CN202199934U - Welding device for substrate and diaphragm of diaphragm movement polymer micro-fluidic chip - Google Patents
Welding device for substrate and diaphragm of diaphragm movement polymer micro-fluidic chip Download PDFInfo
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- CN202199934U CN202199934U CN 201120298694 CN201120298694U CN202199934U CN 202199934 U CN202199934 U CN 202199934U CN 201120298694 CN201120298694 CN 201120298694 CN 201120298694 U CN201120298694 U CN 201120298694U CN 202199934 U CN202199934 U CN 202199934U
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Abstract
The utility model discloses a welding device for a substrate and a diaphragm of a diaphragm movement polymer micro-fluidic chip, which relates to the technical field of manufacture of diaphragm movement polymer micro-fluidic chips and comprises a laser transmitter (700), a pressing device and a diaphragm tightening device (600). The diaphragm tightening device (600) is used for tightening the diaphragm (200) to be welded so that the diaphragm (200) is covered on the surface of the substrate (100), the pressing device is used for pressing the diaphragm (200) on the surface of the substrate (100), and the laser transmitter (700) is used for radiating laser to welding surfaces of the substrate (100) and the diaphragm (200) via the pressing device and the diaphragm (200). By the aid of the welding device, the diaphragm of the diaphragm movement polymer micro-fluidic chip and the substrate are welded firmly, and the surfaces are flat and uniform.
Description
Technical field
The utility model relates to the moving polymeric micro-fluidic chip manufacturing technology field of film, the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of particularly a kind of film.
Background technology
The manufacturing approach of the moving polymeric micro-fluidic chip of film and device are that micro-fluidic technologies realizes industrial large-scale production; Get into the key of application market; Adopt laser emission fusion weld method welding polymer that welding precision, quality are got a promotion, can carry out microwelding processing.
Chinese invention patent " method for laser welding of welding plastic workpiece or plastics and other materials and device ZL00101924.4 " discloses a kind of method that adopts laser welding of plastic articles; It is to need the workpiece of welding to force together with two; Solder side contact, to laser-light transparent, another piece is opaque near the workpiece of laser; Be used for absorbing light and produce heat, weld through laser radiation; Chinese invention patent " the method and apparatus ZL03132664.1 that is used for processing work " discloses a kind of fixing means and device that is used for the laser weld processing work; This device is by last pressure and press down two parts and form; Last splenium divides and mainly comprises printing opacity top board and printing opacity elasticity mantle; Depressed portion comprises lower platen, balancing gate pit, pressure piston; Welding laser is injected from above, and welding region control is to realize through printing opacity that is placed on a masking-out above the printing opacity top board and light tight zone; The solder side of two soldering appliances is through the pressure contact, and the workpiece near LASER Light Source is transparent to the laser beam requirement above, and lower work piece will absorb laser as far as possible.This method and apparatus is applicable to that two workpiece are rigidity, the welding of the elastomeric material not considering to be out of shape.
One of welding work pieces in the manufacturing process of the moving polymeric micro-fluidic chip of film is the printing opacity elastic film, and another piece is light tight rigid substrates, and two solders side are wanted open and flat contact during welding, need vertical pressure; The solder side of actual welding substrate is not the ideal plane, is uneven, and top board adopts dull and stereotyped, under pressure, still has the uneven slit that is produced in the integral planar, and air film, and welding is not gone up; Under flat board, increase a printing opacity elastic cushion, can compensate the uneven problem of some flatnesses, realize because its principle is a pressure strain according to elastic cushion; Like this, big in the high protruding place pressure large deformation of substrate, little at pocket pressure small deformation, the different welding effects of height zones of different pressure are with regard to difference on the plane after the fusion weld, and it is firm inadequately to have welding in certain minuent, even the situation of not welding; The planar abrupt at substrate slot wedge place, the barrier film below loses support, and pressure produces tensile force to barrier film, directly influences the flatness after barrier film welds; Accurate barrier film welding is undesirable for this type of microfluid; If, make it can guarantee bigger plane elasticity amplitude of deformation with printing opacity elastic cushion thickening, stiffened, can be controlled at structure place such as groove again and not have excessive deformation, but the thickening to produce and absorb the influence welding of printing opacity pad to radiant light.
