CN103161763B - Thin fan and manufacture method thereof - Google Patents
Thin fan and manufacture method thereof Download PDFInfo
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- CN103161763B CN103161763B CN201110426348.3A CN201110426348A CN103161763B CN 103161763 B CN103161763 B CN 103161763B CN 201110426348 A CN201110426348 A CN 201110426348A CN 103161763 B CN103161763 B CN 103161763B
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- housing
- metal layer
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- fan
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Abstract
A kind of thin fan and manufacture method thereof, the manufacture method of thin fan comprises: provide plastics containing multiple metallic; By plastics forming one housing; Remove the surface of partial shell, and form a wiring region in housing; And one metal layer is set in wiring region.Thin fan of the present invention and manufacture method thereof, what remove control circuit board arranges volume and space, to shorten the whole height of thin fan, and more effectively can utilize height space, and the variability of fan circuit wiring can be increased, with the design of more favourable fan slimming.
Description
Technical field
The present invention relates to a kind of fan and manufacture method thereof, particularly a kind of thin fan and manufacture method thereof.
Background technique
The heat produced along with heat-generating electronic elements such as electronic industry develop rapidly, the chip in electronic product gets more and more.For these waste heats are effectively distributed, usually be sticked on the surface of heat-generating electronic elements a radiator, then arrange a fan on a heat sink, the cooling blast utilizing fan to produce carries out forced heat radiation to radiator, thus is left by the heat that heat-generating electronic elements produces.
Shown in Figure 1A and Figure 1B, wherein Figure 1A is the schematic diagram of the fan of prior art, and Figure 1B is the sectional drawing of the fan of Figure 1A.For ease of viewing and description, therefore omit the upper cover part illustrating housing in Figure 1A and Figure 1B.Fan 1 comprises impeller 11, stator 12, circuit board 13, housing 14, bearing 15 and a rotor 16.Bearing 15 connects impeller 11 and housing 14, and the coated impeller 11 of housing 14.Stator 12 and circuit board 13 are arranged at housing 14, wherein, and stator 12 setting corresponding with rotor 16.Can improve motor voltage, electric current by the control circuit of circuit board 13, motor be produced excitatory, then via the excitatory dipole inversion of chip controls motor, make tape and motor produce mutual exclusion, mutual suction effect, thus rotor driven 16 and impeller 11 rotate.
In the Making programme of existing fan, with surface mount design (SurfaceMountDesign, SMD) electronic component is welded in is provided with on the circuit board of wiring, and with stator bearing assembling formation one element, again this element and impeller of rotor are assembled on blower-casting, namely complete fan assembling.
But, the compact designs trend of computer product now, make cooling fan structure design on also must with compact, lightening.Because electronic component need be positioned in a plane of circuit board, fan domestic demand reserves height and the space of circuit board and electronic component, causes fan effectively cannot reduce its height and volume.In addition, due to circuit board shape and area can be subject to air-out runner and mechanism limits, fan slimming technology is more restricted.
Therefore, how to provide a kind of thin fan, the whole height of thin fan can be shortened, and more effectively can utilize height space, and can with reached same heat radiation function in the past.
Summary of the invention
Because above-mentioned problem, object of the present invention, for providing a kind of thin fan and manufacture method thereof, can shorten the whole height of thin fan, and more effectively can utilize height space, and can with reached same heat radiation function in the past.
In order to achieve the above object, the manufacture method that the invention provides a kind of thin fan comprises: provide one containing the plastics of multiple metallic; By plastics forming one housing; Remove the surface of partial shell, and form a wiring region in housing; And one metal layer is set in wiring region.
In a preferred embodiment of the present invention, plastics are PPA plastics and/or LCP plastics.
In a preferred embodiment of the present invention, metallic comprises copper and/or chromium metallic.
In a preferred embodiment of the present invention, wherein removing the surface of partial shell, is by surface roughening, and makes part metals particle exposed.
In a preferred embodiment of the present invention, wherein removing the surface of this housing of part, is irradiate in this housing with laser.
In a preferred embodiment of the present invention, wherein arranging a metal layer in the step in wiring region, is arrange metal layer in the mode of chemical plating.
