CN102403423B - Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same - Google Patents
Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same Download PDFInfo
- Publication number
- CN102403423B CN102403423B CN201110369534.8A CN201110369534A CN102403423B CN 102403423 B CN102403423 B CN 102403423B CN 201110369534 A CN201110369534 A CN 201110369534A CN 102403423 B CN102403423 B CN 102403423B
- Authority
- CN
- China
- Prior art keywords
- led chip
- fluorescent
- colloid layer
- led
- preparation technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The embodiment of the invention discloses a preparation technology for an LED fluorescent adhesive layer and a packaging structure formed by using same. The technology comprises a coating step of uniformly coating a fluorescent adhesive to a metal base plate or a ceramic base plate with an LED chip, a covering step of pressing a transparent adhesive body layer by a mould or covering a cover body on the LED chip to cover the LED chip, and a washing step of spraying a washing liquid to the uncovered position to wash away the coated fluorescent adhesive. According to the preparation technology and the packaging structure provided by the embodiment of the invention, the processes of coating the fluorescent adhesive, covering the LED chip and spraying the washing liquid to the fluorescent adhesive at the uncovered position for washing are carried out, so that the automation level is high, the production speed of LED is fast, the efficiency is enhanced, the fluorescent powder adhesive body layers are uniformly and wholly covered on the LED chip, light colors of the products are uniform, the yield and the output rate are both increased and the production cost is reduced.
Description
Technical field
The present invention relates to LED encapsulation field, the encapsulating structure that relates in particular to a kind of LED fluorescent adhesive layer preparation technology and adopt this technique to be packaged into.
Background technology
LED is the luminescent device that a class can be directly visible ray by electric energy conversion, has operating voltage low, little power consumption, the series of characteristics such as luminous efficiency is high, the response time is short, lightweight, volume is little and cost is low, and development is advanced by leaps and bounds.
What at present LED industry applied on LED that fluorescent glue mainly adopts is dosing technology, fluorescent material is mixed according to a certain ratio, stirred with colloid (as silica gel or epoxy resin etc.), then with fine needle head class instrument, be coated on chip surface, ideally formed the coating of similar spherical crown shape.There is obvious fault of construction in the coating of this painting method and generation, first, in practical operation, no matter be manual or machine operation, with the fluorescent glue coating between batch LED, all can have certain difference in shape, its uniformity and consistency are all poor, certainly will bring colourity difference larger between device, even there will be fluorescent glue can not cover the situation of LED chip upper surface very little comprehensively, also affected the luminous flux of LED.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, a kind of LED fluorescent adhesive layer preparation technology is provided, so that fluorescent powder colloid layer is evenly covered in LED chip all sidedly, obtains the emergent light of uniformity.
In order to solve the problems of the technologies described above, the embodiment of the present invention has proposed a kind of LED fluorescent adhesive layer preparation technology, comprising: coating step: fluorescent glue is coated on equably on the metal substrate or ceramic substrate of intrinsic LED chip; Hide step: mold pressing transparent colloid layer or covering cover body are to cover in described LED chip on described LED chip; Cleaning step: to unsheltered position jet cleaning liquid, the described fluorescent glue applying to wash described position.
On the other hand, the embodiment of the present invention also provides a kind of employing encapsulating structure that technique is packaged into as mentioned above, comprise substrate, be fixed on LED chip and the transparent colloid layer of described substrate one side, also comprise: be evenly coated on the fluorescent powder colloid layer on described LED chip outer surface, and described transparent colloid layer is covered in described fluorescent powder colloid layer outside.
The LED fluorescent adhesive layer preparation technology of the embodiment of the present invention and the beneficial effect of encapsulating structure are: by cover in LED chip after applying fluorescent glue, and the fluorescent glue jet cleaning liquid of unsheltered position is cleaned, automaticity is high, the speed of producing LED is fast, efficiency is high, and fluorescent powder colloid layer is evenly covered in LED chip all sidedly, the photochromic uniformity of product, yields and shipment rate all get a promotion, and have reduced production cost; In addition, can also from clean gained mixture, extract fluorescent glue component, to carry out material recycling.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the single package structure of the embodiment of the present invention.
