CN102412256A - Packaged image sensor, formation method thereof and method for reducing flare phenomenon of packaged image sensor - Google Patents
Packaged image sensor, formation method thereof and method for reducing flare phenomenon of packaged image sensor Download PDFInfo
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- CN102412256A CN102412256A CN2011103352352A CN201110335235A CN102412256A CN 102412256 A CN102412256 A CN 102412256A CN 2011103352352 A CN2011103352352 A CN 2011103352352A CN 201110335235 A CN201110335235 A CN 201110335235A CN 102412256 A CN102412256 A CN 102412256A
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Abstract
The invention provides a method for reducing the flare phenomenon of a packaged image sensor. The packaged image sensor comprises a photosensitive layer and optical glass, the photosensitive layer is provided with a photosensitive region and a non-photosensitive region, and the optical glass is positioned on the photosensitive layer, and comprises a first region positioned on the photosensitive region and a second region positioned on the non-photosensitive region. The method includes the following steps: the optical glass is processed, a light-absorbing material layer is formed on the second region, or the surface roughness of the second region is higher than the surface roughness of the first region. The invention also provides the packaged image sensor and a formation method thereof. Since the optical glass upon the photosensitive region can normally transmit light, the image sensor absolutely can work normally; and the optical glass upon the non-photosensitive region can effectively absorb light or diffusely reflect light, and thereby can effectively reduce the flare phenomenon.
Description
Technical field
The invention belongs to field of image sensors, relate in particular to a kind of method that reduces the imageing sensor glare phenomenon of encapsulation.
Background technology
Along with the raising of design level and technological level, be largely increased with the image quality of the cmos image sensor of CIS technology encapsulation, range of application is more and more wider.The encapsulation of CIS is divided into several kinds of CLCC, PLCC, CSP, COB or the like, and the characteristics that wherein CSP (Chip Scale Package) encapsulation is low with cost, yield is high and minimizing plate face takies obtain widely applying.CSP is the unique utilizable technology of the extensive encapsulation of the crystal wafer chip dimension of CMOS and CCD image sensor, optical inductor and other multiple induction installations so far.The characteristics of this encapsulation comprise unique miniature sizes, the remarkable optical property and the reduction of whole module cost; It can be used for comprising mobile phone, scanner in the middle of the product of multiple terminal client; Portable mobile electronic device such as digital camera, Medical Devices etc.
The CSP encapsulating structure of imageing sensor is as shown in Figure 1, generally includes silicon base 10, is formed on the photosensitive layer (not shown, it is arranged in the surface of Fig. 1 silicon base 10) on the silicon base, and hide the optical glass 30 at photosensitive layer.Wherein, the cavity 20 shown in figure can be set between photosensitive layer and the optical glass 30, be provided with a plurality of lenticules 25 that are used to converge light in the cavity 20.Photosensitive layer comprises photosensitive region (it is positioned under the lenticule 25 substantially) that is covered by a plurality of photosensitive units and the non-photosensitive region that is positioned at the edge.The another side of silicon base 10 is formed with a plurality of BGA soldered balls 40, with convenient and extraneous the electric connection.But, find that in practice the imageing sensor glare phenomenon of encapsulation is more obvious like this, influences picture quality.
Thereby, necessary above-mentioned defective is improved.
Summary of the invention
The purpose of this invention is to provide a kind of method that reduces the imageing sensor glare phenomenon of encapsulation.
Another object of the present invention provides a kind of method that forms the imageing sensor of encapsulation, and it can reduce glare phenomenon.
A purpose more of the present invention provides a kind of imageing sensor of encapsulation, and it can reduce glare phenomenon.
For realizing above-mentioned purpose; The present invention provides a kind of method of avoiding or reducing the imageing sensor glare phenomenon of encapsulation; The imageing sensor of said encapsulation comprises the photosensitive layer with photosensitive region and non-photosensitive region; And being positioned at the optical glass on the said photosensitive layer, said optical glass comprises first area that is positioned on the photosensitive region and the second area that is positioned at non-photosensitive region; Said method comprises:
Second area to being positioned at said optical glass is handled, and on said second area, forming the light absorbent layer, or the surface roughness that makes said second area is greater than said first area.
Optional, the treatment step of formation light absorbent layer on said second area comprises:
On said optical glass, cover light absorbent;
Utilize mask to remove the light absorbent on the said first area of said optical glass.
Optional, said mask is a photoresist.
Optional, the treatment step of formation light absorbent layer on said second area comprises:
On said optical glass, form the photoresist of patterning, said photoresist covers the said first area of said optical glass, and exposes the said second area of said optical glass;
Cover light absorbent being formed with on the optical glass of photoresist;
Remove said photoresist.
