CN102403423A - Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same - Google Patents
Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same Download PDFInfo
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- CN102403423A CN102403423A CN2011103695348A CN201110369534A CN102403423A CN 102403423 A CN102403423 A CN 102403423A CN 2011103695348 A CN2011103695348 A CN 2011103695348A CN 201110369534 A CN201110369534 A CN 201110369534A CN 102403423 A CN102403423 A CN 102403423A
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Abstract
The embodiment of the invention discloses a preparation technology for an LED fluorescent adhesive layer and a packaging structure formed by using same. The technology comprises a coating step of uniformly coating a fluorescent adhesive to a metal base plate or a ceramic base plate with an LED chip, a covering step of pressing a transparent adhesive body layer by a mould or covering a cover body on the LED chip to cover the LED chip, and a washing step of spraying a washing liquid to the uncovered position to wash away the coated fluorescent adhesive. According to the preparation technology and the packaging structure provided by the embodiment of the invention, the processes of coating the fluorescent adhesive, covering the LED chip and spraying the washing liquid to the fluorescent adhesive at the uncovered position for washing are carried out, so that the automation level is high, the production speed of LED is fast, the efficiency is enhanced, the fluorescent powder adhesive body layers are uniformly and wholly covered on the LED chip, light colors of the products are uniform, the yield and the output rate are both increased and the production cost is reduced.
Description
Technical field
The present invention relates to the LED encapsulation field, the encapsulating structure that relates in particular to a kind of LED fluorescence glue-line preparation technology and adopt this technology to be packaged into.
Background technology
Series of characteristics such as LED is one type of luminescent device that can directly electric energy be converted into visible light, and it is low to have operating voltage, and little power consumption, luminous efficiency are high, the response time is short, in light weight, volume is little and cost is low, development is advanced by leaps and bounds.
What at present the LED industry applied on LED that fluorescent glue mainly adopts is dosing technology; Fluorescent material is mixed, stirs according to certain proportioning with colloid (like silica gel or epoxy resin etc.); With fine needle head kind tool it is coated on chip surface then, ideal situation forms the coating of similar spherical crown shape down.There is tangible fault of construction in the coating of this painting method and generation, at first, and in practical operation; No matter be manual or machine operation; Fluorescent glue coating with between batch LED all can have certain difference in shape, and its uniformity and consistency are all relatively poor, certainly will bring colourity difference bigger between device; Even the situation that fluorescent glue can not cover the led chip upper surface very little comprehensively can appear, also influenced the luminous flux of LED.
Summary of the invention
Embodiment of the invention technical problem to be solved is, a kind of LED fluorescence glue-line preparation technology is provided, so that the fluorescent powder colloid layer evenly is covered in led chip all sidedly, obtains the emergent light of uniformity.
In order to solve the problems of the technologies described above, the embodiment of the invention has proposed a kind of LED fluorescence glue-line preparation technology, comprising: coating step: fluorescent glue is coated on equably on the metal substrate or ceramic substrate of intrinsic led chip; Hide step: mold pressing transparent colloid layer or covering cover body are to cover in said led chip on said led chip; Cleaning step: to unsheltered position jet cleaning liquid, to wash the said fluorescent glue that said position applies.
On the other hand; The embodiment of the invention also provides a kind of employing encapsulating structure of being packaged into of technology as stated; Comprise substrate, be fixed on the led chip and the transparent colloid layer of said substrate one side; Also comprise: evenly be coated on the fluorescent powder colloid layer on the said led chip outer surface, and said transparent colloid layer is covered in said fluorescent powder colloid layer outside.
The LED fluorescence glue-line preparation technology of the embodiment of the invention and the beneficial effect of encapsulating structure are: through after applying fluorescent glue, covering in led chip, and the fluorescent glue jet cleaning liquid of unsheltered position is cleaned, automaticity is high; The speed of producing LED is fast; Efficient is high, and the fluorescent powder colloid layer evenly is covered in led chip all sidedly, the photochromic uniformity of product; Yields and shipment rate all get a promotion, and have reduced production cost; In addition, the fluorescent glue component can also from clean the gained mixture, be extracted, to carry out the material recycling.
Description of drawings
Fig. 1 is the sketch map of the single encapsulating structure of the embodiment of the invention.
Fig. 2 is the sketch map of the support behind the coating fluorescent glue of the embodiment of the invention.
Fig. 3 is the sketch map that the embodiment of the invention is cleaned the fluorescent glue of unsheltered position behind mold pressing transparent colloid layer.
Fig. 4 is the local enlarged diagram after the fluorescent glue of the embodiment of the invention cleans.
Embodiment
Please refer to Fig. 1 ~ Fig. 4, the encapsulating structure that the embodiment of the invention provided comprises: substrate 10, led chip 20, fluorescent powder colloid layer 30 and transparent colloid layer 40.