Fig. 2 is the schematic diagram of the support after the coating fluorescent glue of the embodiment of the present invention.
Fig. 3 is the schematic diagram that the embodiment of the present invention is cleaned the fluorescent glue of unsheltered position after mold pressing transparent colloid layer.
Fig. 4 is the local enlarged diagram after the fluorescent glue of the embodiment of the present invention cleans.
Embodiment
Please refer to Fig. 1 ~ Fig. 4, the encapsulating structure that the embodiment of the present invention provides comprises: substrate 10, LED chip 20, fluorescent powder colloid layer 30 and transparent colloid layer 40.
Described substrate 10 can be metal substrate or ceramic substrate.
Described LED chip 20 is fixed on a side of substrate 10.
Described fluorescent powder colloid layer 30 is on LED chip 20 outer surfaces, evenly to apply one deck fluorescent glue forming; Further, the upper surface of described fluorescent powder colloid layer 30 is the plane that is parallel to LED chip 20 upper surfaces; Said structure feature has guaranteed encapsulating structure light source space colour temperature uniformity, higher luminous flux and reliability.
Described transparent colloid layer 40 is layer of silica gel, is hemispherical, is also called lens, and mold pressing forms and be covered in described fluorescent powder colloid layer 30 outside.The frontal projected area of described fluorescent powder colloid layer 30 on described substrate 10 corresponding flats is less than or equal to the frontal projected area of described transparent colloid layer 40, and upper surface is square, circular or oval.
Technique corresponding to the embodiment of the present invention is the LED fluorescent adhesive layer preparation technology in LED encapsulation process, described LED encapsulation process also comprises the steps such as die bond, bonding wire and encapsulated moulding, these steps be prior art and with technical problem to be solved by this invention without contacting directly, therefore will not be described in detail in the present invention.
Described LED fluorescent adhesive layer preparation technology comprises: coating step: on support 100, fluorescent glue is coated on equably to the surface of substrate 10 and LED chip 20, wherein, described surface not only comprises the outer surface of described substrate 10 and LED chip 20, also comprise the position that described substrate 10 and LED chip 20 are not set on the corresponding surface of described support 100, the support 100 after coating fluorescent glue as shown in Figure 2; Hide step: mold pressing transparent colloid layer 40 or covering cover body are to cover in described LED chip 20 on described LED chip 20; And cleaning step: to unsheltered position jet cleaning liquid, the described fluorescent glue applying to wash described position.
Described cleaning step also comprises mixing sub-step: stir after described cleaning fluid, pass into and utilize compressed air to spray.Wherein, while hiding the covering of step use cover body, after corresponding cleaning step, mold pressing transparent colloid layer 40 on described LED chip 20 also, the frontal projected area of the covering part that the frontal projected area of the transparent colloid layer 40 of described mold pressing is more than or equal to described cover body on described substrate 10 corresponding flats; Described cleaning fluid ejects fast from the ozzle of playpipe 200, described cleaning fluid is for washing away the solid particle of described fluorescent glue and the mixed solution of cleaning solvent, described solid particle is green silicon carbide, black silicon carbide, brown corundum, white fused alumina or plastic grain etc., and cleaning solvent is water or other chemical cleaning solvent.
Below in conjunction with embodiment, specific implementation of the present invention is described in detail:
The first execution mode of the present invention: be mainly mold pressing transparent colloid layer 40 on LED chip 20 and be cleaned to prevent the fluorescent glue applying on described LED chip 20, comprising:
Coating step: on support 100, fluorescent glue is coated on equably to the surface of substrate 10 and LED chip 20.
Hide step: mold pressing transparent colloid layer 40 is to cover in described LED chip 20 on described LED chip 20.
Cleaning step: cleaning fluid is stirred, pass into and utilize compressed air to spray unsheltered position, the described fluorescent glue applying to wash described position.
In above-mentioned the first execution mode, corresponding to mold pressing transparent colloid layer 40 floor space, be circular, described fluorescent powder colloid layer 30 upper surface are also circular.
