CN102321829B - Silver-free low-melting-point Sn-Bi Pb-free solder alloy and preparation method thereof - Google Patents
Silver-free low-melting-point Sn-Bi Pb-free solder alloy and preparation method thereof Download PDFInfo
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- CN102321829B CN102321829B CN201110323851A CN201110323851A CN102321829B CN 102321829 B CN102321829 B CN 102321829B CN 201110323851 A CN201110323851 A CN 201110323851A CN 201110323851 A CN201110323851 A CN 201110323851A CN 102321829 B CN102321829 B CN 102321829B
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Abstract
The invention discloses a silver-free low-melting-point Sn-Bi Pb-free solder alloy and a preparation method thereof. The solder alloy comprises the following components in percent by weight: 61-63% of Bi, 2-4% of Cd, 4-6% of Sb, 0.01-0.03% of Y, 0.01-0.03% of Ce and balance of Sn. The solder alloy prepared by the invention can effectively improve tensile strength, range of melting point is reduced, melting point temperature is reduced, and production cost is reduced.
Description
Technical field
The present invention relates to a kind of welding flux alloy, be specifically related to a kind of silverless low melting-point tin bismuth series lead-free solder Alloy And Preparation Method.
Background technology
Patent CN201010301331.0 discloses a kind of tin-bismuth solder with low melting point and preparation method thereof; Its scolder is Sn, Bi, Ag ternary hypoeutectic alloy scolder; The weight percent of each chemical ingredients is in the welding flux alloy: Sn is 44～58wt%, and Bi is 42～56wt%, and Ag is 0.25～1wt%.This invention tin-bismuth solder melting range is controlled in 140 ℃-168 ℃, and spreading area is 52-59Cu:mm
2/ 0.2g, melting range are controlled in 140-168 ℃.
The spreading area of this welding flux alloy is 52-59Cu:mm
2/ 0.2g, relatively low; Simultaneously, the span of control broad of fusing point, the higher limit of temperature is higher; And contain valuable silver in the alloy.These have all limited the use of material.
Summary of the invention
In order to solve the existing shortcoming that welding flux alloy intensity is lower, melting range is wide, cost is high, the invention provides a kind of silverless low melting-point tin bismuth series lead-free solder Alloy And Preparation Method.
In order to achieve the above object, the invention provides a kind of silverless low melting-point tin bismuth series lead-free solder alloy, this welding flux alloy is made up of following compositions in weight percentage: Bi 61～63%; Cd 2～4%, and Sb 4～6%, and Y 0.01～0.03%; Ce 0.01～0.03%, and all the other are Sn.
Wherein, welding flux alloy is a powdery, and this welding flux alloy granularity is 50～80 μ m.
The present invention also provides a kind of preparation method of silverless low melting-point tin bismuth series lead-free solder alloy, may further comprise the steps:
(1) preparation mother alloy: get following raw materials by weight percent and carry out proportioning: Bi 61～63%, Cd 2～4%, and Sb 4～6%, and Y 0.01～0.03%, and Ce 0.01～0.03%, and all the other are Sn; Above-mentioned raw materials is put into the vacuum induction furnace melting, and smelting temperature is 500～570 ℃, obtains mother alloy.
(2) preparation alloy band: the remelting tubular type crucible that the mother alloy that step (1) is made is put into the vacuum induction quick quenching furnace carries out remelting, and remelting temperature is 400～430 ℃; The bottom of said remelting tubular type crucible places 2～4mm place on the quick quenching furnace runner wheel rim, and ejection and the runner edge contact of rotating from the hole of crucible bottom under ar gas acting forms the alloy band after the mother alloy fusion; Wherein, the bore dia of crucible bottom is 1mm, and the rotational line speed of fast pure stove runner wheel rim is 10～13m/s, and the width that forms the alloy band is 3～6 millimeters, and thickness is 200～300 microns.
(3) preparation welding flux alloy: after the alloy band pulverizing that makes in the step (2), put into grinding in ball grinder 15～20min; Behind the ball milling, sieve, screening obtains the alloying pellet that granularity is 50～80 μ m.
