CN102378553A - Radiator and manufacturing method thereof - Google Patents

Radiator and manufacturing method thereof Download PDF

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Publication number
CN102378553A
CN102378553A CN201010262796XA CN201010262796A CN102378553A CN 102378553 A CN102378553 A CN 102378553A CN 201010262796X A CN201010262796X A CN 201010262796XA CN 201010262796 A CN201010262796 A CN 201010262796A CN 102378553 A CN102378553 A CN 102378553A
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CN
China
Prior art keywords
flat substrates
radiator
opening
holder
french
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Pending
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CN201010262796XA
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Chinese (zh)
Inventor
董家铭
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CHUN YUEH TECHNOLOGY Co Ltd
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Priority to CN201010262796XA priority Critical patent/CN102378553A/en
Publication of CN102378553A publication Critical patent/CN102378553A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a radiator and a manufacturing method thereof. The radiator is mainly formed by a fixing base and a plurality of chip base materials, wherein the fixing base comprises one or a plurality of packing pieces, the fixing base is formed with more than one opening for one end of the base materials after being connected side by side to insert, more than one groove is formed at the periphery of the adjacent opening on the fixing base and is used for containing the packing pieces, when the packing pieces are respectively pressed into the grooves, the opening can be relatively contracted inwards, and thus the base materials in the opening can be tightly tied up; and a plurality of french drains are formed on each base material, after one end of the base materials is fixedly arranged on the fixing base, a plurality of radiating strips can be formed by switching out the other end of the base materials along each cutting groove and are in dispersing shapes, and thus the radiating area is effectively enlarged.

