CN102319956A - Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip - Google Patents

Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip Download PDF

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Publication number
CN102319956A
CN102319956A CN201110235234A CN201110235234A CN102319956A CN 102319956 A CN102319956 A CN 102319956A CN 201110235234 A CN201110235234 A CN 201110235234A CN 201110235234 A CN201110235234 A CN 201110235234A CN 102319956 A CN102319956 A CN 102319956A
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CN
China
Prior art keywords
barrier film
pressure
substrate
pressure chamber
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201110235234A
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Chinese (zh)
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CN102319956B (en
Inventor
杨奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Bohui Innovation Biotechnology Group Co Ltd
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Beijing Bohui Innovation Technology Co Ltd
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Publication date
Application filed by Beijing Bohui Innovation Technology Co Ltd filed Critical Beijing Bohui Innovation Technology Co Ltd
Priority to CN201110235234.0A priority Critical patent/CN102319956B/en
Publication of CN102319956A publication Critical patent/CN102319956A/en
Priority to JP2014525286A priority patent/JP5966006B2/en
Priority to PCT/CN2012/071781 priority patent/WO2013023449A1/en
Priority to EP12823344.2A priority patent/EP2745977B1/en
Priority to US14/238,848 priority patent/US9427735B2/en
Application granted granted Critical
Publication of CN102319956B publication Critical patent/CN102319956B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1696—Laser beams making use of masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being non-straight, e.g. forming non-closed contours
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/81455—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps being a fluid inflatable bag or bladder, a diaphragm or a vacuum bag for applying isostatic pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/9221—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force or the mechanical power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
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    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/934—Measuring or controlling the joining process by measuring or controlling the speed by controlling or regulating the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/939—Measuring or controlling the joining process by measuring or controlling the speed characterised by specific speed values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding

Abstract

The invention discloses a method for welding a substrate and a diaphragm of a diaphragm-moving polymer microfluidic chip, which relates to the technical field of diaphragm-moving polymer microfluidic chip production. The method includes the steps that: before welding, the substrate is fixed, the diaphragm is spread flat to cover the surface of the substrate; pressure is applied to press the diaphragm on the surface of the substrate; during welding, laser is utilized to irradiate the welding area on the substrate via the diaphragm, and after the welding area is heated to be molten, the substrate and the diaphragm are welded together. The method realizes the welding of the diaphragm and the substrate of the diaphragm-moving polymer microfluidic chip, moreover, welding is firm, and the face of weld is smooth and even.

Description

The substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film
Technical field
The present invention relates to the moving polymeric micro-fluidic chip manufacturing technology field of film, the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of particularly a kind of film.
Background technology
The manufacturing approach of the moving polymeric micro-fluidic chip of film and device are that micro-fluidic technologies realizes industrial large-scale production; Get into the key of application market; Adopt laser emission fusion weld method welding polymer that welding precision, quality are got a promotion, can carry out microwelding processing.
Chinese invention patent " method for laser welding of welding plastic workpiece or plastics and other materials and device ZL00101924.4 " discloses a kind of method that adopts laser welding of plastic articles; It is to need the workpiece of welding to force together with two; Solder side contact, to laser-light transparent, another piece is opaque near the workpiece of laser; Be used for absorbing light and produce heat, weld through laser radiation; Chinese invention patent " the method and apparatus ZL03132664.1 that is used for processing work " discloses a kind of fixing means and device that is used for the laser weld processing work; This device is by last pressure and press down two parts and form; Last splenium divides and mainly comprises printing opacity top board and printing opacity elasticity mantle; Depressed portion comprises lower platen, balancing gate pit, pressure piston; Welding laser is injected from above, and welding region control is to realize through printing opacity that is placed on a masking-out above the printing opacity top board and light tight zone; The solder side of two soldering appliances is through the pressure contact, and the workpiece near LASER Light Source is transparent to the laser beam requirement above, and lower work piece will absorb laser as far as possible.This method and apparatus is applicable to that two workpiece are rigidity, the welding of the elastomeric material not considering to be out of shape.
