CN102387688B - Circuit card assemblies is installed - Google Patents
Circuit card assemblies is installed Download PDFInfo
- Publication number
- CN102387688B CN102387688B CN201110305452.7A CN201110305452A CN102387688B CN 102387688 B CN102387688 B CN 102387688B CN 201110305452 A CN201110305452 A CN 201110305452A CN 102387688 B CN102387688 B CN 102387688B
- Authority
- CN
- China
- Prior art keywords
- circuit card
- card assemblies
- binding agent
- housing
- edge portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000712 assembly Effects 0.000 title claims abstract description 88
- 239000011230 binding agent Substances 0.000 claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive Effects 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 241001646071 Prioneris Species 0.000 claims description 2
- 239000007767 bonding agent Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 16
- 239000000243 solution Substances 0.000 description 39
- 230000002708 enhancing Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 210000002464 Muscle, Smooth, Vascular Anatomy 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000001965 increased Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- KRZGZGXXONWBRA-UHFFFAOYSA-N 1,4-bis(ethenyl)benzene;2-(phenylmethoxymethyl)oxirane;styrene Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=C(C=C)C=C1.C1OC1COCC1=CC=CC=C1 KRZGZGXXONWBRA-UHFFFAOYSA-N 0.000 description 1
- 229910001208 Crucible steel Inorganic materials 0.000 description 1
- 229920002456 HOTAIR Polymers 0.000 description 1
- 210000002381 Plasma Anatomy 0.000 description 1
- 239000004823 Reactive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002452 interceptive Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000000630 rising Effects 0.000 description 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Disclose a kind of installation circuit card with housing, circuit card assemblies (" CCA ") uses binding agent to be attached to housing along at least one marginal portion of CCA, wherein this assembly includes at least one serrated edge portions of the CCA contacted with binding agent, or at least one the raceway groove part of this housing contacted with binding agent, or the combination of the raceway groove part of the serrated edge portions of the CCA contacted with binding agent and housing.
Description
Technical field
Present invention relates in general to circuit card assemblies, and relate more specifically to be installed to bearing or shell
The circuit card assemblies of body.
Background technology
Circuit card assemblies (CCA ' s) or printed circuit board (PCB) (PCB ' s) it is typically mounted to housing or props up
Holder structure (should be understood that, although term CCA is used to refer to be had physical attachment and is connected electrically on it
The PCB of electronic component, but described term is generally interchangeably used and can be relative to disclosed herein
Content is interchangeably used).Do so has multiple reason, heat sink to manage the operation at CCA including providing
Heat that period produces and/or provide close to the home of system element, the electronics electricity of operation period CCA
Road is interactive with system element.
A kind of CCA of installation is canned CCA in the resin kept by housing to the method for housing.
But, canned CCA to housing not the most available solution, owing to many problems,
Such as: easily can not dismantle CCA from housing to repair or change thus needing to change whole installation group
Part；The prolongation time needed for solidifying the resin mass of the most canned CCA, (this was for the quick manufacture (example of high-volume
As in field of motor vehicles) the most unacceptable)；The dimensional stability problems relevant to solidification resin mass
(such as, shrink, rupture)；The weak thermal conductivity of resin mass, it can hinder CCA transfer of heat to heat sink
Ability for thermal management purpose；And to provide through the relevant difficulty of the electrical path of resin mass ground connection.