In a preferred embodiment of the present invention, manufacture method also comprises: arrange at least one electronic component in metal layer; And assemble case, a stator and an impeller.
In a preferred embodiment of the present invention, wherein arranging the step of at least one electronic component in metal layer, is in a welding manner this electronic component is arranged at metal layer.
In order to achieve the above object, the present invention also provides a kind of thin fan to comprise a housing, a stator and an impeller.Housing comprises a wiring region and a metal layer.Wiring region is provided with multiple metallic, and the described multiple metallic of part is exposed to wiring region.Metal layer is arranged at wiring region, and combines with exposed metallic.Stator is arranged at housing.The coated impeller of housing.
In a preferred embodiment of the present invention, the material of metallic comprises copper and/or chromium metallic.
In a preferred embodiment of the present invention, housing also comprises at least one electronic component, and described electronic component is arranged at metal layer.
In a preferred embodiment of the present invention, thin fan also comprises a bearing and a rotor.Bearing connects impeller.Rotor is arranged at impeller, and correspondingly with stator arranges.
From the above, thin fan of the present invention and manufacture method thereof, be first housing by the plastics forming containing metallic, continue and remove the surface of partial shell, and form wiring region in housing, then metal layer is arranged at wiring region.Wherein, the surface of partial shell is removed in the mode of laser, and surface can be plane or roughness, the multiple metallic of surface exposure of the housing after laser, then in the mode of chemical plating, metal layer is arranged at wiring region, metal layer is combined with exposed metallic, finally again electronic component is arranged on metal layer in a welding manner.
Accompanying drawing explanation
Figure 1A is the separation schematic diagram of existing thin fan;
Figure 1B is the combination schematic diagram of the thin fan according to Figure 1A;
Fig. 2 A is the flow chart of steps of the manufacture method of the thin fan of foundation present pre-ferred embodiments;
Fig. 2 B is another flow chart of steps of the manufacture method of thin fan of the present invention;
Fig. 3 is the schematic diagram of housing in manufacture process of present pre-ferred embodiments;
Fig. 4 A is that housing of the present invention is in the fragmentary cross-sectional view of manufacture process;
Fig. 4 B is the fragmentary cross-sectional view of housing in manufacture process of another form of the present invention;
Fig. 5 is that housing of the present invention is in the schematic diagram of manufacture process;
Fig. 6 A is that housing of the present invention is in the sectional drawing of manufacture process;
Fig. 6 B is that the housing of a form more of the present invention is in the sectional drawing of manufacture process;
Fig. 7 A is the separation schematic diagram of thin fan of the present invention;
Fig. 7 B is the combination schematic diagram of the thin fan of Fig. 7 A;
Fig. 8 is the schematic diagram of thin fan of the present invention; And
Fig. 9 and Figure 10 is the version schematic diagram of thin fan of the present invention.
Wherein, description of reference numerals is as follows:
1: fan
2,3,4: thin fan
11,23: impeller
12,22: stator
13: circuit board
14,21,21a, 21b: housing
15,24: bearing
16,25: rotor
211,211b: surface
212,212b: wiring region
213: metallic
214,214b: metal layer
215: electronic component
216: groove
217,218: region
S01 ~ S06: step
Embodiment
Hereinafter with reference to relevant drawings, a kind of thin fan according to present pre-ferred embodiments and manufacture method thereof are described, wherein identical element is illustrated with identical reference character.
Please refer to shown in Fig. 2 A, it is the flow chart of steps of the manufacture method of a kind of thin fan of foundation present pre-ferred embodiments.The manufacture method of the present embodiment comprises step S01 to step S04.
Step S01, provides one containing the plastics of multiple metallic.Wherein, the plastics containing metallic can be PPA plastics, LCP plastics or other there are the plastics of metallic.In addition, the material of metallic can be such as copper and/or chromium metallic, and above-mentioned plastics and the material of metallic are not defined in the present invention.