Therefore, thisly adopt this technology not realize for micro-fluidic by the welding between substrate and the barrier film.
The utility model content
The technical problem that (one) will solve
The technical problem that the utility model will solve is: how to realize the firm welding of moving polymeric micro-fluidic chip barrier film of film and substrate, and solder side is smooth, even.
(2) technical scheme
For solving the problems of the technologies described above; The utility model provides the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of a kind of film; Comprise: the tight device of generating laser, device for exerting and barrier film; The tight device of said barrier film is used to tighten barrier film to be welded makes said barrier film cover substrate surface; Said device for exerting is used for said barrier film is pressed in said substrate surface, and said generating laser is used for laser is seen through said device for exerting and barrier film, shines on the solder side of substrate and barrier film.
Wherein, The substrate and the barrier film welder of the moving polymeric micro-fluidic chip of said film also comprise the illiteracy plate that is positioned between said generating laser and said barrier film, are used to make the generating laser emitted laser through the welding region on the solder side of transmission region irradiated substrate on the illiteracy plate and barrier film.
Wherein, said device for exerting is transparent pressing plate.
Wherein, the substrate of the moving polymeric micro-fluidic chip of said film and barrier film welder also comprise the transparent elastic cushion between said barrier film and said transparent pressing plate.
Wherein, said device for exerting is: the air pressure device for exerting is used for through forming the air pressure face so that said barrier film is pressed in substrate.
Wherein, Said air pressure device for exerting comprises: transparent pressure chamber and transparent press mold; Said press mold is used to seal the opening of said pressure chamber; Said pressure chamber is provided with the control valve that control charges and discharge gas, and said pressure chamber and said barrier film are positioned at the same side, through the air pressure in the pressure chamber said press mold are pressed on the said barrier film.
Wherein, the material characteristic of the material characteristic of said press mold and said barrier film is identical.
Wherein, Said air pressure device for exerting comprises: transparent pressure chamber and the seal receptacle that matches with it; The opening part that said seal receptacle is used for barrier film is pressed on said pressure chamber is to seal said pressure chamber; Said pressure chamber is provided with the control valve that control charges and discharge gas, and said pressure chamber and said barrier film are positioned at the same side.
Wherein, Said air pressure device for exerting comprises: pressure chamber and the seal receptacle that matches with it; The opening part that said seal receptacle is used for barrier film is pressed on said pressure chamber is to seal said pressure chamber; Said pressure chamber is provided with the control valve that control charges and discharge gas, and said pressure chamber and said substrate are positioned at the same side.
Wherein, said pressure chamber also comprises the pressure by air pressure sensor that is used in the measurement of gas ballasting.
Wherein, Said air pressure device for exerting comprises: the first transparent pressure chamber, transparent press mold, second pressure chamber and the seal receptacle that matches with second pressure chamber; Said first pressure chamber and said barrier film are positioned at the same side; Said press mold is used to seal the opening of said first pressure chamber, through the air pressure in first pressure chamber said press mold is pressed on the said barrier film; Said second pressure chamber and said substrate are positioned at the same side; The opening part that said seal receptacle is used for barrier film is pressed on said second pressure chamber is respectively equipped with first control valve and second control valve that control charges and discharge gas to seal said second pressure chamber on said first pressure chamber and first pressure chamber.
Wherein, the material characteristic of the material characteristic of said press mold and said barrier film is identical.
Wherein, said air pressure device for exerting comprises: the first transparent pressure chamber and second pressure chamber, and said first pressure chamber and said barrier film are positioned at the same side; Said second pressure chamber and said substrate are positioned at the same side; Said barrier film is used to seal the opening of said first pressure chamber and the opening of second pressure chamber, is respectively equipped with first control valve and second control valve that control charges and discharge gas on said first pressure chamber and first pressure chamber.
Wherein, said first pressure chamber also comprises the pressure by air pressure sensor that is used in the measurement of gas ballasting, and said second pressure chamber also comprises the pressure by air pressure sensor that is used in the measurement of gas ballasting.