One of welding work pieces in the manufacturing process of the moving polymeric micro-fluidic chip of film is the printing opacity elastic film, and another piece is light tight rigid substrates, and two solders side are wanted open and flat contact during welding, need vertical pressure; The solder side of actual welding substrate is not the ideal plane, is uneven, and top board adopts dull and stereotyped, under pressure, still has the uneven slit that is produced in the integral planar, and air film, and welding is not gone up; Under flat board, increase a printing opacity elastic cushion, can compensate the uneven problem of some flatnesses, realize because its principle is a pressure strain according to elastic cushion; Like this, big in the high protruding place pressure large deformation of substrate, little at pocket pressure small deformation, the different welding effects of height zones of different pressure are with regard to difference on the plane after the fusion weld, and it is firm inadequately to have welding in certain minuent, even the situation of not welding; The planar abrupt at substrate slot wedge place, the barrier film below loses support, and pressure produces tensile force to barrier film, directly influences the flatness after barrier film welds; Accurate barrier film welding is undesirable for this type of microfluid; If, make it can guarantee bigger plane elasticity amplitude of deformation with printing opacity elastic cushion thickening, stiffened, can be controlled at structure place such as groove again and not have excessive deformation, but the thickening to produce and absorb the influence welding of printing opacity pad to radiant light.
Therefore, prior art can't realize for micro-fluidic this by the firm welding between substrate and the barrier film.
Summary of the invention
The technical problem that (one) will solve
The technical problem that the present invention will solve is: how to realize the moving polymeric micro-fluidic chip of film substrate and barrier film between firm welding, and solder side is smooth, even.
(2) technical scheme
For solving the problems of the technologies described above, the invention provides the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of a kind of film, comprise step: before the welding, fixing base covers said barrier film the surface of said substrate open and flatly; Exerting pressure is pressed in said substrate surface with barrier film, utilizes laser to see through said barrier film during welding and shines the welding region on the said substrate, after the said welding region melted by heat said substrate and barrier film is welded together.
Wherein, said barrier film is applied pulling force, cover the surface of said substrate after the tension.
Big or small when wherein, exerting pressure with said barrier film elastic parameter and applied pressure size adjustment pulling force.
Wherein, during welding, the power of said laser is: 80～120W, laser scanning speed is: 60～80mm/s.
Wherein, also adopt before the welding and cover the non-welding region that plate blocks said substrate, make laser see through the welding region that the transmission region that covers plate shines said substrate.
Wherein, adopt transparent pressing plate to exert pressure barrier film is pressed in said substrate surface.
Wherein, adopt transparent pressing plate to exert pressure before, the elastic cushion of layer of transparent is set between said barrier film and said pressing plate.
Wherein, The mode that adopts pressure chamber to exert pressure is pressed in said substrate surface with barrier film, the air pressure or the ambient pressure of said pressure chamber executed, or the surface that the air pressure and the ambient pressure of pressure chamber is applied to the welding of said barrier film and substrate simultaneously; When applying air pressure, pressure chamber is an air-tight state.
Wherein, Said pressure chamber and said barrier film homonymy utilize the said pressure chamber of said diaphragm seal, in said pressure chamber, inflate; The gas that charges into forms the air pressure face so that said barrier film is exerted pressure at said membrane surface, and the cabin body of said pressure chamber is that transparent material is processed.
Wherein, also comprise the step of regulating said pressure chamber internal gas pressure during inflation.
Wherein, Said pressure chamber and said barrier film homonymy; Cover a laminated film at said membrane surface, utilize said press mold to seal said pressure chamber, in said pressure chamber, inflate; The gas that charges into forms the air pressure face so that said barrier film is exerted pressure on said press mold surface, and the cabin body of said pressure chamber is that transparent material is processed.
Wherein, said press mold applies pulling force to said press mold after covering said membrane surface, and is big or small according to the said pulling force of air pressure size adjustment during inflation.
Wherein, the material characteristic of the material characteristic of said press mold and said barrier film is identical.
Wherein, also comprise the step of regulating said pressure chamber internal gas pressure during inflation.
Wherein, with said pressure chamber and said substrate homonymy, utilize the said pressure chamber of said diaphragm seal, extract the gas in the pressure chamber out, ambient pressure forms the air pressure face so that said barrier film is exerted pressure at said membrane surface.
Also comprise the step of regulating said pressure chamber internal gas pressure when wherein, bleeding.
