CN102412465A - Surface-mount-type elastic sheet - Google Patents
Surface-mount-type elastic sheet Download PDFInfo
- Publication number
- CN102412465A CN102412465A CN2011104407579A CN201110440757A CN102412465A CN 102412465 A CN102412465 A CN 102412465A CN 2011104407579 A CN2011104407579 A CN 2011104407579A CN 201110440757 A CN201110440757 A CN 201110440757A CN 102412465 A CN102412465 A CN 102412465A
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- China
- Prior art keywords
- shell fragment
- contact
- smd
- protection portion
- egative film
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Abstract
The embodiment of the invention relates to a surface-mount-type elastic sheet which comprises a base plate, a protection part and an elastic sheet, wherein the protection part is arranged at one end of the base plate; one end of the elastic sheet is connected with the other end of the base plate; the other end of the elastic sheet is provided with a contact; the elastic sheet penetrates through the protection part, so that the protection part restricts the motions of the contact. According to the surface-mount-type elastic sheet disclosed by the embodiment of the invention, the protection part is arranged at one end of the base plate, so that the elastic sheet penetrates through the protection part, the motions of the contact are restricted by the protection part, and the surface-mount-type elastic sheet is protected from being difficult to damage and break off in the pasting and using process.
Description
Technical field
The present invention relates to the communications field, relate in particular to a kind of SMD shell fragment.
Background technology
SMD shell fragment is meant and adopts SMT (Surface Mount Technology; Surface mounting technology) chip mounter mounts and is welded to PCB (Printed Circuit Board automatically; Printed circuit board (PCB)) the compressible bent sheet metal on the mainboard, be used for the connection PCB mainboard with mount components and parts and form electric function.
At present along with electronic product to the development of portable, miniaturization, when shell fragment receives spatial constraints can not be sufficiently large, and it is higher highly to require to compare, SMD shell fragment becomes the highest device easily on the PCB mainboard, in carrying and assembling process, fracture.Fig. 1 is a SMD shell fragment of the prior art, and SMD shell fragment 10 receives external force and is easy at bending arc 101, bending arc 102, bends arc 103 places and fracture in carrying and assembling process, for the use of SMD shell fragment causes inconvenience.
Summary of the invention
The embodiment of the invention relates to a kind of SMD shell fragment, is intended to solve SMD shell fragment and in use under the effect of external force, is prone to the problem in the place's fracture of bending arc, thereby effectively prolong the useful life of SMD shell fragment.
The embodiment of the invention provides a kind of SMD shell fragment, and said SMD shell fragment comprises: egative film; Protection portion is arranged on an end of said egative film; Shell fragment, an end of said shell fragment is connected with the other end of said egative film; The other end of said shell fragment is the contact, and said shell fragment wears from said protection portion, so that said protection portion limits the action of said contact.
The SMD shell fragment that the embodiment of the invention proposes is provided with protection portion through the end at egative film, makes shell fragment wear from protection portion, utilizes the action of protection portion restriction contact, thereby protects SMD shell fragment not fragile fractureing in the process that mounts and use.
Description of drawings
Fig. 1 is the SMD shell fragment of prior art;
Fig. 2 is the SMD elastic piece structure sketch map of the embodiment of the invention;
Fig. 3 is one of stressed sketch map of SMD shell fragment of the embodiment of the invention;
Fig. 4 be the embodiment of the invention the stressed sketch map of SMD shell fragment two;
Fig. 5 be the embodiment of the invention the stressed sketch map of SMD shell fragment three;
Fig. 6 is the SMD shell fragment end view of the embodiment of the invention;
Fig. 7 is the SMD spring slice material strip structural representation of the embodiment of the invention;
Fig. 8 leaves the sketch map in the strip in for the SMD shell fragment of the embodiment of the invention.
Embodiment
Through accompanying drawing and embodiment, technical scheme of the present invention is done further detailed description below.
The embodiment of the invention has proposed a kind of SMD shell fragment, is used for the connection PCB mainboard and mounts components and parts, and concrete comprises: egative film, protection portion and shell fragment, and egative film, protection portion and shell fragment are linked in sequence and are integral; The both sides of egative film one end are connected with protection portion, and the other end of egative film is connected with shell fragment, and protection portion forms three bread to shell fragment and encloses, and restriction is played in the action of shell fragment, thereby protects SMD shell fragment not fragile.
Fig. 2 is the SMD elastic piece structure sketch map of the embodiment of the invention; As shown in Figure 2; The SMD shell fragment of the embodiment of the invention is connected with two segment protect portions 202 in the both sides of egative film 201 1 ends, and the other end of egative film 201 is connected with shell fragment 203, and the other end of shell fragment 203 is provided with contact 204.Though it is fixed that shell fragment 203 1 ends are connected with 201, the contact 204 of working as shell fragment 203 is in the time spent of doing that receives external force, and certain elastic deformation can take place shell fragment 203, thereby under the effect of external force, certain displacement takes place.Shell fragment 203 wears out from two segment protect portions 202, and two segment protect portions 202 are surrounded shell fragment 203 from three directions, and does not contact mutually between shell fragment 203 and the protection portion 202.When contact 204 received the power of all directions, mitigation can be played to the power of all directions by two segment protect portions 202, thereby protection shell fragment 203 is not fractureed.In one embodiment; As shown in Figure 2; Said shell fragment comprises the first bending arc 205 and the second bending arc 206; The said first bending arc 205 is connected with said egative film 201, and the said second bending arc 206 is between said contact 204 and the said first bending arc 205, and said SMD shell fragment wears from said protection portion 202 in said second part that bend between arc 206 and the said contact 204.