Correspondingly, assembly hardware (such as screw) is generally used for installing CCA ' s or PCB ' s to shell
Body.Rigging screw provides some advantage, such as, be prone to from housing dismounting CCA for repairing or changing.But,
The use of rigging screw also causes many problems.Rigging screw is used to ask with one that CCA is fixed to housing
Topic is that they cause the bending of CCA, thus produces strain.In order to CCA is suitably secured to housing,
Typically require multiple rigging screw.If installing CCA for the environment that vibrated, this may need by
The modal response (modal response) of CCA adjusts at least one times of the resonant frequency higher than ambient vibration
Sound interval is to provide the CCA avoiding too early vibration to cause to lose efficacy, and this may need more rigging screw.This
Bending that the use of kind of multiple rigging screws has been further exacerbated by CCA and the strain obtained.CCA screwing
The strain caused is near the region of each screw maximum, its electronic component that can result in these regions or weldering
Connect the premature failure of electrical connection.Trial for avoiding these electrical connections to lose efficacy includes that increasing extra play ties to PCB
Structure, to alleviate strain, which increases cost.The another kind of technology of the strain that management is caused by rigging screw is to set
Meter CCA has " in mustn't entering " (keep-out) region at screw rigging position.Electricity component and link road
Footpath denies admission to these " in mustn't entering " regions, causes the floor area dimensions adding CCA, and this both increased
Add cost usual will integration wherein again and undesirable design limit has been set in the system of CCA.
Accordingly, it is desirable to provide a kind of installation CCA or PCB being not required to suffer the problems referred to above.
Summary of the invention
In one exemplary embodiment of the present invention, it is provided that a kind of installation circuit card with housing,
This housing has CCA, and it uses binding agent to be attached to housing along at least one marginal portion of CCA, its
In this assembly include at least one serrated edge portions of this CCA contacted with binding agent, or with bonding
At least one raceway groove part of this housing of agent contact, or the jagged edge of the CCA contacted with binding agent
The combination of the raceway groove part of part and housing.
In another exemplary embodiment of the present invention, it is provided that a kind of manufacture installs circuit card assemblies
Method, including step: by circuit card assemblies and housing juxtaposition, and along its at least one marginal portion apply
Binding agent is so that binding agent contacts with housing and circuit card assemblies, and wherein this assembly includes contacting with binding agent
At least one serrated edge portions of circuit card assemblies, or at least one contacted with binding agent, or
The serrated edge portions of the circuit card assemblies contacted with binding agent and the combination of the raceway groove part of housing；
And solidify this binding agent.
Solution 1, a kind of installation circuit card assemblies, including:
Housing；And
Circuit card assemblies, uses binding agent to be attached to housing along at least one marginal portion of circuit card assemblies；
Wherein, this assembly includes at least one attached Enhanced feature, including the circuit card group contacted with binding agent
At least one serrated edge portions of part, or at least one the raceway groove part of the housing contacted with binding agent,
Or a combination thereof.
Solution 2, installation circuit card assemblies as described in solution 1, wherein, described at least one
Attached Enhanced feature includes at least one serrated edge portions of the circuit card assemblies contacted with binding agent.
Solution 3, installation circuit card assemblies as described in solution 1, wherein, described at least one
Attached Enhanced feature includes at least one the raceway groove part of the housing contacted with binding agent.
Solution 4, installation circuit card assemblies as described in solution 1, wherein, described at least one
Serrated edge portions that attached Enhanced feature includes having the circuit card assemblies contacted with binding agent and housing
At least one part of both raceway groove parts.
Solution 5, installation circuit card assemblies as described in solution 1, wherein, this binding agent is spoke
Penetrate curable adhesive.
Solution 6, installation circuit card assemblies as described in solution 5, wherein, this binding agent is UV
Curable adhesive.
Solution 7, installation circuit card assemblies as described in solution 1, wherein, described at least one
Jagged edge includes multiple circular opens of the marginal portion along this circuit card assemblies.
Solution 8, installation circuit card assemblies as described in solution 1, wherein, this housing described
At least one raceway groove part has relative to the knoll of raceway groove part and the rising table near described bottom
Face.
Solution 9, installation circuit card assemblies as described in solution 8, wherein, this circuit card assemblies
Directly contact with this elevation surface of this housing.
Solution 10, installation circuit card assemblies as described in solution 1, wherein, circuit card assemblies is
The square on four limits or rectangle, and include marginal portion each along described four limits at least one described in
Attached Enhanced feature.