(3) beneficial effect
Adopt the welder of the utility model,, make firm welding between substrate and the barrier film of the moving polymeric micro-fluidic chip of film, do not damage barrier film, and solder side is smooth, even the pressurization welding of barrier film tension back; Moving component valve body behind the welding fabrication can normally move more than 5000 times under air pressure drives, referring to table 1: barrier film laser weld fatigue experiment tables of data.
Can make barrier film smooth with the pressure adjustment pulling force of barrier film elastic parameter and device for exerting, and control stretcher strain, to guarantee welding quality.
The mode of exerting pressure of pressure chamber-press mold; Can select the press mold match according to the barrier film parameter, pulling force that can be through the adjustment press mold and pressure chamber pressure controlled and exert pressure to the exert pressure degree of distortion of solder side, control welding quality; The pressure chamber structure is relatively independent, is convenient to control.
The mode of exerting pressure to pressure chamber is bled has reduced some devices in the welding light path, be convenient to the welding of light path imaging high accuracy, has also reduced the loss of welding light path, and is simple in structure.
Description of drawings
Fig. 1 is the substrate and the barrier film Welding Structure sketch map of the moving polymeric micro-fluidic chip of a kind of film of the utility model embodiment 1;
Fig. 2 is the substrate and the barrier film Welding Structure sketch map of the moving polymeric micro-fluidic chip of a kind of film of the utility model embodiment 2;
Fig. 3 is the substrate and the barrier film Welding Structure sketch map of the moving polymeric micro-fluidic chip of a kind of film of the utility model embodiment 3;
Fig. 4 is the substrate and the barrier film Welding Structure sketch map of the moving polymeric micro-fluidic chip of a kind of film of the utility model embodiment 4;
Fig. 5 is the substrate and the barrier film Welding Structure sketch map of the moving polymeric micro-fluidic chip of a kind of film of the utility model embodiment 5;
Fig. 6 is the substrate and the barrier film Welding Structure sketch map of the moving polymeric micro-fluidic chip of a kind of film of the utility model embodiment 6;
Fig. 7 is the substrate of the moving polymeric micro-fluidic chip of film and the vertical view after the barrier film welding completion, promptly welds profile diagram.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, the specific embodiment of the utility model is described in further detail.Following examples are used to explain the utility model, but are not used for limiting the scope of the utility model.
Embodiment 1
As shown in Figure 1, the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of a kind of film that present embodiment provides comprise: generating laser 700, transparent pressing plate 300 and the tight device 600 of barrier film.The tight device 600 of barrier film is tightened barrier film to be welded 200 makes barrier film 200 cover substrate 100 surfaces, and pressing plate 300 is positioned at barrier film 200 tops, is used for barrier film 200 is pressed in substrate 100 surfaces.Generating laser 700 is used for laser is seen through pressing plate 300 and barrier film 200, shines on the solder side of substrate 100 and barrier film 200 and realizes welding.
Because the solder side of actual welding substrate 100 is not the ideal plane; Be uneven; What pressing plate 300 adopted is dull and stereotyped, under pressure, still has uneven slit or the air film that is produced in the integral planar, makes welding insecure; Preferably, the elastic cushion 500 that between barrier film 200 and pressing plate 300, also comprises layer of transparent.
Only specific welding region is welded when welding usually, therefore, also comprise: place the illiteracy plate 400 between generating laser 700 and the barrier film 200.Cover plate 400 and can be positioned at barrier film 200 surfaces; Or between elastic cushion 500 and the pressing plate 300; Or above the pressing plate 300; Promptly cover plate 400 and be arranged in the light path of laser, the welding region on the transmission region irradiated substrate 100 that is used to that generating laser 700 emitted laser are seen through and covers on the plate 400 and the solder side of barrier film 200.In the present embodiment, will cover plate 400 and be placed on the pressing plate 300.Cover the welding region on the transmission region counterpart substrate 100 on the plate 400.During welding, laser sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying.
