CN102398421B - Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module - Google Patents
Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module Download PDFInfo
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- CN102398421B CN102398421B CN201010282243.0A CN201010282243A CN102398421B CN 102398421 B CN102398421 B CN 102398421B CN 201010282243 A CN201010282243 A CN 201010282243A CN 102398421 B CN102398421 B CN 102398421B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/10—Finger type piezoelectric elements
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Abstract
The invention provides a piezoelectric actuator module and a manufacturing method of a piezoelectric inkjet head applicable to the piezoelectric actuator module. The invention includes the following steps: (a) an upper piezoelectric chip and a lower piezoelectric chip are formed, a first surface of the upper piezoelectric chip and a first surface of the lower piezoelectric chip are respectively provided with a first electrode and a second electrode; (b) the first electrode and the second electrode are jointed with each other through a conductive layer, so the upper piezoelectric chip is assembled with the lower piezoelectric chip correspondingly; (c) a second surface of the upper piezoelectric chip is cut in a manner of equal interval; and (d) a second surface of the lower piezoelectric chip is cut in a staggered manner relative to the second surface of the upper piezoelectric chip, so as to form multiple runners with up-and-down and staggered openings and further form the piezoelectric actuator module.
Description
Technical field
The invention relates to a kind of manufacture method of piezoelectric actuated module, the manufacture method of espespecially a kind of piezoelectric actuated module and applicable piezoelectric ink jet head thereof.
Background technology
Along with the progress of ink-jet technology, ink-jet technology is no longer just applied on traditional prints market, in recent years be more applied in the process technique of flat-panel screens and semiconductor industry, but, in order to reduce costs and save the processing procedure time, seeking one after another new ink-jet technology, among this, the most widely applied, is exactly piezoelectric ink jet technology.
General piezoelectric ink jet header structure is mainly made up of nozzle piece, cover plate and piezoelectric actuated module.Refer to Figure 1A, it is the structural representation for the piezoelectric actuated module of known piezoelectric ink jet head.As shown in the figure, known piezoelectric actuated module 1 is mainly formed by upper piezo chips 10, lower piezoelectric chip 11 and electrode 12, wherein go up piezo chips 10 and lower piezoelectric chip 11 and there is respectively an electrode 12, and have more a conductive layer 13 between two electrodes 12 of upper piezo chips 10 and lower piezoelectric chip 11, this conductive layer 13 can be formed by a conducting resinl, but not as limit, in order to engage two electrodes 12.And known piezoelectric actuated module 1 has more multiple runners 14, the plurality of runner 14 is to extend downward lower piezoelectric chip 11 from upper piezo chips 10, and the opening 140 of the plurality of runner is all arranged in piezo chips 10.
In the piezoelectric actuated module 1 shown in Figure 1A, its manufacture method is for first making respectively upper piezo chips 10 and lower piezoelectric chip 11, and show surface forming electrode 12 at one of upper piezo chips 10 and lower piezoelectric chip 11, by conductive layer 13, upper piezo chips 10 and lower piezoelectric chip 11 are engaged in together more thereafter.Finally, by a cutting tool, cut downwards according to certain intervals from upper piezo chips 10, to form the runner 14 of multiple fixed sizes, and as shown in the figure, the opening 140 of the plurality of runner 14 is all arranged on the same surface of piezo chips 10.
Refer to Figure 1B, it is the illustrative view for known piezoelectric actuated module.As shown in the figure, in the time that piezoelectric actuated module 1 is carried out start, by electrode 12 to produce an electric field, and then make piezo chips 10 and lower piezoelectric chip 11 produce deformation according to different generating positive and negative voltages, as shown in the figure, when runner 142, the generating positive and negative voltage of piezo chips 10 and lower piezoelectric chip 11 is different on because of both sides produces while expanding situation, be arranged at the runner 141 of runner 142 both sides and runner 143 thereby can be squeezed, and then can make the black liquid (not shown) in runner 141 and runner 143 flow out from a jet orifice (not shown), otherwise, because runner 142 is the states in expansion, thereby can make black liquid (not shown) flow in runner 142, the alternately conversion of generating positive and negative voltage by this, flow out from different runner 14 and jet orifice (not shown) to control black liquid.