Said substrate 10 can be metal substrate or ceramic substrate.
Said led chip 20 is fixed on a side of substrate 10.
Said fluorescent powder colloid layer 30 is on led chip 20 outer surfaces, evenly to apply one deck fluorescent glue that forms; Further, the upper surface of said fluorescent powder colloid layer 30 is the plane that is parallel to led chip 20 upper surfaces; The said structure characteristic has guaranteed encapsulating structure light source space colour temperature uniformity, higher luminous flux and reliability.
Said transparent colloid layer 40 is a silica gel layer, is hemispherical, also is called lens, and mold pressing forms and be covered in said fluorescent powder colloid layer 30 outside.The frontal projected area of said fluorescent powder colloid layer 30 on said substrate 10 corresponding flats is smaller or equal to the frontal projected area of said transparent colloid layer 40, and upper surface is square, circular or oval.
The corresponding technology of the embodiment of the invention is the LED fluorescence glue-line preparation technology in the LED encapsulation process; Said LED encapsulation process also comprises steps such as solid crystalline substance, bonding wire and encapsulated moulding; These steps are prior art and do not have with technical problem to be solved by this invention and to contact directly, so will not do detailed description among the present invention.
Said LED fluorescence glue-line preparation technology comprises: coating step: on support 100; Fluorescent glue is coated on equably the surface of substrate 10 and led chip 20; Wherein, Said surface not only comprises the outer surface of said substrate 10 and led chip 20, also comprises the position that said substrate 10 and led chip 20 are not set on the said support 100 corresponding surfaces, and the support 100 behind the coating fluorescent glue is as shown in Figure 2; Hide step: mold pressing transparent colloid layer 40 or covering cover body are to cover in said led chip 20 on said led chip 20; And cleaning step: to unsheltered position jet cleaning liquid, to wash the said fluorescent glue that said position applies.
Said cleaning step also comprises the blend sub step: behind the said cleaning fluid that stirs, feed and utilize compressed air to spray.Wherein, When hiding the covering of step use cover body; After the cleaning step of correspondence; Mold pressing transparent colloid layer 40 on said led chip 20 also, the frontal projected area of the transparent colloid layer 40 of said mold pressing is more than or equal to the frontal projected area of covering part on said substrate 10 corresponding flats of said cover body; Said cleaning fluid ejects from the ozzle of playpipe 200 fast; Said cleaning fluid is to be used to wash away the solid particle of said fluorescent glue and the mixed solution of cleaning solvent; Said solid particle is green silicon carbide, black silicon carbide, brown corundum, white fused alumina or plastic grain etc., and cleaning solvent is water or other chemical cleaning solvent.
Below in conjunction with embodiment concrete realization of the present invention is described in detail:
First execution mode of the present invention: be mainly at mold pressing transparent colloid layer 40 on the led chip 20 and be cleaned, comprising to prevent on the said led chip 20 fluorescent glue that applies:
Coating step: on support 100, fluorescent glue is coated on equably the surface of substrate 10 and led chip 20.
Hide step: mold pressing transparent colloid layer 40 is to cover in said led chip 20 on said led chip 20.
Cleaning step: cleaning fluid is stirred, feed and utilize compressed air that unsheltered position is sprayed, to wash the said fluorescent glue that said position applies.
In above-mentioned first execution mode, be circular corresponding to mold pressing transparent colloid layer 40 floor space, said fluorescent powder colloid layer 30 upper surface also are circular.
Second execution mode of the present invention: with the main distinction of first execution mode for covering cover body on the led chip 20 to cover in said led chip 20 to prevent that having applied fluorescent glue on the said led chip 20 is cleaned; This execution mode is after the cleaning step of correspondence; Mold pressing transparent colloid layer 40 on said led chip 20 also, mold pressing transparent colloid layer 40 are carried out after moving to said cleaning step.Said second execution mode comprises:
Coating step: on support 100, fluorescent glue is coated on equably the surface of substrate 10 and led chip 20.
Hide step: cover cover body to cover in said led chip 20 at said led chip 20, wherein, the special fixture of said cover body for making in advance.
Cleaning step: cleaning fluid is stirred, feed and utilize compressed air that unsheltered position is sprayed, to wash the said fluorescent glue that said position applies.
In above-mentioned second execution mode; The area of said fluorescent powder colloid layer 30 and shape are long-pending with the covering part corresponding surface of cover body and shape is identical; For example the cover-up surface correspondingly-shaped of cover body is square, circular or oval, and then said fluorescent powder colloid layer 30 upper surface also are square, circular or oval.