The present invention compares prior art and has the following advantages: welding flux alloy of the present invention adopts Bi, Cd, Sb that the fusing point of tin alloy is reduced, and has improved the welding technological properties of alloy, has improved the spreadability of alloy; Simultaneously, Elements C e and element Y have refining effect to alloy substrate, can effectively improve tensile strength of alloys, can improve the spreadability of alloy simultaneously.Alloy of the present invention adopts the fast quenching mode to cool off in solidifying, and can effectively reduce the phase in the alloy, guarantees the uniform distribution of chemical ingredients simultaneously, has so not only guaranteed welding technological properties, has improved the spreadability of alloy, has also guaranteed the mechanical property of alloy.In the present invention's preparation, without precious metals silver, institute's raw materials cost of getting reduces, and preparation technology is easy, and the alloy of production has good performance, is convenient to very much suitability for industrialized production.
Description of drawings
Fig. 1 is the silverless low melting-point tin bismuth series lead-free solder alloy organizing figure of the embodiment of the invention three preparations.
Can find out that by Fig. 1 alloy organizing is fine and close.
Embodiment
Below in conjunction with embodiment silverless low melting-point tin bismuth series lead-free solder alloy of the present invention is elaborated.
Embodiment one
The preparation of mother alloy: get following raw materials by weight percent and carry out proportioning: Bi 61%, Cd 2%, and Sb 4%, and Y 0.01%, and Ce 0.01%, and all the other are Sn; Wherein, the purity of raw material Bi, Cd, Sb, Y, Ce, Sn is all greater than 99.9%.Above-mentioned raw materials is put into the vacuum induction furnace melting, and smelting temperature is 500 ℃, obtains mother alloy.
The preparation of alloy band: the remelting tubular type crucible of mother alloy being put into the vacuum induction quick quenching furnace carries out remelting, and remelting temperature is 400 ℃; The bottom of remelting tubular type crucible places 3mm place on the quick quenching furnace runner wheel rim; After mother alloy places the interior fusion of tubular type crucible; Under ar gas acting, be the runner edge contact of ejection and rotation the hole of 1mm from the crucible bottom diameter, the formation width is that 3mm, thickness are 200 microns alloy band; The rotational line speed of fast pure stove runner wheel rim is 13m/s.
The preparation of welding flux alloy: after the alloy band that makes pulverized, put into grinding in ball grinder 15min after, take out screening, screening obtains the alloying pellet that granularity is 50～80 μ m.
Embodiment two
The preparation of mother alloy: get following raw materials by weight percent and carry out proportioning: Bi 63%, Cd 4%, and Sb 6%, and Y 0.03%, and Ce 0.03%, and all the other are Sn; Wherein, the purity of raw material Bi, Cd, Sb, Y, Ce, Sn is all greater than 99.9%.Above-mentioned raw materials is put into the vacuum induction furnace melting, and smelting temperature is 570 ℃, obtains mother alloy.
The preparation of alloy band: the remelting tubular type crucible of mother alloy being put into the vacuum induction quick quenching furnace carries out remelting, and remelting temperature is 430 ℃; The bottom of remelting tubular type crucible places 3mm place on the quick quenching furnace runner wheel rim; After mother alloy places the interior fusion of tubular type crucible; Under ar gas acting, be the runner edge contact of ejection and rotation the hole of 1mm from the crucible bottom diameter, the formation width is that 6mm, thickness are 300 microns alloy band; The rotational line speed of fast pure stove runner wheel rim is 10m/s.
The preparation of welding flux alloy: after the alloy band that makes pulverized, put into grinding in ball grinder 20min after, take out screening, screening obtains the alloying pellet that granularity is 50～80 μ m.
Embodiment three
The preparation of mother alloy: get following raw materials by weight percent and carry out proportioning: Bi 62%, Cd 3%, and Sb 5%, and Y 0.02%, and Ce 0.02%, and all the other are Sn; Wherein, the purity of raw material Bi, Cd, Sb, Y, Ce, Sn is all greater than 99.9%.Above-mentioned raw materials is put into the vacuum induction furnace melting, and smelting temperature is 530 ℃, obtains mother alloy.
The preparation of alloy band: the remelting tubular type crucible of mother alloy being put into the vacuum induction quick quenching furnace carries out remelting, and remelting temperature is 420 ℃; The bottom of remelting tubular type crucible places 3mm place on the quick quenching furnace runner wheel rim; After mother alloy places the interior fusion of tubular type crucible; Under ar gas acting, be the runner edge contact of ejection and rotation the hole of 1mm from the crucible bottom diameter, the formation width is that 4mm, thickness are 250 microns alloy band; The rotational line speed of fast pure stove runner wheel rim is 11.5m/s.
