CN102371540B - Polishing pad cleaner - Google Patents
Polishing pad cleaner Download PDFInfo
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- CN102371540B CN102371540B CN2010102660671A CN201010266067A CN102371540B CN 102371540 B CN102371540 B CN 102371540B CN 2010102660671 A CN2010102660671 A CN 2010102660671A CN 201010266067 A CN201010266067 A CN 201010266067A CN 102371540 B CN102371540 B CN 102371540B
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Abstract
The invention relates to a polishing pad cleaner which comprises a cleaning tray, a driving shaft, a supporting pillar and a mechanical arm. The polishing pad cleaner is characterized in that a photoelectric detecting device is arranged on the polishing pad cleaner, wherein the photoelectric detecting device comprises a detection mark, a photoelectric sensor and a signal identifying circuit; the detection mark comprises more than one color mark regularly distributed on the cleaning tray; the color marks and the cleaning tray are in different colors; the photoelectric sensor is used for detecting a position change of the detection mark and converting the position change of the detection mark into an electric detecting signal; and the signal identifying circuit is used for receiving the electric detecting signal provided by the photoelectric sensor and converting the electric detecting signal into a state control signal for indicating a current state of the polishing pad cleaner. In the polishing pad cleaner provided by the invention, the photoelectric sensor is used for avoiding the problems of detecting a running state of the cleaning tray when a driving part is in fault and ensuring a cleaning effect of the polishing pad cleaner.
Description
Technical field
The present invention relates to technical field of semiconductors, more specifically, the present invention relates to a kind of cleaner of the polishing pad for chemical-mechanical polisher.
Background technology
CMP process is the technology that is usually used at present the planarization of silicon chip upper film layer, its utilization has the suspend polishing fluid that grinds ion and the polishing pad with suitable elasticity and hardness, at silicon chip surface, carries out each other relative motion to reach the purpose of planarization.
In order to meet the demand of silicon chip surface planarization, a lot of companies have researched and developed for carrying out the chemical-mechanical polisher of described CMP process.U.S. Pat 6695680 discloses a kind of chemical-mechanical polisher.With reference to figure 1, described chemical-mechanical polisher comprises base station 100, polishing pad 110, silicon wafer carrier 120, polishing fluid nozzle 130 and polishing pad cleaner 200, wherein, described base station 100 is for loading polishing pad 110, silicon wafer carrier 120, polishing fluid nozzle 130 and polishing pad cleaner 200, described silicon wafer carrier 120 comprises mechanical arm, support sector and movable part that described mechanical arm two ends connect, described support sector is positioned on the outer base station 100 of polishing pad 110, described movable part is suspended on polishing pad 110, its bottom is for loading the silicon chip that need to carry out polishing, when needs carry out polishing, described movable part moves to the position near polishing pad 110, the silicon chip of its bottom contacts and is rotated with described polishing pad 110, be matched with the polishing fluid by 130 ejections of polishing fluid nozzle, polishing pad 110 and silicon wafer carrier 120 complete the polishing operation of silicon chip jointly.
In the polishing process of described silicon chip, the solid particle had after partially polished liquid and polishing adheres on polishing pad 110, and this can cause the pollution of polishing pad 110, and then affects the effect of chemically mechanical polishing.Therefore, described chemical-mechanical polisher is cleared up by 200 pairs of described polishing pads 110 of the polishing pad cleaner on it.
Structure similar with silicon wafer carrier 110, described polishing pad cleaner 200 includes the support column 202 and cleaning section 203 that mechanical arm 201 and described mechanical arm 201 two ends connect, wherein, described support column 202 is column structure, be positioned on the outer base station 100 of polishing pad 110, the one end is connected with base station 100, and the other end is connected with mechanical arm 201.Described support column 202 can be rotated around the axis of its column structure, thereby the cleaning section 203 that makes mechanical arm 201 and described mechanical arm 201 other ends connect is along the planar movement that is parallel to polishing pad 110.The cleaning section 203 connected for described mechanical arm 201 other ends, it includes power transmission shaft 204 and cleaning pallet 205.One end of described power transmission shaft 204 is connected with mechanical arm 201, and the other end of described power transmission shaft 204 connects described cleaning pallet 205.Under the control of the drive system (not shown) in mechanical arm 201, described power transmission shaft 204 both can, along its axis direction (described axis direction is perpendicular to polishing pad 110 planes) translation, also can rotate around its axis.When needs carry out the cleaning of polishing pad 110, cleaning section 203 moves on polishing pad 110, and the power transmission shaft 204 of described cleaning section 203 extends to polishing pad 110 directions, and makes described cleaning pallet 205 and polishing pad 110 Surface Contacts.Afterwards, described power transmission shaft 204 is around its axis rotation, and then 205 rotations of drive cleaning pallet.Cleaning pallet 205 and the polishing pad 110 of described rotation rub, thereby the pollutant on polishing pad 110 is cleared up away; And, when not carrying out the cleaning of polishing pad 110, described power transmission shaft 204 is contracted to the position near mechanical arm 201, and drives cleaning pallet 205 and lift, thereby leave polishing pad 110 surfaces.