Solution 11, a kind of method manufacturing installation circuit card assemblies, including step:
By circuit card assemblies and housing juxtaposition, and apply binding agent along its at least one marginal portion so that bonding
Agent contacts with housing and circuit card assemblies, and wherein this assembly includes at least one attached Enhanced feature, including with
At least one serrated edge portions of the circuit card assemblies of binding agent contact, or the shell contacted with binding agent
At least one raceway groove part of body, or a combination thereof；And
Solidify this binding agent.
Solution 12, as described in solution 11 manufacture install circuit card assemblies method, wherein,
At least one attached Enhanced feature described includes at least one zigzag of the circuit card assemblies contacted with binding agent
Marginal portion.
Solution 13, as described in solution 11 manufacture install circuit card assemblies method, wherein,
At least one attached Enhanced feature described includes at least one the raceway groove part of the housing contacted with binding agent.
Solution 14, as described in solution 11 manufacture install circuit card assemblies method, wherein,
At least one attached Enhanced feature described includes the jagged edge with the circuit card assemblies contacted with binding agent
At least one part of the raceway groove part of part and housing.
Solution 15, as described in solution 11 manufacture install circuit card assemblies method, wherein,
This binding agent is radiation curable adhesive and curing schedule includes exposing this binding agent in radiation.
Solution 16, as described in solution 14 manufacture install circuit card assemblies method, wherein,
This binding agent is UV curable adhesive and this curing schedule includes that exposing this binding agent radiates in UV.
Solution 17, as described in solution 11 manufacture install circuit card assemblies method, wherein,
At least one jagged edge described includes multiple circular opens of the marginal portion along circuit card assemblies.
Solution 18, as described in solution 11 manufacture install circuit card assemblies method, wherein,
At least one groove described of this housing divides and includes relative to the knoll of raceway groove part and near the described end
The elevation surface in portion.
Solution 19, as described in solution 18 manufacture install circuit card assemblies method, also include
Applying the binding agent front clamp circuit card assemblies step to this elevation surface of housing.
Solution 20, as described in solution 11 manufacture install circuit card assemblies method, wherein,
Circuit card assemblies is polygon geometry, and includes each marginal portion along the plurality of limit extremely
A few described attached Enhanced feature.
Above-described embodiment provides in the case of need not screw and the stress that obtains on CCA thereof
CCA is to the secure attachment of housing, it is provided that the enhancing durability of pad and electronic component and reliability, companion
With the size (floor space and thickness) allowing minimizing.These features are particularly suited at such as electric powered steering
In system, CCA ' s applies, such as U.S. Patent number in the environment of 3 phase AC power for changing DC power
Disclosed in 6535805, the disclosure of which is as with reference to being fully incorporated.
The features described above of embodiment disclosed herein and advantage and further feature and advantage are from the present invention
Following detailed description to combine accompanying drawing apparent.
Accompanying drawing explanation
It is only used as example, in the following detailed description of embodiment, other purpose, feature and advantage
And details reveals, describe in detail and relate to accompanying drawing wherein:
Fig. 1 is the top view of the CCA along its marginal portion with attached Enhanced feature；
Fig. 2 is the top view with the housing that raceway groove part attaches Enhanced feature；
Fig. 3 is the side cross-sectional, view of a housing part of Fig. 2, intercepts along cross section 3-3, it is shown that ditch
Road part attaches the further detail below of Enhanced feature；
Fig. 4 is a part and the juxtaposed side cross-sectional, view of housing of CCA before binding agent applies；
And
Fig. 5 is to be pre-installed to housing and pass through the side cross-sectional, view of the fixing CCA of binding agent.
Detailed description of the invention
According to one exemplary embodiment of the present invention, CCA is included between CCA and housing extremely
A few attached Enhanced feature, such as the serrated edge portions on CCA or the raceway groove part of housing.One
Individual exemplary embodiment is shown in Fig. 1, it illustrates by having the CCA of serrated edge portions 14 on it originally
The circuit card assemblies 10 that body 12 is constituted.In this exemplary embodiment, serrated edge portions 14 passes through edge
Multiple circular opens at CCA body 12 edge are formed, but it be also possible to use other configuration (such as, sawtooth,
Square shaped teeth, irregular shape).The size of serrated edge portions 14 can adjust according to design and Fabrication parameter.