The second execution mode of the present invention: with the main distinction of the first execution mode for to cover cover body to cover in described LED chip 20 to prevent that having applied fluorescent glue on described LED chip 20 is cleaned on LED chip 20, present embodiment is after corresponding cleaning step, mold pressing transparent colloid layer 40 on described LED chip 20 also, mold pressing transparent colloid layer 40 is carried out after moving to described cleaning step.Described the second execution mode comprises:
Coating step: on support 100, fluorescent glue is coated on equably to the surface of substrate 10 and LED chip 20.
Hide step: at described LED chip 20, cover cover body to cover in described LED chip 20, wherein, the special fixture of described cover body for making in advance.
Cleaning step: cleaning fluid is stirred, pass into and utilize compressed air to spray unsheltered position, the described fluorescent glue applying to wash described position.
In above-mentioned the second execution mode, the covering part corresponding surface of the area of described fluorescent powder colloid layer 30 and shape and cover body is long-pending and shape is identical, for example the cover-up surface correspondingly-shaped of cover body is square, circular or oval, and described fluorescent powder colloid layer 30 upper surface are also square, circular or oval.
To sum up; the LED fluorescent adhesive layer preparation technology of the embodiment of the present invention; the main technology that is similar to wet shotcrete technology that adopts is carried out surface clean; after the cleaning fluid that is mixed with solid particle stirs, solid particle can sharpening, and the cleaning fluid of ejection washes away facing to the fluorescent glue that does not hide position at a high speed; can produce collision and friction; cleaning performance is good, and meanwhile, the cleaning fluid that the powder being reamed and the dirt being removed and particle itself can be flowed rinses out.Because described LED fluorescent adhesive layer preparation technology is to the support 100 whole disposable coating fluorescent glues in surface, and adopt the cleaning fluid that is mixed with solid particle of high pressure to clean, automaticity of the present invention is high, the speed of producing LED is fast, efficiency is high, and fluorescent powder colloid layer 30 is evenly covered in LED chip 20 all sidedly, the photochromic uniformity of product, yields and shipment rate all get a promotion, and have reduced production cost; In addition, can also from clean gained mixture, extract fluorescent glue component, to carry out material recycling.
The above is the specific embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (3)
1. a LED fluorescent adhesive layer preparation technology, is characterized in that, comprising:
Coating step: fluorescent glue is coated on equably on the metal substrate or ceramic substrate of intrinsic LED chip;
Hide step: mold pressing transparent colloid layer or covering cover body are to cover in described LED chip on described LED chip;
Cleaning step: to unsheltered position jet cleaning liquid, the described fluorescent glue applying to wash described position,
While hiding the covering of step use cover body, after corresponding cleaning step, mold pressing transparent colloid layer on described LED chip also, the frontal projected area of the covering part that the frontal projected area of the transparent colloid layer of described mold pressing is more than or equal to described cover body on described substrate corresponding flat
The final encapsulating structure that forms, only comprise substrate, be fixed on LED chip, the transparent colloid layer of described substrate one side, and be evenly coated on the fluorescent powder colloid layer on described LED chip outer surface, and described transparent colloid layer is covered in described fluorescent powder colloid layer outside.
2. LED fluorescent adhesive layer preparation technology as claimed in claim 1, is characterized in that, described cleaning step comprises:
Mix sub-step: stir after described cleaning fluid, pass into and utilize compressed air to spray.
