CN102330061A - Magnetic water separation type planar magnetron sputtering target - Google Patents
Magnetic water separation type planar magnetron sputtering target Download PDFInfo
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- CN102330061A CN102330061A CN201110276844A CN201110276844A CN102330061A CN 102330061 A CN102330061 A CN 102330061A CN 201110276844 A CN201110276844 A CN 201110276844A CN 201110276844 A CN201110276844 A CN 201110276844A CN 102330061 A CN102330061 A CN 102330061A
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Abstract
The invention discloses a magnetic water separation type planar magnetron sputtering target, which comprises a cooling water feeding pipe 1, a cooling water draining pipe 2, a concentrating flux plate 3, a cathode body 4, a target pressure ring 5, a boult 6, a target 7, a central pole shoe 8, a central permanent magnet block 9, a tip pole shoe 10, a tip permanent magnet block 11 and a lower sealing ring 13, wherein the cathode body 4 is provided with an annular rectangular groove 41; a circular blind hole 42 is formed in the center of the cathode body 4; the circle center of the annular rectangular groove 41 is superposed with that of the circular blind hole 42; the cooling water feeding pipe 1 and the cooling water draining pipe 2 upwards penetrate through the through holes on the concentrating flux plate 3 and the cathode body 4 and are sealed with the cathode body 4 by using a water pipe sealing ring 43; the central pole shoe 8 and the central permanent magnet block 9 are positioned in the circular blind hole 42; and the tip pole shoe 10 and the tip permanent magnet block 11 are positioned in the annular rectangular groove 41. A novel structure of separating a cathode magnetic path from a cooling water path is adopted in the magnetic water separation type planar magnetron sputtering target, so that the service life of a magnet is greatly prolonged; and meanwhile, cooling water cannot be polluted or blocked, and the quality of a plated film is stably improved.
Description
Technical field
The present invention relates to a kind of vacuum magnetic-control sputtering film coating apparatus of field of new, the release plane magnetic controlled sputtering target of particularly a kind of magnetic moisture.
Background technology
Magnetron sputtering technique has been obtained huge advance made aspect high speed production metal, semi-conductor and the dielectric film since being born the seventies in 20th century, be widely used in fields such as semiconducter device, unicircuit microminiaturization and optics.Related sun power utilizes the efficiency film; No matter be all-glass vacuum thermal-collecting tube, all-metal flat plate collector and as the high-temperature heat-collection pipe of solar energy thermal-power-generating core parts; In R&D process, all used the magnetron sputtering masking technique fully, and wherein a kind of critical equipment is exactly garden column type and flush type magnetron sputtering target.Because the employed high temperature resistant absorbing film system of the high-temperature heat-collection pipe of heat generating (multilayer film is claimed film system or membrane stack); The target that has (the source material of film) is difficult to obtain tubing; Must abandon garden post target; And sheet material just obtains easily, is the plane magnetic controlled sputtering target of sheet material so the high-temperature heat-collection pipe coating equipment just adopts target.
Plane magnetic controlled sputtering target has round target in plane and plane square type target according to the size of workpiece to be plated, and principle is just the same, elongates the round target in plane along diametric(al), is exactly plane square type target.The structure of existing plane magnetic controlled sputtering target (is omitted anode shield insulation and water pipe fastening structure) shown in Fig. 1-4; It comprises cooling water inlet pipe 1, cooling rising pipe 2, magnetic conductive board 3, cathode 4, target pressure ring 5, screw 6, target 7, center pole shoe 8, center permanent magnets 9, limit pole shoe 10, limit permanent magnets 11 and upper and lower sealing- ring 12,13; The through hole that has cooling water inlet pipe 1 and cooling rising pipe 2 to pass through on the magnetic conductive board 3; It is positioned at cathode 4 above; Target pressure ring 5 and target 7 be positioned at cathode 4 below; Magnetic conductive board 3, cathode 4 and target pressure ring 5 are fixing through screw 6, and last sealing-ring 12 is between magnetic conductive board 3 and cathode 4, and lower seal 13 is between cathode 4 and target 7; Cathode 4 centers are a through hole; Cooling water inlet pipe 1, cooling rising pipe 2, center pole shoe 8, center permanent magnets 9, limit pole shoe 10 and limit permanent magnets 11 are positioned at the through hole at cathode 4 centers, and separate with parting bead 14 between center permanent magnets 9 and the limit permanent magnets 11, and cooling water inlet pipe 1 is upward through magnetic conductive board 3 with cooling rising pipe 2 and water pipe sealing-ring 15 forms sealing with magnetic conductive board 3.