But, in known piezoelectric actuated module 1, as shown in Figure 1A and Figure 1B, because all extending downward lower piezoelectric chip 11 from upper piezo chips 10, multiple runners 14 form, and the opening 140 of runner 14 is all arranged in piezo chips 10, therefore, base portion 110 structures that lower piezoelectric chip 11 between each runner 14 is set are comparatively fragile, especially in the time that piezoelectric actuated module 1 is carried out start, the situation that runner 14 can produce expansion or be extruded, often more can have influence on the base portion 110 on runner 14 sides, make base portion 110 easily produce the situation of breaking after deformation extruding repeatedly, and then have influence on the usefulness of piezoelectric actuated module 1, and cause piezoelectric ink jet head may occur the situation of damaging.
In view of this, how to develop a kind of structural strength higher, be difficult for producing the piezoelectric actuated module damaged and the manufacture method of applicable piezoelectric ink jet head thereof, to solve the disappearance of known technology, real is the current problem in the urgent need to address of correlative technology field person.
Summary of the invention
The object of the present invention is to provide the manufacture method of a kind of piezoelectric actuated module and applicable piezoelectric ink jet head thereof, it is by means of having the runner that upper and lower opening is crisscross arranged in piezoelectric actuated module, to solve the fragile structure of known piezoelectric actuated module, easily cause piezoelectric ink jet head may occur damaging the disappearance of situation.
For reaching above-mentioned purpose, of the present invention one implements aspect for a kind of manufacture method of piezoelectric actuated module is provided compared with broad sense, it is to comprise the following steps: that (a) forms on one piezo chips and piezo chips once, and on this, the first surface of piezo chips and this lower piezoelectric chip is to have respectively one first electrode and one second electrode; (b) by a conductive layer, this first electrode and this second electrode are bonded with each other, so that piezo chips connects with corresponding group of this lower piezoelectric chip on this; (c) second surface of piezo chips on this is equidistantly cut; (d) to a second surface of this lower piezoelectric chip carry out with this on a second surface of piezo chips equidistantly cut the cutting of dislocation, the runner interlocking up and down to form multiple openings, to form a piezoelectric actuated module.
For reaching above-mentioned purpose, of the present invention another implemented aspect for a kind of manufacture method of piezoelectric ink jet head is provided compared with broad sense, it is to comprise the following steps: that (a) forms on one piezo chips and piezo chips once, and on this, the first surface of piezo chips and this lower piezoelectric chip is to have respectively one first electrode and one second electrode; (b) by a conductive layer, this first electrode and this second electrode are bonded with each other, so that piezo chips connects with corresponding group of this lower piezoelectric chip on this; (c) second surface of piezo chips on this is equidistantly cut; (d) to a second surface of this lower piezoelectric chip carry out with this on a second surface of piezo chips equidistantly cut the cutting of dislocation, the runner interlocking up and down to form multiple openings, to form a piezoelectric actuated module; (e) on this of this piezoelectric actuated module, on this second surface of piezo chips and this lower piezoelectric chip, a upper cover plate and a lower cover are set respectively; (f) in one first side of this piezoelectric actuated module, one sealant is set, to seal the end of the plurality of runner; (g) in one second side of this piezoelectric actuated module, one nozzle piece is set, has multiple jet orifice on this nozzle piece, it is to be connected with the plurality of runner.
Accompanying drawing explanation
Figure 1A: it is the structural representation for the piezoelectric actuated module of known piezoelectric ink jet head.
Figure 1B: it is the illustrative view for known piezoelectric actuated module.
Fig. 2: it is the manufacture method flow chart for the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 A: it is the decomposition texture schematic diagram for the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 B: it is the combining structure schematic diagram for the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 C: it is to be the structural representation after the upper piezo chips cutting of the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 3 D: it is to be the structural representation after the upper and lower piezo chips cutting of the piezoelectric actuated module of preferred embodiment of the present invention.