King-sized part should be avoided, because they need an excess amount of binding agent, and the least portion should be avoided
Point, because owing to may not adhere to along the position of related features of the opening of jagged edge in required region.
In the embodiment that serrated edge portions 14 is formed by multiple circular opens, the diameter of " justifying " can be:
In one exemplary embodiment, scope is between 0.5mm to 0.6mm, in another exemplary embodiment
Middle scope, between 0.9mm to 1.0mm, can be about 0.76mm in another exemplary embodiment.
Serrated edge portions 14 can be by being molded into jagged edge when manufacturing printed circuit board (PCB)
The basis of printed circuit board (PCB) is internal and is formed, or they are such as worked into molded plate by punch press or drilling machine
In.Depending on the design needs of system, serrated edge portions 14 can be located along the edge of CCA10
One or more positions, at (the figure Anywhere needing use binding agent that CCA10 is attached to housing 20
2).In one embodiment, CCA10 is polygon geometry, such as four limit rectangular or square whens, and
Each edge includes at least one serrated edge portions 14.CCA10 can also is that circle or ellipse, tool
Have along the serrated edge portions 14 at rectangle or oval rim different interval.In another embodiment,
CCA10 can have omnidistance around continuous serrated edge portions 14.In yet another embodiment, than institute
Need more serrated edge portions to be arranged at the diverse location (Fig. 5) at the edge along CCA10, assembling
Period binding agent 30 is applied only to the part in these serrated edge portions, leaves remaining jagged edge
Part can be used for receiving binding agent when the maintenance period must dismantle and change CCA.More specifically show at one
In example embodiment, serrated edge portions 14 is arranged in pairs, and every pair of only one of which jagged edge portion
Divide to have and be applied to binding agent 30 thereon during assembly, leave another jagged edge portion of this centering
Dividing is available during maintenance process.Under height vibration operating environment, in one exemplary embodiment,
The position bonding connection between CCA10 and housing 20 is optional to adjust the modal response of CCA higher than ring
At least one octave of the resonant frequency of border vibration.
In another embodiment of the present invention, the housing 20 that CCA10 is mounted thereto includes at least
One raceway groove part 24, for strengthening attaching between CCA and housing.One exemplary embodiment is shown in Fig. 2
With 3, it illustrates the housing 20 for installing CCA10.Housing 20 is by having many grooves thereon
The enclosure body 22 dividing 24 is constituted.Each raceway groove part 24 includes having elevation surface part 26 (elevated
Surface portion) and the raceway groove part of leader 28 (guide portion).Enclosure body 22 can be by
The material of any appropriate is formed, such as cast steel.Raceway groove part 24 provides the extended surface attached for binding agent
Region, and there is rough surface in one exemplary embodiment to further enhance adhesion.Raceway groove part
24 carry out surface also by chemical etching or low temperature high energy no-voltage plasma (orifice) gas stream processes to further enhance
Adhere to.
Elevation surface part 26 provides can place CCA body 12 before binding agent 30 applies thereon
Facilitate surface, also provide for possible ground connection electrical path and for from CCA body 12 to enclosure body 22
The path of heat radiation.In one exemplary embodiment, elevation surface part 26 has smooth muscle finished surface.
Leader 28 provides suitably putting of the protruding border CCA10 to contribute to during providing assembling on housing
Put.Equally, binding agent 30 can overflow drain part 24 to the part of leader 28, therefore show at one
In example embodiment leader 28 have rough surface and/or by chemistry or plasma treatment to provide enhancing
Adhere to.
In an additional exemplary embodiment, housing 20 can also include along enclosure body 22
Internal one or more bossings 30.Bossing 30 can help to provide for CCA body 12
Structural support and for heat radiation hot path and the electrical path of ground connection.An exemplary embodiment
In, bossing 30 has smooth muscle finished surface.It should be noted that bossing 30 need not be with CCA body
The downside physical contact of 12, and bossing 30 and CCA body 12 in one exemplary embodiment
Downside between there is the small gap of 180-250 μm.
