CN102339806A - Lead frame with toothed groove on front side of matrix - Google Patents
Lead frame with toothed groove on front side of matrix Download PDFInfo
- Publication number
- CN102339806A CN102339806A CN2011101696223A CN201110169622A CN102339806A CN 102339806 A CN102339806 A CN 102339806A CN 2011101696223 A CN2011101696223 A CN 2011101696223A CN 201110169622 A CN201110169622 A CN 201110169622A CN 102339806 A CN102339806 A CN 102339806A
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- CN
- China
- Prior art keywords
- matrix
- lead frame
- front side
- frame body
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a lead frame with a toothed groove on the front side of a matrix. The lead frame comprises a frame body (1), wherein the frame body (1) consists of a plurality of uniwafers; a radiating fin (2) is arranged on the upper part of each uniwafer; the matrix (3) is arranged on the middle part of each uniwafer; lead pin combination (4) is arranged on the lower part of each uniwafer; a positioning hole (5) is formed in the radiating fin (2); the uniwafers are connected with one another through connecting ribs (6) to form the frame body (1); and a T-shaped dovetail transverse groove (7) with round teeth is formed on the combining surface of the front side of the matrix and a plastic package body. The lead frame can improve the bonding force of the lead frame and the plastic package body, increase encapsulation yield and improve reliability.
Description
Technical field
The present invention relates to have on a kind of matrix front the lead frame of teeth groove.
Background technology
Epoxy seal semiconductor device is non-level Hermetic Package device, but air-tightness is had certain requirement.Along with the development of situation, to bubble-tight require increasingly high.Originally the lead frame used of plastic packaging discrete device and the faying face of plastic-sealed body are the planes; Adhesion is not with anti-to invade the profit ability be fine, and when doing vibrations fall-down test and life assessment test, percent of pass is not very high; Influence the rate of finished products of encapsulation, reduced device reliability.And along with the variation of ambient temperature and inevitably vibrations, air-tightness causes component failure worse and worse at last in the process of using.Complete machine with this device also just can not be worked.
Summary of the invention
The invention provides the lead frame that teeth groove is arranged on a kind of matrix front, it can improve the adhesion of lead frame and plastic-sealed body, promotes the rate of finished products and the reliability of encapsulation.
The present invention has adopted following technical scheme: a kind of back side of matrix has the lead frame of flanging, and it comprises frame body, and described frame body is made up of some monolithics; The top of each monolithic is set to fin; The middle part is set to matrix, and the bottom is the terminal pin combination, on fin, is provided with location hole; Each monolithic is interconnected to form frame body through dowel, and the front of described matrix and the faying face of plastic-sealed body are provided with the T type dovetail translot that has knuckle-tooth.
The width of described T type dovetail translot is 0.8/0.4mm/mm, and the degree of depth is 0.05/0.1mm/mm.
The present invention has following beneficial effect: the present invention is provided with the T type dovetail translot of knuckle-tooth; Make the junction of plastic-sealed body and lead frame form a plurality of zig zag planes; Thereby the adhesion that has improved lead frame and plastic-sealed body is invaded the profit ability with anti-, has promoted the rate of finished products of device package and the reliability of device.
Description of drawings
Fig. 1 is a structural representation of the present invention
Fig. 2 is the schematic cross-section of Fig. 1
Fig. 3 is an A prescribing method sketch map among Fig. 2
Embodiment
In Fig. 1, Fig. 2 and Fig. 3, the invention provides the lead frame that teeth groove is arranged on a kind of matrix front, it comprises frame body 1; Frame body 1 is made up of 20 monolithics, and the lengths of frame of 20 monolithic compositions is 228.1mm, and width is 30.35mm; Monolithic is shaped through punching press, surface treatment and cut-out by the KFC copper strips and processes, and the top of each monolithic is set to fin 2, and the middle part is set to matrix 3; The thickness of fin 2 and matrix 3 parts all is 1.25mm, and tolerance is ± 0.015mm that the bottom is terminal pin combination 4; The thickness of terminal pin combination 4 is 0.45mm, and tolerance is ± 0.01mm that terminal pin combination 4 comprises three pins; The thickness of three outside bendings of pin is 2.6mm, on fin 2, is provided with location hole 5, and location hole 5 is of a size of φ 3.75+0.05mm; Spacing between each monolithic is 11.405 ± 0.03mm, and each monolithic is interconnected to form frame body 1 through dowel 6, and the front of matrix and the faying face of plastic-sealed body are provided with the T type dovetail translot 7 that has knuckle-tooth; The width of T type dovetail translot 7 is 0.8/0.4mm/mm, and the degree of depth is 0.05/0.1mm/mm.
Claims (2)
1. the lead frame of teeth groove is arranged on the matrix front, and it comprises frame body (1), and described frame body (1) is made up of some monolithics; The top of each monolithic is set to fin (2); The middle part is set to matrix (3), and the bottom is terminal pin combination (4), on fin (2), is provided with location hole (5); Each monolithic is interconnected to form frame body (1) through dowel (6), it is characterized in that the front of described matrix and the faying face of plastic-sealed body are provided with the T type dovetail translot (7) that has knuckle-tooth.
2. the lead frame that teeth groove is arranged on the matrix according to claim 1 front, the width that it is characterized in that described T type dovetail translot (7) is 0.8/0.4mm/mm, the degree of depth is 0.05/0.1mm/mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101696223A CN102339806A (en) | 2011-06-16 | 2011-06-16 | Lead frame with toothed groove on front side of matrix |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101696223A CN102339806A (en) | 2011-06-16 | 2011-06-16 | Lead frame with toothed groove on front side of matrix |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102339806A true CN102339806A (en) | 2012-02-01 |
Family
ID=45515445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101696223A Pending CN102339806A (en) | 2011-06-16 | 2011-06-16 | Lead frame with toothed groove on front side of matrix |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102339806A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969297A (en) * | 2012-11-20 | 2013-03-13 | 无锡市威海达机械制造有限公司 | Pouring basin type lead frame structure |
| CN103617986A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic-packaged lead frame capable of performing heat dissipation rapidly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201017876Y (en) * | 2007-03-15 | 2008-02-06 | 宁波华龙电子有限公司 | Waterproof type plastic capsulation series lead wire frame |
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
| CN201663159U (en) * | 2010-04-28 | 2010-12-01 | 四川金湾电子有限责任公司 | Strong coating adhesive type plastic package lead frame |
-
2011
- 2011-06-16 CN CN2011101696223A patent/CN102339806A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201017876Y (en) * | 2007-03-15 | 2008-02-06 | 宁波华龙电子有限公司 | Waterproof type plastic capsulation series lead wire frame |
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN201611654U (en) * | 2010-04-16 | 2010-10-20 | 宁波华龙电子股份有限公司 | Enhancement type waterproof lead-in wire frame |
| CN201663159U (en) * | 2010-04-28 | 2010-12-01 | 四川金湾电子有限责任公司 | Strong coating adhesive type plastic package lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969297A (en) * | 2012-11-20 | 2013-03-13 | 无锡市威海达机械制造有限公司 | Pouring basin type lead frame structure |
| CN103617986A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Plastic-packaged lead frame capable of performing heat dissipation rapidly |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120201 |