Shown in Fig. 3, it is the schematic diagram of housing in manufacture process of present pre-ferred embodiments.Step S02, by plastics forming one housing 21.In more detail, a mould (figure does not illustrate) is first provided, then plastics are put into mould.Wherein, the size of mould and form, essence equals size and the form of housing for molding, in other embodiment, can difference according to demand, and be different sizes and form by Design of Dies.In addition, the material of mould can apply existing person, therefore will not describe in detail.Plastics the mode such as ejection formation or moulding by casting can be formed housing 21 by the present embodiment, first solid plastics heating are dissolved fluidly state, and make the plastic flow of fluid state in mould, then, and hardened plastic.The present embodiment such as can cool and solidify at the mode hardened plastic, to form housing 21.
Shown in Fig. 2 A, Fig. 4 A and Fig. 5, wherein Fig. 4 A is that housing of the present invention is in the fragmentary cross-sectional view of manufacture process; Fig. 5 is that housing of the present invention is in the schematic diagram of manufacture process.Continue, step S03, removes the surface 211 of partial shell 21, and forms a wiring region 212 in housing 21.In more detail, to swash the surface 211 (as shown in Figure 4 A) that light-struck mode removes partial shell 21, by surperficial 211 roughenings, and make part metals particle 213 exposed.
It is worth mentioning that, the housing 21 of the present embodiment is for a plastics forming containing multiple metallic 213, but non-ly limits the use of in the present invention.Please refer to shown in Fig. 4 B, it is the fragmentary cross-sectional view of housing in manufacture process of another form of the present invention.In other embodiment, housing 21a can also one containing the plastics of metallic 213 and the plastics forming of a non-metal-containing particle.Such as, first by after the plastic ejection moulding containing metallic 213, by the plastic ejection moulding of non-metal-containing particle, and combine with the plastics of ejection formation.To make that there are in housing 21a two regions 217,218, wherein a region 217 is the region for arranging wiring, it is with the plastics forming containing multiple metallic 213, and another region 218 is the above-mentioned outer region for arranging wiring region, it can the plastics forming of general non-metal-containing particle.
Shown in Fig. 6 A, it is that housing of the present invention is in the sectional drawing of manufacture process.Step S04, arranges a metal layer 214 in wiring region 212.The present embodiment is, in the mode of chemical plating, metal layer 214 is arranged at wiring region 212, metal layer 214 is combined with the metallic 213 being exposed to wiring region 212, and is formed at housing 21.
Please refer to shown in Fig. 2 B, it is another flow chart of steps of the manufacture method of thin fan of the present invention.The manufacture method of the present embodiment also comprises step S05 and step S06.
Shown in Fig. 2 B and Fig. 6 A, step S05, arranges at least one electronic component 215 in metal layer 214.The present embodiment is, with welding manner, multiple electronic component 215 is arranged at metal layer 214, makes these electronic components 215 couple mutually or electrically conduct by metal layer 214.
In addition, please refer to shown in Fig. 6 B, it is that a form housing more of the present invention is in the sectional drawing of manufacture process.More what deserves to be explained is, the surperficial 211b with wiring region 212b of housing 21b can be non-planar surface, that is, also can in the surperficial 211b of non-flat forms shape, non-planar housing 21b, remove part surface 211b, and form wiring region 212b in this surperficial 211b.In time performing step S02, first form the housing 21b with multiple groove 216, when being connected in step S03 and step S04, the surperficial 211b of the housing 21b near described multiple groove 216 and described multiple groove 216 forms wiring region 212b in the mode of laser, and metal layer 214b is also formed at wiring region 212b, step S05, is arranged at described multiple groove 216 respectively by multiple electronic component 215, and is electrically connected with the metal layer 214b of described multiple groove 216.The degree of depth and the size of wherein said multiple groove 216 are each unequal, and the degree of depth of described multiple groove 216 is relative with the height of the corresponding electronic component 215 arranged to be designed.