Preferably,, adopt 600 pairs of barrier films 200 of tight device to apply certain pulling force, the barrier film 200 after the tension is covered substrate 100 surfaces in order to make firm welding.Big or small when exerting pressure with barrier film 200 elastic parameters and applied pressure size adjustment pulling force; Because barrier film 200 is tightened up, substrate 100 withstands barrier film 200 from the below, thereby makes barrier film 200 be attached to substrate 100 surfaces open and flatly; And control stretcher strain is to guarantee welding quality.
The substrate and the barrier film welder of the moving polymeric micro-fluidic chip of the film of present embodiment can weld covering on the substrate 200 after barrier film 200 tensions, make the weld firm welding of substrate 100 and barrier film 200, and solder side are smooth, even; And that this device adopted was simple in structure, convenient and easy.
Embodiment 2
Present embodiment provides the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of a kind of film, and is as shown in Figure 2, comprising: generating laser 700, transparent pressure chamber 800, transparent press mold 900 and the tight device 600 of barrier film.The tight device 600 of barrier film is tightened barrier film to be welded 200, makes barrier film 200 cover substrate 100 surfaces.Press mold 900 is used for the opening 804 of blanket gas ballasting 800.Pressure chamber 800 is provided with the control valve 802 that control charges and discharge gas.In the present embodiment, pressure chamber 800 is positioned at the same side with barrier film 200, in pressure chamber 800, charges into gas through control valve 802, charges into the air pressure that gas produces press mold 900 is pressed on the barrier film 200, thereby barrier film 200 is pressed on the substrate 100.Generating laser 700 emitted laser see through pressure chamber 800, press mold 900 and barrier film 200, shine on the solder side of substrate 100 and barrier film 200 and realize welding.
Because there is the air-tightness condition of poor in pressure chamber 800; Therefore, open to the feedback interval through pressure sensor 801 control valve 802 and regulate the air pressure size in the pressure chambers 800, to reach the pressure that needs; Regulate back closed control valve 802, to keep the constant pressure in the pressure chamber 800.
Only specific welding region is welded when welding usually, therefore, also comprise: place the illiteracy plate 400 between generating laser 700 and the barrier film 200.Cover plate 400 and can be positioned on the press mold 900, also can be positioned on the pressure chamber 800, be about to cover the light path that plate 400 places laser, guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400.In the present embodiment, cover plate 400 and be positioned on the press mold 900, during welding, laser sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
The substrate of the moving polymeric micro-fluidic chip of the film of present embodiment and barrier film welder adopt the mode of air pressure-press mold to exert pressure; Air pressure face and press mold have guaranteed that simultaneously barrier film 200 is attached to substrate 100 surfaces open and flatly; Thereby make firm welding, and solder side is smooth, even.
Embodiment 3
As shown in Figure 3; The substrate and the barrier film welder structure of the substrate of the moving polymeric micro-fluidic chip of the film that present embodiment provides and the structure of barrier film welder and the moving polymeric micro-fluidic chip of the film among the embodiment 2 are basic identical, comprising: generating laser 700, the transparent tight device 600 of pressure chamber 800, barrier film and the seal receptacle 803 that matches with pressure chamber 800.Different is not adopt press mold blanket gas ballasting 800, but through seal receptacle 803 barrier film 200 is pressed on around the pressure chamber 800, with the opening 804 of blanket gas ballasting 800.Generating laser 700 emitted laser see through pressure chamber 800 and barrier film 200, shine on the solder side of substrate 100 and barrier film 200 and realize welding.
Before barrier film 200 blanket gas ballastings 800, adopt 600 pairs of barrier films 200 of tight device to apply pulling force, make it tight.The mode of exerting pressure and embodiment 2 are basic identical, and the gas of fill gas ballasting 800 forms the air pressure face on barrier film 200 surfaces, and barrier film 200 is pressed on the substrate 100.When inflation,,, guarantee welding quality with the stretcher strain of control barrier film 200 with barrier film 200 elastic parameters and air pressure size adjustment pulling force size.In the present embodiment; Owing to adopt barrier film 200 blanket gas ballastings 800, when the pulling force of regulating barrier film 200, may cause pressure chamber 800 air-tightness bad or itself have the air-tightness condition of poor, therefore; Open to feedback interval through pressure sensor 801 control valve 802 and regulate the air pressure size in the pressure chambers 800; To reach the pressure that needs, regulate back closed control valve 802, to keep the constant pressure in the pressure chamber 800.
