CN102409322B - 一种陶瓷元件局部表面化学镀NiP-Cu电极制造工艺 - Google Patents
一种陶瓷元件局部表面化学镀NiP-Cu电极制造工艺 Download PDFInfo
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- CN102409322B CN102409322B CN 201110364229 CN201110364229A CN102409322B CN 102409322 B CN102409322 B CN 102409322B CN 201110364229 CN201110364229 CN 201110364229 CN 201110364229 A CN201110364229 A CN 201110364229A CN 102409322 B CN102409322 B CN 102409322B
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- 238000007747 plating Methods 0.000 title claims abstract description 58
- 239000000919 ceramic Substances 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000002994 raw material Substances 0.000 claims abstract description 16
- 238000001035 drying Methods 0.000 claims abstract description 9
- 238000007639 printing Methods 0.000 claims abstract description 5
- 238000007788 roughening Methods 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 26
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 24
- 238000001994 activation Methods 0.000 claims description 24
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- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 12
- 239000002002 slurry Substances 0.000 claims description 11
- 238000007772 electroless plating Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 238000006555 catalytic reaction Methods 0.000 claims description 9
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- -1 nitrogenous compound Chemical class 0.000 claims description 9
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- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- 238000007669 thermal treatment Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 6
- 238000011056 performance test Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 3
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 3
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 3
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 3
- 229910018104 Ni-P Inorganic materials 0.000 claims description 3
- 229910018536 Ni—P Inorganic materials 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
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- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 229920002301 cellulose acetate Polymers 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 3
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 claims description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 3
- 150000002815 nickel Chemical class 0.000 claims description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims description 3
- 239000001230 potassium iodate Substances 0.000 claims description 3
- 235000006666 potassium iodate Nutrition 0.000 claims description 3
- 229940093930 potassium iodate Drugs 0.000 claims description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical group CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 3
- SONJTKJMTWTJCT-UHFFFAOYSA-K rhodium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Rh+3] SONJTKJMTWTJCT-UHFFFAOYSA-K 0.000 claims description 3
- YBCAZPLXEGKKFM-UHFFFAOYSA-K ruthenium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Ru+3] YBCAZPLXEGKKFM-UHFFFAOYSA-K 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 229940065287 selenium compound Drugs 0.000 claims description 3
- 150000003343 selenium compounds Chemical class 0.000 claims description 3
- 239000001488 sodium phosphate Substances 0.000 claims description 3
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 3
- PODWXQQNRWNDGD-UHFFFAOYSA-L sodium thiosulfate pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[O-]S([S-])(=O)=O PODWXQQNRWNDGD-UHFFFAOYSA-L 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- XOGGUFAVLNCTRS-UHFFFAOYSA-N tetrapotassium;iron(2+);hexacyanide Chemical compound [K+].[K+].[K+].[K+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] XOGGUFAVLNCTRS-UHFFFAOYSA-N 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
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- 239000000126 substance Substances 0.000 abstract description 8
- 239000010953 base metal Substances 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 abstract description 3
- 238000005234 chemical deposition Methods 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
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- 238000005516 engineering process Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
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- 239000004332 silver Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 4
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- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
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Abstract
Description
40℃/10min | 40℃/20min | 50℃/10min | 50℃/20min | |
样品拉力 | 3N | 5N | 7N | 10N |
日期 | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
3.30 | 235 | 227 | 220 | 264 | 247 | 260 | 270 | 241 | 233 | 238 |
4.28 | 235 | 227 | 221 | 264 | 247 | 260 | 270 | 241 | 233 | 238 |
5.25 | 236 | 229 | 221 | 266 | 249 | 262 | 270 | 242 | 234 | 238 |
6.29 | 237 | 231 | 222 | 269 | 251 | 264 | 271 | 244 | 235 | 241 |
7.27 | 239 | 232 | 233 | 270 | 251 | 265 | 272 | 246 | 236 | 242 |
8.31 | 240 | 231 | 223 | 270 | 251 | 265 | 272 | 246 | 235 | 241 |
Claims (1)
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CN 201110364229 CN102409322B (zh) | 2011-11-16 | 2011-11-16 | 一种陶瓷元件局部表面化学镀NiP-Cu电极制造工艺 |
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CN 201110364229 CN102409322B (zh) | 2011-11-16 | 2011-11-16 | 一种陶瓷元件局部表面化学镀NiP-Cu电极制造工艺 |
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CN102409322A CN102409322A (zh) | 2012-04-11 |
CN102409322B true CN102409322B (zh) | 2013-12-25 |
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CN105839159B (zh) * | 2016-05-23 | 2018-08-03 | 中山恒亿电镀有限公司 | 一种聚乙烯塑料电镀工艺 |
CN106282978A (zh) * | 2016-08-31 | 2017-01-04 | 上海芮远化学科技有限公司 | 用于在陶瓷上制作导体线路的离子钯活化液及其制备方法 |
CN106399982A (zh) * | 2016-08-31 | 2017-02-15 | 潍坊歌尔精密制造有限公司 | 一种陶瓷表面导体线路的制作方法 |
CN106637156B (zh) * | 2016-12-23 | 2019-03-05 | 贵州黎阳航空动力有限公司 | 一种复杂钛合金零件局部化学镀镍方法 |
CN107723691A (zh) * | 2017-09-25 | 2018-02-23 | 江苏时瑞电子科技有限公司 | 一种化学镀制备铜电极负温度系数热敏电阻的方法 |
CN111641016A (zh) * | 2020-04-30 | 2020-09-08 | 深圳第三代半导体研究院 | 一种陶瓷滤波器表面电极制备方法 |
Citations (2)
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CN101093743A (zh) * | 2007-05-25 | 2007-12-26 | 甘跃 | 一种用于聚合物热敏电阻制造的电解铜箔生产方法 |
CN101429655A (zh) * | 2008-11-28 | 2009-05-13 | 天津大学 | 热敏电阻表面局部化学镀制造良好欧姆接触电极方法 |
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JPH099482A (ja) * | 1995-06-14 | 1997-01-10 | Otsuka Chem Co Ltd | 過電流保護回路素子 |
JPH1022104A (ja) * | 1996-07-04 | 1998-01-23 | Murata Mfg Co Ltd | 正特性サーミスタ |
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Patent Citations (2)
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CN101093743A (zh) * | 2007-05-25 | 2007-12-26 | 甘跃 | 一种用于聚合物热敏电阻制造的电解铜箔生产方法 |
CN101429655A (zh) * | 2008-11-28 | 2009-05-13 | 天津大学 | 热敏电阻表面局部化学镀制造良好欧姆接触电极方法 |
Non-Patent Citations (1)
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JP特开平10-22104A 1998.01.23 |
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