Shown in Fig. 2 B, Fig. 7 A, Fig. 7 B and Fig. 8, wherein Fig. 7 A is the separation schematic diagram of thin fan of the present invention, and Fig. 7 B is the combination schematic diagram of the thin fan of Fig. 7 A, and Fig. 8 is the schematic diagram of thin fan of the present invention.Step S06, assemble case 21, stator 22 and an impeller 23.First need state clearly, for ease of viewing and description, therefore the omission of the upper cover part of the housing 21 of Fig. 7 A and Fig. 7 B be illustrated, but, for illustrating complete thin fan 2 in Fig. 8, and the upper cover part of housing 21 is shown.By being provided with the assembling of the housing 21 of wiring region 212 and metal layer 214, stator 22 and impeller 23 phase, to form thin fan 2.Wherein, stator 22 is arranged at housing 21, and impeller 23 to be connected with housing 21 by a bearing 24 and to arrange.In addition, a rotor 25 is arranged at impeller 23, and rotor 25 and stator 22 are oppositely arranged.The thin fan 2 of the present embodiment such as having the centrifugal fan of two wind inlets 26, but non-ly to limit the use of in the present invention.The framework of thin fan 2 of the present invention more can be applicable to other centrifugal fan (as having the centrifugal fan of a wind inlet) (thin fan 3 as shown in Figure 9), axial flow fan (thin fan 4 as shown in Figure 10), mixed flow fan or cross flow fan etc.
It is worth mentioning that, wiring region of the present invention and metal layer, not only for the center region being arranged at housing, if need increase circuit variation or design, also can extend to the surrounding of housing, that is the region-wide scope of housing lower cover all can arrange wiring region and metal layer.In addition, wiring region and metal layer be the non-lower cover only for being arranged at housing also, also can be arranged at the upper cover of housing, to increase the scope of use.
Shown in Fig. 7 A, Fig. 7 B and Fig. 8, the present invention also discloses a kind of thin fan.For ease of viewing and description, therefore the omission of the upper cover part of the housing 21 of Fig. 7 A and Fig. 7 B is illustrated, but, in Fig. 8, illustrate complete thin fan 2, and the upper cover part of housing 21 is shown.First chat bright, the thin fan 2 of the present embodiment is the centrifugal fan with two wind inlets 26 is example, but non-ly limits the use of in the present invention.The framework of thin fan 2 of the present invention also can be applicable to other centrifugal fan (as having the centrifugal fan of a wind inlet) (thin fan 3 as shown in Figure 9), axial flow fan (thin fan 4 as shown in Figure 10), mixed flow fan or cross flow fan etc.Thin fan 2 comprises housing 21, stator 22 and an impeller 23.Stator 22 is arranged at housing 21.The coated impeller 23 of housing 21.
Housing 21 comprises wiring region, surface 211, one 212 and a metal layer 214.Wiring region 212 is formed at surface 211 in the mode of laser, and wiring region 212 is provided with multiple metallic (figure does not illustrate), and the described multiple metallic of part is exposed to wiring region 212.Metal layer 214 is formed in the mode of chemical plating and is arranged at wiring region 212, and combines with exposed metallic.Wherein, the material of metallic can be copper and/or chromium metallic, is not defined in the present invention.Housing 21 also comprises at least one electronic component 215, and it is arranged at metal layer 214 in a welding manner.The housing 21 of the present embodiment has multiple electronic component 215, is arranged at metal layer 214 respectively, and by metal layer 214, described multiple electronic component 215 is coupled.Wherein, housing 21 is with above-described embodiment, and housing 21,21a, 21b have identical technical characteristics, therefore repeat no more in this.
Thin fan 2 also comprises bearing 24 and a rotor 25.Bearing 24 connects impeller 23.Rotor 25 is arranged at impeller 23, and correspondingly with stator 24 arranges.
In sum, thin fan of the present invention and manufacture method thereof, be first housing by the plastics forming containing metallic, continue and remove the surface of partial shell, and form wiring region in housing, then metal layer is arranged at wiring region.Wherein, the surface of partial shell is removed in the mode of laser, and surface can be plane or roughness, the multiple metallic of surface exposure of the housing after laser, then in the mode of chemical plating, metal layer is arranged at wiring region, metal layer is combined with exposed metallic, finally again electronic component is arranged on metal layer in a welding manner.
Compared with prior art, thin fan of the present invention and manufacture method thereof, what remove control circuit board arranges volume and space, to shorten the whole height of thin fan, and more effectively can utilize height space, and the variability of fan circuit wiring can be increased, with the design of more favourable fan slimming.
The foregoing is only illustrative, but not be restricted person.Anyly do not depart from spirit of the present invention and category, and to its equivalent modifications of carrying out or change, all should be contained in the protection domain of appending claims.
