CN102403314A - 双极cmos工艺中的有源区边墙及制造方法 - Google Patents
双极cmos工艺中的有源区边墙及制造方法 Download PDFInfo
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- CN102403314A CN102403314A CN2010102755351A CN201010275535A CN102403314A CN 102403314 A CN102403314 A CN 102403314A CN 2010102755351 A CN2010102755351 A CN 2010102755351A CN 201010275535 A CN201010275535 A CN 201010275535A CN 102403314 A CN102403314 A CN 102403314A
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104699344A (zh) * | 2015-03-30 | 2015-06-10 | 京东方科技集团股份有限公司 | 触控面板及其制造方法、触控显示装置 |
CN104752314A (zh) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | 一种具有sti结构的半导体器件及制备方法 |
Citations (5)
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US20020197806A1 (en) * | 2000-03-13 | 2002-12-26 | Toshiharu Furukawa | Methods using disposable and permanent films for diffusion and implantation doping |
KR100760925B1 (ko) * | 2006-09-20 | 2007-09-21 | 동부일렉트로닉스 주식회사 | 반도체 소자 형성방법 |
CN101290879A (zh) * | 2007-04-17 | 2008-10-22 | 中芯国际集成电路制造(上海)有限公司 | 栅极的制造方法 |
CN101364537A (zh) * | 2007-08-09 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 栅极及半导体器件的制造方法、用于制造栅极的结构 |
US20090186475A1 (en) * | 2008-01-21 | 2009-07-23 | Shyh-Fann Ting | Method of manufacturing a MOS transistor |
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- 2010-09-08 CN CN201010275535.1A patent/CN102403314B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020197806A1 (en) * | 2000-03-13 | 2002-12-26 | Toshiharu Furukawa | Methods using disposable and permanent films for diffusion and implantation doping |
KR100760925B1 (ko) * | 2006-09-20 | 2007-09-21 | 동부일렉트로닉스 주식회사 | 반도체 소자 형성방법 |
CN101290879A (zh) * | 2007-04-17 | 2008-10-22 | 中芯国际集成电路制造(上海)有限公司 | 栅极的制造方法 |
CN101364537A (zh) * | 2007-08-09 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 栅极及半导体器件的制造方法、用于制造栅极的结构 |
US20090186475A1 (en) * | 2008-01-21 | 2009-07-23 | Shyh-Fann Ting | Method of manufacturing a MOS transistor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104752314A (zh) * | 2013-12-27 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | 一种具有sti结构的半导体器件及制备方法 |
CN104752314B (zh) * | 2013-12-27 | 2017-11-28 | 中芯国际集成电路制造(上海)有限公司 | 一种具有sti结构的半导体器件及制备方法 |
CN104699344A (zh) * | 2015-03-30 | 2015-06-10 | 京东方科技集团股份有限公司 | 触控面板及其制造方法、触控显示装置 |
CN104699344B (zh) * | 2015-03-30 | 2017-11-28 | 京东方科技集团股份有限公司 | 触控面板及其制造方法、触控显示装置 |
US9898141B2 (en) | 2015-03-30 | 2018-02-20 | Boe Technology Group Co., Ltd. | Touch panel, method for fabricating the same and touch display device |
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CN102403314B (zh) | 2014-04-16 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140103 |
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Effective date of registration: 20140103 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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