Fig. 4: it is the manufacture method flow chart for the piezoelectric ink jet head of the piezoelectric actuated module of application preferred embodiment of the present invention.
Fig. 5: it is the decomposition texture schematic diagram that is respectively the piezoelectric ink jet head of the piezoelectric actuated module of application preferred embodiment of the present invention.
Fig. 6: it is the combining structure schematic diagram that is respectively the piezoelectric ink jet head of the piezoelectric actuated module of application preferred embodiment of the present invention.
Fig. 7 A: it is respectively the piezoelectric ink jet head cross-sectional view for the piezoelectric actuated module of application preferred embodiment of the present invention.
Fig. 7 B: it is respectively the illustrative view for the piezoelectric ink jet head of the piezoelectric actuated module of application preferred embodiment of the present invention.
[primary clustering symbol description]
Known piezoelectric actuated module: 1
Upper piezo chips: 10,231
Lower piezoelectric chip: 11,232
Base portion: 110,230e, 230f
Electrode: 12
Conductive layer: 13,235
14,141,142,143,230,230a, 230c runner:
Opening: 140,230b, 230d
Piezoelectric ink jet header structure: 2
Upper cover plate: 21
The 3rd surface: 210,220
The 4th surface: 211,221
Enter black hole: 212,222
China ink liquid water conservancy diversion discrimination road: 213,223
Lower cover: 22
Piezoelectric actuated module: 23
First surface: 231a, 232a
Second surface: 231b, 232b
The first electrode: 233
The second electrode: 234
The first side: 236
The second side: 237
Nozzle piece: 24
Jet orifice: 240
Sealant: 25
Enter black runner: 26,27
The manufacturing step of piezoelectric actuated module: S30～S34
The manufacturing step of piezoelectric ink jet head: S40～S46
The specific embodiment
Some exemplary embodiments that embody feature & benefits of the present invention will describe in detail in the explanation of back segment.Be understood that the present invention can have various variations in different aspects, it neither departs from the scope of the present invention, and explanation wherein and graphic be when the use that explain in itself, but not in order to limit the present invention.
Please refer to Fig. 2 and Fig. 3 A, Fig. 2 is the manufacture method flow chart for the piezoelectric actuated module of preferred embodiment of the present invention, and Fig. 3 A is the decomposition texture schematic diagram of the piezoelectric actuated module of preferred embodiment of the present invention.As shown in Figure 3A, piezoelectric actuated module 23 of the present invention is mainly formed by upper piezo chips 231, lower piezoelectric chip 232, the first electrode 233, the second electrode 234 and conductive layer 235.In the present embodiment, as shown in the step S30 of Fig. 2, in formation, the mode of piezo chips 231 and lower piezoelectric chip 232 is for a piezoelectric is first provided, for example: the lead zirconate titanate piezoelectric material (PZT-5H) of high d31, but not as limit, this piezoelectric, by a mould and fluid pressure type machine, is compressed to laminated structure by this piezoelectric, to form upper piezo chips 231 and lower piezoelectric chip 232 under the effect of suitable pressure.And it is piezo chips on this 231 and lower piezoelectric chip 232 to be ground to needed thickness by a twin grinder device, in some embodiment, the thickness of upper piezo chips 231 and lower piezoelectric chip 232 is for better, but not as limit with 500 μ m.
Referring again to Fig. 2 and Fig. 3 A, as shown in step S31, when forming after upper piezo chips 231 and lower piezoelectric chip 232, on the first surface 231a of upper piezo chips 231 and lower piezoelectric chip 232 and 232a, form respectively the first electrode 233 and the second electrode 234 subsequently.In some embodiment, form in the processing procedure of the first electrode 233 and the second electrode 234, more comprise and first form a temporary electrode, but not as limit, this practice is for first by an electrode material, for example: one-pack type high temperature silver palladium glue, but not as limit, painting invests on the first surface 231a and 232a of piezo chips 231 and lower piezoelectric chip 232, again pass through high-temperature firing thereafter, for example: the high temperature of 600 ℃, and send in high-temperature insulation silicone oil groove, and impose voltage, for example: the voltage of 3V/ μ m, to carry out the polarization of 10 minutes, and then in first surface 231a and the upper temporary electrode (not shown) that forms of 232a of upper piezo chips 231 and lower piezoelectric chip 232, then, again this temporary electrode is removed in the mode of grinding.Then, again with metal lift-off techniques (lift off) by another electrode material, for example: Jin Ge (Au/Cr) material, but not as limit, the first surface 231a and the 232a that are formed at upper piezo chips 231 and lower piezoelectric chip 232 in the mode of evaporation are upper, by this to form the first electrode 233 and the second electrode 234.