During work; The N utmost point of magneticline of force B permanent magnets 9 that the center permanent magnets 9 at the back side of target 7, limit permanent magnets 11 produce from the center; Pass target 7, get back to the S utmost point of limit permanent magnets 11, magnetic field shape plays an annular magnetic line of force " shed " as " building " in target 7 fronts.When the cooling water inlet pipe that serves as electrode simultaneously 1 connected 300～700 volts negative poles of magnetron sputtering power supply with cooling rising pipe 2, the direction of electric field was shown in power line E, and target 7 fronts form the EM field of intersection; Under the pressure of 0.2Pa～2Pa, produce gas glow discharge and form plasma body, because the difference of ion and electronic mobility; Positive ion is separated from plasma body in the cathodic area; And be accelerated bombardment target 7, cause target 7 sputters, when the workpiece surface that makes solid target 7 atoms disengaging target 7 surfaces be splashed to target surface the place ahead forms rete; Portion of energy heats up target 7, so must adopt the recirculated water cooling.Because its center permanent magnets 9 communicates with recirculated water with limit permanent magnets 11, and center permanent magnets 9 is a kind of rare-earth Nd-Fe-B (NdFeB) alloys with limit permanent magnets 11, though it has excellent magnetic characteristics; But it is poor that its shortcoming is a solidity to corrosion, although the surface is coated with the nickel dam protection, in the magnetic circuit assembling process; The corner of permanent magnets or local surfaces nickel dam have small breakage, cause the permanent magnets local corrosion, and the time has been grown; Permanent magnets monoblock powderised; Make the rugged change in magnetic field, target surface the place ahead, cause sputter coating inhomogeneous, the permanent magnets of having to change again; Simultaneously, powdery permanent magnets powder also is prone to stop up water channel, causes current not smooth, the cooling performance variation, and the serious target 7 that possibly burn out causes the accident with lower seal 13.Because REE is a kind of resource less and less, price is very high, thereby causes production cost (Financial cost, time cost) height, and coating quality is poor.
Summary of the invention
The objective of the invention is to overcome the above-mentioned deficiency of prior art, and provide a kind of magnetic moisture release plane magnetic controlled sputtering target.
Technical scheme of the present invention is: the release plane magnetic controlled sputtering target of a kind of magnetic moisture; Comprise cooling water inlet pipe, cooling rising pipe, magnetic conductive board, cathode, target pressure ring, screw, target, center pole shoe, center permanent magnets, limit pole shoe, limit permanent magnets and lower seal, the through hole that has cooling water inlet pipe and cooling rising pipe to pass through on the magnetic conductive board, its be positioned at cathode above; Target pressure ring and target be positioned at cathode below; Magnetic conductive board, cathode and target pressure ring are through screw retention, and lower seal has rectangular tank on the cathode between cathode and target; There is blind hole at its center; Cool off the through hole that water inlet pipe and cooling rising pipe pass through on the cathode in addition, the cooling water inlet pipe is upward through the through hole on magnetic conductive board and the cathode with the cooling rising pipe, and water pipe sealing-ring and cathode formation sealing; Center pole shoe and center permanent magnets are positioned at blind hole, and limit pole shoe and limit permanent magnets are positioned at rectangular tank.
The further technical scheme of the present invention is: magnetic conductive board, cathode, target pressure ring and target are rectangle, and the rectangular tank on the cathode is a rectangle, and the rectangular tank at its center is a long strip shape.
The further technical scheme of the present invention also can be: magnetic conductive board, cathode, target pressure ring and target are circle, and the rectangular tank on the cathode is an annular, and its central blind hole is circular.
The further again technical scheme of the present invention is: the center of circle of annular rectangular tank overlaps with the center of circle of circular blind hole.
The present invention is owing to adopt magnet and the design of current separated structures, and compared with prior art, magnet no longer is corroded; The long-term stability that keeps this important technology parameter of magnetic induction density (B); Water coolant can be not contaminated yet simultaneously, and water channel is not blocked, and temperature stability also is improved; The work-ing life of magnet can be prolonged greatly, the planar target coating quality can be improved steadily in the long term again.