Optional, the material of said light absorbent layer is a photosensitive-ink.
Optional, make the treatment step of the surface roughness of said second area greater than said first area, comprising:
Utilize mask to protect the said first area of said optical glass, and expose the said second area of said optical glass;
Utilize dry method or wet etching to make said second area roughening.
Optional, the said optical glass surface roughness of said second area is less than 40um.
Optional, in said dry etching, utilize in inert gas, air, nitrogen, oxygen, fluorocarbon gases and the hydrocarbon gas one or more as plasma source.
Optional, in said dry etching, the mist that utilizes argon gas and carbon tetrafluoride composition is as plasma source; In said wet etching, utilize hydrofluoric acid to make said second area roughening.
For realizing above-mentioned purpose, the present invention also provides a kind of method that forms the imageing sensor of encapsulation, comprising:
Substrate is provided;
On said substrate, form photosensitive layer, said photosensitive layer has photosensitive region and non-photosensitive region;
On said photosensitive layer, optical glass is set;
Said optical glass is carried out foregoing method.
For realizing above-mentioned purpose, the present invention also provides a kind of method that forms the imageing sensor of encapsulation, comprising:
Substrate is provided;
On said substrate, form photosensitive layer, said photosensitive layer has photosensitive region and non-photosensitive region;
To be arranged on through the optical glass that preceding method was handled on the said photosensitive layer.
For realizing above-mentioned purpose, the present invention provides a kind of imageing sensor of encapsulation in addition, comprising:
Photosensitive layer comprises non-photosensitive region and the photosensitive region that is provided with photosensitive unit;
Optical glass is positioned on said photosensitive region and the said non-photosensitive region;
The light absorbent layer is positioned on the surface of said optical glass away from said photosensitive layer, and exposes photosensitive region, so that light can get into photosensitive region.
Optional, said optical glass also is provided with the light absorbent layer near on the surface of said photosensitive layer.
Optional, the imageing sensor of said encapsulation is a CSP encapsulation type imageing sensor.
Optional, said imageing sensor is a cmos image sensor.
Optional, the material of said light absorbent layer is a photosensitive-ink.
Optional, said light absorbent layer is by a plurality of layers of sandwich construction of forming that are used to absorb different light rays.
For realizing above-mentioned purpose, the present invention provides a kind of imageing sensor of encapsulation in addition, comprising:
Photosensitive layer comprises non-photosensitive region and the photosensitive region that is provided with photosensitive unit;
Optical glass is positioned on said photosensitive region and the said non-photosensitive region, and the surface roughness that wherein is positioned at the optical glass zone on the non-photosensitive region is greater than the optical glass zone that is positioned on the photosensitive region.
Optional, the surface roughness that is positioned at the optical glass zone on the non-photosensitive region is less than 40um.
Compared with prior art, the present invention has the following advantages: because the normal printing opacity of optical glass of photosensitive region top, institute's image taking sensor fully can operate as normal; The optical glass of non-photosensitive region top can absorb light well or make light generation diffuse reflection, and then can effectively reduce glare phenomenon.
Description of drawings
Fig. 1 is the structural representation of the imageing sensor of CSP type encapsulation.
Fig. 2 to 3 is principle schematic that the glare phenomenon that provides of inventor produces reason.
Fig. 4 is the method flow diagram of the reduction glare phenomenon that provides of first execution mode.
Fig. 5 to 7 is the structural representations that form the imageing sensor of encapsulation according to method shown in Figure 4.
Fig. 8 is the method flow diagram of the reduction glare phenomenon that provides of second execution mode.
Fig. 9 is the sketch map of optical glass and atmosphere plasma equipment.
Figure 10 to 11 is the structural representations that form the imageing sensor of encapsulation according to method shown in Figure 8.
Embodiment
When the experience glare phenomenon seriously influenced this problem of picture quality, can be considered to usually was the reason of camera lens basically, thereby only can address this problem from camera lens usually.But the inventor thinks that for the packaged type that on photosensitive layer, is coated with optical glass, dazzle also has the very important source of another one, and that is exactly that this layer optical glass is to reflection of incident light.