In other embodiment, can cut instrument by one again, for example: wafer cutter, but not as limit, upper piezo chips 231 and the lower piezoelectric chip 232 with the first electrode 233 and the second electrode 234 are cut into required specific dimensions.And this size be with 7mm × 20mm × 0.5mm for better, but not as limit, it is to apply situation and appoint and execute variation according to actual.When upper piezo chips 231 and lower piezoelectric chip 232 have been cut into after specific dimensions, as shown in step S32, can be bonded with each other being arranged at the first surface 231a of upper piezo chips 231 and lower piezoelectric chip 232 and the first electrode 233 of 232a and the second electrode 234 by conductive layer 235, and in some embodiment, by a screen printing technology, this conductive layer 235 and the first electrode 233 and the second electrode 234 to be bonded with each other, but not as limit, by this so that upper piezo chips 231 and lower piezoelectric chip 232 can corresponding group connect, and form as shown in Figure 3 B upper, lower piezoelectric chip 231, 232 combining structure.And in the present embodiment, conductive layer 235 is to can be a conducting resinl, but not as limit.
Please refer to Fig. 2 and Fig. 3 C, Fig. 3 C is to be the structural representation after the upper piezo chips cutting of the piezoelectric actuated module of preferred embodiment of the present invention, as shown in Figure 2, when completing upper, lower piezoelectric chip 231, 232 carry out after the corresponding group of step connecing, thereafter as shown in step S33, by a cutting instrument, for example: wafer cutter, but not as limit, second surface 231b to upper piezo chips 231 cuts, and its cutting mode is the equidistant cutting for be fixed width and the degree of depth with specific range, and then form from upper piezo chips 231 and extend downward multiple runner 230a of lower piezoelectric chip 232, and the opening 230b of the plurality of runner 230a is arranged on the second surface 231b of piezo chips 231.
Then, for another example shown in the step S34 of Fig. 2, the combining structure of upper and lower piezo chips 231,232 is overturn, and the second surface 232b of lower piezoelectric chip 232 is carried out equidistantly cutting with the second surface 231b of upper piezo chips 231 cutting for the second time of dislocation, its cutting tool and cutting mode are all similar with aforementioned embodiments, therefore repeat no more.After cutting for the second time, can form the multiple runner 230c that extend to upper piezo chips 23 from lower piezoelectric chip 232, and the opening 230d of the plurality of runner 230c is arranged on the second surface 232b of lower piezoelectric chip 232.Thus, by this secondary cut, can make piezoelectric actuated module 23 there is multiple opening 230b as shown in Figure 3 D, the runner 230 that 230d is crisscross arranged up and down, and because opening 230b, the 230d of runner 230 are crisscross arranged respectively on second surface 231b, the 232b of upper piezo chips 231 and lower piezoelectric chip 232, but not be arranged in same piezo chips, thereby for each runner 230, its both sides all have the column structure that is enough to support, therefore have stronger structural strength.And because the intensity of this structure is higher, make can shorten the distance between each runner 230 in design, as can be seen here, this piezoelectric actuated module 23 with staggered up and down runner 230 except structural strength high, can avoid producing the situation of breaking man-hour in adding, more can save the material cost of making piezoelectric actuated module 23.