Wherein, comprise two pressure chambers, first pressure chamber is positioned at the barrier film side; Second pressure chamber is positioned at substrate-side; Utilize said first pressure chamber of said diaphragm seal and second pressure chamber, in said first pressure chamber, inflate, extract the gas in second pressure chamber simultaneously out; The gas differential pressure of two pressure chambers forms the air pressure face so that said barrier film is exerted pressure at said membrane surface, and the cabin body of said first pressure chamber is that transparent material is processed.
Wherein, inflate and also comprise the step of regulating said first pressure chamber and the second pressure chamber internal gas pressure when bleeding.
Wherein, comprise two pressure chambers, first pressure chamber is positioned at the barrier film side; Second pressure chamber is positioned at substrate-side; Cover a laminated film at said membrane surface, utilize said press mold to seal said first pressure chamber, utilize said second pressure chamber of said diaphragm seal; In said first pressure chamber, inflate; Extract the gas in second pressure chamber simultaneously out, so that said barrier film is exerted pressure jointly, the cabin body of said first pressure chamber is that transparent material is processed at the air pressure face of said membrane surface formation for the air pressure face that the air pressure of said first pressure chamber forms on press mold surface and ambient pressure.
Wherein, said press mold applies pulling force to said press mold after covering said membrane surface, and is big or small according to the said pulling force of air pressure size adjustment during inflation.
Wherein, the material characteristic of the material characteristic of said press mold and said barrier film is identical.
Wherein, inflate and also comprise the step of regulating said first pressure chamber and the second pressure chamber internal gas pressure when bleeding.
(3) beneficial effect
The present invention is barrier film tension back pressurization welding, makes firm welding between substrate and the barrier film of the moving polymeric micro-fluidic chip of film, do not damage barrier film, and solder side is smooth, even; Moving component valve body behind the welding fabrication can normally move more than 5000 times under air pressure drives, referring to table 1: barrier film laser weld fatigue experiment tables of data.
Can make barrier film smooth with the pressure adjustment pulling force of barrier film elastic parameter and device for exerting, and control stretcher strain, to guarantee welding quality.
The mode of exerting pressure of pressure chamber-press mold; Can select the press mold match according to the barrier film parameter, pulling force that can be through the adjustment press mold and pressure chamber pressure controlled and exert pressure to the exert pressure degree of distortion of solder side, control welding quality; The pressure chamber structure is relatively independent, is convenient to control.
The mode of exerting pressure to pressure chamber is bled has reduced some devices in the welding light path, be convenient to the welding of light path imaging high accuracy, has also reduced the loss of welding light path, and is simple in structure.
Description of drawings
Fig. 1 is that a kind of film of the embodiment of the invention 1 moves the substrate of polymeric micro-fluidic chip and the Welding Structure sketch map of barrier film welding method;
Fig. 2 is that a kind of film of the embodiment of the invention 2 moves the substrate of polymeric micro-fluidic chip and the Welding Structure sketch map of barrier film welding method;
Fig. 3 is that a kind of film of the embodiment of the invention 3 moves the substrate of polymeric micro-fluidic chip and the Welding Structure sketch map of barrier film welding method;
Fig. 4 is that a kind of film of the embodiment of the invention 4 moves the substrate of polymeric micro-fluidic chip and the Welding Structure sketch map of barrier film welding method;
Fig. 5 is that a kind of film of the embodiment of the invention 5 moves the substrate of polymeric micro-fluidic chip and the Welding Structure sketch map of barrier film welding method;
Fig. 6 is that a kind of film of the embodiment of the invention 6 moves the substrate of polymeric micro-fluidic chip and the Welding Structure sketch map of barrier film welding method;
Fig. 7 is the substrate of the moving polymeric micro-fluidic chip of film and the vertical view after the barrier film welding completion, promptly welds profile diagram.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention describes in further detail.Following examples are used to explain the present invention, but are not used for limiting scope of the present invention.
Embodiment 1
Present embodiment provides the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of a kind of film, and is as shown in Figure 1, for adopting the Welding Structure sketch map of welding method in the present embodiment.Before the welding, substrate 100 is fixing, and barrier film 200 covers substrate 100 surfaces, exerts pressure barrier film 200 is pressed in substrate 100 surfaces, in the present embodiment, adopts 300 pairs of barrier films of transparent pressing plate to exert pressure.
