CN102313157A - Light emitting diode lamp module with high radiating efficiency and manufacturing method thereof - Google Patents
Light emitting diode lamp module with high radiating efficiency and manufacturing method thereof Download PDFInfo
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- CN102313157A CN102313157A CN2010102192101A CN201010219210A CN102313157A CN 102313157 A CN102313157 A CN 102313157A CN 2010102192101 A CN2010102192101 A CN 2010102192101A CN 201010219210 A CN201010219210 A CN 201010219210A CN 102313157 A CN102313157 A CN 102313157A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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Abstract
The invention discloses a light emitting diode lamp module with high radiating efficiency and a manufacturing method thereof. The lamp module comprises a flat plate type heat pipe, an insulating layer, a conductive layer, a plurality of light emitting diode crystal grains and a transparent colloid, wherein the flat plate type heat pipe is provided with a flat plane; the insulating layer is formed on the plane of the flat plate type heat pipe and can be divided into a pair of insulating electrode regions and a plurality of crystal grain setting regions which are arranged among the insulating electrode regions; the conductive layer comprises a pair of conductive electrode region parts which cover the pair of insulating electrode regions; the light emitting diode crystal grains are fixed at the crystal grain setting regions respectively and are electrically connected to the pair of conductive electrode regions through wires; and the transparent colloid covers the light emitting diode crystal grains and comprises fluorescent powder. Through the lamp module, the problem of radiation of the high-power lamp module with a plurality of light emitting diode crystal grains is solved, and a heat transfer path is shortened to promote radiating efficiency.
Description
Technical field
The invention relates to a kind of light-emitting diode lamp module and manufacturing approach thereof of high cooling efficiency, be meant especially a kind ofly directly to be incorporated on the flat plate heat tube and to have the lamp module of many LED crystal particles that the present invention also provides its manufacturing approach.
Background technology
Light emitting diode (Light Emitting Diode; LED) have that volume is little, shock-resistant, life-span length, low power consumption, chemiluminescence and do not have mercury pollution or the like advantage, become the research and development emphasis in the nearest lighting field.The developing direction of light emitting diode develops towards high power from small-power, and is more polynary on application surface, by the indicator lamp progress of earliest led lighting product till now.
Along with the extensive use of High Power LED, the demand of heat radiation also improves gradually.If the not in good time discharge of these waste heats is with producing a lot of problems.For example, luminous efficiency reduces, shorten service life, photochromic quality changes ... etc.So at the thermal conductance design aspect, need effective radiator structure that waste heat is derived module, avoid the generation of above these problems.
The radiating mode of present led lamp, major part are to use radiating fin to improve the area of dissipation mode, and its shortcoming is that radiating efficiency is relatively poor, and the volume of radiating module is also bigger.The heat radiation of utilization again that has is heat pipe heat radiation more rapidly, to improve its radiating efficiency.
Yet above-mentioned radiating mode all has common shortcoming, is exactly that the heat that produces of light-emitting diode component all need pass through printed circuit board (PCB) and passes.Printed circuit board (PCB) is the material of low heat conductivity, thereby the heat that light emitting diode produces can't be passed to the external world efficiently and effectively.In order to improve the bigger problem of printed circuit board (PCB) thermal resistance value, prior art develops printed circuit board (PCB) (the Metal Core PCB that metal substrate in addition; MCPCB).Yet the heat that light-emitting diode component produces still need pass through layers of material, and the thermal grease (or heat radiation paster) of the printed circuit board (PCB) of metal substrate, just can reach radiating fin or heat pipe at last.
Moreover, for fixing led lamp in heat pipe and radiating fin, the complicated fastener of the common utilization structure of prior art.Fastener has not only increased cost, also takes up space.In addition, assembling fastener also expends suitable manpower.
So prior art, the combination that at first is how to improve light-emitting diode component and heat pipe is to increase heat conducting efficient; In addition, also to solve light-emitting diode component and how be incorporated into heat pipe or radiating fin compactly.
Therefore, the improving of inventor's thoughts the problems referred to above concentrated on studies and cooperates the utilization of scientific principle, and proposes a kind of reasonable in design and effectively improve the present invention of the problems referred to above.
