CN102409304A - Method for coating films on focusing mirrors - Google Patents
Method for coating films on focusing mirrors Download PDFInfo
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- CN102409304A CN102409304A CN2011101567928A CN201110156792A CN102409304A CN 102409304 A CN102409304 A CN 102409304A CN 2011101567928 A CN2011101567928 A CN 2011101567928A CN 201110156792 A CN201110156792 A CN 201110156792A CN 102409304 A CN102409304 A CN 102409304A
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- turntable
- focusing mirror
- plated film
- film coating
- film
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Abstract
The invention discloses a method for coating films on focusing mirrors. The method comprises the following steps: 1. putting focusing mirrors to undergo film coating on a horizontal rotary table uniformly and selecting a target; 2. ensuring a marked position indication sign to be in an initial position before film coating; 3. sealing a vacuum chamber and starting a vacuum acquirement system; 4. filling a reacting gas; 5. keeping a baffle of a magnetron sputtering target closed and switching on a sputtering power supply to begin pre-sputtering; 6. setting the rotating speed of the rotary table while opening the baffle and starting the rotation of the rotary table to begin film coating timing at the moment; and 7. when the film coating time is achieved and the position indication sign returns to the initial position, immediately closing the baffle and then switching off the sputtering power supply and stopping the rotation of the rotary table to coating films on the focusing mirrors. The problem that the thickness of the films coated on the focusing mirrors is nonuniform is solved by using the method.
Description
Technical field
The present invention relates to the plated film field, relate in particular to a kind of film coating method that is used for solar energy electrical part focusing mirror.
Background technology
The structure of solar energy electrical part focusing mirror 2 is a spherical crown shape, and is as shown in Figure 1, all around in the plane be projected as square, the cross section is a circular arc, the centre is a circular hole 101.The sphere vacuum is coated with the uniform highly reflecting films of a layer thickness within it, and spherical outside surface does not allow plated film.Film coating method commonly used is evaporation and magnetron sputtering technology, and because of magnetron sputtering plating has good uniformity, sedimentation velocity high conformity, the characteristics that controllability is strong become optimal selection.But because the structure of focusing mirror and the singularity of PVD coating apparatus; The focusing mirror of every batch of different positions is different with respect to the position of magnetron sputtering target; Therefore; The sedimentary thicknesses of layers of the different sites of each focusing mirror and single focusing mirror is different in unit time; Especially sull optical property such as TiO2 is very responsive to thickness, causes after the coating workpiece or its different sites to present non-uniform phenomenons such as yellow, redness, blueness, and hence one can see that, and to solve film thickness uniformity be the key point of coating process.
Summary of the invention
The objective of the invention is to propose a kind of film coating method that is used for solar energy electrical part focusing mirror, solved the problem of film thickness uniformity.
The object of the invention will be achieved through following technical scheme:
A kind of film coating method of focusing mirror may further comprise the steps:
Step 1: a plurality of focusing mirrors to be coated are positioned on the turntable of a level equably, and said turntable is arranged in the vacuum chamber that is provided with a magnetron sputtering target on the inwall at least, chooses Coating Materials as target;
Step 2: position indicator of the mark on the said turntable of step 1 makes said position indicator be in a starting position before plated film begins;
Step 3: the sealed vacuum chamber, start vacuum acquiring system, vacuum tightness reaches and is higher than 8.0 * 10 in the vacuum chamber
-4Pa;
Step 4: feed reactant gases, make the vacuum tightness in the vacuum chamber reach 0.5Pa～0.01Pa;
Step 5: keep the flapper closure of magnetron sputtering target, open shielding power supply and begin preparatory sputter, set sedimentation rate in 10 dusts/second～50 dust/second;
Step 6: the rotating speed that turntable is set guarantees the focusing mirror running steadily on the one hand at 5 rev/mins～20 rev/mins, guarantees at the number of times of plated film effective coating film area of each focusing mirror process in the time abundant on the other hand; Open baffle plate and the rotation that starts turntable simultaneously, this moment, the plated film timing began;
Step 7: confirm the plated film time according to coating film thickness; When timing reaches the plated film time, and the described position indicator of step 2 is closed baffle plate when reverting to starting position immediately; Close shielding power supply and the rotation that stops turntable again, promptly accomplish the plated film of focusing mirror.
Preferably; The film coating method of above-mentioned focusing mirror; Wherein: the center of the regular polygon that focusing mirror surrounds described in the step 1 overlaps with the center of circle of said turntable, guarantees that the parallel and distance of the target face of plated film face and magnetron sputtering target of each focusing mirror equates.