Based on above-mentioned cognition; The inventor proposes a kind of method of avoiding or reducing the imageing sensor glare phenomenon of encapsulation; The imageing sensor of said encapsulation comprises the photosensitive layer with photosensitive region and non-photosensitive region; And being positioned at the optical glass on the said photosensitive layer, said optical glass comprises first area that is positioned on the photosensitive region and the second area that is positioned at non-photosensitive region; The said method of avoiding or reducing the imageing sensor glare phenomenon of encapsulation comprises: the second area to being positioned at said optical glass is handled; On said second area, forming the light absorbent layer, or the surface roughness that makes said second area is greater than said first area.Actual test result shows that also the above-mentioned processing to optical glass carries out promptly on said second area, form the light absorbent layer, or the surface roughness that makes said second area can significantly reduce glare phenomenon really greater than said first area.
Set forth detail in the following description so that make much of the present invention.But the present invention can be different from alternate manner described here and implements with multiple, and those skilled in the art can do similar popularization under the situation of intension of the present invention.Therefore the present invention does not receive the restriction of following disclosed embodiment.
First execution mode
Please with reference to Fig. 4, it is the flow chart of steps of method of avoiding or reduce the imageing sensor glare phenomenon of encapsulation according to first embodiment of the invention.At first, shown in step S11, be provided the semiconductor-based end 100, be formed with photosensitive layer (not shown) on this semiconductor-based end 100.The structure that forms is as shown in Figure 5.Because the needs of considering and encapsulating of product self function design, photosensitive layer is divided into two zones, the photosensitive region that is positioned at central authorities, forms by a plurality of photosensitive units, and be positioned at non-photosensitive region all around.In the present embodiment, the photosensitive unit that is positioned at photosensitive region is the photosensitive unit of CMOS (CMOS conductor) type.The photosensitive layer top can also be provided with cavity 120, is provided with a plurality of lenticules 125 that are used to converge light in the cavity 120, and the photosensitive region of photosensitive layer is positioned under the lenticule 125 substantially.
Shown in step S13, on photosensitive layer, be provided with or form optical glass 130, this optical glass 130 hides the photosensitive region and the non-photosensitive region of photosensitive layer.The structure that forms is as shown in Figure 6.Be the convenience of subsequent descriptions, optical glass 130 zones that are positioned on the photosensitive region are referred to as the first area, and optical glass 130 zones that are positioned on the non-photosensitive region are referred to as second area.
Then, shown in step S15, said optical glass 130 is handled, on said second area, to form light absorbent layer 160.The structure that forms is as shown in Figure 7.
Here form the treatment step of light absorbent layer 160, specifically can comprise: on said optical glass 130, cover light absorbent, the method for covering can be physical vapour deposition (PVD) or chemical vapour deposition (CVD), and preferable light absorbent can be a photosensitive-ink.Under the prerequisite that does not influence overall performance, also can select other light absorbent commonly used for use.In addition, for realizing preferable extinction effect, the light absorbent layer can be by a plurality of layers of sandwich construction of forming that are used to absorb different light rays.Afterwards, spin coating photoresist on light absorbent only keeps photoresist after graphical on second area, utilize patterned photoresist as mask, removes the light absorbent on the said first area of said optical glass 130; After having removed the light absorbent of first area, and then remove photoresist.
Also can adopt diverse ways to form above-mentioned light absorbent layer 160.Such as, the photoresist of formation patterning on said optical glass 130, said photoresist covers the said first area of said optical glass 130, and exposes the said second area of said optical glass 130; Then, cover light absorbent being formed with on the optical glass of photoresist.Because the existence of photoresist, the top, first area does not have light absorbent and covers.After light absorbent layer 160 forms, can utilize wet method to remove patterned photoresist.
After optical glass 130 carried out above-mentioned processing, shown in step S17, can carry out follow-up step so that image sensor package is good.The encapsulation here is preferably the encapsulation of CSP (Chip Scale Package) type.Certainly, also can adopt other packaged type.
In the present embodiment, optical glass 130 only depends on a side of nearly incident light to be provided with light absorbent layer 160.But in other embodiments, the both sides of optical glass 130 can be provided with similar light absorbent layer 160.
Explaining a bit, is after optical glass 130 is placed on photosensitive layer here, just on optical glass 130, forms light absorbent layer 160.This is also nonessential, can otherwise replace fully.Such as, earlier optical glass is handled, make its follow-up part formation light absorbent layer that is used to hide non-photosensitive region; Then, the optical glass after directly will handling covers photosensitive layer.Because the formation of light absorbent layer can not be mixed in the formation and encapsulation step of imageing sensor, thereby the formation technogenic influence that this method can be avoided the light absorbent layer is to imageing sensor.
