CN102348336A - Method for plugging conductive holes of circuit boards by resin - Google Patents
Method for plugging conductive holes of circuit boards by resin Download PDFInfo
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- CN102348336A CN102348336A CN201110285647XA CN201110285647A CN102348336A CN 102348336 A CN102348336 A CN 102348336A CN 201110285647X A CN201110285647X A CN 201110285647XA CN 201110285647 A CN201110285647 A CN 201110285647A CN 102348336 A CN102348336 A CN 102348336A
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- conductive hole
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Abstract
The embodiment of the invention discloses a method for plugging conductive holes of circuit boards by resin. The method comprises the following steps of: dividing conductive holes formed on the circuit boards into N groups, wherein N is an integer not smaller than 2 and the distribution density of any group of conductive holes is smaller than the distribution density of all conductive holes; and plugging the N groups of conductive holes by resin in sequence. According to the technical scheme of the invention, because the conductive holes are grouped to reduce the distribution density of the conductive holes plugged by resin each time, the difficulty in plugging the conductive holes by resin is reduced, thereby reducing the chance of generating depression and bubbles in holes and improving the quality of resin plugged holes.
Description
Technical field
The present invention relates to the circuit board processing technique field, be specifically related to a kind of method of the circuit board conductive hole being carried out filling holes with resin.
Background technology
For increasing the area of dissipation of circuit board, the method circuit board manufacturing of electroplating (POVF) behind the present normal employing consent is made flow process and is generally comprised: holes heavy copper, plating, filling holes with resin, polishing resin, heavy copper, plating, figure transfer, and follow-up other operation.
For the bigger circuit board of some pore size distribution density, carry out being easy to generate behind the filling holes with resin in consent depression and the hole defectives such as bubble, cause the circuit board quality defective.
Summary of the invention
The embodiment of the invention provides a kind of the circuit board conductive hole is carried out the method for filling holes with resin, can improve the quality of filling holes with resin.
A kind of the circuit board conductive hole is carried out the method for filling holes with resin, comprising:
The conductive hole of offering on the circuit board is divided into N group, and N is not less than 2 integer, and wherein the distribution density of arbitrary group of conductive hole is all less than whole distribution densities of conductive holes;
Successively said N group conductive hole is carried out filling holes with resin.
What the embodiment of the invention provided carries out the method for filling holes with resin to the circuit board conductive hole; Through adopting the conductive hole that distribution density is bigger to be divided into many groups; Successively every group of conductive hole carried out the technical scheme of filling holes with resin, reduced the distribution density of conductive hole when at every turn carrying out the filling holes with resin processing, thereby reduced the difficulty that filling holes with resin is handled; And then reduced the chance that bubble in consent depression and the hole occurs, improved the quality of filling holes with resin.
Description of drawings
Fig. 1 is the embodiment of the invention is carried out the method for filling holes with resin to the circuit board conductive hole a flow chart;
Fig. 2 a is the sketch map of the circuit board that offers conductive hole of the embodiment of the invention;
Fig. 2 b and 2c are the sketch mapes that the conductive hole to circuit board shown in Fig. 2 a divides into groups, and wherein Fig. 2 b is the sketch map of first group of conductive hole telling, and Fig. 2 c is the sketch map of second group of conductive hole telling.
Embodiment
Please refer to the circuit board 100 shown in Fig. 2 a, be drilled with the conductive hole 200 of dense distribution on this circuit board 100, these conductive holes 200 are the via holes that run through circuit board 100.The minimum-value aperture of said conductive hole 200 is generally in 0.3 millimeter.The conductive hole 200 of said dense distribution is used for BGA, and (Ball Grid Array, BGA) encapsulation need be carried out filling holes with resin and handle.
Usually, can adopt screen process press to carry out filling holes with resin.During printing, circuit board is fixed on the workbench, and silk screen is fixed on the circuit board; Offer the mesh corresponding on the silk screen with the conductive hole position; Resin-coated to be printed is utilized scraper to drive resin and is moved to the silk screen other end at silk screen one end, realizes resin is filled in the conductive hole.When conductive hole is densely distributed, behind a cutter (scraper) consent, can't be filled up by resin in the partially conductive hole, defectives such as consent depression and consent cavity can appear; For improving this defective, can adopt two cutter consents or multitool consent.Two cutter consents or multitool consent can be obtained certain effect of improving, but can not thoroughly address the aforementioned drawbacks, and the circuit board behind two cutter consents or the multitool consent a lot of consent depressions and consent cavity blemish still can occur behind follow-up baking, curing process.