The preparation of welding flux alloy: after the alloy band that makes pulverized, put into grinding in ball grinder 17min after, take out screening, screening obtains the alloying pellet that granularity is 50～80 μ m.
Embodiment four
The preparation of mother alloy: get following raw materials by weight percent and carry out proportioning: Bi 60%, Cd 1%, and Sb 3%, and Y 0.005%, and Ce 0.005%, and all the other are Sn; Wherein, the purity of raw material Bi, Cd, Sb, Y, Ce, Sn is all greater than 99.9%.Above-mentioned raw materials is put into the vacuum induction furnace melting, and smelting temperature is 500 ℃, obtains mother alloy.
The preparation of alloy band: the remelting tubular type crucible of mother alloy being put into the vacuum induction quick quenching furnace carries out remelting, and remelting temperature is 400 ℃; The bottom of remelting tubular type crucible places 3mm place on the quick quenching furnace runner wheel rim; After mother alloy places the interior fusion of tubular type crucible; Under ar gas acting, be the runner edge contact of ejection and rotation the hole of 1mm from the crucible bottom diameter, the formation width is that 4mm, thickness are 200 microns alloy band; The rotational line speed of fast pure stove runner wheel rim is 13m/s.
The preparation of welding flux alloy: after the alloy band that makes pulverized, put into grinding in ball grinder 15min after, take out screening, screening obtains the alloying pellet that granularity is 50～80 μ m.
Embodiment five
The preparation of mother alloy: get following raw materials by weight percent and carry out proportioning: Bi 64%, Cd 5%, and Sb 7%, and Y 0.05%, and Ce 0.05%, and all the other are Sn; Wherein, the purity of raw material Bi, Cd, Sb, Y, Ce, Sn is all greater than 99.9%.Above-mentioned raw materials is put into the vacuum induction furnace melting, and smelting temperature is 500 ℃, obtains mother alloy.
The preparation of alloy band: the remelting tubular type crucible of mother alloy being put into the vacuum induction quick quenching furnace carries out remelting, and remelting temperature is 400 ℃; The bottom of remelting tubular type crucible places 3mm place on the quick quenching furnace runner wheel rim; After mother alloy places the interior fusion of tubular type crucible; Under ar gas acting, be the runner edge contact of ejection and rotation the hole of 1mm from the crucible bottom diameter, the formation width is that 4mm, thickness are 200 microns alloy band; The rotational line speed of fast pure stove runner wheel rim is 13m/s.
The preparation of welding flux alloy: after the alloy band that makes pulverized, put into grinding in ball grinder 15min after, take out screening, screening obtains the alloying pellet that granularity is 50～80 μ m.
Effect embodiment
Be illustrated in figure 1 as the silverless low melting-point tin bismuth series lead-free solder alloy organizing structure iron that the embodiment of the invention three makes, Elements C e and element Y have refining effect to alloy substrate Sn in the welding flux alloy, can effectively improve the spreadability of alloy; Adopt the fast quenching mode to cool off when solidifying simultaneously, can guarantee the uniform distribution of chemical ingredients.
Contrast each performance of products parameter, as shown in the table:
Each product performance contrast of table 1
| The alloy numbering | Alloying constituent | Spreading area is 52-59Cu:mm 2/0.2g | Fusing point/℃ |
| Product one | The product that makes by patent CN201010301331.0 | 52-59 | 140℃-168 |
| Product two | The product that makes by embodiment one | 60 | 139 |
| Product three | The product that makes by embodiment two | 62 | 145 |
| Product four | The product that makes by embodiment three | 65 | 141 |
| Product five | The product that makes by embodiment four | 51 | 156 |
| Product six | The product that makes by embodiment five | 56 | 150 |
Can find out that by last table the product two, product three and the product four that make through the present invention have all improved spreadability, and have reduced melting temperature.
The performance data of product five, six shows that Bi, Cd, Sb, Y, Ce add-on do not reach the due spreadability of alloy less than scope of design.Add-on is too high, and compound is too much, can destroy the spreadability of alloy.Value is not in scope of design, and the fusing point of alloy can raise.