Refer to Fig. 4, it is the manufacture method flow chart for the piezoelectric ink jet head of the piezoelectric actuated module of application preferred embodiment of the present invention.As shown in Figure 4, piezoelectric ink jet head of the present invention is in the time manufacturing, first by the step as described in step S40～S44, to make a piezoelectric actuated module 23, because the step in this processing procedure, material and required instrument etc. are all identical with previous embodiment, therefore repeat no more.After forming piezoelectric actuated module 23, can be as described in step S45, in the upper piezo chips 231 of piezoelectric actuated module 23 and the second surface 231b of lower piezoelectric chip 232, upper cover plate 21 and lower cover 22 (as shown in Figure 5) are set respectively on 232b, in some embodiment, in the time that upper piezo chips 231 and lower piezoelectric chip 232 will engage with upper cover plate 21 and lower cover 22, also can be by a conducting resinl (not shown) by it joint, but not as limit, thus, can the first electrode 233 of upper piezo chips 231 and lower piezoelectric chip 232 and the second electrode 234 be led to respectively to upper cover plate 21 and lower cover 22 by means of this conducting resinl (not shown).
Please refer to Fig. 4 Fig. 5, after upper cover plate 21 and lower cover 22 assembling corresponding to piezoelectric actuated module 23, can be as described in step S46,236 places, the first side in piezoelectric actuated module arrange sealant 25, in the time that sealing layer 25 correspondence are arranged at the first side 236, runner 230 ends in piezoelectric actuated module 23 can be sealed, and then be prevented black liquid seepage.In some embodiment, sealant 25 is to can be a fluid sealant, for example: and silica gel, but not as limit.Then, for another example shown in step S47, 237 places, the second side in piezoelectric actuated module 23 arrange nozzle piece 24 (as shown in Figure 5), and on nozzle piece 24, there are multiple jet orifice 240, in the time that nozzle piece 24 will connect with corresponding group of piezoelectric actuated module 23, that corresponding to the multiple runners in piezoelectric actuated module 23, group connects by multiple jet orifice 240, in the present embodiment, to stick together medium by one, for example: structure glue, but not as limit, by corresponding nozzle piece 24 gluing on piezoelectric actuated module 23, by this to form the combining structure of piezoelectric ink jet head as shown in Figure 6.
Please refer to Fig. 5 and Fig. 6, it is decomposition texture schematic diagram and the combining structure schematic diagram that is respectively the piezoelectric ink jet head of the piezoelectric actuated module of application preferred embodiment of the present invention.As shown in the figure, piezoelectric ink jet head 2 of the present invention is mainly made up of upper cover plate 21, lower cover 22, piezoelectric actuated module 23, nozzle piece 24 and sealant 25.Wherein, upper cover plate 21 and lower cover 22 are correspond respectively to the second surface 231b of upper piezo chips 231 of piezoelectric actuated module 23 and the second surface 232b of lower piezoelectric chip 232 and arrange, and upper cover plate 21 and lower cover 22 have respectively the 3rd surface 210,220 and the 4th surface 211,221, and on the 3rd surface 210,220, have respectively into black hole 212,222, on the 4th surface 211,221, there is respectively black liquid water conservancy diversion discrimination road 213,223.The one end that enters black hole 212 and 222 be respectively with enter black runner 26,27 and be connected, the other end is connected with black liquid water conservancy diversion discrimination road 213,223.In the time that piezoelectric ink jet head 2 will spray black liquid, by entering black runner 26,27, black liquid to be imported in upper and lower cover plate 21,22, flow to black liquid water conservancy diversion discrimination road 213,223 by the black hole 212,222 of entering of upper and lower cover plate 21,22, by black liquid water conservancy diversion discrimination road 213,223, black liquid is guided in the runner 230 in piezoelectric actuated module 23 equably again, and carry over runner 230 and flow to jet orifice 240, by the actuating of piezoelectric actuated module 23, sprayed by specific jet orifice 240 to control black liquid again.