Claims (12)
1. a manufacture method for thin fan, comprises the following steps:
There is provided one containing the plastics of multiple metallic;
By this plastics forming one housing;
Remove the surface of this housing of part, and form a wiring region in this housing; And
In this wiring region, one metal layer is set.
2. manufacture method as claimed in claim 1, wherein these plastics comprise PPA plastics and/or LCP plastics.
3. manufacture method as claimed in claim 1, wherein said multiple metallic comprises copper and/or chromium metallic.
4. manufacture method as claimed in claim 1, wherein removes the surface of this housing of part, is by surface roughening, and makes the described multiple metallic of part exposed.
5. manufacture method as claimed in claim 1, wherein removing the surface of this housing of part, is irradiate in this housing with laser.
6. manufacture method as claimed in claim 1, wherein arranging the step of a metal layer in this wiring region, is arrange this metal layer in the mode of chemical plating.
7. manufacture method as claimed in claim 1, wherein the method is further comprising the steps of:
In this metal layer, at least one electronic component is set; And
Assemble this housing, a stator and an impeller.
8. manufacture method as claimed in claim 7, wherein arranging the step of at least one electronic component in this metal layer, is in a welding manner this electronic component is arranged at this metal layer.
9. a thin fan, comprising:
One housing, comprising:
One wiring region, is formed at the surface of this housing, and is provided with multiple metallic, and the described multiple metallic of part is exposed to this wiring region; And
One metal layer, is arranged at this wiring region, and combines with exposed described multiple metallic;
One stator, is arranged at this housing; And
One impeller, this housing this impeller coated.
10. thin fan as claimed in claim 9, the material of wherein said multiple metallic comprises copper and/or chromium metallic.
11. thin fans as claimed in claim 9, wherein this housing also comprises at least one electronic component, and described electronic component is arranged at this metal layer.
12. thin fans as claimed in claim 9, wherein this thin fan also comprises:
One bearing, connects this impeller; And
One rotor, is arranged at this impeller, and correspondingly with this stator arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110426348.3A CN103161763B (en) | 2011-12-19 | 2011-12-19 | Thin fan and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110426348.3A CN103161763B (en) | 2011-12-19 | 2011-12-19 | Thin fan and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103161763A CN103161763A (en) | 2013-06-19 |
| CN103161763B true CN103161763B (en) | 2016-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110426348.3A Active CN103161763B (en) | 2011-12-19 | 2011-12-19 | Thin fan and manufacture method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN103161763B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104948476B (en) * | 2014-03-31 | 2020-06-02 | 台达电子工业股份有限公司 | Thin fan, electronic system and manufacturing method of thin fan |
| CN106567840A (en) * | 2016-11-01 | 2017-04-19 | 东莞永立电机有限公司 | Thin brushless direct-current fan |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3608410A1 (en) * | 1986-03-13 | 1987-09-17 | Siemens Ag | Production of fine structures for semiconductor contacts |
| CN101451536A (en) * | 2007-12-07 | 2009-06-10 | 台达电子工业股份有限公司 | Fan |
| CN101900135A (en) * | 2009-05-29 | 2010-12-01 | 日本电产株式会社 | Centrifugal cutter |
| CN201878490U (en) * | 2010-12-14 | 2011-06-22 | 苏州聚力电机有限公司 | Support base structure of cooling fan |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4716065B2 (en) * | 2000-06-21 | 2011-07-06 | ミネベア株式会社 | Axial blower |
-
2011
- 2011-12-19 CN CN201110426348.3A patent/CN103161763B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3608410A1 (en) * | 1986-03-13 | 1987-09-17 | Siemens Ag | Production of fine structures for semiconductor contacts |
| CN101451536A (en) * | 2007-12-07 | 2009-06-10 | 台达电子工业股份有限公司 | Fan |
| CN101900135A (en) * | 2009-05-29 | 2010-12-01 | 日本电产株式会社 | Centrifugal cutter |
| CN201878490U (en) * | 2010-12-14 | 2011-06-22 | 苏州聚力电机有限公司 | Support base structure of cooling fan |
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| Publication number | Publication date |
|---|---|
| CN103161763A (en) | 2013-06-19 |
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