In described polishing pad cleaner, the rotation of described cleaning pallet is drive and control by the drive system of polishing pad cleaner and control system, and wherein, described drive system includes the parts such as reduction gearing, belt, CD-ROM drive motor.For example, for described cleaning pallet, need to drive power transmission shaft by belt by CD-ROM drive motor and rotate, and then drive described cleaning pallet rotation.And the rotation situation of described cleaning pallet need to be detected by the motor encoder on CD-ROM drive motor, the testing result of described motor encoder can feed back to control system, as the reference of controlling the rotation of cleaning pallet.
Yet, in the real work engineering, when the drive disk assemblies such as described reduction gearing, belt, power transmission shaft lost efficacy, the rotation situation of cleaning pallet and the working condition of CD-ROM drive motor are inconsistent.At this moment, the motor encoder that detects the revolution situation can't correctly reflect the actual rotation situation of clearing up pallet, can not determine the cleaning effect of cleaning pallet, and then may affect quality of finish.
Summary of the invention
The problem that the present invention solves is to provide a kind of polishing pad cleaner, avoids drive disk assembly to lose efficacy on the impact of polishing pad cleaning effect.
For addressing the above problem, the invention provides a kind of polishing pad cleaner, comprise cleaning pallet, power transmission shaft, support column and mechanical arm, it is characterized in that, be provided with photoelectric detection system on described polishing pad cleaner, described electrooptical device comprises certification mark, photoelectric sensor and signal recognition circuit, wherein
Described certification mark, include the color mark of an above regular distribution on the cleaning pallet, and described color mark has different colors from the cleaning pallet;
Described photoelectric sensor, for detection of the change in location of described certification mark, and be converted to electrical detection signal by the change in location of described certification mark;
Described signal recognition circuit, the electrical detection signal provided for receiving photoelectric sensor, be converted to described electrical detection signal the state control signal of indicating polishing pad cleaner current state.
Optionally, described certification mark is positioned at side elevation and/or the front of cleaning pallet.
Optionally, described certification mark distributes along the rotating shaft equal angles of cleaning pallet.
Optionally, described photoelectric sensor is positioned on the mechanical arm of polishing pad cleaner.
Optionally, described photoelectric sensor is positioned at the side of mechanical arm towards the polishing pad center of circle.
Optionally, described photoelectric sensor is the diffuse reflection type photoelectric sensor.
Optionally, the electrical detection signal of described photoelectric sensor output is pulse signal, and described state control signal indication polishing pad cleaner is in the cleaning state; The electrical detection signal of described photoelectric sensor output is direct current signal, and described state control signal indication polishing pad cleaner is in non-cleaning state.
Optionally, described color mark is black, and the edge of described cleaning pallet is white, silver color or light gray.
Optionally, the spacer area between the color mark on described cleaning pallet surpasses the area of photoelectric sensor surveyed area.
Optionally, the state control signal of described signal recognition circuit generation offers the control system of polishing pad cleaner.
Compared with prior art, the present invention has the following advantages: the rotation situation of directly monitoring the cleaning pallet by photoelectric detection system, while having avoided drive disk assembly to lose efficacy, motor encoder can't correctly reflect the problem of cleaning pallet rotation situation, has guaranteed the cleaning effect of polishing pad cleaner.
The accompanying drawing explanation
Fig. 1 shows a kind of chemical-mechanical polisher of prior art.
Fig. 2 to Fig. 5 shows an embodiment of polishing pad cleaner of the present invention.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Set forth in the following description a lot of details so that fully understand the present invention, implement but the present invention can also adopt other to be different from alternate manner described here, so the present invention has not been subject to the restriction of following public specific embodiment.