Second execution mode
Please with reference to Fig. 8, it is the flow chart of steps of method of avoiding or reduce the imageing sensor glare phenomenon of encapsulation according to second embodiment of the invention.And please be simultaneously with reference to Fig. 9, it is the sketch map of optical glass and atmosphere plasma equipment.At first; Shown in step 21, optical glass 230 is provided, this optical glass 230 comprises two zones; I.e. back extended meeting is placed on the first area on the photosensitive region of photosensitive layer; Back extended meeting is placed on the second area on the non-photosensitive region of photosensitive layer, and wherein the first area of optical glass 230 is protected by mask (for example photoresist), and it is outer and not protected that the second area of optical glass 230 is exposed to mask.Then, shown in step 22, optical glass 230 is placed in the reaction zone 6, wherein, optical glass 230 is placed on the platform 5 and its surface is positioned under the plasma gun 2.
Then, shown in step 23, provide plasma to come from the reaction zone 6.Plasma source can be inert gas, air, nitrogen, oxygen, fluorocarbon gases and hydrocarbon gas etc. at least one of them.Wherein, inert gas for example is helium, neon, argon gas, krypton gas, and air for example is that (clean dry air, CDA), fluorocarbon gases for example is carbon tetrafluoride (CF to clean dry air
4), hydrocarbon gas for example is acetylene (C
2H
2).
In addition, technology of the present invention is not limited thereto.Optical glass 230 is being carried out in the surface treatment process, can arrange in pairs or groups to obtain preferable effect with optical glass 230 as the gas that plasma source uses.For example, plasma source uses argon gas argon), optical glass can obtain preferable effect.
Then, shown in step 24, the pressure of keeping in the reaction zone 6 are normal pressure, and the pressure of just keeping in the reaction zone 6 drag about ear (torr) 760, apply the electric field back ejection formation plasma 4 that in plasma gun 2 in, will dissociate as the gas of plasma source.But technology of the present invention is not limited thereto, and when the pressure in the reaction zone 6 is maintained between the 100torr to 760torr, still can reach effect of the present invention.
Then, shown in step 25, the surface of handling optical glass 230 with plasma 4 is with said second area roughening.Because the pressure in the reaction zone 6 maintains about atmospheric pressure, the plasma ion concentration that the plasma ion concentration ratio that produces in the reaction zone 6 produces under environment under low pressure is higher.Therefore, the ion bombardment that atmospheric pressure plasma produced, thermal effect and etching effect are also more obvious, therefore can form uniform micro-protuberance structure on the not protected surface of optical glass 100 (being second area).After micro-protuberance structure on the second area forms, can remove the protection mask of surface, first area.
The above-mentioned steps 21～25 of present embodiment is preferably in an atmospheric pressure plasma system carries out, and does not limit the execution sequence of each step.Wherein, the atmospheric plasma system can produce one of them kind of atmospheric pressure plasma glow discharge (glow discharge), atmospheric pressure jet plasma (jet plasma), atmospheric pressure plasma torch (plasma torch), atmospheric pressure surface dielectric medium discharge different plasma kenels such as (surface dielectric barrier discharge).
Please with reference to Figure 10, it is the sketch map through the optical glass of atmospheric plasma treatment.Optical glass 230 after treatment, its light entrance face have the micro-protuberance structure 231 of a plurality of periodicity nano-scale.Preferably, micro-protuberance structure 231 be encapsulated in optical glass 230 surface mutually roughness less than 40um (micron).Roughness is that (atomic force microscopy AFM) measures with AFM in the present embodiment.
Subsequently, shown in step 26, optical glass 230 is placed on the photosensitive layer 200a, wherein the first area of optical glass 230 is positioned at the photosensitive region top of photosensitive layer 200a, and the second area of optical glass 230 is positioned at the non-photosensitive region top of photosensitive layer 200a.Afterwards, can carry out follow-up step so that image sensor package is good.
Explaining a bit, is to form rough region at optical glass earlier here, then optical glass is positioned over photosensitive layer and encapsulates.Under the situation that environment allows, also can be earlier with the optical glass setting or be formed on the photosensitive layer, then optical glass is carried out aforementioned processing to form rough region.
What adopt here in addition, is dry etching.In other embodiments, also can take wet etching to become coarse with the specific region at optical glass, the solution that etching is used can be hydrofluoric acid (HF).
Though the present invention with preferred embodiment openly as above; But it is not to be used for limiting the present invention; Any those skilled in the art are not breaking away from the spirit and scope of the present invention; Can utilize the method and the technology contents of above-mentioned announcement that technical scheme of the present invention is made possible change and modification, therefore, every content that does not break away from technical scheme of the present invention; To any simple modification, equivalent variations and modification that above embodiment did, all belong to the protection range of technical scheme of the present invention according to technical spirit of the present invention.
