | 2015-11-18 | 2016-03-09 | 江门崇达电路技术有限公司 | Method for manufacturing metalized blind holes on PCB |
| CN107493661A (en) * | 2017-08-04 | 2017-12-19 | 淳华科技(昆山)有限公司 | FPC line manufacturing process |
| CN107645830A (en) * | 2017-08-29 | 2018-01-30 | 深南电路股份有限公司 | Two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof |
| CN109246942A (en) * | 2018-10-19 | 2019-01-18 | 高德（江苏）电子科技有限公司 | A kind of processing technology of dry film cap bore removal printed wiring board surface layer copper thickness |
| CN110418519A (en) * | 2019-09-26 | 2019-11-05 | 博敏电子股份有限公司 | Multistage printed circuit board differentiation processing method of through holes and its printed circuit board |
| CN111148378A (en) * | 2020-01-09 | 2020-05-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of local thick copper plate |
| CN111148378B (en) * | 2020-01-09 | 2021-04-06 | 深圳市景旺电子股份有限公司 | Manufacturing method of local thick copper plate |
| CN111935913A (en) * | 2020-07-30 | 2020-11-13 | 珠海杰赛科技有限公司 | Control method for thickness of cladding coating and printed board |
| CN112822856A (en) * | 2020-12-30 | 2021-05-18 | 厦门柔性电子研究院有限公司 | Manufacturing method of thin double-sided flexible circuit board capable of improving wrinkles |
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Application publication date: 20120425 |