Just as described in the background section, in the chemical-mechanical polisher of prior art, the rotation situation of cleaning pallet need to be detected by the motor encoder on CD-ROM drive motor.But, when the drive disk assembly be connected when described and described cleaning pallet lost efficacy, the rotation situation of cleaning pallet and the working condition of CD-ROM drive motor are inconsistent.At this moment, described motor encoder can't correctly reflect the actual rotation situation of clearing up pallet, also just can not determine the cleaning effect of cleaning pallet.
For the problems referred to above, it is a kind of by the polishing pad cleaner of photoelectric detection system direct-detection cleaning pallet rotation situation that the present inventor provides, and avoided motor encoder testing result under the drive disk assembly failure conditions can not reflect the problem of clearing up the pallet rotation situation.
Referring to Fig. 2, show an embodiment of polishing pad cleaner of the present invention.
As shown in Figure 2, described polishing pad cleaner includes the support column 302 and cleaning section 303 and drive system and control system (not shown) that mechanical arm 301, described mechanical arm 301 two ends connect.
Wherein, described support column 302 is column structure, be positioned on the outer base station (not shown) of polishing pad 310, described support column 302 can be rotated around the axis of its column structure, thereby the cleaning section 303 that makes mechanical arm 301 and described mechanical arm 301 other ends connect is along the planar movement that is parallel to polishing pad 310.
The cleaning section 303 connected for described mechanical arm 301 other ends, it includes power transmission shaft 304 and cleaning pallet 305.One end of described power transmission shaft 304 is connected with mechanical arm 301, and the other end is connected with cleaning pallet 305.
Described drive system and control system cooperatively interact, to realize the motion of polishing pad cleaner.Wherein, duty or the operational order formation control signal of described control system based on chemical-mechanical polisher, under the control of described control signal, drive system provides power to each parts of polishing pad cleaner.
Described polishing pad cleaner also is provided with the photoelectric detection system for detection of cleaning pallet 305 rotation situation, and described photoelectric detection system comprises certification mark 306, photoelectric sensor 307 and signal recognition circuit (not shown), wherein:
Described certification mark 306, include the color mark of an above regular distribution on cleaning pallet 305, and described color mark has different colors from cleaning pallet 305;
Described photoelectric sensor 307, for detection of the change in location of described certification mark 306, and be converted to electrical detection signal by the change in location of described certification mark 306;
Described signal recognition circuit, the electrical detection signal provided for receiving photoelectric sensor 307, be converted to state control signal by described electrical detection signal and offer the control system of polishing pad cleaner.Described signal recognition circuit can be realized based on PLC (Programmable Logic Controller) or MCU (microcontroller).Particularly, described state control signal comprises that whether the polishing pad cleaner is in the cleaning state, and the information such as rotating speed of clearing up pallet 305 under the cleaning state.Based on described state control signal, the control system of polishing pad cleaner can be controlled to drive system different control signals is provided, and then drives the work of described polishing pad cleaner.For example, after knowing that described cleaning pallet 305 rotating speeds are low and can't effectively clearing up polishing pad 310, the control system of polishing pad cleaner can improve motor rotary speed by control-driven system, and then improves the rotating speed of cleaning pallet 305.
According to the difference of specific embodiment, described certification mark 306 is positioned at side elevation and/or the front of cleaning pallet 305, and described front refers to the side bottom surface of cleaning pallet 305 away from polishing pad 310.Why described certification mark 306 can be arranged on to side elevation and/or the front of cleaning pallet 305, be to be convenient to photoelectric sensor 307 detections on mechanical arm 301 because be arranged at side elevation with positive certification mark 306.Preferably, be positioned at the edge that the certification mark 306 of clearing up pallet 305 fronts can be arranged at described cleaning pallet 305.When described cleaning pallet 305 rotation, compared to cleaning pallet 305 center of circle near zones, the color mark of cleaning pallet 305 marginal positions has larger interval, is beneficial to detection.
Described photoelectric sensor 307 is the diffuse reflection type photoelectric sensor, and it includes optical lens and electrooptical device.When described photoelectric sensor 307 work, the light that external light source sends projects on cleaning pallet 305, from cleaning pallet 305 surface reflections, project on the optical lens of photoelectric sensor 307 again, light via described optical lens continues to project on electrooptical device, thus imaging be converted to electrical detection signal.