Need to prove; The egative film of SMD shell fragment, shell fragment and protection portion can adopt same material; The material that the egative film of SMD shell fragment, shell fragment and protection portion adopt is generally stainless steel, phosphor-copper or beryllium copper, and gold-plated processing can be done in the surface, and gold-plated thickness is generally 0.1mm～0.3mm.
Fig. 3 is one of stressed sketch map of SMD shell fragment of the embodiment of the invention; As shown in Figure 3; When contact 204 received object 301 along the power of X axle negative direction, protection portion 202 face 212 of shell fragment 203 dorsad can at first contact with object 301, and alleviation object 301 imposes on the power of contact 204; Thereby the displacement of restriction shell fragment 203, protection shell fragment 203 can not fracture because displacement is excessive.As shown in Figure 3 again when contact 204 receives object 302 along the power of X axle positive direction, under the effect of power, contact 204 can be moved along X axle positive direction; When a segment distance is moved in contact 204; Meeting and protection portion 202 are towards face 222 joints of shell fragment, and the face 222 of protection this moment portion 202 can be given contact 204 reciprocal power, the restriction displacement of contact 204 under the effect of the power of object 302; Thereby the displacement of restriction shell fragment 203, protection shell fragment 203 can not fracture because displacement is excessive.
Fig. 4 be the embodiment of the invention the stressed sketch map of SMD shell fragment two, as shown in Figure 4, when contact 204 receives the power along Y axle negative direction; Effect lower contact 204 in power can move down; After contact 204 moved down certain distance, when the height of the height of contact 204 peaks and the face that makes progress 232 of protection portion 202 was identical, this moment, face 232 can be shared a part of power; This moment, contact 204 did not move down, thereby protection shell fragment 203 can not fracture because displacement is excessive.When contact 204 receives the power along Y axle positive direction; Effect lower contact 204 in power can move up; After contact 204 moved up certain distance, the downward face 242 of contact 204 and protection portion 202 contacted, and this moment, face 242 can stop contact 204 to continue to move upward; Thereby the displacement of restriction shell fragment 203, protection shell fragment 203 can not fracture because displacement is excessive.
Fig. 5 be the embodiment of the invention the stressed sketch map of SMD shell fragment three; As shown in Figure 5; When contact 204 received the power along Z axle negative direction, the outside face 252 of the side of protection portion 202 can be at first contact the power that alleviation contact 204 receives with power along Z axle negative direction; Thereby the displacement of restriction shell fragment 203, protection shell fragment 203 can not fracture because displacement is excessive.During with the power that should contact 204 receives along Z axle positive direction; The outside face of the side of protection portion 202 262 can be at first contacts with power along Z axle positive direction; Alleviate the power that contact 204 receives; Thereby the displacement of restriction shell fragment 203, protection shell fragment 203 can not fracture because displacement is excessive, has effectively prolonged the useful life of SMD shell fragment.
SMD shell fragment in use, contact 204 can receive the power on a plurality of directions, causes SMD shell fragment to rupture at bending arc place, thereby influences the use of SMD shell fragment.After the SMD shell fragment of the embodiment of the invention had increased protection portion 202, when contact 204 in use received the power on a plurality of directions, restriction can play to the action of contact 204 in protection portion 202, thereby protected SMD shell fragment not in the place's fracture of bending arc.
Fig. 6 is the SMD shell fragment end view of the embodiment of the invention; As shown in Figure 6, need to keep certain between the outward flange of contact 204 and the protection portion 202 apart from a, keeping certain distance between the outward flange of contact 204 and the protection portion 202 mainly is to be used for doing an individual boss at strip; SMD shell fragment is stuck on the boss of strip; The boss of strip is played a supporting role to shell fragment, prevents SMD shell fragment in the strip medium dip, be convenient to the SMT chip mounter get smoothly the material and mount.Generally be not less than 0.50mm apart from a between the outward flange of contact and the protection portion, be not easy moulding, can't play effective supporting to SMD shell fragment simultaneously apart from the boss in the too short then strip of a.
Fig. 7 is the SMD spring slice material strip structural representation of the embodiment of the invention, and as shown in Figure 5, strip 70 is provided with groove 701, and the number of groove 701 and arrangement mode are confirmed according to the needs of reality, are not limited to number and arrangement mode in the embodiment of the invention.End at groove 701 is provided with boss 702, and the width of boss 702 is according to confirming apart from a between SMD shrapnel contact outward flange and the protection portion.