Below in conjunction with accompanying drawing and embodiment detailed structure of the present invention is further described.
Description of drawings
Fig. 1 is the structural representation of the round magnetron sputtering target in existing plane;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the structural representation of existing plane square type magnetron sputtering target;
Fig. 4 is the vertical view of Fig. 3;
The structural representation of the round magnetron sputtering target in Fig. 5 plane of the present invention;
Fig. 6 is the vertical view of Fig. 5;
The structural representation of Fig. 7 plane of the present invention square type magnetron sputtering target;
Fig. 8 is the vertical view of Fig. 7.
Embodiment
Embodiment one
Like Fig. 5, shown in 6, the release plane magnetic controlled sputtering target of a kind of magnetic moisture comprises cooling water inlet pipe 1, cooling rising pipe 2, magnetic conductive board 3, cathode 4, target pressure ring 5, screw 6, target 7, center pole shoe 8, center permanent magnets 9, limit pole shoe 10, limit permanent magnets 11 and lower seal 13; Magnetic conductive board 3, cathode 4, target pressure ring 5 and target 7 are circle; The through hole that has cooling water inlet pipe 1 and cooling rising pipe 2 to pass through on the magnetic conductive board 3, its be positioned at cathode 4 above, target pressure ring 5 and target 7 be positioned at cathode 4 below; Magnetic conductive board 3, cathode 4 and target pressure ring 5 are fixing through screw 6; Lower seal 13 has annular rectangular tank 41 on the cathode 4 between cathode 4 and target 7, there is circular blind hole 42 at its center; The center of circle of annular rectangular tank 41 overlaps with the center of circle of circular blind hole 42; Cool off the through hole that water inlet pipe 1 and cooling rising pipe 2 pass through on the cathode 4 in addition, cooling water inlet pipe 1 is upward through the through hole on magnetic conductive board 3 and the cathode 4 with cooling rising pipe 2, and water pipe sealing-ring 43 forms sealing with cathode 4; Center pole shoe 8 is positioned at circular blind hole 42 with center permanent magnets 9, and limit pole shoe 10 is positioned at annular rectangular tank 41 with limit permanent magnets 11.
Embodiment two
Like Fig. 7, shown in 8: the release plane magnetic controlled sputtering target of a kind of magnetic moisture; Comprise cooling water inlet pipe 1, cooling rising pipe 2, magnetic conductive board 3, cathode 4, target pressure ring 5, screw 6, target 7, center pole shoe 8, center permanent magnets 9, limit pole shoe 10, limit permanent magnets 11 and lower seal 13; Magnetic conductive board 3, cathode 4, target pressure ring 5 and target 7 are rectangle, the through hole that has cooling water inlet pipe 1 and cooling rising pipe 2 to pass through on the magnetic conductive board 3, its be positioned at cathode 4 above; Target pressure ring 5 and target 7 be positioned at cathode 4 below; Magnetic conductive board 3, cathode 4 and target pressure ring 5 are fixing through screw 6, and lower seal 13 has rectangular rectangular tank 44 on the cathode 4 between cathode 4 and target 7; There is the rectangular tank 45 of long strip shape at its center; Cool off the through hole that water inlet pipe 1 and cooling rising pipe 2 pass through on the cathode 4 in addition, cooling water inlet pipe 1 is upward through the through hole on magnetic conductive board 3 and the cathode 4 with cooling rising pipe 2, and water pipe sealing-ring 43 forms sealing with cathode 4; Center pole shoe 8 is positioned at rectangular rectangular tank 44 with center permanent magnets 9, and limit pole shoe 10 and limit permanent magnets 11 are positioned at the rectangular tank 45 of long strip shape.
Use the filming equipment of high-temperature heat-collection pipe to be example with a production solar electrical energy generation; 4 targets of an equipment, every target is with 816 of 20 mm * 11 mm * 10 mm ndfeb magnets, and 4 targets are with 3264; If adopt original magnetic water not separate the target of structure; Because the magnet etching problem on average uses and just need more renew magnet in 1 year, adds manpower, time cost, the operation and maintenance appropriate litigation fees is expensive.After adopting negative electrode magnetic circuit of the present invention and the isolating new texture of cooling water channel; Because its center permanent magnets (9) and limit permanent magnets (11) are isolated in outside the water route by the sealing-ring 13 on water pipe sealing-ring 43 and the magnetic conductive board 3; No longer be immersed in the current, NdFeB magnet is in the environment of clean dry, no longer produces the galvanic corrosion problem; The long-term magnetic property that keeps is stable, has remarkable economic efficiency and social benefit.