For improving this defective, provide a kind of the circuit board conductive hole is carried out the method for filling holes with resin in the embodiment of the invention, please refer to Fig. 2, this method comprises:
101, the conductive hole of offering on the circuit board is divided into N group, N is not less than 2 integer, and wherein the distribution density of arbitrary group of conductive hole is all less than whole distribution densities of conductive holes.
102, successively said N group conductive hole is carried out filling holes with resin.
Through conductive hole being divided into many groups; And the distribution density that makes every group of conductive hole carries out filling holes with resin to every group of conductive hole then successively all less than all distribution densities of conductive holes, can reduce the distribution density of at every turn carrying out filling holes with resin conductive hole when handling; Thereby reduce the difficulty that filling holes with resin is handled; Under the less situation of conductive hole distribution density, filling holes with resin can reduce the chance that bubble in consent depression and the hole occurs when handling, and then improves the quality of filling holes with resin.
In order to improve the filling holes with resin quality and to practice thrift the balance that gets on process time; In the preferred embodiment conductive hole is divided into two groups; Carry out consent at twice; Be specially: the conductive hole of offering on the circuit board is divided into two groups, and wherein the distribution density of arbitrary group of conductive hole is all less than whole distribution densities of conductive holes; Earlier first group of conductive hole carried out filling holes with resin; Again second group of conductive hole carried out filling holes with resin.
Can divide into groups to the conductive hole that is the display distribution according to multiple mode.
In a kind of mode, shown in Fig. 2 a, the conductive hole that is used for the BGA encapsulation is array distribution; Can be with wherein being distributed in conductive hole in even number line or the even column as first group of conductive hole; For example shown in Fig. 2 b, with the conductive hole of the 2nd, 4,6 row as first group of conductive hole, with the conductive hole that is distributed in odd-numbered line or odd column as second group of conductive hole; For example shown in Fig. 2 c, with the conductive hole of the 1st, 3,5 row as second group of conductive hole; Certainly, also can be with being distributed in conductive hole in odd-numbered line or the odd column as first group of conductive hole, with the conductive hole that is distributed in even number line or even column as second group of conductive hole.
In the another kind of execution mode, if conductive hole is an annular array of enclosing, then can be with being positioned at conductive hole on even loop or the odd loop as first group of conductive hole, with remaining other conductive hole as second group of conductive hole.
In another mode, can also picked at random part conductive hole as first group of conductive hole, with remaining other conductive hole as second group of conductive hole.
In other execution mode, more packet mode can also be arranged, decrease as long as can satisfy the distribution density of the every group of conductive hole in back that divide into groups, this paper enumerates no longer one by one.
General, the conductive hole of offering on the circuit board is divided into groups can also comprise before:
On circuit board, offer conductive hole, the circuit board of having offered conductive hole is sunk copper and electroplating processes.
Wherein, can adopt modes such as power auger or laser brill, handle according to general heavy copper and electroplating technology then, make the inwall in hole adhere to layer of metal, realize conduction, become conductive hole at circuit boring.
Conductive hole is carried out can also comprising after the filling holes with resin:
Resin to said circuit board surface is unnecessary is polished, and the circuit board after the polishing sink copper and electroplating processes, the circuit board surface making circuitous pattern after plating.
Behind the filling holes with resin, the resin that the conductive hole both ends open goes out is generally has circular protrusions, is higher than circuit board surface; Resin polishing that need these are unnecessary is removed; With convenient follow-up processing, comprising: sink copper and plating once more, and the making of the circuit board surface after plating circuitous pattern etc.; All can adopt routine techniques, give unnecessary details no longer one by one here.
More than; The method that the circuit board conductive hole is carried out filling holes with resin that the embodiment of the invention is provided specifies, but it is understandable that, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Should not be construed as limitation of the present invention; Any technical staff who is familiar with the present technique field it will also be appreciated that more variation or replacement in the technical scope that the present invention discloses, all should be encompassed within protection scope of the present invention.