Summary of the invention
Technical problem to be solved by this invention; Be to provide a kind of light-emitting diode lamp module and manufacturing approach thereof of high cooling efficiency; Particularly to solve the heat dissipation problem of high power light fixture with many LED crystal particles; And be incorporated into flat plate heat tube compactly, shorten the thermal conductance approach to promote heat dissipation.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of light-emitting diode lamp module of high cooling efficiency is provided, it includes a flat plate heat tube and has a smooth plane; One insulating barrier is formed on this plane of this flat plate heat tube, and this insulating barrier is divided into a pair of insulated electro polar region, reached a plurality of crystal grain setting area between this is to the insulated electro polar region; One conductive layer includes the pair of conductive electrode district and partly is covered in this on the insulated electro polar region; A plurality of LED crystal particles are fixed in those crystal grain setting areas separately, and are electrically connected on this to the conductive electrode district through lead; And one transparent colloid be covered on those LED crystal particles, this transparent colloid contains fluorescent material.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of manufacturing approach of light-emitting diode lamp module of high cooling efficiency is provided, comprise the following steps at least.At first, a flat plate heat tube is provided, and on this flat plate heat tube, forms a smooth plane; Then, form an insulating barrier on this plane of this flat plate heat tube, wherein this insulating barrier is divided into a pair of insulated electro polar region, is reached a plurality of crystal grain setting area between this is to the insulated electro polar region; Then, form a conductive layer on this insulating barrier, this conductive layer district comprises that the pair of conductive electrode district partly is covered in this on the insulated electro polar region; After, a plurality of LED crystal particles are fixed on those crystal grain setting areas accordingly, and through lead be electrically connected those LED crystal particles in this to the conductive electrode district; At last, provide transparent colloid to be covered on those LED crystal particles, wherein this transparent colloid contains fluorescent material.
According to wherein a kind of embodiment of the present invention, comprise that further an isolation annular is formed in the periphery of those LED crystal particles.
According to another embodiment of the invention; Wherein this flat plate heat tube forms a depressed part and a plurality of barricade around this depressed part; This depressed part has a planar bottom surface, and wherein those crystal grain setting areas and those a plurality of LED crystal particles place on this planar bottom surface.
The present invention has following beneficial effect:
One, the present invention does not need circuit board or metal substrate, shortens heat conducting path between this LED crystal particle and this flat plate heat tube by this, to increase radiating efficiency.
Two, the present invention optionally is provided with the periphery of this shading ring in those LED crystal particles.When utilizing the colloid framework for this shading ring, have height-adjustable property, can conveniently adjust its shape
Three, the present invention's this flat plate heat tube capable of using directly forms this depressed part, and does not need shading ring.The overall dimensions of this light-emitting diode lamp module is thinner.This skewed barricade helps reflecting the light of those LED crystal particles in addition.
Reach technology, method and the effect that set purpose is taked in order further to understand the present invention; See also following relevant detailed description of the present invention, accompanying drawing; Believe the object of the invention, characteristic and characteristics; When can being able to thus deeply and concrete understanding, yet appendedly graphicly with annex reference and explanation usefulness only being provided, is not to be used for to the present invention's limitr in addition.
Description of drawings
Figure 1A to Fig. 1 E is the manufacturing process sketch map of the light-emitting diode lamp module of high cooling efficiency of the present invention.
Fig. 2 A to Fig. 2 E is the schematic flow sheet of another embodiment of light-emitting diode lamp module of high cooling efficiency of the present invention.
Fig. 3 is the cutaway view of the present invention according to Fig. 1 E.
Fig. 4 is the cutaway view of the present invention according to another embodiment of Fig. 1 E.
Fig. 5 does not have the cutaway view of first embodiment of shading ring for light-emitting diode lamp module of the present invention.
Fig. 6 does not have the cutaway view of second embodiment of shading ring for light-emitting diode lamp module of the present invention.
Fig. 7 does not have the cutaway view of the 3rd embodiment of shading ring for light-emitting diode lamp module of the present invention.
