CN102419439A - Method for distinguishing inclination of plastic packaged component chip - Google Patents
Method for distinguishing inclination of plastic packaged component chip Download PDFInfo
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- CN102419439A CN102419439A CN2011102369375A CN201110236937A CN102419439A CN 102419439 A CN102419439 A CN 102419439A CN 2011102369375 A CN2011102369375 A CN 2011102369375A CN 201110236937 A CN201110236937 A CN 201110236937A CN 102419439 A CN102419439 A CN 102419439A
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- chip
- ultrasonic scanning
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- scanning
- component chip
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- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention provides a method for distinguishing inclination of plastic packaged component chip. The method comprises the following steps: A, horizontally placing a to-be-tested component in a testing area of an ultrasonic scanning microscope, adjusting scanning parameters of the ultrasonic scanning microscope, scanning by focusing on the surface of a component chip; B, selecting four points at four corners of the to-be-tested component chip, and performing fixed-point ultrasonic scanning; C, judging whether the chip in the component inclines or not according to the sound wave propagation time or propagation distance during ultrasonic scanning at the four points. The method provided by the invention has the advantages of simple and rapid steps, and can distinguish whether the component chip inclines or not rapidly and accurately without damaging the component product.
Description
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Technical field
the present invention relates to the failure analysis field of product, and whether particularly a kind of plastic device chip the determination methods of run-off the straight.
Background technology
C-SAM is the ultrasonic scanning microscope, is very important in the industry a kind of lossless detection method.Ultrasound wave has rectilinear propagation, produces reflection at the interface and penetrates signal at different material, with the characteristic that runs into the air total reflection, sample is carried out harmless check.Ultrasound wave runs into the cavity, peels off, abnormity point or zone such as delamination when electronic devices and components encapsulation internal delivery, can produce total reflection phenomenon, and this reflection signal can normally to receive the reflection signal at matter interface obviously different with ultrasound wave.Being that ultrasonic scanning microscope board utilizes this detecting principle just, to the package quality of semiconductor components and devices, carrying out test and evaluation, is the necessary nondestructive test gimmick of present semiconductor and components and parts encapsulation industrial community.The scope that this test is dabbled has: the components and parts package quality detects, the authentication of component package moisture-sensitive degree level estimate, the unusual transition detection of encapsulation before and after other Pre-condition specimen components and parts, unusual element screening etc.
The method that whether the plastic packaging element chip tilts in
general inspection element is to cut into slices element earlier, then the distance of measured chip two ends and chip welding spot, the size of chip in addition; Calculate the angle of inclination again; This method should be destroyed element, can spend the long time again, therefore; Need a kind of new method to reach when whether detection plastic packaging element chip tilts and neither cut into slices, can judge result's purpose again fast.
Summary of the invention
Judge that in order to solve existing detection method whether the plastic packaging element chip will cut into slices during run-off the straight, and the long problem that expends time in, the present invention proposes following technical scheme:
The method of discrimination that a kind of plastic packaging element chip tilts, this method may further comprise the steps:
A, the element under test level is put into the microscopical test section of ultrasonic scanning, adjust the microscopical sweep parameter of ultrasonic scanning, focus on the surface scan of element chip;
B, on four angles of element under test chip, choose four points, do the ultrasonic scanning of fixed point;
C, the time or the propagation distance of sonic propagation during according to said four some ultrasonic scannings are judged the whether run-off the straight of chip of element internal.
as a kind of preferred version of the present invention, what fixed point scanning was adopted among the said step B is the A-SCAN mode.
The beneficial effect that
the present invention brings is: the inventive method step is simple, quick, and whether judgement is exactly made in run-off the straight to element chip fast under situation about component products not being destroyed.
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Embodiment
Set forth in the face of preferred embodiment of the present invention down in detail
, thereby so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
Present embodiment is for detecting the method for discrimination whether certain SOIC8 packaged chip tilts, and this method may further comprise the steps:
A, SOIC8 packaged chip level is put into the microscopical test section of ultrasonic scanning, adjust the microscopical sweep parameter of ultrasonic scanning, focus on the surface scan of element chip;
B, on four angles of element under test chip, choose four points, adopt the mode of A-SCAN to do fixed point scanning, record packaging body surface is respectively to the distance of chip surface: 0.956mm, 0952mm, 0.987mm, 0.991mm;
C, can judge this SOIC8 packaged chip according to the data that obtain in the above-mentioned steps.
the above; Be merely embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed, and variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (2)
1. the method for discrimination that tilts of a plastic packaging element chip, it is characterized in that: this method may further comprise the steps:
A, the element under test level is put into the microscopical test section of ultrasonic scanning, adjust the microscopical sweep parameter of ultrasonic scanning, focus on the surface scan of element chip;
B, on four angles of element under test chip, choose four points, do the ultrasonic scanning of fixed point;
C, the time or the propagation distance of sonic propagation during according to said four some ultrasonic scannings are judged the whether run-off the straight of chip of element internal.
2. the method for discrimination that a kind of plastic packaging element chip according to claim 1 tilts is characterized in that: what fixed point scanning was adopted among the said step B is the A-SCAN mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102369375A CN102419439A (en) | 2011-08-18 | 2011-08-18 | Method for distinguishing inclination of plastic packaged component chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102369375A CN102419439A (en) | 2011-08-18 | 2011-08-18 | Method for distinguishing inclination of plastic packaged component chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102419439A true CN102419439A (en) | 2012-04-18 |
Family
ID=45943938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102369375A Pending CN102419439A (en) | 2011-08-18 | 2011-08-18 | Method for distinguishing inclination of plastic packaged component chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102419439A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4618934A (en) * | 1982-12-28 | 1986-10-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Ultrasonic microscope apparatus |
| US4706185A (en) * | 1985-05-14 | 1987-11-10 | Olympus Optical Co., Ltd. | Apparatus for displaying ultrasonic image |
| JPH0219762A (en) * | 1988-07-07 | 1990-01-23 | Fuji Electric Co Ltd | Sample surface inclination adjusting device for ultrasonic microscope |
| CN201527414U (en) * | 2009-09-29 | 2010-07-14 | 中国电子科技集团公司第四十五研究所 | Ultrasonic transmit-receive unit for ultrasonic scanning microscope |
-
2011
- 2011-08-18 CN CN2011102369375A patent/CN102419439A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4618934A (en) * | 1982-12-28 | 1986-10-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Ultrasonic microscope apparatus |
| US4706185A (en) * | 1985-05-14 | 1987-11-10 | Olympus Optical Co., Ltd. | Apparatus for displaying ultrasonic image |
| JPH0219762A (en) * | 1988-07-07 | 1990-01-23 | Fuji Electric Co Ltd | Sample surface inclination adjusting device for ultrasonic microscope |
| CN201527414U (en) * | 2009-09-29 | 2010-07-14 | 中国电子科技集团公司第四十五研究所 | Ultrasonic transmit-receive unit for ultrasonic scanning microscope |
Non-Patent Citations (1)
| Title |
|---|
| 姚立新: "超声扫描检测技术在半导体封装中的应用", 《半导体技术》 * |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120418 |