Only specific welding region is welded when welding usually, therefore, also comprise: place the illiteracy plate 400 between generating laser 700 and the barrier film 200.Cover plate 400 and can be positioned on the barrier film 200, also can be positioned on the pressure chamber 800, be about to cover the light path that plate 400 places laser, guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400.In the present embodiment, cover plate 400 and be positioned on the barrier film 200, during welding, laser sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
The substrate and the barrier film welder of the moving polymeric micro-fluidic chip of the film of present embodiment have saved press mold 900 with respect to embodiment 2; Reduced the energy loss of laser in light path; Improved welding precision and efficient, and realized firm welding equally, and solder side is smooth, even.
Embodiment 4
Present embodiment provides the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of a kind of film, and is as shown in Figure 4, comprising: generating laser 700, pressure chamber 800, the tight device 600 of barrier film and the seal receptacle 803 that matches with pressure chamber 800.The tight device 600 of barrier film is tightened barrier film to be welded 200, makes barrier film 200 cover substrate 100 surfaces.Seal receptacle 803 is pressed on barrier film 200 around the pressure chamber 800, with the opening 804 of blanket gas ballasting 800.Pressure chamber 800 is provided with the control valve 802 that control charges and discharge gas.In the present embodiment, pressure chamber 800 is positioned at the same side with substrate 100, and through control valve 802 gas bleeding from pressure chamber 800, ambient pressure is pressed on barrier film 200 on the substrate 100.Generating laser 700 emitted laser see through barrier film 200, shine on the solder side of substrate 100 and barrier film 200 and realize welding.
Only specific welding region is welded when welding usually, therefore, also comprise: place the illiteracy plate 400 between generating laser 700 and the barrier film 200.In the present embodiment, cover plate 400 and be positioned on the barrier film 200, during welding, laser sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
The relative embodiment 2 with the barrier film welder of substrate of the moving polymeric micro-fluidic chip of the film of present embodiment and 3 film move the substrate and the barrier film welder of polymeric micro-fluidic chip; In the welding light path, has only the plate 400 of illiteracy; Be convenient to the welding of light path imaging high accuracy, also reduced the loss of welding light path, simple in structure; And realized firm welding equally, and solder side is smooth, even.
Embodiment 5
Present embodiment provides the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of a kind of film; As shown in Figure 5, comprising: generating laser 700, the first transparent pressure chamber 800a, the transparent tight device 600 of press mold 900, the second pressure chamber 800b, barrier film and the seal receptacle 803b that matches with the second pressure chamber 800b.The tight device 600 of barrier film is tightened barrier film to be welded 200, makes barrier film 200 cover substrate 100 surfaces.The first pressure chamber 800a and barrier film 200 are positioned at the same side, and the opening 804a of the press mold 900 sealings first pressure chamber 800a is pressed in press mold 900 on the barrier film 200 through the air pressure among the first pressure chamber 800a.The second pressure chamber 800b and substrate 100 are positioned at the same side; Seal receptacle 803b sentences the sealing second pressure chamber 800b with the opening 804b that barrier film 200 is pressed on the second pressure chamber 800b, is respectively equipped with the first control valve 802a and the second control valve 802b that control charges and discharge gas on the first pressure chamber 800a and the first pressure chamber 800b.Generating laser 700 emitted laser see through the first pressure chamber 800a, press mold 900 and barrier film 200, shine on the solder side of substrate 100 and barrier film 200 and realize welding.
Inflate in the first pressure chamber 800a through control valve 802a; Air pressure forms the air pressure face so that barrier film 200 is exerted pressure on press mold 900 surfaces; Through control valve 802b the second pressure chamber 800b is bled simultaneously, ambient pressure is exerted pressure to barrier film 200 at the air pressure face that barrier film 200 surfaces form air pressure face and first pressure chamber 800a formation simultaneously.