Fig. 8 does not have the cutaway view of the 4th embodiment of shading ring for light-emitting diode lamp module of the present invention.
Symbol description
Flat plate heat tube 100 planes 101
Raised platform 106 insulating barriers 20
Insulated electro polar region 21a, 21b crystal grain setting area 22
The specific embodiment
See also Figure 1A to Fig. 1 E, be the manufacturing process sketch map of the light-emitting diode lamp module of high cooling efficiency of the present invention.In Figure 1A, the present invention provides a flat plate heat tube (Flat heat pipe, FHP) 100, and form a smooth plane 101 on this flat plate heat tube 100 earlier.This flat plate heat tube 100 is a microscler plate body, is preferably the design of multithread road, and its use is to increase the internal liquid capacity, increases capillary force and makes the shunting of internal flow liquid gas, the frictional force between minimizing liquid gas phase is mutual.
Then, comprise that an insulating barrier 20 is formed on this plane 101 of this flat plate heat tube 100.Wherein this insulating barrier district 20 is divided into a pair of insulated electro polar region 21a, 21b, reaches a plurality of crystal grain setting area 22 between this is to insulated electro polar region 21a, 21b.The purposes of this insulating barrier 20 is to form earlier the bottom of one deck and 100 isolation of this flat plate heat tube.This crystal grain setting area 22 be for crystal grain (shown in assembly 40 among Fig. 1 C) can insulate and good heat conductive place on this flat plate heat tube 100.
The material of this insulating barrier 20; Particularly to this insulated electro polar region 21a, 21b; Can be macromolecular material, or use the low thermal resistance heat-conducting insulation material, for example can adopt the epoxy resin of uv-hardening resin (UV glue), high heat conduction; Or epoxy resin adds glass fibre (Epoxy+Glass Fabric), perhaps the epoxy glass cloth bonding sheet of high heat conduction.Another kind of mode particularly to those crystal grain setting areas 22, can be to use the heat conduction elargol, and the mode through screen painting is formed on this flat plate heat tube 100, and prebake conditions is about 30 minutes then, and temperature is 90 to 100 degree Celsius.
Please refer to Figure 1B, this figure shows that a conductive layer 30 is formed on this insulating barrier 20, and in particular, this conductive layer 30 comprises that pair of conductive electrode district 31a, 31b are covered in partly that this is last to insulated electro polar region 21a, 21b.This to conductive electrode district 31a, 31b as electrode to connect power supply.The material of this conductive layer 30 can be an electrocondution slurry, for example copper glue, elargol, silver-colored aluminium paste, aluminium paste or noble metal slurry, and its advantage is can serigraphy.This conductive electrode district 31a, 31b can be Copper Foils in addition, form printed circuit through etching, the big electric current of can loading.
The present invention further can be coated with a welding resisting layer according to demand partly, for example forms this welding resisting layer through coating anti-solder ink (Solder Mask).This welding resisting layer can cover this conductive layer 30 partly, and its function is to protect local circuit and electrode; This welding resisting layer also can directly overlay on this flat plate heat tube, avoids oxidation with the aqueous vapor in the secluding air.After being coated with anti-solder ink, can do surperficial anti-oxidant treatment, to strengthen the top layer oxidation resistance further according to demand.The coating method of this welding resisting layer can be to utilize screen painting and form.
Please refer to Fig. 1 C, show the flow process that cloth of the present invention is brilliant.Show among Fig. 1 C that a plurality of LED crystal particles (LED chips) 40 are fixed in those crystal grain setting areas 22.In addition, comprise among this figure providing a shading ring 50, in order to limit and fixedly to be covered in the transparent colloid (shown in Fig. 1 E assembly 60) of those LED crystal particles 40 in the periphery of those LED crystal particles 40.The embodiment of a kind of concrete saving step of the present invention is being put Copper Foil (print copper cream), LED crystal particle, shading ring, is being reached connector (being placed in the conductive electrode district).Baking is fixing together then, and about one to two hour, temperature was about 150 degree Celsius.