Please refer to Fig. 7 A, B, its be respectively for application preferred embodiment of the present invention piezoelectric actuated module piezoelectric ink jet head cross-sectional view with and illustrative view.As shown in Figure 7 A, wherein the opening 230b of the runner 230a of piezoelectric actuated module 23 is for being arranged on upper piezo chips 231, and runner 230a is that the runner 230c that is arranged at lower piezoelectric chip 232 with opening 230d is crisscross arranged, therefore, as shown in the figure, each runner 230 is the base portion 230e of piezo chips 231 on it is positioned at no matter, or is positioned at the base portion 230f place of lower piezoelectric chip 232, all can obtain good support.Thus, in the time that the first electrode 233 in the upper and lower piezo chips 231 and 232 of piezoelectric ink jet head 2 and the second electrode 234 produce an electric field, can make to produce different positive and negative magnitudes of voltage on the side wall of runner 230 both sides, by means of this different positive and negative magnitude of voltage, can and then make runner 230 produce different deformation.For instance, as shown in Figure 7 B, to there is respectively a positive and negative magnitude of voltage when being arranged at the left and right sides of central runner 230c, thereby impel runner 230c to produce deformation and expanding, and be expressed to the runner 230a of its both sides, and be to be earth terminal due to the opposite side of runner 230a, this ground connection is distolateral does not produce deformation, a side that is adjacent to expansionary channel 230c is squeezed, therefore runner 230a can spray from the jet orifice 240 of runner 230a end because the deformation of this extruding impels black liquid wherein.As for the runner 230c that produces expansion deformation, because of the attraction of expansion deformation, can impel black liquid to flow in runner 230c from black liquid water conservancy diversion discrimination road 223 (as shown in Figure 5).As can be seen here, piezoelectric ink jet head 2 is can be by the electric field change of piezoelectric actuated module 23, and then make multiple runners 230 produce deformation or constant, to control outside black liquid ejection jet orifice 240 or to insert among passage 230, to complete the ink-jet operation of piezoelectric ink jet head 2.
In sum, the manufacture method of piezoelectric actuated module of the present invention and the piezoelectric ink jet head that is suitable for thereof is mainly by means of the equidistant cutting of carrying out upper and lower secondary dislocation in piezoelectric actuated module, the runner being crisscross arranged to form multiple upper and lower openings, therefore can strengthen the structural strength of piezoelectric actuated module, and because its support structure power is higher, make more can reduce on runner design the distance between runner, and then can reduce the volume of piezoelectric actuated module and required material, to have, escapable cost and structure are comparatively firm, the advantage such as be difficult for breaking.To be known technology person can't be obtained due to above-mentioned advantage, therefore the manufacture method of piezoelectric actuated module of the present invention and applicable piezoelectric ink jet head thereof has industrial value.
The present invention must be thought and is to modify as all by the personage Ren Shi craftsman who has the knack of this technology, so neither de-as Protector that attached claim is wanted.
Claims (12)
1. a manufacture method for piezoelectric actuated module, it is to comprise the following steps:
(a) form on one piezo chips and piezo chips once, on this, the first surface of piezo chips and this lower piezoelectric chip is to have respectively one first electrode and one second electrode;
(b) by a conductive layer, this first electrode and this second electrode are bonded with each other, so that piezo chips connects with corresponding group of this lower piezoelectric chip on this;
(c) second surface of piezo chips on this is equidistantly cut;
(d) to a second surface of this lower piezoelectric chip carry out with this on this second surface of piezo chips equidistantly cut the cutting of dislocation, extend downward multiple first flows of lower piezoelectric chip and extend to multiple second runners of upper piezo chips from lower piezoelectric chip to form from upper piezo chips, self interlocks the plurality of first flow and the plurality of the second runner, to form a piezoelectric actuated module.
2. the manufacture method of piezoelectric actuated module as claimed in claim 1, wherein on this, piezo chips and this lower piezoelectric chip are made by a lead zirconate titanate piezoelectric material.
3. the manufacture method of piezoelectric actuated module as claimed in claim 1, wherein in step (a), this first electrode and this second electrode are with the mode of metal lift-off techniques this first surface of evaporation piezo chips and this lower piezoelectric chip on this respectively.