The first pressure chamber 800a also comprises pressure sensor 801a, and the second pressure chamber 800b also comprises pressure sensor 801b.Through the air pressure among the feedback regulation first pressure chamber 800a of pressure sensor 801a, also through the air pressure among the feedback regulation second pressure chamber 800b of pressure sensor 801b, make total atmospheric pressure value reach needed pressure simultaneously.
Because possibly there are the air-tightness condition of poor in the first pressure chamber 800a and the second pressure chamber 800b; Therefore; Open to feedback interval through pressure sensor 801a control valve 802a and regulate the air pressure size among the first pressure chamber 800a; Also open to the feedback interval through pressure sensor 801b control valve 802b simultaneously and regulate the air pressure size among the second pressure chamber 800b; To reach the pressure that needs, regulate back closed control valve 802a and 802b, to keep the constant pressure among the first pressure chamber 800a and the second pressure chamber 800b.
Only specific welding region is welded when welding usually, therefore, also comprise: place the illiteracy plate 400 between generating laser 700 and the barrier film 200.Cover plate 400 and can be positioned on the press mold 900, also can be positioned on the first pressure chamber 800a, be about to cover the light path that plate 400 places laser, guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400.In the present embodiment, cover plate 400 and be positioned on the first pressure chamber 800a, during welding, laser sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
The substrate of the moving polymeric micro-fluidic chip of the film of present embodiment and barrier film welder adopt the mode of air pressure-press mold to exert pressure; Air pressure face and press mold have guaranteed that simultaneously barrier film 200 is attached to substrate 100 surfaces open and flatly; Thereby make firm welding, and solder side is smooth, even.Two pressure chambers are exerted pressure simultaneously, can access bigger pressure.
Embodiment 6
Present embodiment provides the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of a kind of film, and is as shown in Figure 6, comprising: generating laser 700, the transparent first pressure chamber 800a, the second pressure chamber 800b and the tight device 600 of barrier film.The tight device 600 of barrier film is tightened barrier film to be welded 200, makes barrier film 200 cover substrate 100 surfaces.The first pressure chamber 800a and barrier film 200 are positioned at the same side; The second pressure chamber 800b and substrate 100 are positioned at the same side; Barrier film 200 is pressed in the end around two pressure chambers; Make barrier film 200 seal the opening 804a of the first pressure chamber 800a and the opening 804b of the second pressure chamber 800b simultaneously, be respectively equipped with the first control valve 802a and the second control valve 802b that control charges and discharge gas on the first pressure chamber 800a and the first pressure chamber 800b.Generating laser 700 emitted laser see through the first pressure chamber 800a and barrier film 200, shine on the solder side of substrate 100 and barrier film 200 and realize welding.
Inflate in the first pressure chamber 800a through control valve 802a; Air pressure forms the air pressure face so that barrier film 200 is exerted pressure on barrier film 200 surfaces; Through control valve 802b the second pressure chamber 800b is bled simultaneously, ambient pressure is exerted pressure to barrier film 200 at the air pressure face that barrier film 200 surfaces form air pressure face and first pressure chamber 800a formation simultaneously.
The first pressure chamber 800a also comprises pressure sensor 801a, and the second pressure chamber 800b also comprises pressure sensor 801b.Through the air pressure among the feedback regulation first pressure chamber 800a of pressure sensor 801a, also through the air pressure among the feedback regulation second pressure chamber 800b of pressure sensor 801b, make total atmospheric pressure value reach needed pressure simultaneously.When inflating and bleeding, with barrier film 200 elastic parameters and air pressure size adjustment pulling force size, with control stretcher strain, the assurance welding quality.
Because possibly there are the air-tightness condition of poor in the first pressure chamber 800a and the second pressure chamber 800b; Therefore; Open to feedback interval through pressure sensor 801a control valve 802a and regulate the air pressure size among the first pressure chamber 800a; Also open to the feedback interval through pressure sensor 801b control valve 802b simultaneously and regulate the air pressure size among the second pressure chamber 800b; To reach the pressure that needs, regulate back closed control valve 802a and 802b, to keep the constant pressure among the first pressure chamber 800a and the second pressure chamber 800b.