Turning now to Figure 4 and 5, the assembling of installing circuit card assemblies 10 be will be described in further detail.Class
Like Fig. 3, Figure 4 and 5 are the cross-sectional views of the marginal portion of the enclosure body 22 by attached CCA body 12.
As shown in Figure 4, CCA body 12 is arranged in enclosure body 22 thus the marginal portion of CCA body 12
It is shelved on raised portion 26.In one exemplary embodiment, the jagged edge portion of CCA body 12
Divide 14 (Fig. 1) consistent with the raceway groove part 24 of housing 20, but this is not at the cross-sectional view of Figure 4 and 5
Shown in, because section line intercepts in the outermost area of serrated edge portions 14.
After CCA body 12 is placed in enclosure body 22, binding agent 30 as shown in Figure 5
It is arranged on the raceway groove part 24 of enclosure body.At the raised portion that CCA body 12 is placed into housing 22
Binding agent is set after 26, prevent any binding agent be directly sandwiched in CCA body 12 and enclosure body 22 it
Between, thus the dismounting of follow-up CCA body 12 and replacing, it is that maintenance is necessary.At one
In exemplary embodiment, enough binding agents are arranged in raceway groove part 24, thus cover at least in part and draw
Lead part 28 to further enhance adhesion.
In one exemplary embodiment, binding agent is can be expelled to raceway groove by regular injection technology
The liquid of part 24.In another embodiment, binding agent is the powder introduced by conventional powders flow technique
End.In fact any kind of binding agent known to can using, including fusible thermoplasticity, air mummification
Solvent delivery or water transport carry binding agent；Reactive adhesive, such as bi-component epoxide-resin or urethane；Empty
Gas or the binding agent of moisture-curable, such as siloxanes；Or radiation curable adhesive.Exemplary at one
In embodiment, binding agent is that radiation curable adhesive (such as UV curable adhesive) or electron beam are solid
Change binding agent.Radiation curable adhesive is provided that controlled hardening time, and it can allow at binding agent solid
Before changing, CCA body 12 is relative to any final adjustment of the position of enclosure body 22.Radiation-curable bonds
Agent also is able to when being exposed to radiation provide fast setting, and it contributes to high-volume and manufactures.In another example
In property embodiment, radiation curable adhesive is UV curable adhesive.The example of UV curable adhesive
Including, but not limited to acrylate (such as
6-621T and 20014) and epoxy resin (example
As
3336-EN)。
In one exemplary embodiment, CCA10 is installed to be configured at maintenance process period CCA
Must reuse in the case of dismantling and changing.As it has been described above, this can be by using the multiple saws on CCA
Toothed edge part 14 and apply binding agent 30 during initial assembling in described serrated edge portions
Only a part and/or after-applied CCA body 12 is placed on the raised portion 26 of enclosure body 22
Binding agent becomes easy.CCA body 12 is dismantled from enclosure body 22, along adhesive tape local for follow-up
Ground applies heat (such as, using needle point hot air tool) to raise the binding agent of solidification to higher than its glass transition
Temperature.Then the binding agent 30 softened can remove to discharge CCA body from enclosure body 22 carefully
12.In order to CCA body 12 is placed in enclosure body 22 again after maintenance, CCA body 12 is again
It is placed in enclosure body 22 thus it is shelved on raised portion 26, and binding agent 30 is applied to initially
Untapped serrated edge portions during assembling.
Although the present invention is described by reference to exemplary embodiment, those skilled in the art should
Understand, in the case of without departing substantially from the scope of the present invention, multiple change and equivalent its yuan replaceable can be carried out
Part.It addition, in the case of scope without departing from the spirit, multiple amendment can be carried out so that concrete situation is lived
Material is suitable for the guidance of the present invention.Therefore, the present invention is not intended to be limited to as performing the present invention
Specific embodiment disclosed in good pattern, and the present invention will include all embodiments fallen within the scope of the present application.