Description

Radiator and its preparation method
Technical field
The present invention relates to a kind of Radiator and its preparation method, refer to the Radiator and its preparation method that a kind of area of dissipation is big and have sufficient clearance especially.
Background technology
Each electronic component in electronic installations such as computer can produce heat when operating; Because of the working temperature of electronic component directly determines its useful life and stability; In order to let the working temperature of each element of electronic installation remain in the reasonable range; Except the temperature that makes said electronic installation operational environment is in the zone of reasonableness; Must on the electronic component of meeting heat production, add a radiator,, reach the purpose of arranging diffusing electronic component heat and then making the normal operation of said electronic installation ability to promote and the heat exchange of environment.Traditional radiator outside drawing is shown in figure 11; It forms a plurality of fins 91 on a pedestal 90; The bottom surface 92 of this pedestal 90 with contact like electronic components such as central processing unit (CPU), transistors; The heat energy that produces from said electronic component is through being delivered to fin 91 with radiator bottom surface 92 that it closely contacts with heat conducting mode; The heat energy that accumulates in fin 91 passes to through the mode like thermal convections such as fan blow and dispels the heat in the outside air, through the heat conduction and the thermal convection of aforementioned radiator, the heat that promptly removable electronic component produced.
But traditional radiator is with a plurality of fin heat radiations, easy phenomenon because of the different generation flow-disturbings with the correspondence position of fan or air outlet of this radiator; Heat can't effectively be taken in the outside air by the method for thermal convection and dispel the heat; Make the integral heat sink deleterious, and because of the traditional heat-dissipating device is to be made up of aluminium extruded type, it will make the height of fin and minimum spacing that its restriction is arranged; Thereby the expansion of area of dissipation is affected, and then influence its radiating effect.The above is all the undesirable part of traditional radiator, is further improved in fact, and seeks feasible solution.
Summary of the invention
Because the shortcoming of traditional heat-dissipating device structure, main purpose of the present invention is to provide a kind of radiator, and its area of dissipation is big and have sufficient clearance, can arrange the heat energy that is produced when loosing the electronic component running rapidly.
For reaching the major technique means that aforementioned purpose takes is to make aforementioned radiator include:
One holder is formed with more than one opening on this holder;
A plurality of flat substrates; Be formed with a plurality of french drains on this flat substrates; These a plurality of flat substrates have one first end and reach and corresponding one second end of this first end, and its first end is fixed in the opening of holder, and its second end forms a plurality of radial heat sink strips that scatter that are along the french drain separation.
When the present invention is installed on the electronic component; Utilize first end of heat sink strip to contact and carry out heat conduction with the surface of this electronic component; The thermal energy conduction that electronic component is produced is to second end of this heat sink strip, carries out thermal convection by second end of this heat sink strip again and heat energy is reached in the outside air dispels the heat; And the heat sink strip that forms because of the flat substrates of this radiator is radial and scatters; So its radiating effect is not influenced by the difference in corresponding space; And the area of dissipation that makes this radiator is big and have sufficient clearance, can arrange the heat energy that is produced when loosing the electronic component running rapidly.
The present invention also provides a kind of manufacturing approach of aforementioned radiator, and its step includes:
A plurality of flat substrates are provided, and each flat substrates is formed with a plurality of french drains at it more than the one side;
With a plurality of flat substrates side by side after, insert and be fixed in the opening of a holder with an end;
The french drain of flat substrates along the other end pulled open to form a plurality of heat sink strips, make each heat sink strip be radial and scatter;
Aforementioned manufacturing approach is a sheet because of the base material that is fixed on the holder; So can conveniently insert holder and carry out fixed operation; By the time coming flat substrates other end branch after wherein an end is fixed becomes strip again, with effective raising area of dissipation, so have easily manufactured advantage.
Description of drawings
The stereogram that Fig. 1 accomplishes for one embodiment of the present invention assembling,
Fig. 2 is the exploded view of one embodiment of the present invention,
Fig. 3 is the enlarged drawing of one embodiment of the present invention flat substrates,
Fig. 4 is the vertical view of one embodiment of the present invention flat substrates,
Fig. 5 is the assembling process figure of one embodiment of the present invention,
Fig. 6 is the assembling process profile of one embodiment of the present invention,
Fig. 7 is another assembling process profile of one embodiment of the present invention,
Fig. 8 is another assembling process figure of one embodiment of the present invention,
Fig. 9 is the assembling process sketch map of one embodiment of the present invention,
Figure 10 is the assembling process profile of another preferred embodiment of the present invention,
Figure 11 is the outside drawing of existing radiator.
The primary clustering symbol description
20 holders, 21 openings
22 grooves, 23 forcing pieces
24 clamping parts, 25 locking holes
311 first of 31 flat substrates
312 second 313 french drains
314 french drains, 315 heat sink strips
41 solder layers, 42 bottom surfaces
90 pedestals, 91 fins
92 bottom surfaces
Embodiment
The stereogram that the assembling of one embodiment of the present invention is accomplished is as shown in Figure 1; The present invention is a kind of radiator; It includes a holder 20 and forms with a plurality of flat substrates 31 (as shown in Figure 3) that are divided into a plurality of heat sink strips 315; This flat substrates 31 has one first end and one second end, and its first end is fixed in the opening 21 (as shown in Figure 2) of holder 20, and its second end is radial and scatters; Shape before this radiator assembling such as Fig. 2 are to shown in Figure 4; This holder 20 is a tabular, is formed with more than one opening 21 on it, and it can hold a plurality of flat substrates 31; In this preferred embodiment; This opening 21 is positioned at the central authorities of holder 20, and this opening 21 is shaped as rectangle, and its quantity is one; Please with reference to shown in Figure 2, around this opening 21, be formed with more than one groove 22 again, respectively be provided with one with upper tighten piece 23 on this groove 22; And between opening 21 and each groove 22, respectively be formed with a clamping part 