Preferably,, adopt 600 pairs of barrier films 200 of tight device to apply certain pulling force, the barrier film 200 after the tension is covered substrate 100 surfaces in order to make firm welding.Big or small when exerting pressure with barrier film 200 elastic parameters and applied pressure size adjustment pulling force; Because barrier film 200 is tightened up, substrate 100 withstands barrier film 200 from the below, thereby makes barrier film 200 be attached to substrate 100 surfaces open and flatly; And control stretcher strain is to guarantee welding quality.
The solder side of actual welding substrate 100 is not the ideal plane, is uneven, and what pressing plate 300 adopted is dull and stereotyped; Under pressure, still have uneven slit or the air film that is produced in the integral planar, make welding insecure, preferably; Before exerting pressure, place the elastic cushion 500 of one deck printing opacity on the surface of barrier film 200, can compensate the uneven problem of some flatnesses; Make welding more firm, and barrier film 200 is sustained damage.
Only specific welding region is welded when welding usually, therefore, also will cover the light path that plate 400 places laser 700 before the welding; Promptly before placing elastic cushion 500, will cover plate 400 and be placed on barrier film 200 surfaces; Also can after placing elastic cushion 500, will cover plate 400 and be placed on the elastic cushion 500, place pressing plate 300 again, and can also place and to cover plate 400 behind the pressing plate 300 and be placed on the pressing plate 300; In the present embodiment, will cover plate 400 and be placed on the pressing plate 300.Cover the welding region on the transmission region counterpart substrate 100 on the plate 400.During welding, laser 700 sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
The welding method of present embodiment is welded covering on the substrate 200 after barrier film 200 tensions, make the weld firm welding of substrate 100 and barrier film 200, and solder side is smooth, even; And implement that this method adopts simple in structure, convenient and easy.
Embodiment 2
Present embodiment provides the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of a kind of film, and is as shown in Figure 2, for adopting the Welding Structure sketch map of welding method in the present embodiment.The step and the embodiment 1 of welding are basic identical, and different is the mode that barrier film 100 is exerted pressure.Present embodiment adopts the mode of air pressure-press mold that barrier film 100 is exerted pressure.Before the welding, substrate 100 is fixing, and barrier film 200 covers substrate 100 surfaces.Preferably, cover substrate 100 surfaces after adopting tight device 600 with barrier film 200 tension.Pressure chamber 800 and press mold 900 are placed on barrier film 200 surfaces, and with pressure chamber 800 sealings, the cabin body of pressure chamber 800 is provided with pressure sensor 801 and control valve 802 to press mold 900 in advance.When exerting pressure, inflate in pressure chamber 800 through control valve 802, air pressure forms the air pressure face so that barrier film 200 is exerted pressure on barrier film 200 surfaces.
Preferably, through the air pressure in the feedback regulation pressure chamber 800 of pressure sensor 801, make air pressure reach needed pressure.Press mold 900 can be selected for use and the identical material of barrier film 200 material characteristics; Pulling force is regulated its degree of tautness and the air pressure size is controlled at the deflection of a certain welding pressure lower pressed film 900 surfaces with substrate 100 surfaces through press mold 900 is applied; The deformation quantity of barrier film 200 when controlling welding with this, and need not the strict level of tightness of controlling barrier film 200.
Because there is the air-tightness condition of poor in pressure chamber 800; Therefore, open to the feedback interval through pressure sensor 801 control valve 802 and regulate the air pressure size in the pressure chambers 800, to reach the pressure that needs; Regulate back closed control valve 802, to keep the constant pressure in the pressure chamber 800.
Before the welding, also will cover the light path that plate 400 places laser 700, as shown in Figure 2, can be placed on the press mold 900 covering plate 400 in advance, utilize press mold 900 blanket gas ballastings 800 again; Also can will cover plate 400 and place on the pressure chamber 800, promptly will guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400 at laser 700 pre-irradiations.During welding, laser 700 sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
Owing to will make laser radiation arrive the welding region of substrate 100, therefore, the pressure chamber 800 in the present embodiment is transparent material with press mold 900.
Present embodiment adopts the mode of air pressure-press mold to exert pressure, and air pressure face and press mold have guaranteed that simultaneously barrier film 200 is attached to substrate 100 surfaces open and flatly, thereby make firm welding, and solder side is smooth, even.