For described photoelectric sensor 307, the scope of its surveyed area is determined by described optical lens to the distance of polishing pad 310, the focal length of optical lens and the imaging area of electrooptical device.In the present embodiment, the surveyed area of described photoelectric sensor 307 is positioned at the optical lens optical axis position crossing with clearing up pallet 305 (under the cleaning state) front or side elevation.In addition, by the parameter of described photoelectric sensor 307 is set, make described surveyed area surpass the area of single color mark on cleaning pallet 305, and be less than two spacer areas between color mark, to guarantee only having at most a color mark to fall in surveyed area in any time.
Referring to Fig. 3 a and Fig. 3 b, show the detailed schematic of cleaning pallet in Fig. 2.Wherein, Fig. 3 a is the top view of described cleaning pallet, and Fig. 3 b is the side view of described cleaning pallet.
As shown in Figure 3 a, the certification mark 306 in described cleaning pallet 305 fronts includes the color mark of 12 regular distribution, and described 12 color marks distribute along the axis equal angles of cleaning pallet 305, and is positioned at the edge of described cleaning pallet 305.Particularly, in described cleaning pallet 305 front edge, centered by the axis of cleaning pallet 305, at interval of 30 degree, be provided with a color mark.It should be noted that, in Fig. 3 a, the quantity of color mark is only example, should not limit its scope.
As shown in Fig. 3 b, described cleaning pallet 305 side elevations also can be provided with and the positive similarly certification mark of Fig. 3 a cleaning pallet 305.Described certification mark 306 also includes the color mark of 12 regular distribution, along the axis equal angles distribution of cleaning pallet 305.
Difference according to specific embodiment, certification mark 306 on described cleaning pallet 305 both can only be positioned at the front of cleaning pallet 305, also can only be positioned at the side elevation of cleaning pallet 306, can also be positioned at front and the side elevation of cleaning pallet 305 simultaneously, should not limit its scope.
Preferably, in order to improve the identification of 307 pairs of described certification marks 306 of photoelectric sensor, described certification mark 306 is black, and described cleaning pallet 305 is easy to the color with the black differentiation for white, silver color, light gray or other.
Referring to Fig. 4 a and Fig. 4 b, the position of cleaning pallet when showing respectively the polishing pad cleaner and carrying out the polishing pad cleaning operation, and the position of cleaning pallet while not carrying out cleaning operation.
As shown in Fig. 4 a, when described polishing pad cleaner carries out the polishing pad cleaning, power transmission shaft 304 extends to polishing pad 310 directions, and make described cleaning pallet 305 and polishing pad 310 Surface Contacts, afterwards, described power transmission shaft 304 is around its axis rotation, and then 305 rotations of drive cleaning pallet.Cleaning pallet 305 and the polishing pad 310 of described rotation rub, thereby the pollutant on polishing pad 310 is cleared up away.
As shown in Figure 4 b, when described polishing pad cleaner does not carry out polishing pad 310 cleaning, power transmission shaft 304 shrinks and drives cleaning pallet 305 and is raised up to the position that approaches mechanical arm 301, thereby makes cleaning pallet 305 leave polishing pad 310 surfaces.In this case, the certification mark of described cleaning pallet 305 will leave the surveyed area of photoelectric sensor 307.
Next, the operation principle of described photoelectric detection system described:
When described polishing pad cleaner carries out the polishing pad cleaning, cleaning pallet 305 is pressed close to polishing pad 310 surfaces and is rotated.The camera lens of the photoelectric sensor 307 on described mechanical arm 301 adopts tight shot, and photoelectric sensor 307 also is fixed on mechanical arm 301, and therefore, the surveyed area of described photoelectric sensor 307 immobilizes.Now, the cleaning pallet 305 rotated and on certification mark make the color in photoelectric sensor 307 surveyed areas constantly change: when color that surveyed area is cleaning pallet 305, the voltage signal of photoelectric sensor 307 output low levels, and while in described surveyed area, color mark occurring, the voltage signal of photoelectric sensor 307 output high level.Like this, the change in location that photoelectric sensor 307 will be cleared up the certification mark of pallet spaced at equal angles around is converted to the pulse signal of CF, and the different frequency of described pulse signal is corresponding to the different rotary speed of cleaning pallet 305.
