CN102313842A - Method for detecting resistance reduction and failure phenomena of PCB (printed circuit board) - Google Patents
Method for detecting resistance reduction and failure phenomena of PCB (printed circuit board) Download PDFInfo
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- CN102313842A CN102313842A CN201110077639A CN201110077639A CN102313842A CN 102313842 A CN102313842 A CN 102313842A CN 201110077639 A CN201110077639 A CN 201110077639A CN 201110077639 A CN201110077639 A CN 201110077639A CN 102313842 A CN102313842 A CN 102313842A
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- pcb
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Abstract
The invention relates to a method for detecting resistance reduction and failure phenomena of a PCB (printed circuit board). The method comprises the following steps of: 1) performing resistance tests before and after washing the PCB: firstly, performing an insulation resistance test to the PCB before washing, and then washing the PCB with acetone and drying, and then performing the insulation resistance test on the PCB again; and if the washed test insulation resistance is increased remarkably, determining that the resistance reduction and failure phenomena of the PCB occur; and 2) performing resistance tests before and after applying damp and heat on the PCB: firstly performing the insulation resistance test on the PCB before applying damp and heat, and then putting the PCB in a high-temperature high-humidity box with a temperature of 50 DEG C and a humidity of 90%RH (relative humidity) for processing, and then performing the insulation resistance test on the PCB again; and if the processed resistance is reduced remarkably, determining that the resistance reduction and failure phenomena of the PCB occur. The detection method can be accurately and stably used for judging the resistance reduction and failure phenomena of the PCB because of oxidization of copper on the surface of the resistance.
Description
Technical field
The present invention relates to a kind of detection method; Particularly a kind of detection method of pcb board resistance failure phenomenon; Be used to detect pcb board because of forming the oxide of the copper that electrolytic cell produced between the adjacent through hole; The through hole that should not link to each other, and cause the resistance failure phenomenon that resistance descends or short circuit produces.
Background technology
(Printed circuit board PCB) because the oxide of its surperficial copper links to each other the through hole that should not link to each other, thereby causes resistance to descend or the short circuit failure phenomenon that diminishes that has a resistance to printed circuit board (PCB).For the detection of this failure phenomenon, generally judge through the outward appearance optical check of observing the surperficial corrosion variable color degree of pcb board.Though this method is simple, operation easily, deficient in stability and accuracy.
Summary of the invention
The technical matters that the present invention will solve is: a kind of detection method of pcb board resistance failure phenomenon is provided, and this method can detect the resistance failure phenomenon that pcb board produces exactly.
In order to solve the problems of the technologies described above, the present invention provides a kind of detection method of pcb board resistance failure phenomenon, and this detection method may further comprise the steps:
1), pcb board is carried out resistance test
11), pcb board is cleaned the resistance test of front and back
At first, the pcb board before cleaning is carried out megger test, adopt acetone that pcb board is cleaned and dries then after, once more it is carried out megger test; If the test insulation resistance after finding to clean obviously increases, then pcb board generation resistance failure phenomenon;
12), pcb board is carried out damp and hot front and back resistance test
At first, the pcb board before damp and hot is carried out megger test, then pcb board being put into temperature is that 50 ℃, humidity are after the hot and humid case of 90%RH is handled, once more it to be carried out megger test; If the resistance after finding to handle obviously reduces, then pcb board generation resistance failure phenomenon.
According to the detection method of pcb board resistance failure phenomenon of the present invention, said detection method is used to detect the resistance failure phenomenon of judging that pcb board causes because of the oxidation of surperficial copper.
The detection method of pcb board resistance failure phenomenon of the present invention; Through the resistance test before and after pcb board is cleaned and pcb board is carried out damp and hot front and back resistance test, can accurately, stably judge the resistance failure phenomenon that pcb board causes because of the oxidation of surperficial copper.