Claims (7)
1. one kind is carried out the method for filling holes with resin to the circuit board conductive hole, it is characterized in that, comprising:
The conductive hole of offering on the circuit board is divided into N group, and N is not less than 2 integer, and wherein the distribution density of arbitrary group of conductive hole is all less than whole distribution densities of conductive holes;
Successively said N group conductive hole is carried out filling holes with resin.
2. method according to claim 1 is characterized in that, this method specifically comprises:
The conductive hole of offering on the circuit board is divided into two groups, and wherein the distribution density of arbitrary group of conductive hole is all less than whole distribution densities of conductive holes;
Earlier first group of conductive hole carried out filling holes with resin;
Again second group of conductive hole carried out filling holes with resin.
3. method according to claim 2 is characterized in that, saidly the conductive hole of offering on the circuit board is divided into two groups comprises:
Just be the conductive hole that is distributed in the conductive hole that display distributes in even number line or the even column as first group of conductive hole, with the conductive hole that is distributed in odd-numbered line or odd column as second group of conductive hole;
Perhaps, with being distributed in conductive hole in odd-numbered line or the odd column as first group of conductive hole, with the conductive hole that is distributed in even number line or even column as second group of conductive hole.
4. method according to claim 2 is characterized in that, saidly the conductive hole of offering on the circuit board is divided into two groups comprises:
Be positioned at conductive hole on even loop or the odd loop in the conductive hole with circular array as first group of conductive hole, with remaining other conductive hole as second group of conductive hole.
5. method according to claim 2 is characterized in that, saidly the conductive hole of offering on the circuit board is divided into two groups comprises:
Picked at random part conductive hole is as first group of conductive hole, with remaining other conductive hole as second group of conductive hole.
6. according to claim 2,3,4 or 5 described methods, it is characterized in that the said conductive hole of offering on the circuit board is divided into also comprises before two groups:
On circuit board, offer conductive hole, the circuit board of having offered conductive hole is sunk copper and electroplating processes.
7. according to claim 2,3,4 or 5 described methods, it is characterized in that, saidly again second group of conductive hole carried out also comprising after the filling holes with resin:
Resin to said circuit board surface is unnecessary is polished;
Circuit board to after the polishing sinks copper and electroplating processes;
Circuit board surface after plating is made circuitous pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110285647.XA CN102348336B (en) | 2011-09-23 | 2011-09-23 | Method for plugging conductive holes of circuit boards by resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110285647.XA CN102348336B (en) | 2011-09-23 | 2011-09-23 | Method for plugging conductive holes of circuit boards by resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102348336A true CN102348336A (en) | 2012-02-08 |
| CN102348336B CN102348336B (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110285647.XA Active CN102348336B (en) | 2011-09-23 | 2011-09-23 | Method for plugging conductive holes of circuit boards by resin |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582316A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Hole-filling method of high-density silk-screen products |
| CN104602452A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Manufacturing method of circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626666A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for filling holes with resin after circuit etching |
| CN101711096A (en) * | 2009-11-05 | 2010-05-19 | 惠州中京电子科技股份有限公司 | Micro hole manufacturing process of multilayer HDI circuit board |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
-
2011
- 2011-09-23 CN CN201110285647.XA patent/CN102348336B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101626666A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for filling holes with resin after circuit etching |
| CN101711096A (en) * | 2009-11-05 | 2010-05-19 | 惠州中京电子科技股份有限公司 | Micro hole manufacturing process of multilayer HDI circuit board |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602452A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Manufacturing method of circuit board |
| CN104582316A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Hole-filling method of high-density silk-screen products |
| CN104582316B (en) * | 2014-12-31 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | High density silk screen product method for plugging |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102348336B (en) | 2014-07-09 |
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| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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Owner name: WUXI SHENNAN CIRCUIT COMPANY LIMITED Free format text: FORMER OWNER: SHENNAN CIRCUIT CO., LTD. Effective date: 20150609 |
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Effective date of registration: 20150609 Address after: 214000 Changjiang Road, New District, Jiangsu, Wuxi, No. 18 Patentee after: Wuxi Shennan Circuits Co., Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENZHEN SHENNAN CIRCUIT CO., LTD. |