Claims (19)
1. a circuit card assemblies is installed, including:
Housing；And
Circuit card assemblies, described circuit card assemblies uses binding agent to be attached to housing along at least one marginal portion of circuit card assemblies；
Wherein, described assembly includes that at least one attached Enhanced feature, at least one attached Enhanced feature described include contacting with binding agent
At least one serrated edge portions of circuit card assemblies or at least one groove of described housing of contacting with binding agent
Dividing or a combination thereof, wherein, binding agent is applied only to the part in described serrated edge portions, leaves remaining zigzag
Marginal portion can be used for receiving binding agent, at least one raceway groove part described of housing when dismantling and change circuit card assemblies
Have relative to the knoll of raceway groove part and the elevation surface near described bottom, and wherein, circuit card assemblies and described liter
High surface directly contacts, and after circuit card assemblies is placed into the elevation surface of housing, arranges binding agent.
Installing circuit card assemblies the most as claimed in claim 1, wherein, at least one attached Enhanced feature described includes and binding agent
At least one serrated edge portions described of the circuit card assemblies of contact.
Installing circuit card assemblies the most as claimed in claim 2, wherein, circuit card assemblies also includes the sawtooth not contacted with binding agent
Shape marginal portion.
Installing circuit card assemblies the most as claimed in claim 1, wherein, at least one attached Enhanced feature described includes and binding agent
At least one raceway groove part described of the housing of contact.
Installing circuit card assemblies the most as claimed in claim 1, wherein, at least one attached Enhanced feature described includes having circuit
The serrated edge portions of card assembly and at least one part of the raceway groove part of housing contacted with binding agent.
Installing circuit card assemblies the most as claimed in claim 1, wherein, this binding agent is radiation curable adhesive.
Installing circuit card assemblies the most as claimed in claim 6, wherein, this binding agent is UV curable adhesive.
Installing circuit card assemblies the most as claimed in claim 1, wherein, at least one serrated edge portions described includes along this electricity
Multiple circular opens of the marginal portion of an outpost of the tax office's assembly.
Installing circuit card assemblies the most as claimed in claim 1, wherein, circuit card assemblies is square or the rectangle on four limits, and
Including at least one in the described attached Enhanced feature of marginal portion each along described four limits.
10. manufacture the method installing circuit card assemblies, including step:
By circuit card assemblies and housing juxtaposition, and apply binding agent along its at least one marginal portion so that binding agent and housing and circuit card
Component touch, wherein, described assembly include at least one attached Enhanced feature, at least one attached Enhanced feature described include with
At least one serrated edge portions of circuit card assemblies of binding agent contact or the described housing that contacts with binding agent are at least
One raceway groove part or a combination thereof, wherein, binding agent is applied only to the part in described serrated edge portions, stays
Remaining serrated edge portions can be used for receiving binding agent, described at least the one of housing when dismantling and change circuit card assemblies
Individual raceway groove part has relative to the knoll of raceway groove part and the elevation surface near described bottom, and wherein, circuit card group
Part directly contacts with described elevation surface, after circuit card assemblies is placed into the elevation surface of housing, arranges binding agent；With
And
Solidify this binding agent.
11. manufacture the method installing circuit card assemblies, wherein, the unattached edge part of circuit card assemblies as claimed in claim 10
Including the serrated edge portions contacted with binding agent.
12. manufacture as claimed in claim 11 the methods installing circuit card assemblies, wherein, circuit card assemblies also include not with bonding
The serrated edge portions of agent contact.
13. manufacture the method installing circuit card assemblies as claimed in claim 10, and wherein, described housing includes at least one raceway groove
Part, binding agent adheres to the raceway groove part of housing and the unattached edge part of circuit card assemblies.
14. manufacture the method installing circuit card assemblies, wherein, the unattached edge part of circuit card assemblies as claimed in claim 10
Including the serrated edge portions contacted with binding agent, and described housing includes at least one raceway groove part, and binding agent adheres to shell
The raceway groove part of body and the unattached edge part of circuit card assemblies.