Claims (19)
1. method of avoiding or reducing the imageing sensor glare phenomenon of encapsulation; The imageing sensor of said encapsulation comprises the photosensitive layer with photosensitive region and non-photosensitive region; And being positioned at the optical glass on the said photosensitive layer, said optical glass comprises first area that is positioned on the photosensitive region and the second area that is positioned at non-photosensitive region; It is characterized in that said method comprises:
Second area to being positioned at said optical glass is handled, and on said second area, forming the light absorbent layer, or the surface roughness that makes said second area is greater than said first area.
2. the method for claim 1 is characterized in that, on said second area, forms the treatment step of light absorbent layer, comprising:
On said optical glass, cover light absorbent;
Utilize mask to remove the light absorbent on the said first area of said optical glass.
3. method as claimed in claim 2 is characterized in that, said mask is a photoresist.
4. the method for claim 1 is characterized in that, on said second area, forms the treatment step of light absorbent layer, comprising:
On said optical glass, form the photoresist of patterning, said photoresist covers the said first area of said optical glass, and exposes the said second area of said optical glass;
Cover light absorbent being formed with on the optical glass of photoresist;
Remove said photoresist.
5. like each described method of claim 1 to 4, it is characterized in that the material of said light absorbent layer is a photosensitive-ink.
6. the method for claim 1 is characterized in that, makes the treatment step of the surface roughness of said second area greater than said first area, comprising:
Utilize mask to protect the said first area of said optical glass, and expose the said second area of said optical glass;
Utilize dry method or wet etching to make said second area roughening.
7. method as claimed in claim 6 is characterized in that, the said optical glass surface roughness of said second area is less than 40um.
8. method as claimed in claim 6 is characterized in that, in said dry etching, utilizes in inert gas, air, nitrogen, oxygen, fluorocarbon gases and the hydrocarbon gas one or more as plasma source.
9. method as claimed in claim 6 is characterized in that, in said dry etching, the mist that utilizes argon gas and carbon tetrafluoride composition is as plasma source; In said wet etching, utilize hydrofluoric acid to make said second area roughening.
10. a method that forms the imageing sensor of encapsulation is characterized in that, comprising:
Substrate is provided;
On said substrate, form photosensitive layer, said photosensitive layer has photosensitive region and non-photosensitive region;
On said photosensitive layer, optical glass is set;
Said optical glass is carried out like each described method of claim 1 to 9.
11. a method that forms the imageing sensor of encapsulation is characterized in that, comprising:
Substrate is provided;
On said substrate, form photosensitive layer, said photosensitive layer has photosensitive region and non-photosensitive region;
To be arranged on the said photosensitive layer through the optical glass that each said method of claim 1 to 9 was handled.
12. the imageing sensor of an encapsulation is characterized in that, comprising:
Photosensitive layer comprises non-photosensitive region and the photosensitive region that is provided with photosensitive unit;
Optical glass is positioned on said photosensitive region and the said non-photosensitive region;
The light absorbent layer is positioned on the surface of said optical glass away from said photosensitive layer, and exposes photosensitive region, so that light can get into photosensitive region.
13. the imageing sensor of encapsulation as claimed in claim 12 is characterized in that, said optical glass also is provided with the light absorbent layer near on the surface of said photosensitive layer.
14. the imageing sensor of encapsulation as claimed in claim 12 is characterized in that, the imageing sensor of said encapsulation is a CSP encapsulation type imageing sensor.
15. the imageing sensor of encapsulation as claimed in claim 12 is characterized in that, said imageing sensor is a cmos image sensor.
16. the imageing sensor of encapsulation as claimed in claim 12 is characterized in that, the material of said light absorbent layer is a photosensitive-ink.
17. the imageing sensor of encapsulation as claimed in claim 12 is characterized in that, said light absorbent layer is by a plurality of layers of sandwich construction of forming that are used to absorb different light rays.
18. the imageing sensor of an encapsulation is characterized in that, comprising:
Photosensitive layer comprises non-photosensitive region and the photosensitive region that is provided with photosensitive unit;
Optical glass is positioned on said photosensitive region and the said non-photosensitive region, and the surface roughness that wherein is positioned at the optical glass zone on the non-photosensitive region is greater than the optical glass zone that is positioned on the photosensitive region.
19. the imageing sensor of encapsulation as claimed in claim 18 is characterized in that, the surface roughness that is positioned at the optical glass zone on the non-photosensitive region is less than 40um.
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Application publication date: 20120411 |