Preferably, the film coating method of above-mentioned focusing mirror, wherein: the target of said magnetron sputtering target is Ti, Si, TiO
2Perhaps SiO
2Among any.
Preferably; The film coating method of above-mentioned focusing mirror; Wherein: reactant gases described in the step 4 is argon gas and oxygen, and the ratio of said argon gas and oxygen is 0.3: 1～1: 1, guarantees to generate stable oxide; And the specific refractory power of this oxide compound is suitable, can accomplish high reflection function together with other retes.
The inventive method is utilized magnetron sputtering technology, and deposition process is easy to control, and plated film efficient is high, can on focusing mirror, plate out meet the coating process requirement, the uniform highly reflecting films of film thickness.The present invention confirms starting position according to position indicator; Be beginning with position indicator at this starting position during each plated film; Return this starting position again for ending; As a plated film cycle; Purpose is to let each focusing mirror equate through the number of times or the time of the magnetron sputtering target of work, guarantees that the coating film thickness of focusing mirror of every batch of each position is all the same, eliminates the problem of the non-uniform film thickness of the different focusing mirrors that cause owing to the starting position difference or same focusing mirror different sites.
Following constipation closes the embodiment accompanying drawing, and specific embodiments of the invention is done further to detail, so that technical scheme of the present invention is easier to understand, grasp.
Description of drawings
Fig. 1 is the structural representation of focusing mirror;
Fig. 2 is the structural representation of the embodiment of the invention 1.
Embodiment
The film coating method of a kind of focusing mirror of present embodiment, as shown in Figure 2, may further comprise the steps:
Step 1: four focusing mirrors to be coated 1 are positioned over equably on the turntable 2 of a level; Turntable 2 is arranged in the vacuum chamber 4 that an inwall is provided with a magnetron sputtering target 3; The center of the regular polygon that focusing mirror 1 surrounds overlaps with the center of circle of turntable 2, guarantees that the plated film face of each focusing mirror 1 and distance parallel with the target face of magnetron sputtering target 3 equates; Choose Ti or TiO
2Coating Materials is as target;
Step 2: position indicator 5 of the mark on the turntable 2 of step 1 makes said position indicator 5 be in a starting position before plated film begins;
Step 3: sealed vacuum chamber 4, start vacuum acquiring system, vacuum tightness reaches and is higher than 8.0 * 10 in the vacuum chamber 4
-4Pa;
Step 4: feed reactant gases argon gas and oxygen, and the ratio of said argon gas and oxygen is 0.3: 1～1: 1, makes vacuum chamber 4 interior vacuum tightnesss reach 0.5Pa～0.01Pa;
Step 5: keep the flapper closure of magnetron sputtering target 3, open shielding power supply and begin preparatory sputter, set sedimentation rate in 10 dusts/second～50 dust/second;
Step 6: the rotating speed that turntable 2 is set is opened baffle plate and the rotation that starts turntable 2 simultaneously at 5 rev/mins～20 rev/mins, and this moment, the plated film timing began;
Step 7: confirm the plated film time according to coating film thickness; When timing reaches the plated film time, and the described position indicator 5 of step 2 is closed baffle plate when reverting to starting position immediately; Close shielding power supply and the rotation that stops turntable 2 again, promptly accomplish the plated film of focusing mirror 1.
Use the every batch products qualification rate of present embodiment and reach 100%, and reflectivity is all greater than 96%.The present embodiment method is utilized magnetron sputtering technology; Effective coating film area 6 of magnetron sputtering is distributed in certain zone of vacuum chamber 4, in this zone, and sedimentation rate approximately equal everywhere; Sedimentation rate is stable; Deposition process is easy to control, and plated film efficient is high, can on focusing mirror, plate out meet the coating process requirement, the uniform highly reflecting films of film thickness.Present embodiment is confirmed starting position according to position indicator 5; Be beginning with position indicator 5 at this starting position during each plated film; Return this starting position again for ending; As a plated film cycle; Purpose is to let each focusing mirror 1 equate through the number of times or the time of the magnetron sputtering target 3 of work, guarantees that the coating film thickness of focusing mirror 1 of every batch of each position is all the same, eliminates the problem of the non-uniform film thickness of the different focusing mirrors 1 that cause owing to the starting position difference or same focusing mirror 1 different sites.
The method of present embodiment is similar with embodiment 1, and difference is that the target of magnetron sputtering target is Si or SiO
2So, repeat no more.
The present invention still has numerous embodiments, and all employing equivalents or equivalent transformation and all technical schemes of forming all drop within protection scope of the present invention.