15. manufacture the method installing circuit card assemblies as claimed in claim 10, and wherein, this binding agent is radiation-curable bonding
Agent and curing schedule include exposing this binding agent in radiation.
16. manufacture the method installing circuit card assemblies as claimed in claim 15, and wherein, this binding agent is UV curable adhesive
Agent and this curing schedule include that exposing this binding agent radiates in UV.
17. manufacture the method installing circuit card assemblies as claimed in claim 10, and wherein, described serrated edge portions includes edge
Multiple circular opens of the marginal portion of circuit card assemblies.
18. manufacture the method installing circuit card assemblies as claimed in claim 10, wherein, before applying binding agent, and circuit card group
Part leans against on this elevation surface.
19. manufacture the method installing circuit card assemblies as claimed in claim 10, and wherein, circuit card assemblies is polygon geometric form
Shape, and include each serrated edge portions along the plurality of limit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/870,020 US8638568B2 (en) | 2010-08-27 | 2010-08-27 | Mounted circuit card assembly |
| US12/870020 | 2010-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102387688A CN102387688A (en) | 2012-03-21 |
| CN102387688B true CN102387688B (en) | 2016-12-14 |
Family
ID=
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5461256A (en) * | 1992-11-06 | 1995-10-24 | Mitsubishi Denki Kabushiki Kaisha | Portable semiconductor device with resin |
| US6377464B1 (en) * | 1999-01-29 | 2002-04-23 | Conexant Systems, Inc. | Multiple chip module with integrated RF capabilities |
| US7507914B2 (en) * | 2004-06-30 | 2009-03-24 | Honeywell International Inc. | Micro-castellated interposer |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5461256A (en) * | 1992-11-06 | 1995-10-24 | Mitsubishi Denki Kabushiki Kaisha | Portable semiconductor device with resin |
| US6377464B1 (en) * | 1999-01-29 | 2002-04-23 | Conexant Systems, Inc. | Multiple chip module with integrated RF capabilities |
| US7507914B2 (en) * | 2004-06-30 | 2009-03-24 | Honeywell International Inc. | Micro-castellated interposer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101341415B (en) | Anistropic conductive connector manufacture method | |
| JP2015195198A (en) | Anisotropic conductive film and manufacturing method thereof | |
| US20060176611A1 (en) | Formed parts for adhesive height setting | |
| CN104604346B (en) | The method for designing of electric equipment and manufacture method and electric equipment | |
| JP5416458B2 (en) | Method of manufacturing high frequency module having shield and heat dissipation | |
| JP2001291431A (en) | Composition for anisotropic conductive sheet, anisotropic conductive sheet, its production and contact structure using anisotropic conductive sheet | |
| CN102387688B (en) | Circuit card assemblies is installed | |
| CN102412453B (en) | Electric connector and manufacturing method thereof | |
| CN101655382A (en) | Flow measurement device | |
| CN103539366A (en) | Cofferdam type glue sticking process | |
| JP2002124318A (en) | Composite sheet and its manufacturing method | |
| JP2002128911A (en) | Anisotropically conductive sheet and method of using the same | |
| CN102387688A (en) | Mounted circuit card assembly | |
| JP2009289863A (en) | Method of manufacturing semiconductor device | |
| CN105222791A (en) | For the body structure of accommodating navigation circuit main board | |
| CN104023171B (en) | Camera module and its support | |
| CN103161763B (en) | Thin fan and manufacture method thereof | |
| JP2002093485A (en) | Manufacturing method for composite sheet and composite sheet | |
| JP2007282491A (en) | Brushless vibration motor | |
| JP2006324457A (en) | Coil component | |
| CN213244456U (en) | Circuit board assembly | |
| CN105352515A (en) | GPS navigator used for automobile | |
| CN104023170B (en) | Camera module and its support | |
| CN101998781B (en) | Electronic device | |
| CN205090979U (en) | Navigator machine case |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20170827 |