Above-mentioned shading ring 50 can be optionally to be formed on this flat plate heat tube 100, and it can be substituted by these flat plate heat tube 100 structures own, asks Rong Houshu.
Please refer to Fig. 1 D, it shows the flow process of routing of the present invention (wiring).Behind fixing those LED crystal particles 40, then be through lead be electrically connected those LED crystal particles 40 in this to conductive electrode district 31a, 31b.Present embodiment is explained with the routing mode.That is providing each this LED crystal particle 40 respectively to have couple of conductor 41, those adjoining LED crystal particles 40 are with the connection of contacting each other of this lead 41.Those LED crystal particles 40 of outermost are electrically connected on this to conductive electrode district 31a, 31b with this lead 41.The above-mentioned step that this shading ring 50 is provided can be after routing of the present invention is accomplished.Those leads 41 can be gold thread, copper cash or aluminum steel.
Please refer to Fig. 1 E, be the completion vertical view of the light-emitting diode lamp module of high cooling efficiency of the present invention.Cover a transparent colloid 60 at last on those LED crystal particles 40, wherein this transparent colloid 60 contains fluorescent material (phosphor powder) as light color mixed light material.So both accomplished the light-emitting diode lamp module of high cooling efficiency of the present invention.The visual light fixture of these transparent colloid 60 its its fluorescent material compositions needs adjustment.The example of a kind of practical implementation of the present invention, transparent colloid 60 bakings are about one hour after coating, and temperature is 170 degree Celsius.These transparent colloid 60 shapes that contain fluorescent material can be little the dashing forward so that optically focused effect or tool flat surfaces to be provided that make progress.
See also Fig. 2 A to Fig. 2 E, be the schematic flow sheet of another embodiment of light-emitting diode lamp module of high cooling efficiency of the present invention.The difference of Fig. 2 A and Figure 1A is, wherein in the step that forms this insulating barrier 20, further comprises forming a plurality of insulation bar areas 24, and those insulation bar areas 24 are parallel on this flat plate heat tube 100 and between those crystal grain setting areas 22.
The difference of Fig. 2 B and Figure 1B is, in the step that forms this conductive layer 30, comprises that further forming a plurality of conduction bar areas 33 is covered in those insulation bar areas 24.
Fig. 2 C and Fig. 1 C are similar, that is fixing those LED crystal particles 40 are in those crystal grain setting areas 22.In addition, provide this shading ring 50, in order to limit and fixedly to be covered in the transparent adhesive tape (shown in Fig. 2 E assembly 60) of those LED crystal particles 40 in the periphery of those LED crystal particles 40.
The difference of Fig. 2 D and Fig. 1 D is that those adjoining LED crystal particles 40 wherein this lead 43 are not the connections of contacting each other, but are connected in this conduction bar area 33.Those LED crystal particles 40 of outermost are electrically connected on this to conductive electrode district 31a, 31b with another this lead 43.The advantage of present embodiment is that this lead 43 has short length.Because routing is normally implemented with the gold thread of costliness, these short lead 43 escapable costs are with less precious metal resource.
Fig. 2 E and Fig. 1 E are similar, cover this transparent colloid 60 at last on those LED crystal particles 40.
Please refer to Fig. 3, be the cutaway view of the present invention according to Fig. 1 E.This shading ring 50 is a metal framework in the present embodiment.The excellent body of metal framework is reflective good.This metal framework 50 is an example with the square among this figure, yet is not limited thereto.The madial wall that for example can have concave shape is to promote the effect of optically focused.
Please refer to Fig. 4, be the cutaway view of the present invention according to another embodiment of Fig. 1 E.This shading ring 50a is for using nontransparent thermmohardening plastic matter framework in the present embodiment, and its advantage is to have height-adjustable property, can conveniently adjust its shape, for example circular, square or polygon.Use the colloid framework of light color can be beneficial to the enhancement reflection function equally, for example can dose the pigment of tool silver color.Even can further behind this shading ring 50a that accomplishes colloid, be coated with the last layer reflector layer.