Then, described pulse signal is provided for signal recognition circuit, and signal recognition circuit is changed based on described pulse signal, forms state control signal and offers the control system of polishing pad cleaner.Now, described state control signal indicates described cleaning pallet 305 to be in the cleaning state, and, by calculating the frequency of pulse signal, still can know the rotary speed information of described cleaning pallet 305 and offer in the lump described control system.
It is example that the described certification mark of still take includes 12 color marks, when the frequency of pulse signal is 240 hertz, illustrate that the color mark quantity that photoelectric sensor 307 per seconds detect is 240, and 12 color marks often detected corresponding to cleaning pallet 305 rotation 1 circles, therefore, now the rotating speed of described cleaning pallet 305 is 20 revolutions per seconds, i.e. 1200rpm.
And, when the polishing pad cleaner does not carry out the polishing pad cleaning, cleaning pallet 305 is raised near the position of mechanical arm 301 and makes color mark can not fall in the surveyed area of photoelectric sensor 307.At this moment, photoelectric sensor 307 can't detect color in color mark and surveyed area and not change, thereby the electrical detection signal of its output remains direct current signal, is for example lasting low level signal or high level signal.At this moment, signal recognition circuit is changed based on described direct current signal, forms state control signal and offers the control system of polishing pad cleaner.Now, described state control signal indicates described cleaning pallet 305 to be in non-cleaning state.
In actual applications, when described polishing pad cleaner is cleared up polishing pad, polishing pad and all constantly rotations of cleaning pallet, and described cleaning pallet be take support column and is moved back and forth between the polishing pad center of circle and polishing pad edge as axle center.In described polishing pad rotary course, the cleaning pallet can evoke the polishing fluid on described polishing pad away from the top of support column, and makes the described polishing fluid evoked be attached on the cleaning pallet.Simultaneously, described cleaning pallet is also rotating, and under the effect of centrifugal force, the polishing fluid adhered on described cleaning pallet can throw away along the tangential direction of cleaning pallet.
For chemical-mechanical polisher, its cleaning pallet is identical with the direction of rotation of polishing pad, and described cleaning pallet and polishing pad all turn clockwise or be rotated counterclockwise.Simultaneously, because the reciprocating scope of cleaning pallet is no more than the polishing pad center of circle, therefore, described mechanical arm has a side all the time near the polishing pad center of circle, and opposite side is away from the polishing pad center of circle.In this case, the polishing fluid that mechanical arm easily is thrown out of away from the side in the polishing pad center of circle pollutes, if photoelectric sensor is arranged at this side, easy polished liquid pollutes and impact detects effect (as shown in Figure 5).Therefore, in preferred embodiment, described photoelectric sensor is arranged at the side of mechanical arm near the polishing pad center of circle, avoids being thrown away by cleaning pallet or polishing pad the pollution of liquid.
Polishing pad cleaner of the present invention adopts photoelectric sensor directly to monitor the situation of change of described cleaning pallet certification mark, but not by the rotation situation of the described cleaning pallets of parts indirect detection such as drive disk assembly, motor encoder, while having avoided drive disk assembly to lose efficacy, motor encoder can't correctly reflect that the problem of cleaning pallet rotation situation occurs, thereby has guaranteed the cleaning effect of polishing pad cleaner.In addition, described polishing pad cleaner can also determine whether the cleaning pallet is on polishing pad and is cleared up.
Should be appreciated that, example herein and embodiment are only exemplary, and those skilled in the art can in the situation that do not deviate from the spirit and scope of the present invention that the application and claims limit, make various modifications and corrigendum.
Claims (10)
1. a polishing pad cleaner, comprise cleaning pallet, power transmission shaft, support column and mechanical arm, it is characterized in that, be provided with photoelectric detection system on described polishing pad cleaner, described photoelectric detection system comprises certification mark, photoelectric sensor and signal recognition circuit, wherein
Described certification mark, include the color mark of an above regular distribution on the cleaning pallet, and described color mark has different colors from the cleaning pallet;
Described photoelectric sensor, for detection of the change in location of described certification mark, and be converted to electrical detection signal by the change in location of described certification mark;
Described signal recognition circuit, the electrical detection signal provided for receiving photoelectric sensor, be converted to described electrical detection signal the state control signal of indicating polishing pad cleaner current state.
