CN102426413A - Ultraviolet laser solidification wiring method - Google Patents
Ultraviolet laser solidification wiring method Download PDFInfo
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- CN102426413A CN102426413A CN2011103442857A CN201110344285A CN102426413A CN 102426413 A CN102426413 A CN 102426413A CN 2011103442857 A CN2011103442857 A CN 2011103442857A CN 201110344285 A CN201110344285 A CN 201110344285A CN 102426413 A CN102426413 A CN 102426413A
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- violet laser
- microns
- wiring method
- hardening agent
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Abstract
The invention discloses an ultraviolet laser solidification wiring method, belonging to the technical field of touch panel induction trace and electrode routing processing. According to the invention, an ultraviolet laser processing method is used in the technology of processing an induction layer of a touch panel to combine with solidification agents to increase the fastness of the trace, thus no etching trace on the surface of a processed product is successfully realized, the appearance of the product is trim and beautiful, the ruling lines are optimized and smooth, the production form is flexible, and the product quality is good. The invention is convenient for standardized batch production by using the new technology, and increases the light transmittance of the touch panel.
Description
Technical field
The present invention relates to a kind of Ultra-Violet Laser and solidify wiring method, belong to contact panel induction stitching and electrode cabling process technique field.
Background technology
Laser is compared with other job operations, has the characteristics of high-speed, high precision and high-adaptability, so the accurate manufacture field that is widely used.The present invention utilizes accurately machining characteristics of laser just, adapts to the increasingly high requirement of processing technology of contact panel.
Different characteristics according to machined material in the Laser Processing reaches the degree of absorption difference to different wavelength of laser, selects the laser of a certain specific wavelength that material is processed, to reach best processing effect.Ultraviolet wavelength laser is fit to handle this base polymer material of contact panel very much.Different with infrared laser processing, Ultra-Violet Laser is not " heat " processing procedure, and the high-octane photon of Ultra-Violet Laser can directly destroy the chemical bond of material, is called " photetching " effect.Visible light and infrared light laser beam are to utilize the heat that focuses on working position to come molten material, can produce the heat-affected zone; And Ultra-Violet Laser processing is " cold " processing procedure, and the heat-affected zone is little, and the parts that process have the carbonization of smooth edges and low limit and burn influence.
Cation light initiator has that pair oxygen molecule insensitivity, dark polymerization of later stage, low shrinkage factor, adhesive property are good, chemical resistance and the characteristics of polymerization speed faster.Ultraviolet light solidifies the photoresistance film exposure that contains cation light initiator, helps the transmission of the complete firm assurance touch signal of stitching.
Summary of the invention
Technical matters: the present invention is directed in processing touch-control panel induction layer technology and used the radium-shine processing mode of Ultra-Violet Laser to combine to increase the firm quality of stitching with hardening agent; It is high to propose a kind of product yield and touch-control precision, and the Ultra-Violet Laser that can enhance productivity solidifies wiring method.
Technical scheme: the invention discloses a kind of Ultra-Violet Laser and solidify wiring method, comprising:
In thousand grades of dust free rooms,
The step of optics level PET basic unit single face plating conductive material;
After subsides on the optics level PET parent metal conductive material contain the photoresistance film of hardening agent, and the step of baking;
Contain the photoresistance film of hardening agent with Ultra-Violet Laser exposure, 10% KOH solution develops, the salt acid etching of 3.5mol/L, and 3.5% NaOH solution demoulding forms the step of electrode cabling and metal series inductance unit group.
Above-mentioned metallic conduction material is that copper, copper niobium evanohm or silver-colored palladium-copper alloy constitute; Metal surface side's resistance is 0.1 ohm～0.3 ohm.Optics level PET groundwork thickness is 50 microns～200 microns; The thickness of metal series inductance unit group and electrode cabling is 1 micron～10 microns for the stitching width of
metal series inductance unit group.The thickness that contains the photoresistance film of hardening agent is 4 microns～6 microns; Wherein, hardening agent is free radical photo-initiation and cation light initiator; The photoresistance film that contains hardening agent is the minus photoresistance.Baking temperature is 133 degrees centigrade～137 degrees centigrade, and stoving time is 14 minutes～16 minutes.Wavelength 365 nanometers of Ultra-Violet Laser, the power of Ultra-Violet Laser is 5KW, and the beam diameter of Ultra-Violet Laser is 1 micron～10 microns, and the illumination speed of Ultra-Violet Laser is 2 meter per seconds.
Beneficial effect: the invention discloses a kind of Ultra-Violet Laser and solidify wiring method; Through in processing touch-control panel induction layer technology, having used the radium-shine processing mode of Ultra-Violet Laser to combine to increase the firm quality of stitching with hardening agent; Thereby realized that successfully the product surface after the processing does not have etching mark, its outward appearance is more neat and artistic, and the line lines are optimized smoothly more; Production form is more flexible; Product quality is high, is convenient to adopt new process standardization volume production, and improves the transmittance of contact panel.