Embodiment 3
As shown in Figure 3; The substrate of the moving polymeric micro-fluidic chip of the film that present embodiment provides and barrier film welding method and embodiment 2 are basic identical; Different is not adopt press mold blanket gas ballasting 800; But after placing substrate 100 and barrier film 200, through the seal receptacle 803 that matches with pressure chamber 800 barrier film 200 is pressed on around the pressure chamber 800, with blanket gas ballasting 800.Preferably, before sealing, adopt 600 pairs of barrier films 200 of tight device to apply pulling force, make it tight.The mode of exerting pressure is identical with embodiment 2.
Preferably, when inflation,,, guarantee welding quality with control stretcher strain with barrier film 200 elastic parameters and air pressure size adjustment pulling force size.In the present embodiment; Owing to adopt barrier film 200 blanket gas ballastings 800, when the pulling force of regulating barrier film 200, may cause pressure chamber 800 air-tightness bad or itself have the air-tightness condition of poor, therefore; Open to feedback interval through pressure sensor 801 control valve 802 and regulate the air pressure size in the pressure chambers 800; To reach the pressure that needs, regulate back closed control valve 802, to keep the constant pressure in the pressure chamber 800.
Before the welding, also will cover the light path that plate 400 places laser 700, as shown in Figure 3, can be placed on the barrier film 200 covering plate 400 in advance, utilize barrier film 200 blanket gas ballastings 800 again; Also can before laser 700 irradiations, be placed on the pressure chamber 800, promptly will guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400.During welding, laser 700 sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.Pressure chamber 800 in the present embodiment is a transparent material.
Present embodiment has saved press mold 900 with respect to embodiment 2, has reduced the energy loss of laser 700 in light path, improved welding precision and efficient, and realized firm welding equally, and solder side is smooth, even.
Embodiment 4
Present embodiment provides the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of a kind of film, and is as shown in Figure 4, compares with embodiment 3; Adopted the different modes of exerting pressure; Be pressure chamber 800 with substrate 100 in the same side, it is bled exerts pressure, specific as follows:
Before the welding, substrate 100 is fixing, and barrier film 200 covers substrate 100 surfaces.Preferably, cover substrate 100 surfaces after adopting tight device 600 with barrier film 200 tension.Pressure chamber 800 is placed the same side of substrate 100, through the seal receptacle 803 that matches with pressure chamber 800 barrier film 200 is pressed on around the pressure chamber 800, with blanket gas ballasting 800.When exerting pressure, through the gas that control valve 802 is extracted out in the pressure chamber 800, can be through the air pressure in the pressure sensor 801 detection pressure chambers 800.After bleeding; Ambient pressure forms the air pressure face to exert pressure on the surface of barrier film 200; Be that ambient pressure is to pressing down barrier film 200; Owing to adopt barrier film 200 blanket gas ballastings 800, the pressure that the part that barrier film 200 does not contact with substrate 100 surfaces receives ambient pressure makes barrier film 200 be close to the surface of substrate 100.
Preferably, when bleeding,,, guarantee welding quality with control stretcher strain with barrier film 200 elastic parameters and air pressure size adjustment pulling force size.In the present embodiment; Owing to adopt barrier film 200 blanket gas ballastings 800, when the pulling force of regulating barrier film 200, may cause pressure chamber 800 air-tightness bad or itself have the air-tightness condition of poor, therefore; Open to feedback interval through pressure sensor 801 control valve 802 and regulate the air pressure size in the pressure chambers 800; To reach the pressure that needs, regulate back closed control valve 802, to keep the constant pressure in the pressure chamber 800.
Before the welding, also will cover the light path that plate 400 places laser 700, as shown in Figure 4, will cover plate 400 at laser 700 pre-irradiations and be placed on the barrier film 200, guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400.During welding, laser 700 sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
The relative embodiment 2 of present embodiment and 3 has only the plate 400 of illiteracy in the welding light path, be convenient to the welding of light path imaging high accuracy, has also reduced the loss of welding light path, and is simple in structure, and realized firm welding equally, and solder side is smooth, even.