Claims (2)
1. the detection method of a pcb board resistance failure phenomenon, it is characterized in that: this detection method may further comprise the steps:
1), pcb board is carried out resistance test
11), pcb board is cleaned the resistance test of front and back
At first, the pcb board before cleaning is carried out megger test, adopt acetone that pcb board is cleaned and dries then after, once more it is carried out megger test; If the test insulation resistance after finding to clean obviously increases, then pcb board generation resistance failure phenomenon;
12), pcb board is carried out damp and hot front and back resistance test
At first, the pcb board before damp and hot is carried out megger test, then pcb board being put into temperature is that 50 ℃, humidity are after the hot and humid case of 90%RH is handled, once more it to be carried out megger test; If the resistance after finding to handle obviously reduces, then pcb board generation resistance failure phenomenon.
2. the detection method of pcb board resistance failure phenomenon according to claim 1 is characterized in that: said detection method is used to detect the resistance failure phenomenon of judging that pcb board causes because of the oxidation of surperficial copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110077639A CN102313842A (en) | 2011-03-29 | 2011-03-29 | Method for detecting resistance reduction and failure phenomena of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110077639A CN102313842A (en) | 2011-03-29 | 2011-03-29 | Method for detecting resistance reduction and failure phenomena of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102313842A true CN102313842A (en) | 2012-01-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110077639A Pending CN102313842A (en) | 2011-03-29 | 2011-03-29 | Method for detecting resistance reduction and failure phenomena of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102313842A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481886B (en) * | 2013-04-26 | 2015-04-21 | Giga Byte Tech Co Ltd | Testing system for eletrical circuit board |
| CN106770484A (en) * | 2016-12-31 | 2017-05-31 | 南昌欧菲光科技有限公司 | The detection method of copper material |
| CN110794286A (en) * | 2019-10-30 | 2020-02-14 | 孙传保 | Circuit testing device convenient for taking and placing integrated circuit board |
Citations (4)
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| CN101038263A (en) * | 2006-03-13 | 2007-09-19 | 华为技术有限公司 | Method and system for estimating circuit board corrosion risk |
| JP2009002893A (en) * | 2007-06-25 | 2009-01-08 | Hioki Ee Corp | Circuit board test method and circuit board test apparatus |
| CN201535784U (en) * | 2009-11-10 | 2010-07-28 | 中芯国际集成电路制造(上海)有限公司 | Aging test substrate |
| CN101983004A (en) * | 2010-09-21 | 2011-03-02 | 深圳创维数字技术股份有限公司 | Graphic structure and method for insulation reliability test of finished PCB |
-
2011
- 2011-03-29 CN CN201110077639A patent/CN102313842A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038263A (en) * | 2006-03-13 | 2007-09-19 | 华为技术有限公司 | Method and system for estimating circuit board corrosion risk |
| JP2009002893A (en) * | 2007-06-25 | 2009-01-08 | Hioki Ee Corp | Circuit board test method and circuit board test apparatus |
| CN201535784U (en) * | 2009-11-10 | 2010-07-28 | 中芯国际集成电路制造(上海)有限公司 | Aging test substrate |
| CN101983004A (en) * | 2010-09-21 | 2011-03-02 | 深圳创维数字技术股份有限公司 | Graphic structure and method for insulation reliability test of finished PCB |
Non-Patent Citations (1)
| Title |
|---|
| 曲文娟: "印刷电路板缝隙腐蚀行为研究", 《材料保护》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481886B (en) * | 2013-04-26 | 2015-04-21 | Giga Byte Tech Co Ltd | Testing system for eletrical circuit board |
| CN106770484A (en) * | 2016-12-31 | 2017-05-31 | 南昌欧菲光科技有限公司 | The detection method of copper material |
| CN110794286A (en) * | 2019-10-30 | 2020-02-14 | 孙传保 | Circuit testing device convenient for taking and placing integrated circuit board |
| CN110794286B (en) * | 2019-10-30 | 2021-09-10 | 北京国基科航第三代半导体检测技术有限公司 | Circuit testing device convenient for taking and placing integrated circuit board |
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Application publication date: 20120111 |