24; Being formed with more than one outstanding fixed part on the holder 20, be formed with more than one locking hole 25 on each fixed part respectively, its confession is established on the electronic component that the fixture (not shown) is fixed on radiator the desire heat radiation and is used; In this preferred embodiment; Around this opening 21, respectively be formed with a groove 22, and respectively be provided with a forcing piece 23 on this groove 22, this forcing piece 23 has an end face and a bottom surface; And this forcing piece 23 near the width of clamping part 24 1 sides from end face successively decrease along the bottom surface (as shown in Figure 6); And holder 20 is a rectangle, and each corner of this holder 20 is formed with an outstanding fixed part respectively, is formed with a locking hole 25 on each fixed part respectively; Still unassembled a plurality of flat substrates 31 uprightly are arranged in a cubold; The enlarged drawing of single flat substrates 31 is as shown in Figure 3, and this flat substrates 31 has one first 311 and 1 second 312 (as shown in Figure 4), and its first 311 is formed with a plurality of french drains 313; Its second face also is formed with a plurality of french drains 314; A plurality of french drains 313,314 on these a plurality of flat substrates 31 can use pinch roller roll extrusion flat substrates 31 to form, or form with modes such as instrument skive shape base materials 31, see also shown in Figure 4; And the position that is formed with french drain 314 on second 312 is corresponding to the position of each french drain 313 on first 311; In this preferred embodiment, 313 of each french drains are equidistance, and on first 311 each french drain 313 with second 312 on the shape and the degree of depth of each french drain 314 identical; The part that flat substrates 31 thickness between each french drain 313 and the french drain 314 are not established french drain 313,314 is thin, when assembling, can flat substrates be opened in 31 minutes from french drain 313,314.When this radiator is installed on the electronic component; Utilize first end of heat sink strip 315 to contact and carry out heat conduction with the surface of this electronic component; The thermal energy conduction that electronic component is produced is to second end of this heat sink strip 315, carries out thermal convection by second end of this heat sink strip 315 again and heat energy is reached in the outside air dispels the heat.
A plurality of flat substrates 31 of the present invention are explained so that continuous decomposition is graphic with holder 20 associated methods; See also Fig. 5 and shown in Figure 6; With a plurality of flat substrates 31 side by side; And after french drain 313 (as shown in Figure 3) position between a plurality of flat substrates 31 is aligned with each other, first end of a plurality of flat substrates 31 is inserted in the opening 21 of holder 20, again forcing piece 23 is filled in the groove 22 with french drain 313 and holder 20 nonparallel directions; See also Fig. 6 and shown in Figure 7,24 of a plurality of flat substrates 31 and clamping parts are formed with a gap, after filling in the groove 22 of holder 20 to forcing piece 23; Clamping part 24 just can be by forcing piece 23 extruding and move toward the direction of opening 21; Opening 21 is internally contracted mutually, and a plurality of flat substrates 31 of packing and then tighten first end of these a plurality of flat substrates 31 can be fixed on the holder 20 a plurality of flat substrates 31; In this preferred embodiment; Forcing piece 23 compressings that this clamping part 24 successively decreases along the bottom surface from end face because of receiving width, so the first half of this clamping part 24 touches a plurality of flat substrates 31, and the deformation that produced narrowed width of this clamping part 24; And this flat substrates 31 and holder 20 are except fixing with preceding method; Also can use methods such as welding or use adhesive agent to fix; See also shown in Figure 10, with a plurality of flat substrates 31 side by side, and the french drain between a plurality of flat substrates 31 313 (as shown in Figure 3) position aligned with each other after; First end of these a plurality of flat substrates 31 is inserted in the opening 21 of holder 20; Use soldering appliance will be based in each flat substrates and the opening of this open bottom end, the solder layer 41 of burn-oning on each flat substrates 31 that will be based in these opening 21 bottoms with soldering appliance again and the opening 21 makes each flat substrates 31 interconnect with opening 21; And then these a plurality of flat substrates 31 are fixed on this holder 20, last again these a plurality of flat substrates 31 polishings with the bottom surface 42 of these solder layer 41 compositions makes it constitute smooth contact-making surface; Also can first end of a plurality of flat substrates be stained with adhesive agent, again these a plurality of flat substrates be inserted in the opening of holder, treat adhesive agent do solid after these a plurality of flat substrates promptly be fixed on the holder.
See also Fig. 8 and shown in Figure 9; After a plurality of flat substrates 31 are fixed on the holder 20; Just can a plurality of flat substrates 31 french drains 313,314 (as shown in Figure 3) be separated and then formation heat sink strip 315; And use anchor clamps that heat sink strip 315 is pulled open, make second end of each heat sink strip 315 on same flat substrates 31 be symmetry or asymmetric fan-shaped is scattered; See also shown in Figure 1; Use at last anchor clamps will lean on the different flat substrates 31 heat sink strip 315 toward and 315 of same flat substrates 31 heat sink strips be the different directions that fan-shaped scatters and pull open; Make the heat sink strip 315 of 31 of each flat substrates also be symmetry or asymmetric fan-shaped is scattered; And then second end that makes each heat sink strip 315 is radial and scatters, and promptly accomplishes the manufacturing of this radiator.This kind manufacturing approach is shaped as sheet because of the flat substrates 31 of putting into holder 20 openings 21; By the time just opened the heat sink strip 315 that forms strip to flat substrates in 31 minutes after first end is fixed; Need not heat sink strip 315 be inserted opening 21 internal fixation of holder 20; So have an easily manufactured advantage, and the heat sink strip 315 that forms because of the flat substrates 31 of this radiator is radial and scatters, so its radiating effect is not influenced by the difference in corresponding space; And the area of dissipation that makes this radiator is big and have sufficient gap, can arrange the heat energy that is produced when loosing the electronic component running rapidly.
The above is merely the preferred embodiments of the present invention; Be not that the present invention is done any pro forma restriction; Though the present invention discloses as above with preferred embodiment, yet be not that those skilled in the art are in the scope that does not break away from technical scheme of the present invention in order to qualification the present invention; The technology contents of above-mentioned announcement capable of using is made a little change or is modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from technical scheme of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.