Claims (4)
1. the film coating method of a focusing mirror is characterized in that may further comprise the steps:
Step 1: a plurality of focusing mirrors to be coated are positioned on the turntable of a level equably, and said turntable is arranged in the vacuum chamber that is provided with a magnetron sputtering target on the inwall at least, chooses Coating Materials as target;
Step 2: position indicator of the mark on the said turntable of step 1 makes said position indicator be in a starting position before plated film begins;
Step 3: the sealed vacuum chamber, start vacuum acquiring system, vacuum tightness reaches 8.0 * 10 in the vacuum chamber
- 4More than the Pa;
Step 4: feed reactant gases, make the vacuum tightness in the vacuum chamber reach 0.5Pa～0.01Pa;
Step 5: keep the flapper closure of magnetron sputtering target, open shielding power supply and begin preparatory sputter, set sedimentation rate in 10 dusts/second～50 dust/second;
Step 6: the rotating speed that turntable is set is opened baffle plate and the rotation that starts turntable simultaneously at 5 rev/mins～20 rev/mins, and this moment, the plated film timing began;
Step 7: confirm the plated film time according to coating film thickness; When timing reaches the plated film time, and the described position indicator of step 2 is closed baffle plate when reverting to starting position immediately; Close shielding power supply and the rotation that stops turntable again, promptly accomplish the plated film of focusing mirror.
2. the film coating method of focusing mirror according to claim 1, it is characterized in that: the center of the regular polygon that focusing mirror surrounds described in the step 1 overlaps with the center of circle of said turntable.
3. the film coating method of focusing mirror according to claim 1, it is characterized in that: the target of said magnetron sputtering target is Ti, Si, TiO
2Perhaps SiO
2Among any.
4. the film coating method of focusing mirror according to claim 3, it is characterized in that: reactant gases described in the step 4 is argon gas and oxygen, and the ratio of said argon gas and oxygen is 0.3: 1～1: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101567928A CN102409304A (en) | 2011-06-13 | 2011-06-13 | Method for coating films on focusing mirrors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101567928A CN102409304A (en) | 2011-06-13 | 2011-06-13 | Method for coating films on focusing mirrors |
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| Publication Number | Publication Date |
|---|---|
| CN102409304A true CN102409304A (en) | 2012-04-11 |
Family
ID=45911638
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101567928A Pending CN102409304A (en) | 2011-06-13 | 2011-06-13 | Method for coating films on focusing mirrors |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108203808A (en) * | 2017-10-25 | 2018-06-26 | 同济大学 | Improve the method and device of X ray reflection mirror uniformity of film and production efficiency |
| CN110699653A (en) * | 2019-10-30 | 2020-01-17 | 哈尔滨工业大学 | Metal film preparation device and method suitable for polyhedral reflector |
| CN113186502A (en) * | 2020-06-30 | 2021-07-30 | 南京三乐集团有限公司 | Method for uniformly plating copper on surfaces of multiple spiral lines through magnetron sputtering |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1611631A (en) * | 2003-10-28 | 2005-05-04 | 柯尼卡美能达精密光学株式会社 | Spattering device |
| CN101100740A (en) * | 2007-08-02 | 2008-01-09 | 哈尔滨工业大学 | Method for preparing magnetron sputtering hemisphere film |
| CN101315435A (en) * | 2007-06-01 | 2008-12-03 | 哈尔滨工业大学 | High reflection film of silicon carbide reflection mirror within visible light wave range, and its production method |
-
2011
- 2011-06-13 CN CN2011101567928A patent/CN102409304A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1611631A (en) * | 2003-10-28 | 2005-05-04 | 柯尼卡美能达精密光学株式会社 | Spattering device |
| CN101315435A (en) * | 2007-06-01 | 2008-12-03 | 哈尔滨工业大学 | High reflection film of silicon carbide reflection mirror within visible light wave range, and its production method |
| CN101100740A (en) * | 2007-08-02 | 2008-01-09 | 哈尔滨工业大学 | Method for preparing magnetron sputtering hemisphere film |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108203808A (en) * | 2017-10-25 | 2018-06-26 | 同济大学 | Improve the method and device of X ray reflection mirror uniformity of film and production efficiency |
| CN110699653A (en) * | 2019-10-30 | 2020-01-17 | 哈尔滨工业大学 | Metal film preparation device and method suitable for polyhedral reflector |
| CN110699653B (en) * | 2019-10-30 | 2021-08-03 | 哈尔滨工业大学 | Metal film preparation device and method suitable for polyhedral reflector |
| CN113186502A (en) * | 2020-06-30 | 2021-07-30 | 南京三乐集团有限公司 | Method for uniformly plating copper on surfaces of multiple spiral lines through magnetron sputtering |
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Application publication date: 20120411 |