2. polishing pad cleaner as claimed in claim 1, is characterized in that, described certification mark is positioned at side elevation and/or the front of cleaning pallet.
3. polishing pad cleaner as claimed in claim 1, is characterized in that, described certification mark distributes along cleaning tray rotating shaft equal angles.
4. polishing pad cleaner as claimed in claim 1, is characterized in that, described photoelectric sensor is positioned on the mechanical arm of polishing pad cleaner.
5. polishing pad cleaner as claimed in claim 1, is characterized in that, described photoelectric sensor is positioned at the side of mechanical arm towards the polishing pad center of circle.
6. polishing pad cleaner as claimed in claim 1, is characterized in that, described photoelectric sensor is the diffuse reflection type photoelectric sensor.
7. polishing pad cleaner as claimed in claim 1, is characterized in that, the electrical detection signal of described photoelectric sensor output is pulse signal, and described state control signal indication polishing pad cleaner is in the cleaning state; The electrical detection signal of described photoelectric sensor output is direct current signal, and described state control signal indication polishing pad cleaner is in non-cleaning state.
8. polishing pad cleaner as claimed in claim 1, is characterized in that, described color mark is black, and the edge of described cleaning pallet is white, silver color or light gray.
9. polishing pad cleaner as claimed in claim 1, is characterized in that, the spacer area between the color mark on described cleaning pallet surpasses the area of photoelectric sensor surveyed area.
10. polishing pad cleaner as claimed in claim 1, is characterized in that, the state control signal that described signal recognition circuit produces offers the control system of polishing pad cleaner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102660671A CN102371540B (en) | 2010-08-19 | 2010-08-19 | Polishing pad cleaner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102660671A CN102371540B (en) | 2010-08-19 | 2010-08-19 | Polishing pad cleaner |
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| Publication Number | Publication Date |
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| CN102371540A CN102371540A (en) | 2012-03-14 |
| CN102371540B true CN102371540B (en) | 2013-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102660671A Active CN102371540B (en) | 2010-08-19 | 2010-08-19 | Polishing pad cleaner |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6658119B2 (en) * | 2016-03-08 | 2020-03-04 | 株式会社ジェイテクト | Grinder |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6077147A (en) * | 1999-06-19 | 2000-06-20 | United Microelectronics Corporation | Chemical-mechanical polishing station with end-point monitoring device |
| CN1454131A (en) * | 2000-06-09 | 2003-11-05 | 斯特拉斯保 | Polishing pad with built-in optical sensor |
| KR20040064984A (en) * | 2003-01-13 | 2004-07-21 | 삼성전자주식회사 | CMP apparatus for semiconductor manufacture |
| KR20060121565A (en) * | 2005-05-24 | 2006-11-29 | 삼성전자주식회사 | Apparatus for rotating motion of pad conditioner in cmp system |
| KR20070028191A (en) * | 2005-09-07 | 2007-03-12 | 동부일렉트로닉스 주식회사 | Polishing pad conditioner equipped polishing pad life time detecting device and polishing pad life time detecting method |
| KR20080086014A (en) * | 2007-03-21 | 2008-09-25 | 삼성전자주식회사 | Apparatus for chemical mechanical polishing |
-
2010
- 2010-08-19 CN CN2010102660671A patent/CN102371540B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6077147A (en) * | 1999-06-19 | 2000-06-20 | United Microelectronics Corporation | Chemical-mechanical polishing station with end-point monitoring device |
| CN1454131A (en) * | 2000-06-09 | 2003-11-05 | 斯特拉斯保 | Polishing pad with built-in optical sensor |
| KR20040064984A (en) * | 2003-01-13 | 2004-07-21 | 삼성전자주식회사 | CMP apparatus for semiconductor manufacture |
| KR20060121565A (en) * | 2005-05-24 | 2006-11-29 | 삼성전자주식회사 | Apparatus for rotating motion of pad conditioner in cmp system |
| KR20070028191A (en) * | 2005-09-07 | 2007-03-12 | 동부일렉트로닉스 주식회사 | Polishing pad conditioner equipped polishing pad life time detecting device and polishing pad life time detecting method |
| KR20080086014A (en) * | 2007-03-21 | 2008-09-25 | 삼성전자주식회사 | Apparatus for chemical mechanical polishing |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121119 |
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Effective date of registration: 20121119 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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