Please refer to Fig. 5, do not have the cutaway view of the embodiment of shading ring for light-emitting diode lamp module of the present invention.This embodiment can optionally not be provided with the practice of this shading ring in order to explain the present invention.Its practice is to form a depressed part 102 on this flat plate heat tube 100, and this depressed part 102 has a planar bottom surface.This depressed part 102 is centered on by a plurality of barricades 103.Wherein those crystal grain setting areas (not label), and those a plurality of LED crystal particles 40 place in this depressed part 102 on these planar bottom surface, wherein this transparent colloid 60 is limited and be fixed in this depressed part 102, does not need shading ring.Wherein this to insulated electro polar region (not label), and this conductive electrode district 31a, 31b are formed at outside and contiguous this depressed part 102 of this depressed part 102.This depressed part 102 can be to accomplish to bore modes such as mill, grinding or cutter removal.Among this embodiment, those LED crystal particles 40 are more near the flow channel for liquids of this flat plate heat tube 100, the better heat-conducting effect of tool.In addition, the more aforesaid embodiment of the height of this light-emitting diode lamp module is low, and overall dimensions is thinner.
Please refer to Fig. 6, do not have the cutaway view of second embodiment of shading ring for light-emitting diode lamp module of the present invention.This embodiment and Fig. 5 difference be in, wherein this depressed part 102 is centered on by skewed barricade 105, this is the light that skewed barricade 105 helps reflecting those LED crystal particles 40.
Please refer to Fig. 7, do not have the cutaway view of the 3rd embodiment of shading ring for light-emitting diode lamp module of the present invention.This embodiment and Fig. 6 difference be in, wherein contain like the practice among Fig. 2 A to Fig. 2 E, those conduction bar areas 33 further are set and are positioned at the insulation bar area (not shown) of those conductions under bar areas 33.In addition, present embodiment extends to this on this skewed barricade 105 to conductive electrode district 31a ', 31b '.The advantage of this embodiment not only is not provided with shading ring, and utilizes this short lead 43,45 to electrically connect those LED crystal particles 40 to those conduction bar areas 33 and this is to conductive electrode district 31a ', 31b '.
Please refer to Fig. 8, do not have the cutaway view of the 4th embodiment of shading ring for light-emitting diode lamp module of the present invention.This embodiment and Fig. 6 difference be in, utilize a raised platform 106 to substitute depressed parts, supply those LED crystal particles 40 to place on this raised platform 106.This then places this raised platform 106 outsides to conductive electrode district 31a, 31b.This transparent colloid 60 covers this raised platform 106 and the part covers this to conductive electrode district 31a, 31b.
Therefore, see through the light-emitting diode lamp module and the manufacturing approach thereof of high cooling efficiency of the present invention, have characteristics described as follows and function:
One, the present invention is through directly putting those LED crystal particles 40 on this good flat plate heat tube 100 of heat radiation; Do not need circuit board or metal substrate; Shorten heat conducting path between this LED crystal particle 40 and this flat plate heat tube 100 by this, to increase radiating efficiency.
Two, the present invention optionally is provided with this shading ring 50 in the periphery of those LED crystal particles 40.When utilizing the colloid framework for this shading ring 50a, have height-adjustable property, can conveniently adjust its shape.
Three, the present invention's this flat plate heat tube 100 capable of using directly forms this depressed part 102, and does not need shading ring.The overall dimensions of this light-emitting diode lamp module is thinner.This skewed barricade 105 helps reflecting the light of those LED crystal particles 40 in addition.
The above is merely preferable possible embodiments of the present invention, and is non-so promptly limit to protection scope of the present invention, so the equivalence techniques that uses specification of the present invention and accompanying drawing content to do such as changes, all in like manner all is contained in protection scope of the present invention, closes and gives Chen Ming.
Claims (11)
1. the light-emitting diode lamp module of a high cooling efficiency is characterized in that, comprising:
One flat plate heat tube, it has a smooth plane;
One insulating barrier is formed on this plane of this flat plate heat tube, this insulating barrier divide into a pair of insulated electro polar region, and a plurality of words in this to the crystal grain setting area between the insulated electro polar region;
One conductive layer includes the pair of conductive electrode district and partly is covered in this on the insulated electro polar region;
A plurality of LED crystal particles are fixed in those crystal grain setting areas separately, and are electrically connected on this to the conductive electrode district through lead; And
One transparent colloid is covered on those LED crystal particles, and this transparent colloid contains fluorescent material.