4. the manufacture method of piezoelectric actuated module as claimed in claim 3, wherein this first electrode and this second electrode are made by a gold medal chromium material.
5. the manufacture method of piezoelectric actuated module as claimed in claim 1, wherein in step (b), by a screen printing technology, this conductive layer and this first electrode and this second electrode to be bonded with each other, so that piezo chips joint corresponding to this lower piezoelectric chip on this.
6. the manufacture method of piezoelectric actuated module as claimed in claim 5, wherein this conductive layer is to be a conducting resinl.
7. the manufacture method of piezoelectric actuated module as claimed in claim 1, in step (c) and (d), is wherein respectively this second surface of piezo chips on this and this lower piezoelectric chip to be carried out to cutting sequentially by wafer cutter.
8. a manufacture method for piezoelectric ink jet head, it is to comprise the following steps:
(a) form on one piezo chips and piezo chips once, on this, the first surface of piezo chips and this lower piezoelectric chip is to have respectively one first electrode and one second electrode;
(b) by a conductive layer, this first electrode and this second electrode are bonded with each other, so that piezo chips connects with corresponding group of this lower piezoelectric chip on this;
(c) second surface of piezo chips on this is equidistantly cut;
(d) to a second surface of this lower piezoelectric chip carry out with this on a second surface of piezo chips equidistantly cut the cutting of dislocation, extend downward multiple first flows of lower piezoelectric chip and extend to multiple second runners of upper piezo chips from lower piezoelectric chip to form from upper piezo chips, self interlocks the plurality of first flow and the plurality of the second runner, to form a piezoelectric actuated module;
(e) on this of this piezoelectric actuated module, on this second surface of piezo chips and this lower piezoelectric chip, a upper cover plate and a lower cover are set respectively;
(f) in one first side of this piezoelectric actuated module, one sealant is set, to seal the end of the plurality of runner;
(g) in one second side of this piezoelectric actuated module, one nozzle piece is set, has multiple jet orifice on this nozzle piece, it is to be connected with the plurality of runner.
9. the manufacture method of piezoelectric ink jet head as claimed in claim 8, wherein, in step (e), this upper cover plate and this lower cover are to be connected by the piezoelectric actuated module of a conducting resinl and this.
10. the manufacture method of piezoelectric ink jet head as claimed in claim 8, wherein this upper cover plate and lower cover are to be connected respectively on the surface of this piezoelectric actuated module, to be respectively equipped with black liquid water conservancy diversion discrimination road, this China ink liquid water conservancy diversion discrimination road is communicated with one and enters black hole, is provided with black liquid and is guided in this piezoelectric actuated module runner.
The manufacture method of 11. piezoelectric ink jet heads as claimed in claim 8, wherein, in step (f), sealing layer is a silica gel material.
The manufacture method of 12. piezoelectric ink jet heads as claimed in claim 8, wherein in step (g), this nozzle piece and piezoelectric actuated module are to connect by corresponding group an of structure glue of sticking together medium.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010282243.0A CN102398421B (en) | 2010-09-09 | 2010-09-09 | Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module |
| US13/218,917 US8388115B2 (en) | 2010-09-09 | 2011-08-26 | Piezoelectric inkjet head structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010282243.0A CN102398421B (en) | 2010-09-09 | 2010-09-09 | Piezoelectric actuator module and manufacturing method of piezoelectric inkjet head applicable to piezoelectric actuator module |
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| CN102398421A CN102398421A (en) | 2012-04-04 |
| CN102398421B true CN102398421B (en) | 2014-05-21 |
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| CN1474750A (en) * | 2000-09-26 | 2004-02-11 | Droplet deposition apparatus | |
| CN1445090A (en) * | 2002-03-18 | 2003-10-01 | 精工爱普生株式会社 | Piezoelectric actuator, liquid spray nozzle containing it, piezoelectric element and its making method |
| CN101503025A (en) * | 2008-02-08 | 2009-08-12 | 精工爱普生株式会社 | Liquid ejecting head and liquid ejecting apparatus |
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| CN102398421A (en) | 2012-04-04 |
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