Embodiment 5
Present embodiment provides the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of a kind of film; Its welding process and embodiment 2,3 and 4 are basic identical; Different is the mode of exerting pressure that has adopted two pressure chambers, as shown in Figure 5, and the first pressure chamber 800a and barrier film 200 are in the same side; The second pressure chamber 800b and substrate 100 are in the same side, and be specific as follows:
Before the welding, substrate 100 is fixing, and barrier film 200 covers substrate 100 surfaces.Preferably, cover substrate 100 surfaces after adopting tight device 600 with barrier film 200 tension.In the present embodiment; Barrier film 200 after will straining through the seal receptacle 803b that matches with the second pressure chamber 800b is pressed on around the second pressure chamber 800b to seal the second pressure chamber 800b; The first pressure chamber 800a and press mold 900 are placed on barrier film 200 surfaces, and press mold 900 seals the first pressure chamber 800a in advance.The cabin body of the first pressure chamber 800a is provided with pressure sensor 801a and control valve 802a; The cabin body of the second pressure chamber 800b is provided with pressure sensor 801b and control valve 802b when exerting pressure; Inflate in the first pressure chamber 800a through control valve 802a; Air pressure forms the air pressure face so that barrier film 200 is exerted pressure on press mold 900 surfaces; Through control valve 802b the second pressure chamber 800b is bled simultaneously, ambient pressure is exerted pressure to barrier film 200 at the air pressure face that barrier film 200 surfaces form air pressure face and first pressure chamber 800a formation simultaneously.
Preferably, through the air pressure among the feedback regulation first pressure chamber 800a of pressure sensor 801a, also through the air pressure among the feedback regulation second pressure chamber 800b of pressure sensor 801b, make total atmospheric pressure value reach needed pressure simultaneously.
Preferably; Press mold 900 can be selected for use and the identical material of barrier film 200 material characteristics; Pulling force is regulated its degree of tautness and the air pressure size is controlled at the deflection of a certain welding pressure lower pressed film 900 surfaces with substrate 100 surfaces through press mold 900 is applied; The deformation quantity of barrier film 200 when controlling welding with this, and need not the strict level of tightness of controlling barrier film 200.
Because possibly there are the air-tightness condition of poor in the first pressure chamber 800a and the second pressure chamber 800b; Therefore; Open to feedback interval through pressure sensor 801a control valve 802a and regulate the air pressure size among the first pressure chamber 800a; Also open to the feedback interval through pressure sensor 801b control valve 802b simultaneously and regulate the air pressure size among the second pressure chamber 800b; To reach the pressure that needs, regulate back closed control valve 802a and 802b, to keep the constant pressure among the first pressure chamber 800a and the second pressure chamber 800b.
Before the welding, also will cover the light path that plate 400 places laser 700, as shown in Figure 5, can be placed on the press mold 900 covering plate 400 in advance, utilize the press mold 900 sealings first pressure chamber 800a again; Also can will cover plate 400 and place on the first pressure chamber 800a, promptly will guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400 at laser 700 pre-irradiations.During welding, laser 700 sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
Owing to will make laser radiation arrive the welding region of substrate 100, therefore, the first pressure chamber 800a and press mold 900 in the present embodiment are transparent material.
Present embodiment adopts the mode of air pressure-press mold to exert pressure, and air pressure face and press mold have guaranteed that simultaneously barrier film 200 is attached to substrate 100 surfaces open and flatly, thereby make firm welding, and solder side is smooth, even.Two pressure chambers are exerted pressure simultaneously, can access bigger pressure.
Embodiment 6
As shown in Figure 6, present embodiment provides the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of a kind of film, compares with embodiment 5, has removed press mold 900, the first pressure chamber 800a and has also adopted barrier film 200 sealings.Specific as follows:
Before the welding, substrate 100 is fixing, and barrier film 200 covers substrate 100 surfaces.Preferably, cover substrate 100 surfaces after adopting tight device 600 with barrier film 200 tension.In the present embodiment, utilize the barrier film 200 sealing first pressure chamber 800a and the second pressure chamber 800b after straining.The cabin body of the first pressure chamber 800a is provided with pressure sensor 801a and control valve 802a; The cabin body of the second pressure chamber 800b is provided with pressure sensor 801b and control valve 802b when exerting pressure; Inflate in the first pressure chamber 800a through control valve 802a; Air pressure forms the air pressure face so that barrier film 200 is exerted pressure on barrier film 200 surfaces; Through control valve 802b the second pressure chamber 800b is bled simultaneously, ambient pressure is exerted pressure to barrier film 200 at the air pressure face that barrier film 200 surfaces form air pressure face and first pressure chamber 800a formation simultaneously.