Description of drawings:
Fig. 1 is a technological process schematic block diagram of the present invention.
Embodiment
Be that specific embodiment of the present invention further describes below:
Shown in Figure 1, a kind of Ultra-Violet Laser of the present invention solidifies wiring method, comprising:
In thousand grades of dust free rooms,
The step of optics level PET basic unit single face plating conductive material;
After subsides on the optics level PET parent metal conductive material contain the photoresistance film of hardening agent, and the step of baking;
Contain the photoresistance film of hardening agent with Ultra-Violet Laser exposure, 10% KOH solution develops, the salt acid etching of 3.5mol/L, and 3.5% NaOH solution demoulding forms the step of electrode cabling and metal series inductance unit group.
Said metallic conduction material is that copper, copper niobium evanohm or silver-colored palladium-copper alloy constitute; Metal surface side's resistance is 0.1 ohm～0.3 ohm.Optics level PET groundwork thickness is 50 microns～200 microns; The thickness of metal series inductance unit group and electrode cabling is 1 micron～10 microns for the stitching width of
metal series inductance unit group.The thickness that contains the photoresistance film of hardening agent is 4 microns～6 microns; Wherein, hardening agent is free radical photo-initiation and cation light initiator; The photoresistance film that contains hardening agent is the minus photoresistance.Baking temperature is 133 degrees centigrade～137 degrees centigrade, and stoving time is 14 minutes～16 minutes.Wavelength 365 nanometers of Ultra-Violet Laser, the power of Ultra-Violet Laser is 5KW, and the beam diameter of Ultra-Violet Laser is 1 micron～10 microns, and the illumination speed of Ultra-Violet Laser is 2 meter per seconds.
Embodiment 1:
The metallic conduction material is that copper constitutes; Metal surface side's resistance is 0.1 ohm.Optics level PET groundwork thickness is 50 microns; The thickness of metal series inductance unit group and electrode cabling is 1 micron for the stitching width of
metal series inductance unit group.The thickness that contains the photoresistance film of hardening agent is 4 microns; Baking temperature is 133 degrees centigrade, and stoving time is 16 minutes.The beam diameter of Ultra-Violet Laser is 1 micron.
Ultra-Violet Laser solidifies wiring method, comprises the steps:
In thousand grades of dust free rooms,
The step of optics level PET basic unit single face plating conductive material;
After subsides on the optics level PET parent metal conductive material contain the photoresistance film of hardening agent, and the step of baking;
Contain the photoresistance film of hardening agent with Ultra-Violet Laser exposure, 10% KOH solution develops, the salt acid etching of 3.5mol/L, and 3.5% NaOH solution demoulding forms the step of electrode cabling and metal series inductance unit group.
Embodiment 2:
The metallic conduction material is that copper niobium evanohm constitutes; Metal surface side's resistance is 0.3 ohm.Optics level PET groundwork thickness is 200 microns; The thickness of metal series inductance unit group and electrode cabling is 10 microns for the stitching width of
metal series inductance unit group.The thickness that contains the photoresistance film of hardening agent is 6 microns; Baking temperature is 137 degrees centigrade, and stoving time is 14 minutes.The beam diameter of Ultra-Violet Laser is 10 microns.
Ultra-Violet Laser solidifies wiring method, comprises the steps:
In thousand grades of dust free rooms,
The step of optics level PET basic unit single face plating conductive material;
After subsides on the optics level PET parent metal conductive material contain the photoresistance film of hardening agent, and the step of baking;
Contain the photoresistance film of hardening agent with Ultra-Violet Laser exposure, 10% KOH solution develops, the salt acid etching of 3.5mol/L, and 3.5% NaOH solution demoulding forms the step of electrode cabling and metal series inductance unit group.
Embodiment 3:
The metallic conduction material is that silver-colored palladium-copper alloy constitutes; Metal surface side's resistance is 0.15 ohm.Optics level PET groundwork thickness is 150 microns; The thickness of metal series inductance unit group and electrode cabling is 5 microns for the stitching width of
metal series inductance unit group.The thickness that contains the photoresistance film of hardening agent is 5 microns; Baking temperature is 135 degrees centigrade, and stoving time is 15 minutes.The beam diameter of Ultra-Violet Laser is 6 microns.
Ultra-Violet Laser solidifies wiring method, comprises the steps:
In thousand grades of dust free rooms,
The step of optics level PET basic unit single face plating conductive material;
After subsides on the optics level PET parent metal conductive material contain the photoresistance film of hardening agent, and the step of baking;
Contain the photoresistance film of hardening agent with Ultra-Violet Laser exposure, 10% KOH solution develops, the salt acid etching of 3.5mol/L, and 3.5% NaOH solution demoulding forms the step of electrode cabling and metal series inductance unit group.