Claims (4)
1. silverless low melting-point tin bismuth series lead-free solder alloy, it is characterized in that: be made up of following compositions in weight percentage: Bi 61～63%, and Cd 2～4%, and Sb 4～6%, and Y 0.01～0.03%, and Ce 0.01～0.03%, and all the other are Sn.
2. silverless low melting-point tin bismuth series lead-free solder alloy according to claim 1, it is characterized in that: said welding flux alloy is a powdery, the granularity of alloying pellet is 50～80 μ m.
3. the preparation method of a silverless low melting-point tin bismuth series lead-free solder alloy is characterized in that: may further comprise the steps:
(1) preparation mother alloy: get following raw materials by weight percent and carry out proportioning: Bi 61～63%, Cd 2～4%, and Sb 4～6%, and Y 0.01～0.03%, and Ce 0.01～0.03%, and all the other are Sn; Above-mentioned raw materials is put into the vacuum induction furnace melting, and smelting temperature is 500～570 ℃, obtains mother alloy;
(2) preparation alloy band: the remelting tubular type crucible that the mother alloy that step (1) is made is put into the vacuum induction quick quenching furnace carries out remelting, and remelting temperature is 400～430 ℃; The bottom of said remelting tubular type crucible places 2～4mm place on the quick quenching furnace runner wheel rim; After the mother alloy fusion under ar gas acting from the hole of crucible bottom the runner edge contact of ejection and rotation, form width and be 3～6 millimeters, thickness and be 200～300 microns alloy band;
(3) preparation welding flux alloy: after the alloy band pulverizing that makes in the step (2), put into grinding in ball grinder 15～20min, sieve, screening obtains the alloying pellet that granularity is 50～80 μ m.
4. the preparation method of silverless low melting-point tin bismuth series lead-free solder alloy according to claim 3 is characterized in that: the bore dia of crucible bottom is 1mm in the said step (2), and the rotational line speed of quick quenching furnace runner wheel rim is 10～13m/s.
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|---|---|---|---|
| CN201110323851A CN102321829B (en) | 2011-10-24 | 2011-10-24 | Silver-free low-melting-point Sn-Bi Pb-free solder alloy and preparation method thereof |
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|---|---|---|---|
| CN201110323851A CN102321829B (en) | 2011-10-24 | 2011-10-24 | Silver-free low-melting-point Sn-Bi Pb-free solder alloy and preparation method thereof |
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| CN102321829A CN102321829A (en) | 2012-01-18 |
| CN102321829B true CN102321829B (en) | 2012-09-19 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102560311A (en) * | 2012-03-16 | 2012-07-11 | 鹰潭市众鑫成铜业有限公司 | Alloy used in hot plating process of tinned wire |
| CN108292610B (en) * | 2015-09-25 | 2023-02-28 | 英特尔公司 | Electronic assembly using bismuth-rich solder |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0969525A1 (en) * | 1998-06-29 | 2000-01-05 | Tellurex Corporation | thermoelectric module |
| CN1463294A (en) * | 2001-06-12 | 2003-12-24 | Esec贸易公司 | Unleaded solder |
| CN101232967A (en) * | 2005-08-11 | 2008-07-30 | 千住金属工业株式会社 | Lead free solder paste and application thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59156598A (en) * | 1983-02-24 | 1984-09-05 | Senjiyu Kinzoku Kogyo Kk | Method for using cream solder |
| JP3885995B2 (en) * | 2001-11-14 | 2007-02-28 | エヌイーシー ショット コンポーネンツ株式会社 | Thermal fuse |
-
2011
- 2011-10-24 CN CN201110323851A patent/CN102321829B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0969525A1 (en) * | 1998-06-29 | 2000-01-05 | Tellurex Corporation | thermoelectric module |
| CN1463294A (en) * | 2001-06-12 | 2003-12-24 | Esec贸易公司 | Unleaded solder |
| CN101232967A (en) * | 2005-08-11 | 2008-07-30 | 千住金属工业株式会社 | Lead free solder paste and application thereof |
Non-Patent Citations (2)
| Title |
|---|
| JP昭59-156598A 1984.09.05 |
| JP特开2003-147461A 2003.05.21 |
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