3. LED fluorescent adhesive layer preparation technology as claimed in claim 1, is characterized in that, described cleaning fluid is for washing away the solid particle of described fluorescent glue and the mixed solution of cleaning solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110369534.8A CN102403423B (en) | 2011-11-18 | 2011-11-18 | Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110369534.8A CN102403423B (en) | 2011-11-18 | 2011-11-18 | Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102403423A CN102403423A (en) | 2012-04-04 |
| CN102403423B true CN102403423B (en) | 2014-10-29 |
Family
ID=45885426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110369534.8A Expired - Fee Related CN102403423B (en) | 2011-11-18 | 2011-11-18 | Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102403423B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684075A (en) * | 2017-02-16 | 2017-05-17 | 张虹 | High-light efficiency light source assembly and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1707817A (en) * | 2004-06-11 | 2005-12-14 | 浙江古越龙山电子科技发展有限公司 | White bias to blue paster type light-emitting diode and producing method thereof |
| CN101465328A (en) * | 2007-12-21 | 2009-06-24 | 深圳富泰宏精密工业有限公司 | Encapsulation of LED and method of manufacturing the same |
| CN102005522A (en) * | 2010-11-30 | 2011-04-06 | 杭州彩虹光电有限公司 | LED gel sealing technology |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100392879C (en) * | 2004-02-23 | 2008-06-04 | 弘元科技有限公司 | Light-emitting device and making method thereof, making system, packaging device and light emitting source, backlight module and display device |
| CN101030610B (en) * | 2006-03-05 | 2011-06-15 | 浙江古越龙山电子科技发展有限公司 | Large-power light-emitting diodes and its fluorescent-powder coating method |
| US8067120B2 (en) * | 2006-03-24 | 2011-11-29 | Panasonic Corporation | Non-aqueous electrolyte secondary battery |
| JP2009152338A (en) * | 2007-12-20 | 2009-07-09 | Yuri Kagi Kofun Yugenkoshi | Method for manufacturing light emitting diode |
-
2011
- 2011-11-18 CN CN201110369534.8A patent/CN102403423B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1707817A (en) * | 2004-06-11 | 2005-12-14 | 浙江古越龙山电子科技发展有限公司 | White bias to blue paster type light-emitting diode and producing method thereof |
| CN101465328A (en) * | 2007-12-21 | 2009-06-24 | 深圳富泰宏精密工业有限公司 | Encapsulation of LED and method of manufacturing the same |
| CN102005522A (en) * | 2010-11-30 | 2011-04-06 | 杭州彩虹光电有限公司 | LED gel sealing technology |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2009-152338A 2009.07.09 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102403423A (en) | 2012-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101740707B (en) | Preformed fluorescent powder patch and method for encapsulating same and light emitting diode | |
| CN101807659B (en) | Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure | |
| CN106876534B (en) | A kind of packaging method of flip-chip grade LED light source | |
| CN105720164B (en) | A kind of preparation method of white light LEDs | |
| WO2014101602A1 (en) | Led packaging structure using distant fluorescent powder layer and manufacturing method thereof | |
| CN101533786A (en) | Method for eliminating air bubble in chip adhesion rubber layer encapsulated by semiconductor | |
| CN102218391A (en) | Plane coating method of fluorescent glue in package of white-light LED | |
| CN102403423B (en) | Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same | |
| CN103165797A (en) | Preformed phosphor thin film for white light-emitting diode (LED) thin film packaging and preparation method for thin film | |
| CN102931328B (en) | A kind of preparation method of LED packaging body | |
| CN107681041A (en) | A kind of LED car lamp method for packing | |
| CN105870298A (en) | Packaging method of LED light source | |
| CN108305932A (en) | A kind of specular removal white light LAMP-LED structures and packaging method | |
| CN202332962U (en) | LED (light-emitting diode) packaging structure | |
| CN205564742U (en) | Mix wavelength purple light LED | |
| CN110429170A (en) | It is a kind of to use the cured chip device packaging technology of ultraviolet light | |
| CN110459481A (en) | The packaging method of semiconductor element and its to position mould | |
| CN205790054U (en) | EMC upside-down mounting support adds a package lens structure | |
| CN102431951B (en) | Double-carrier and double-MEMS (micro-electro-mechanical systems) device package and production method thereof | |
| CN101572287B (en) | Method for actively packaging blue light LED chip based white light LED | |
| CN101582482A (en) | Method for covering fluorescent layer on surface of LED chip | |
| CN102263189A (en) | Manufacturing method of LED device | |
| CN105374923A (en) | Five-side light emission LED packaging structure and preparation method therefor | |
| CN103489994B (en) | A kind of strong cohesive property, high reliability White-light LED chip | |
| CN104347785A (en) | Die-method fluorescent powder adhesive layer coating process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171012 Address after: The Town Lake Anxi County of Quanzhou City, Fujian province 362411 Photoelectric Industrial Park Patentee after: FUJIAN LIGHTNING OPTOELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 South Road community should be one stone Wentao Science Park building B Patentee before: Lighting Optoectronic(SZ) Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20191118 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |