CN102357735A - Double-scanning three-dimensional (3D) laser etching method based on controllable profile shape and power distribution of light beams - Google Patents
Double-scanning three-dimensional (3D) laser etching method based on controllable profile shape and power distribution of light beams Download PDFInfo
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- CN102357735A CN102357735A CN2011102836372A CN201110283637A CN102357735A CN 102357735 A CN102357735 A CN 102357735A CN 2011102836372 A CN2011102836372 A CN 2011102836372A CN 201110283637 A CN201110283637 A CN 201110283637A CN 102357735 A CN102357735 A CN 102357735A
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Abstract
The invention provides a double-scanning three-dimensional (3D) laser etching method based on controllable cross-section shape and power distribution of light beams, and belongs to the technical field of laser etching. In the method, equivalent laser processing spots with controllable power profile distribution is matched with an optical machine scanning galvanometer so as to carry out double-scanning laser processing on the surface of a workpiece, which can realize the laser etching of a complex 3D microstructure. The double-scanning 3D laser etching method provided by the invention has the beneficial effects of promoting the capability of the existing laser etching technology from a two-dimensional (2D) plane laser etching mode to a 3D any-curve uncovered laser etching mode, and solving the problem of no appropriate processing technology of the 3D microstructure within the size range of 1mu m-1mm, thus having scientific and industrially practical potential.
Description
Technical field
The invention belongs to the laser ablation processing technique field, relate to a kind of laser ablation processing method of the 3 D complex structure based on new principle, relate in particular to a kind of two scanning three-dimensional laser ablation processing methods that distribute based on controlled light beam shape of cross section and power.
Background technology
Laser ablation processing is meant the technology of utilizing laser that the surface of the work material is ablated and removed.Relatively belong to a new field of laser processing with ripe relatively cut, laser weld; Be a kind of surface texture micro-processing technology that develops gradually along with peak value ultra-short pulse laser (nanosecond, psec, femtosecond) development of technology over past ten years, its development application the earliest is a laser marking.In this technology, focussed laser beam etches character and various pattern at surface scan.Be the process technology of a kind of plane (two dimension) in essence.
Micro-electromechanical system (MEMS) (Micro-electromechanical Systems) technology is considered to one of important support technology of 21st century, is similar to the effect of microelectric technique to twentieth century.3 D stereo and the manufacturing of the micro-structural of on-plane surface, little part is its development key.Up to the present, the typical size in this field is 1 μ m ~ 1mm scope, and the very wide material of coverage.This yardstick is to traditional machined and Yan Taixiao, and for microelectronic technique too big (and microelectronic technique can only carry out the processing of plane (two dimension), mainly be limited to silicon materials), so all inapplicable.Unique technology that can be used for this field is a LIGA technology (Lithography Electroforming Micro Molding) at present.But this technology depends on the synchrotron radiation that large-scale cyclotron produces, and this huge equipment also is very few in the world.Therefore, can't become a kind of industrial technology of reality.
Laser ablation processing is a potential technology that can be used for above-mentioned processing tasks.It is a kind of flexible process technology, has the flexibility of height, is applicable to the material category that haves a wide reach, and the particularly important is on the principle it and possesses the ability in the three-dimensional processing of 1 μ m～1mm range scale, although in that it also only is used for two dimension processing at present.The core content of present patent application has proposed a kind of the two dimensional surface laser ablation is developed into 3 D stereo laser ablation processing and has the method that becomes industrial practical technique potentiality exactly.
Summary of the invention
The objective of the invention is to the problem that exists in the prior art; A kind of two scanning three-dimensional laser ablation processing methods based on controlled light beam section shape and power distribution are provided; Its thinking is to utilize the method for low-light spot quick directed scan in a very little zone; Form shape and the controlled processing hot spot of power profiles, make " processing hot spot " carry out rescan with suitable mode again.
The object of the invention can be realized through following scheme:
Utilize the quadrature acousto-optic deflection device to make laser beam carry out the low-angle high frequency sweep in the mode set by demand among a small circle through the acoustooptic diffraction effect; Form the equivalent laser facula that processing needs; As the processing hot spot, carry out rescan with galvanometer system guiding processing hot spot and can produce three-dimensional microstructures.
When practical application, according to the needs of processing tasks, set the excitation waveform and the intensity of acousto-optic deflection device, produce required waveform by outside waveform generator, thereby obtain the required certain power distribution and the hot spot of shape, to satisfy different processing requests.Specific beam profile can form corresponding etching section, therefore, utilizes the hot spot of guiding certain power distribution of laser galvanometer scanning system and shape to carry out rescan, can form more complicated three-dimensional etching structure.
The present invention compared with prior art has following beneficial effect:
(1) the present invention utilizes the acousto-optic deflection device of quadrature each other; Make laser carry out the low-angle high frequency sweep; The equivalent laser facula that forms section shape and power controlled is as the processing hot spot; Carry out rescan with galvanometer system guiding processing hot spot again, on workpiece, form corresponding three-dimensional microstructures etching section, realized the direct laser ablation processing of three-dimensional microstructures; Solve the problem of no suitable three-dimensional microstructures process technology in present 1 μ m～1mm range scale, have the science potentiality practical with industry.
(two dimension) rises to the direct processing that the stereoscopic three-dimensional arbitrary surface does not have coverage to the ability of (2) present laser ablation being processed from the plane, improved the machining accuracy of existing two-dimentional etching.
(3) can adopt and program controlly control automatically, have high degree of flexibility.
Description of drawings
Fig. 1 is the sketch map of acousto-optic deflection device of the present invention, mechanical galvanometer double scanning laser processing.
The specific embodiment
Below through the do further explanation of specific embodiment to the two scanning three-dimensional laser ablation processing methods of the present invention.
With reference to Fig. 1, earlier quadrature acousto-optic scanning deflector 2 quadratures are placed the delivery outlet of laser instrument 1.Target setting laser facula area is 0.2mm
2The triangle hot spot.Adjustment X, Y are 15W to the excitation waveform (producing required waveform by outside waveform generator) and the power of laser beam of acousto-optic deflection device, make laser beam carry out the low-angle high frequency sweep, and just can obtain area is 0.2mm
2, power is the equally distributed triangle of 15W and power equivalence laser facula.Be arranged on the motion track that hot spots are processed in acousto-optic deflection device laser scanning galvanometer system 3 controls afterwards with equivalent laser facula as processing hot spot, utilizing again, elder generation's initial position along continuous straight runs on workpiece is that 0.6mm scans etching by the cycle; The Laser Processing hot spot is got back to the etching initial position then, vertically scans etching by same period 0.6mm again, promptly forms the array of Pyramid.
Claims (1)
1. two scanning three-dimensional laser ablation processing methods that distribute based on controlled light beam section shape and power; It is characterized in that: two acousto-optic deflection devices that utilize quadrature placement each other; Excitation waveform and intensity through the guide sound light deflector; Make laser beam carry out the low-angle high frequency sweep by the mode of setting; The equivalent laser facula that forms section shape and power controlled carries out rescan with laser galvanometer system guiding processing hot spot again as the processing hot spot, promptly on workpiece, forms corresponding three-dimensional microstructures etching section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110283637.2A CN102357735B (en) | 2011-09-22 | 2011-09-22 | Double-scanning three-dimensional (3D) laser etching method based on controllable profile shape and power distribution of light beams |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110283637.2A CN102357735B (en) | 2011-09-22 | 2011-09-22 | Double-scanning three-dimensional (3D) laser etching method based on controllable profile shape and power distribution of light beams |
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| CN102357735A true CN102357735A (en) | 2012-02-22 |
| CN102357735B CN102357735B (en) | 2015-05-13 |
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| CN201110283637.2A Active CN102357735B (en) | 2011-09-22 | 2011-09-22 | Double-scanning three-dimensional (3D) laser etching method based on controllable profile shape and power distribution of light beams |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108716894A (en) * | 2018-04-04 | 2018-10-30 | 杭州电子科技大学 | A kind of non-mechanical laser three-dimensional scanning system based on acousto-optic deflection device |
| CN108838551A (en) * | 2018-06-29 | 2018-11-20 | 中国科学院西安光学精密机械研究所 | A kind of three-dimension curved surface laser etching method |
| CN109270763A (en) * | 2018-10-23 | 2019-01-25 | 华中科技大学 | A kind of beam homogenization device based on audio-optical deflection |
| CN112987501A (en) * | 2019-12-17 | 2021-06-18 | 苏州苏大维格科技集团股份有限公司 | Direct-write lithography system and direct-write lithography method |
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| CN101590570A (en) * | 2008-05-26 | 2009-12-02 | 上海市激光技术研究所 | A kind of method of welding tube type heat exchanger by using laser scanning and device |
| JP2010214428A (en) * | 2009-03-17 | 2010-09-30 | Disco Abrasive Syst Ltd | Optical system and laser beam machining apparatus |
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| JPH067973A (en) * | 1992-06-25 | 1994-01-18 | Fanuc Ltd | Laser beam machine |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108716894A (en) * | 2018-04-04 | 2018-10-30 | 杭州电子科技大学 | A kind of non-mechanical laser three-dimensional scanning system based on acousto-optic deflection device |
| CN108716894B (en) * | 2018-04-04 | 2020-04-28 | 杭州电子科技大学 | Non-mechanical laser three-dimensional scanning system based on acousto-optic deflector |
| CN108838551A (en) * | 2018-06-29 | 2018-11-20 | 中国科学院西安光学精密机械研究所 | A kind of three-dimension curved surface laser etching method |
| CN108838551B (en) * | 2018-06-29 | 2019-12-03 | 中国科学院西安光学精密机械研究所 | A kind of three-dimension curved surface laser etching method |
| CN109270763A (en) * | 2018-10-23 | 2019-01-25 | 华中科技大学 | A kind of beam homogenization device based on audio-optical deflection |
| CN109270763B (en) * | 2018-10-23 | 2020-05-19 | 华中科技大学 | Light beam homogenizer based on acousto-optic deflection |
| CN112987501A (en) * | 2019-12-17 | 2021-06-18 | 苏州苏大维格科技集团股份有限公司 | Direct-write lithography system and direct-write lithography method |
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| CN102357735B (en) | 2015-05-13 |
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