Claims (4)
1. release plane magnetic controlled sputtering target of magnetic moisture; Comprise cooling water inlet pipe, cooling rising pipe, magnetic conductive board, cathode, target pressure ring, screw, target, center pole shoe, center permanent magnets, limit pole shoe, limit permanent magnets and lower seal, the through hole that has cooling water inlet pipe and cooling rising pipe to pass through on the magnetic conductive board, its be positioned at cathode above; Target pressure ring and target be positioned at cathode below; Magnetic conductive board, cathode and target pressure ring are through screw retention, and lower seal is cooled off water inlet pipe in addition and cooled off the through hole that rising pipe passes through between cathode and target on the cathode; It is characterized in that rectangular tank is arranged on the cathode; There is blind hole at its center, and the cooling water inlet pipe is upward through the through hole on magnetic conductive board and the cathode with the cooling rising pipe, and water pipe sealing-ring and cathode formation sealing; Center pole shoe and center permanent magnets are positioned at blind hole, and limit pole shoe and limit permanent magnets are positioned at rectangular tank.
2. the release plane magnetic controlled sputtering target of magnetic moisture according to claim 1 is characterized in that magnetic conductive board, cathode, target pressure ring and target are rectangle, and the rectangular tank on the cathode is a rectangle, and the rectangular tank at its center is a long strip shape.
3. the release plane magnetic controlled sputtering target of magnetic moisture according to claim 1 is characterized in that magnetic conductive board, cathode, target pressure ring and target are circle, and the rectangular tank on the cathode is an annular, and its central blind hole is circular.
4. the release plane magnetic controlled sputtering target of magnetic moisture according to claim 3 is characterized in that the center of circle of annular rectangular tank overlaps with the center of circle of circular blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110276844A CN102330061A (en) | 2011-09-19 | 2011-09-19 | Magnetic water separation type planar magnetron sputtering target |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110276844A CN102330061A (en) | 2011-09-19 | 2011-09-19 | Magnetic water separation type planar magnetron sputtering target |
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| CN102330061A true CN102330061A (en) | 2012-01-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109778127A (en) * | 2017-11-13 | 2019-05-21 | 佳能特机株式会社 | Sputtering equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5571393A (en) * | 1994-08-24 | 1996-11-05 | Viratec Thin Films, Inc. | Magnet housing for a sputtering cathode |
| CN1944707A (en) * | 2006-09-27 | 2007-04-11 | 中国科学院上海光学精密机械研究所 | Permanent magnet gun target device for magnetic control sputtering film coating machine |
| CN101736300A (en) * | 2008-11-19 | 2010-06-16 | 中国科学院沈阳科学仪器研制中心有限公司 | Magnetic control sputtering target |
| CN202246844U (en) * | 2011-09-19 | 2012-05-30 | 衡阳市真空机电设备有限公司 | Magnet and water separated type plane magnetron sputtering target |
-
2011
- 2011-09-19 CN CN201110276844A patent/CN102330061A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5571393A (en) * | 1994-08-24 | 1996-11-05 | Viratec Thin Films, Inc. | Magnet housing for a sputtering cathode |
| CN1944707A (en) * | 2006-09-27 | 2007-04-11 | 中国科学院上海光学精密机械研究所 | Permanent magnet gun target device for magnetic control sputtering film coating machine |
| CN101736300A (en) * | 2008-11-19 | 2010-06-16 | 中国科学院沈阳科学仪器研制中心有限公司 | Magnetic control sputtering target |
| CN202246844U (en) * | 2011-09-19 | 2012-05-30 | 衡阳市真空机电设备有限公司 | Magnet and water separated type plane magnetron sputtering target |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109778127A (en) * | 2017-11-13 | 2019-05-21 | 佳能特机株式会社 | Sputtering equipment |
| CN109778127B (en) * | 2017-11-13 | 2022-10-21 | 佳能特机株式会社 | Sputtering device |
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Application publication date: 20120125 |