Only specific welding region is welded when welding usually, therefore, also comprise: place the illiteracy plate 400 between generating laser 700 and the barrier film 200.Cover plate 400 and can be positioned on the barrier film 200, also can be positioned on the first pressure chamber 800a, be about to cover the light path that plate 400 places laser, guarantee to cover the welding region on the transmission region counterpart substrate 100 on the plate 400.In the present embodiment, cover plate 400 and be positioned on the first pressure chamber 800a, during welding, laser sees through this transmission region and shines the welding region on the substrate 100, and the welding region melted by heat sticks on substrate 100 and barrier film 200 together after solidifying, and accomplishes welding.
The substrate and the barrier film welder of the moving polymeric micro-fluidic chip of the film of present embodiment have saved press mold, have reduced the energy loss of laser in light path, improved welding precision and efficient, and realized firm welding equally, and solder side is smooth, even.
Adopt the welder welding back of above embodiment 1～6 as shown in Figure 7, whole boundary profile is the barrier film solder side, and corresponding with the light tight zone of illiteracy plate is non-welding region B district, and corresponding with illiteracy plate transmission region is welding region A district.Welding region is different and different according to the function of the moving polymeric micro-fluidic chip of film.Following table is the testing fatigue to the moving polymeric micro-fluidic chip of film that adopts above-mentioned welding manner welding; It is thus clear that during welding; Laser power is at 100W (about 80～120W); (60～80mm/s) time, the moving polymeric micro-fluidic chip of the film after the welding is longer service life, and length can reach more than 6000 time at 80mm/s for sweep speed.
Table 1 barrier film laser weld fatigue experiment tables of data
Above embodiment only is used to explain the utility model; And be not the restriction to the utility model; The those of ordinary skill in relevant technologies field under the situation of spirit that does not break away from the utility model and scope, can also be made various variations and modification; Therefore all technical schemes that are equal to also belong to the category of the utility model, and the scope of patent protection of the utility model should be defined by the claims.
Claims (14)
1. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of a film; It is characterized in that; Comprise: generating laser (700), device for exerting and the tight device of barrier film (600); The tight device of said barrier film (600) is used to tighten barrier film to be welded (200) makes said barrier film (200) cover substrate (100) surface; Said device for exerting is used for said barrier film (200) is pressed in said substrate (100) surface, and said generating laser (700) is used for laser is seen through said device for exerting and barrier film (200), shines on the solder side of substrate (100) and barrier film (200).
2. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 1; It is characterized in that; The substrate and the barrier film welder of the moving polymeric micro-fluidic chip of said film also comprise the illiteracy plate (400) that is positioned between said generating laser (700) and said barrier film (200), are used to make generating laser (700) emitted laser through the welding region on the solder side of transmission region irradiated substrate (100) on the illiteracy plate (400) and barrier film (200).
3. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 2 is characterized in that said device for exerting is transparent pressing plate (300).
4. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 3; It is characterized in that the substrate of the moving polymeric micro-fluidic chip of said film and barrier film welder also comprise the transparent elastic cushion (500) that is positioned between said barrier film (200) and the said transparent pressing plate (300).
5. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 2 is characterized in that said device for exerting is: the air pressure device for exerting is used for through forming the air pressure face so that said barrier film (200) is pressed in substrate (100).
6. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 5; It is characterized in that; Said air pressure device for exerting comprises: transparent pressure chamber (800) and transparent press mold (900); Said press mold (900) is used to seal the opening (804) of said pressure chamber (800); Said pressure chamber (800) is provided with the control valve (802) that control charges and discharge gas, and said pressure chamber (800) is positioned at the same side with said barrier film (200), through the air pressure in the pressure chamber (800) said press mold (900) is pressed on the said barrier film (200).
7. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 6 is characterized in that the material characteristic of said press mold (900) is identical with the material characteristic of said barrier film (200).
8. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 5; It is characterized in that; Said air pressure device for exerting comprises: transparent pressure chamber (800) and the seal receptacle (803) that matches with it; Said seal receptacle (803) is used for the opening (804) that barrier film (200) is pressed on said pressure chamber (800) is sentenced sealing said pressure chamber (800); Said pressure chamber (800) is provided with the control valve (802) that control charges and discharge gas, and said pressure chamber (800) is positioned at the same side with said barrier film (200).
9. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 5; It is characterized in that; Said air pressure device for exerting comprises: pressure chamber (800) and the seal receptacle (803) that matches with it; Said seal receptacle (803) is used for the opening (804) that barrier film (200) is pressed on said pressure chamber (800) is sentenced sealing said pressure chamber (800); Said pressure chamber (800) is provided with the control valve (802) that control charges and discharge gas, and said pressure chamber (800) is positioned at the same side with said substrate (200).
10. like the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of each described film in the claim 6～9, it is characterized in that said pressure chamber (800) also comprises the pressure by air pressure sensor (801) that is used in the measurement of gas ballasting (800).
11. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 5; It is characterized in that; Said air pressure device for exerting comprises: transparent first pressure chamber (800a), transparent press mold (900), second pressure chamber (800b) and the seal receptacle (803b) that matches with second pressure chamber (800b); Said first pressure chamber (800a) is positioned at the same side with said barrier film (200); Said press mold (900) is used to seal the opening (804a) of said first pressure chamber (800a), through the air pressure in first pressure chamber (800a) said press mold (900) is pressed on the said barrier film (200); Said second pressure chamber (800b) is positioned at the same side with said substrate (100); Said seal receptacle (803b) is used for the opening (804b) that barrier film (200) is pressed on said second pressure chamber (800b) is sentenced sealing said second pressure chamber (800b), is respectively equipped with on said first pressure chamber (800a) and first pressure chamber (800b) and controls first control valve (802a) and second control valve (802b) that charges and discharge gas.
12. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 11 is characterized in that the material characteristic of said press mold (900) is identical with the material characteristic of said barrier film (200).
13. the substrate and the barrier film welder of the moving polymeric micro-fluidic chip of film as claimed in claim 5; It is characterized in that; Said air pressure device for exerting comprises: transparent first pressure chamber (800a) and second pressure chamber (800b), and said first pressure chamber (800a) is positioned at the same side with said barrier film (200); Said second pressure chamber (800b) is positioned at the same side with said substrate (100); Said barrier film (200) is used to seal the opening (804a) of said first pressure chamber (800a) and the opening (804b) of second pressure chamber (800b), is respectively equipped with first control valve (802a) and second control valve (802b) that control charges and discharge gas on said first pressure chamber (800a) and first pressure chamber (800b).
14. substrate and barrier film welder like the moving polymeric micro-fluidic chip of each described film in the claim 11～13; It is characterized in that; Said first pressure chamber (800a) also comprises the pressure by air pressure sensor (801a) that is used in the measurement of gas ballasting (800a), and said second pressure chamber (800b) also comprises the pressure by air pressure sensor (801b) that is used in the measurement of gas ballasting (800b).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120298694 CN202199934U (en) | 2011-08-16 | 2011-08-16 | Welding device for substrate and diaphragm of diaphragm movement polymer micro-fluidic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120298694 CN202199934U (en) | 2011-08-16 | 2011-08-16 | Welding device for substrate and diaphragm of diaphragm movement polymer micro-fluidic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202199934U true CN202199934U (en) | 2012-04-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120298694 Expired - Lifetime CN202199934U (en) | 2011-08-16 | 2011-08-16 | Welding device for substrate and diaphragm of diaphragm movement polymer micro-fluidic chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202199934U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056525A (en) * | 2012-12-28 | 2013-04-24 | 江苏大学 | Novel method of laser transmission welding connection |
-
2011
- 2011-08-16 CN CN 201120298694 patent/CN202199934U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103056525A (en) * | 2012-12-28 | 2013-04-24 | 江苏大学 | Novel method of laser transmission welding connection |
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Address after: 102206 9 life Garden Road, Changping District, Beijing Patentee after: Beijing Bo Hui innovative biotechnology Limited by Share Ltd Address before: 100195 G, block 25, Lu Jia, 25, Bei Wu Village, Beijing. Patentee before: Beijing Bohui Innovation Technology Co., Ltd. |
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