Preferably, through the air pressure among the feedback regulation first pressure chamber 800a of pressure sensor 801a, also through the air pressure among the feedback regulation second pressure chamber 800b of pressure sensor 801b, make total atmospheric pressure value reach needed pressure simultaneously.
Preferably, when inflating and bleeding, with barrier film 200 elastic parameters and air pressure size adjustment pulling force size, with control stretcher strain, the assurance welding quality.
Because possibly there are the air-tightness condition of poor in the first pressure chamber 800a and the second pressure chamber 800b; Therefore; Open to feedback interval through pressure sensor 801a control valve 802a and regulate the air pressure size among the first pressure chamber 800a; Also open to the feedback interval through pressure sensor 801b control valve 802b simultaneously and regulate the air pressure size among the second pressure chamber 800b; To reach the pressure that needs, regulate back closed control valve 802a and 802b, to keep the constant pressure among the first pressure chamber 800a and the second pressure chamber 800b.
Before the welding; Also will cover the light path that plate 400 places laser 700; As shown in Figure 6; Can be placed on the barrier film 200 covering plate 400 in advance, also can will cover plate 400 and place on the first pressure chamber 800a, promptly will guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400 at laser 700 pre-irradiations.During welding, laser 700 sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
Owing to will make laser radiation arrive the welding region of substrate 100, therefore, the first pressure chamber 800a in the present embodiment is a transparent material.
Present embodiment has saved press mold, has reduced the energy loss of laser 700 in light path, improved welding precision and efficient, and realized firm welding equally, and solder side is smooth, even.
Adopt the welding method welding back of above embodiment 1～6 as shown in Figure 7, whole boundary profile is the barrier film solder side, and corresponding with the light tight zone of illiteracy plate is non-welding region B district, and corresponding with illiteracy plate transmission region is welding region A district.Welding region is different and different according to the function of the moving polymeric micro-fluidic chip of film.Following table is the testing fatigue to the moving polymeric micro-fluidic chip of film that adopts above-mentioned welding manner welding; It is thus clear that during welding; Laser power is at 100W (about 80～120W); (60～80mm/s) time, the moving polymeric micro-fluidic chip of the film after the welding is longer service life, and length can reach more than 6000 time at 80mm/s for sweep speed.
Table 1 barrier film laser weld fatigue experiment tables of data
Figure BDA0000083704980000121
Above embodiment only is used to explain the present invention; And be not limitation of the present invention; The those of ordinary skill in relevant technologies field under the situation that does not break away from the spirit and scope of the present invention, can also be made various variations and modification; Therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.

Claims (22)

1. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of a film is characterized in that, comprise step: before the welding, fixing base covers said barrier film the surface of said substrate open and flatly; Exerting pressure is pressed in said substrate surface with barrier film, utilizes laser to see through said barrier film during welding and shines the welding region on the said substrate, after the said welding region melted by heat said substrate and barrier film is welded together.
2. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 1 is characterized in that, said barrier film is applied pulling force, cover the surface of said substrate after the tension.
3. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 2 is characterized in that, and be big or small with said barrier film elastic parameter and applied pressure size adjustment pulling force when exerting pressure.
4. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 1, it is characterized in that during welding, the power of said laser is: 80～120W, laser scanning speed is: 60～80mm/s.
5. move the substrate and the barrier film welding method of polymeric micro-fluidic chip like each described film in the claim 1～4; It is characterized in that; Also adopt before the welding and cover the non-welding region that plate blocks said substrate, make laser see through the welding region that the transmission region that covers plate shines said substrate.
6. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 5 is characterized in that, adopt transparent pressing plate to exert pressure barrier film is pressed in said substrate surface.
7. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 6 is characterized in that, adopt transparent pressing plate to exert pressure before, the elastic cushion of layer of transparent is set between said barrier film and said pressing plate.
8. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 5; It is characterized in that; The mode that adopts pressure chamber to exert pressure is pressed in said substrate surface with barrier film, the air pressure or the ambient pressure of said pressure chamber executed, or the surface that the air pressure and the ambient pressure of pressure chamber is applied to the welding of said barrier film and substrate simultaneously; When applying air pressure, pressure chamber is an air-tight state.
9. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 8; It is characterized in that; Said pressure chamber and said barrier film homonymy utilize the said pressure chamber of said diaphragm seal, in said pressure chamber, inflate; The gas that charges into forms the air pressure face so that said barrier film is exerted pressure at said membrane surface, and the cabin body of said pressure chamber is that transparent material is processed.
10. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 9 is characterized in that, also comprise the step of regulating said pressure chamber internal gas pressure during inflation.
11. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 8; It is characterized in that said pressure chamber and said barrier film homonymy cover a laminated film at said membrane surface; Utilize said press mold to seal said pressure chamber; In said pressure chamber, inflate, the gas that charges into forms the air pressure face so that said barrier film is exerted pressure on said press mold surface, and the cabin body of said pressure chamber is that transparent material is processed.
12. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 10 is characterized in that said press mold applies pulling force to said press mold after covering said membrane surface, and be big or small according to the said pulling force of air pressure size adjustment during inflation.
13. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 10 is characterized in that the material characteristic of said press mold is identical with the material characteristic of said barrier film.
14. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 10 is characterized in that, also comprise the step of regulating said pressure chamber internal gas pressure during inflation.
15. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 8; It is characterized in that; With said pressure chamber and said substrate homonymy; Utilize the said pressure chamber of said diaphragm seal, extract the gas in the pressure chamber out, ambient pressure forms the air pressure face so that said barrier film is exerted pressure at said membrane surface.
16. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 15 is characterized in that, also comprise the step of regulating said pressure chamber internal gas pressure when bleeding.
17. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 8; It is characterized in that comprise two pressure chambers, first pressure chamber is positioned at the barrier film side; Second pressure chamber is positioned at substrate-side; Utilize said first pressure chamber of said diaphragm seal and second pressure chamber, in said first pressure chamber, inflate, extract the gas in second pressure chamber simultaneously out; The gas differential pressure of two pressure chambers forms the air pressure face so that said barrier film is exerted pressure at said membrane surface, and the cabin body of said first pressure chamber is that transparent material is processed.
18. substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 17 is characterized in that, inflate and also comprise when bleeding the step of said first pressure chamber of adjusting and the second pressure chamber internal gas pressure.
19. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 8; It is characterized in that comprise two pressure chambers, first pressure chamber is positioned at the barrier film side; Second pressure chamber is positioned at substrate-side; Cover a laminated film at said membrane surface, utilize said press mold to seal said first pressure chamber, utilize said second pressure chamber of said diaphragm seal; In said first pressure chamber, inflate; Extract the gas in second pressure chamber simultaneously out, so that said barrier film is exerted pressure jointly, the cabin body of said first pressure chamber is that transparent material is processed at the air pressure face of said membrane surface formation for the air pressure face that the air pressure of said first pressure chamber forms on press mold surface and ambient pressure.
20. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 19 is characterized in that said press mold applies pulling force to said press mold after covering said membrane surface, and be big or small according to the said pulling force of air pressure size adjustment during inflation.
21. the substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 19 is characterized in that the material characteristic of said press mold is identical with the material characteristic of said barrier film.
22. substrate and the barrier film welding method of the moving polymeric micro-fluidic chip of film as claimed in claim 19 is characterized in that, inflate and also comprise when bleeding the step of said first pressure chamber of adjusting and the second pressure chamber internal gas pressure.
CN201110235234.0A 2011-08-16 2011-08-16 Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip Active CN102319956B (en)

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CN201110235234.0A CN102319956B (en) 2011-08-16 2011-08-16 Method for welding substrate and diaphragm of diaphragm-moving polymer microfluidic chip
JP2014525286A JP5966006B2 (en) 2011-08-16 2012-02-29 Method of welding membrane substrate and membrane of membrane-moving polymer microfluidic chip
PCT/CN2012/071781 WO2013023449A1 (en) 2011-08-16 2012-02-29 Welding method of substrate and membrane of membrane mobile polymer microfluidic chip
EP12823344.2A EP2745977B1 (en) 2011-08-16 2012-02-29 Welding method of substrate with a membrane of a mobile polymer microfluidic chip
US14/238,848 US9427735B2 (en) 2011-08-16 2012-02-29 Welding method for substrate and membrane of membrane mobile polymer microfluidic chip

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JP5966006B2 (en) 2016-08-10
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US9427735B2 (en) 2016-08-30
EP2745977B1 (en) 2018-11-21
CN102319956B (en) 2015-04-22
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WO2013023449A1 (en) 2013-02-21
US20140216647A1 (en) 2014-08-07

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