To sum up, the LED fluorescence glue-line preparation technology of the embodiment of the invention, the main technology that is similar to wet shotcrete technology that adopts is carried out surface clean; After the cleaning fluid that is mixed with solid particle stirred, solid particle can sharpening, and the cleaning fluid of ejection washes away facing to the fluorescent glue that does not hide the position at a high speed; Can produce collision and friction; Cleaning performance is good, and simultaneously, the powder that is reamed can be rinsed out by the cleaning fluid that flows with dirt that is removed and particle itself.Because said LED fluorescence glue-line preparation technology is to the whole disposable coating fluorescent glues in support 100 surfaces, and adopts the cleaning fluid that is mixed with solid particle of high pressure to clean, automaticity of the present invention is high; The speed of producing LED is fast; Efficient is high, and fluorescent powder colloid layer 30 evenly is covered in led chip 20 all sidedly, the photochromic uniformity of product; Yields and shipment rate all get a promotion, and have reduced production cost; In addition, the fluorescent glue component can also from clean the gained mixture, be extracted, to carry out the material recycling.
The above is an embodiment of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; Can also make some improvement and retouching, these improvement and retouching also are regarded as protection scope of the present invention.
Claims (8)
1. a LED fluorescence glue-line preparation technology is characterized in that, comprising:
Coating step: fluorescent glue is coated on equably on the metal substrate or ceramic substrate of intrinsic led chip;
Hide step: mold pressing transparent colloid layer or covering cover body are to cover in said led chip on said led chip;
Cleaning step: to unsheltered position jet cleaning liquid, to wash the said fluorescent glue that said position applies.
2. LED fluorescence glue-line preparation technology as claimed in claim 1 is characterized in that said cleaning step comprises:
Blend sub step: behind the said cleaning fluid that stirs, feed and utilize compressed air to spray.
3. LED fluorescence glue-line preparation technology as claimed in claim 1; It is characterized in that; When hiding the covering of step use cover body; After the cleaning step of correspondence, mold pressing transparent colloid layer on said led chip also, the frontal projected area of the transparent colloid layer of said mold pressing is more than or equal to the frontal projected area of covering part on said substrate corresponding flat of said cover body.
4. LED fluorescence glue-line preparation technology as claimed in claim 1 is characterized in that said cleaning fluid is to be used to wash away the solid particle of said fluorescent glue and the mixed solution of cleaning solvent.
5. encapsulating structure that adopts technology according to claim 1 to be packaged into; Comprise substrate, be fixed on the led chip and the transparent colloid layer of said substrate one side; It is characterized in that; Said encapsulating structure also comprises: evenly be coated on the fluorescent powder colloid layer on the said led chip outer surface, and said transparent colloid layer is covered in said fluorescent powder colloid layer outside.
6. encapsulating structure as claimed in claim 5 is characterized in that, the frontal projected area of said fluorescent powder colloid layer on said substrate corresponding flat is smaller or equal to the frontal projected area of said transparent colloid layer.
7. encapsulating structure as claimed in claim 5 is characterized in that, the upper surface of said fluorescent powder colloid layer is the plane that is parallel to the led chip upper surface.
8. encapsulating structure as claimed in claim 5 is characterized in that, said fluorescent powder colloid layer upper surface is square, circular or oval.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110369534.8A CN102403423B (en) | 2011-11-18 | 2011-11-18 | Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same |
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| CN201110369534.8A CN102403423B (en) | 2011-11-18 | 2011-11-18 | Preparation technology for LED fluorescent adhesive layer and packaging structure formed by the same |
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| CN102403423A true CN102403423A (en) | 2012-04-04 |
| CN102403423B CN102403423B (en) | 2014-10-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684075A (en) * | 2017-02-16 | 2017-05-17 | 张虹 | High-light efficiency light source assembly and preparation method thereof |
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| JP2009152338A (en) * | 2007-12-20 | 2009-07-09 | Yuri Kagi Kofun Yugenkoshi | Method for manufacturing light emitting diode |
| CN102005522A (en) * | 2010-11-30 | 2011-04-06 | 杭州彩虹光电有限公司 | LED gel sealing technology |
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2011
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| CN1691359A (en) * | 2004-02-23 | 2005-11-02 | 弘元科技有限公司 | Light-emitting device and making method thereof, making system, packaging device and light emitting source, backlight module and display device |
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| CN106684075A (en) * | 2017-02-16 | 2017-05-17 | 张虹 | High-light efficiency light source assembly and preparation method thereof |
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| CN102403423B (en) | 2014-10-29 |
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Effective date of registration: 20171012 Address after: The Town Lake Anxi County of Quanzhou City, Fujian province 362411 Photoelectric Industrial Park Patentee after: FUJIAN LIGHTNING OPTOELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 South Road community should be one stone Wentao Science Park building B Patentee before: Lighting Optoectronic(SZ) Co., Ltd. |
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