Claims (10)

1. radiator, it includes:
One holder is formed with more than one opening on this holder;
A plurality of flat substrates; Be formed with a plurality of french drains on this flat substrates; These a plurality of flat substrates have one first end and reach and corresponding one second end of this first end, and its first end is fixed in the opening of holder, and its second end forms a plurality of radial heat sink strips that scatter that are along the french drain separation.
2. radiator according to claim 1 be formed with more than one groove around this opening, and each groove is arranged with more than one forcing piece.
3. radiator according to claim 2; Each groove is arranged with a forcing piece; And between opening and each groove, respectively be formed with a clamping part, this forcing piece has an end face and a bottom surface, and this forcing piece successively decreases along the bottom surface from end face at the width near clamping part one side.
4. radiator according to claim 3, this flat substrates have one first with one second, its first all is formed with a plurality of french drains with second face, and the position that is formed with french drain on second is corresponding to first position of going up each french drain.
5. radiator according to claim 4 is formed with fixed part outstanding more than on this holder, be formed with more than one locking hole on each fixed part respectively.
6. the manufacturing approach of a radiator, its step includes:
A plurality of flat substrates are provided, and each flat substrates is formed with a plurality of french drains at it more than the one side;
With a plurality of flat substrates side by side after, insert and be fixed in the opening of a holder with an end;
The french drain of flat substrates along the other end pulled open to form a plurality of heat sink strips, make each heat sink strip be radial and scatter.
7. according to the manufacturing approach of the said radiator of claim 6, this flat substrates have one first with one second, its first all is formed with a plurality of french drains with second face, and the position that is formed with french drain on second is corresponding to first position of going up each french drain.
8. according to the manufacturing approach of the said radiator of claim 7; Be formed with more than one groove in this around openings; Respectively be provided with a forcing piece on each groove; And between opening and each groove, respectively be formed with a clamping part, this forcing piece has an end face and a bottom surface, and this forcing piece successively decreases along the bottom surface from end face at the width near clamping part one side.
9. according to the manufacturing approach of claim 6 a said radiator, a plurality of french drains on these a plurality of flat substrates can use pinch roller roll extrusion flat substrates or tool using to dissect flat substrates and form.
10. according to the manufacturing approach of the said radiator of claim 7, these a plurality of flat substrates and this holder can use welding to fix, and its step includes:
With a plurality of flat substrates side by side after, insert with an end in the opening of a holder;
Use soldering appliance will be based in the solder layer of burn-oning on each flat substrates and the opening of this open bottom end, these a plurality of flat substrates are fixed on this holder;
Make it constitute smooth contact-making surface the bottom surface polishing of these a plurality of flat substrates and this solder layer composition.
CN201010262796XA 2010-08-24 2010-08-24 Radiator and manufacturing method thereof Pending CN102378553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010262796XA CN102378553A (en) 2010-08-24 2010-08-24 Radiator and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN201010262796XA CN102378553A (en) 2010-08-24 2010-08-24 Radiator and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN102378553A true CN102378553A (en) 2012-03-14

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CN201010262796XA Pending CN102378553A (en) 2010-08-24 2010-08-24 Radiator and manufacturing method thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114434116A (en) * 2020-11-06 2022-05-06 深圳市金合联技术股份有限公司 Manufacturing method of radiator and radiator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1674360A (en) * 2004-03-03 2005-09-28 蒂科电子公司 Pluggable electronic receptacle with heat sink assembly
CN2742575Y (en) * 2004-10-28 2005-11-23 珍通科技股份有限公司 Heat radiator plate
TWM298732U (en) * 2006-03-07 2006-10-01 Stirring Entpr Company Ltd Improved heat dissipation device structure
TWI298732B (en) * 2001-04-17 2008-07-11 Matsushita Electric Ind Co Ltd Conductive organic thin film and production method therefor, electrode and electric cable using it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI298732B (en) * 2001-04-17 2008-07-11 Matsushita Electric Ind Co Ltd Conductive organic thin film and production method therefor, electrode and electric cable using it
CN1674360A (en) * 2004-03-03 2005-09-28 蒂科电子公司 Pluggable electronic receptacle with heat sink assembly
CN2742575Y (en) * 2004-10-28 2005-11-23 珍通科技股份有限公司 Heat radiator plate
TWM298732U (en) * 2006-03-07 2006-10-01 Stirring Entpr Company Ltd Improved heat dissipation device structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114434116A (en) * 2020-11-06 2022-05-06 深圳市金合联技术股份有限公司 Manufacturing method of radiator and radiator

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ASS Succession or assignment of patent right

Owner name: DONG JIAMING

Free format text: FORMER OWNER: JUNYUE TECHNOLOGY CO., LTD.

Effective date: 20120517

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20120517

Address after: Taiwan County, Taipei, China

Applicant after: Dong Jiaming

Address before: Taiwan County, Taipei, China

Applicant before: Chun Yueh Technology Co., Ltd.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120314