Fig. 8 leaves the sketch map in the strip in for the SMD shell fragment of the embodiment of the invention; As shown in Figure 8; The SMD shell fragment of the embodiment of the invention leaves in earlier before mounting in the groove 701 of strip 70; When mounting SMD shell fragment is taken out from groove 701, be fixed on the pad of pcb board through reflow soldering then.Preferably, egative film 201 is a plane, and the area on this plane is the best can support SMD shell fragment.The egative film 201 of SMD shell fragment is placed on the baseplane 703 of groove 701; Contact 204 is placed on the boss 702; Boss 702 just is embedded in the vacant position between contact and the protection portion; SMD shell fragment is played the good supporting effect, effectively solved the problem of SMD shell fragment, can realize stable absorption and mount in strip medium dip or upset.
The SMD shell fragment that the embodiment of the invention proposes is connected with protection portion at egative film one end; Protection portion forms one three limit to the contact and surrounds; Effectively limited the displacement of contact under the effect of all directions power, thus protect SMD shell fragment not fragile in the process that mounts and use, fracture.
Above-described embodiment; The object of the invention, technical scheme and beneficial effect have been carried out further explain, and institute it should be understood that the above is merely embodiment of the present invention; And be not used in qualification protection scope of the present invention; All within spirit of the present invention and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a SMD shell fragment is characterized in that, said SMD shell fragment comprises:
Egative film;
Protection portion is arranged on an end of said egative film;
Shell fragment, an end of said shell fragment is connected with the other end of said egative film; The other end of said shell fragment is the contact, and said shell fragment wears from said protection portion, so that said protection portion limits the action of said contact.
2. SMD shell fragment as claimed in claim 1 is characterized in that, said protection portion is centered around three limits of said contact.
3. according to claim 1 or claim 2 SMD shell fragment is characterized in that, the end of said contact does not contact with said protection portion.
4. like each described SMD shell fragment of claim 1-3, it is characterized in that the minimum range of the end of said contact and said protection portion is not less than 0.5mm.
5. like each described SMD shell fragment of claim 1-4, it is characterized in that the material of said egative film, said protection portion and said shell fragment is identical.
6. like each described SMD shell fragment of claim 1-5, it is characterized in that the material of said egative film, said protection portion and said shell fragment is stainless steel, phosphor-copper or beryllium copper.
7. SMD shell fragment as claimed in claim 6 is characterized in that, when said egative film, said protection portion and said shell fragment adopted stainless steel, phosphor-copper or beryllium copper material, gold-plated processing was done on the surface.
8. SMD shell fragment as claimed in claim 7 is characterized in that, the thickness of said surface gold-plating is 0.1～0.3mm.
9. like each described SMD shell fragment of claim 1-8; It is characterized in that; Said shell fragment comprises the first bending arc and the second bending arc; The said first bending arc is connected with said egative film, and the said second bending arc is between said contact and the said first bending arc, and said SMD shell fragment wears from said protection portion in said second part that bend between arc and the said contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104407579A CN102412465A (en) | 2011-12-26 | 2011-12-26 | Surface-mount-type elastic sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104407579A CN102412465A (en) | 2011-12-26 | 2011-12-26 | Surface-mount-type elastic sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102412465A true CN102412465A (en) | 2012-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104407579A Pending CN102412465A (en) | 2011-12-26 | 2011-12-26 | Surface-mount-type elastic sheet |
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| CN (1) | CN102412465A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201178541Y (en) * | 2007-12-25 | 2009-01-07 | 瑞虹精密工业股份有限公司 | Improved construction of surface mounted metal spring plate |
| CN101707301A (en) * | 2009-11-24 | 2010-05-12 | 中兴通讯股份有限公司 | Metal spring leaf in electronic product and connecting structure adopting same |
| CN201556714U (en) * | 2009-09-25 | 2010-08-18 | 富港电子（东莞）有限公司 | Elastic piece |
| CN101959384A (en) * | 2009-07-20 | 2011-01-26 | 陈惟诚 | Surface mounting elastic sheet with supporting section and blocking adsorption section |
| CN202282473U (en) * | 2011-09-06 | 2012-06-20 | 东莞宇龙通信科技有限公司 | Spring leaf structure |
-
2011
- 2011-12-26 CN CN2011104407579A patent/CN102412465A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201178541Y (en) * | 2007-12-25 | 2009-01-07 | 瑞虹精密工业股份有限公司 | Improved construction of surface mounted metal spring plate |
| CN101959384A (en) * | 2009-07-20 | 2011-01-26 | 陈惟诚 | Surface mounting elastic sheet with supporting section and blocking adsorption section |
| CN201556714U (en) * | 2009-09-25 | 2010-08-18 | 富港电子（东莞）有限公司 | Elastic piece |
| CN101707301A (en) * | 2009-11-24 | 2010-05-12 | 中兴通讯股份有限公司 | Metal spring leaf in electronic product and connecting structure adopting same |
| CN202282473U (en) * | 2011-09-06 | 2012-06-20 | 东莞宇龙通信科技有限公司 | Spring leaf structure |
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Application publication date: 20120411 |