Claims (6)
1. a Ultra-Violet Laser solidifies wiring method, it is characterized in that, comprising:
In thousand grades of dust free rooms,
The step of optics level PET basic unit single face plating conductive material;
After subsides on the optics level PET parent metal conductive material contain the photoresistance film of hardening agent, and the step of baking;
Contain the photoresistance film of hardening agent with Ultra-Violet Laser exposure, 10% KOH solution develops, the salt acid etching of 3.5mol/L, and 3.5% NaOH solution demoulding forms the step of electrode cabling and metal series inductance unit group.
2. Ultra-Violet Laser solidifies wiring method according to claim 1, it is characterized in that: said metallic conduction material is that copper, copper niobium evanohm or silver-colored palladium-copper alloy constitute; Metal surface side's resistance is 0.1 ohm～0.3 ohm.
3. Ultra-Violet Laser solidifies wiring method according to claim 1, and it is characterized in that: said optics level PET groundwork thickness is 50 microns～200 microns; The thickness of metal series inductance unit group and electrode cabling is 1 micron～10 microns for the stitching width of
metal series inductance unit group.
4. Ultra-Violet Laser solidifies wiring method according to claim 1, and it is characterized in that: the said thickness that contains the photoresistance film of hardening agent is 4 microns～6 microns; Wherein, hardening agent is free radical photo-initiation and cation light initiator; The photoresistance film that contains hardening agent is the minus photoresistance.
5. Ultra-Violet Laser solidifies wiring method according to claim 1, and it is characterized in that: said baking temperature is 133 degrees centigrade～137 degrees centigrade, and stoving time is 14 minutes～16 minutes.
6. Ultra-Violet Laser solidifies wiring method according to claim 1, it is characterized in that: wavelength 365 nanometers of said Ultra-Violet Laser, and the power of Ultra-Violet Laser is 5KW, and the beam diameter of Ultra-Violet Laser is 1 micron～10 microns, and the illumination speed of Ultra-Violet Laser is 2 meter per seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103442857A CN102426413A (en) | 2011-11-04 | 2011-11-04 | Ultraviolet laser solidification wiring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103442857A CN102426413A (en) | 2011-11-04 | 2011-11-04 | Ultraviolet laser solidification wiring method |
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| CN102426413A true CN102426413A (en) | 2012-04-25 |
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| CN2011103442857A Pending CN102426413A (en) | 2011-11-04 | 2011-11-04 | Ultraviolet laser solidification wiring method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707837A (en) * | 2012-05-04 | 2012-10-03 | 牧东光电（苏州）有限公司 | Single-face multi-point touch panel and manufacture method thereof |
| CN103425302A (en) * | 2012-05-16 | 2013-12-04 | 宸鸿科技(厦门)有限公司 | Touch panel and production method thereof |
| CN103613281A (en) * | 2013-11-01 | 2014-03-05 | 深圳市海富莱电子有限公司 | Graphical method capable of forming conductive function pattern and application |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101675504A (en) * | 2007-09-21 | 2010-03-17 | Lg化学株式会社 | Method for etching glass or metal substrates using negative photoresist and method for fabricating cliche using the same |
| JP2010160300A (en) * | 2009-01-08 | 2010-07-22 | Toray Ind Inc | Negative photosensitive resin composition and touch panel material using the same |
| CN101817108A (en) * | 2010-03-24 | 2010-09-01 | 江苏大学 | Method and device for realizing photoelectrochemical micro-etch processing of masked electrode |
| CN102096534A (en) * | 2010-12-31 | 2011-06-15 | 晟光科技股份有限公司 | Production method of electrode of capacitive touch screen |
-
2011
- 2011-11-04 CN CN2011103442857A patent/CN102426413A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101675504A (en) * | 2007-09-21 | 2010-03-17 | Lg化学株式会社 | Method for etching glass or metal substrates using negative photoresist and method for fabricating cliche using the same |
| JP2010160300A (en) * | 2009-01-08 | 2010-07-22 | Toray Ind Inc | Negative photosensitive resin composition and touch panel material using the same |
| CN101817108A (en) * | 2010-03-24 | 2010-09-01 | 江苏大学 | Method and device for realizing photoelectrochemical micro-etch processing of masked electrode |
| CN102096534A (en) * | 2010-12-31 | 2011-06-15 | 晟光科技股份有限公司 | Production method of electrode of capacitive touch screen |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707837A (en) * | 2012-05-04 | 2012-10-03 | 牧东光电（苏州）有限公司 | Single-face multi-point touch panel and manufacture method thereof |
| CN103425302A (en) * | 2012-05-16 | 2013-12-04 | 宸鸿科技(厦门)有限公司 | Touch panel and production method thereof |
| CN103613281A (en) * | 2013-11-01 | 2014-03-05 | 深圳市海富莱电子有限公司 | Graphical method capable of forming conductive function pattern and application |
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Address after: 215126 Jiangsu Province, Suzhou City Industrial Park North Lane 8 Applicant after: Mutto Optronics Corporation Address before: 215126 Jiangsu Province, Suzhou City Industrial Park North Lane 8 Applicant before: Mutto Optronics Corporation |
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