2. the light-emitting diode lamp module of high cooling efficiency according to claim 1; It is characterized in that; This insulating barrier comprises that further a plurality of insulation bar areas are parallel on this flat plate heat tube and between those crystal grain setting areas; This conductive layer comprises that further a plurality of conduction bar areas are covered in those insulation bar areas; Wherein those LED crystal particles respectively are connected with couple of conductor, and wherein this lead is connected in those conduction bar areas, and each is connected in those conductive electrode districts with this lead wherein outermost those LED crystal particles.
3. the light-emitting diode lamp module of high cooling efficiency according to claim 1 is characterized in that, comprises that further an isolation annular is formed in the periphery of those LED crystal particles, and wherein this shading ring is a metal framework or a colloid framework.
4. the light-emitting diode lamp module of high cooling efficiency according to claim 1; It is characterized in that; This flat plate heat tube forms a depressed part and a plurality of barricade around this depressed part, and this depressed part has a planar bottom surface, wherein those crystal grain setting areas, and those a plurality of LED crystal particles place on this planar bottom surface of this depressed part; Wherein this transparent colloid is fixed in this depressed part, wherein this to the insulated electro polar region, and this conductive electrode district is formed at the outside of this depressed part.
5. the light-emitting diode lamp module of high cooling efficiency according to claim 4 is characterized in that, it is skewed to reflect the light of those LED crystal particles that this barricade is.
6. the manufacturing approach of the light-emitting diode lamp module of a high cooling efficiency is characterized in that, comprises the following steps:
One flat plate heat tube is provided, and forms a smooth plane on this flat plate heat tube;
Form an insulating barrier on this plane of this flat plate heat tube, wherein this insulating barrier is divided into a pair of insulated electro polar region, is reached a plurality of crystal grain setting area between this is to the insulated electro polar region;
Form a conductive layer on this insulating barrier, this conductive layer district comprises that the pair of conductive electrode district partly is covered in this on the insulated electro polar region;
Fixing a plurality of LED crystal particles are in those crystal grain setting areas, and through lead be electrically connected those LED crystal particles in this to the conductive electrode district; And
Cover a transparent colloid on those LED crystal particles, wherein this transparent colloid contains fluorescent material.
7. the manufacturing approach of the light-emitting diode lamp module of high cooling efficiency according to claim 6 is characterized in that, further comprises forming a welding resisting layer to cover this conductive layer partly.
8. the manufacturing approach of the light-emitting diode lamp module of high cooling efficiency according to claim 6; It is characterized in that; In the step that forms this insulating barrier; Comprise further forming a plurality of insulation bar areas that those insulation bar areas are parallel on this flat plate heat tube and between those crystal grain setting areas; And in the step that forms this conductive layer, comprise that further forming a plurality of conduction bar areas is covered in those insulation bar areas.
9. the manufacturing approach of the light-emitting diode lamp module of high cooling efficiency according to claim 6; It is characterized in that; Comprise further the periphery of a shading ring in those LED crystal particles is provided that wherein this shading ring is to use nontransparent thermmohardening plastic matter framework.
10. the manufacturing approach of the light-emitting diode lamp module of high cooling efficiency according to claim 6; It is characterized in that; Further comprise forming a depressed part on this flat plate heat tube, this depressed part has a planar bottom surface, and wherein those crystal grain setting areas and those a plurality of crystal grain place on this planar bottom surface; Wherein this transparent colloid is fixed in this depressed part, wherein this to the insulated electro polar region, and this conductive electrode district is formed at the outside of this depressed part.
11. the manufacturing approach of the light-emitting diode lamp module of high cooling efficiency according to claim 10 is characterized in that, this depressed part is centered on by a plurality of barricades, and it is skewed to reflect the light of those LED crystal particles that this barricade is.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102192101A CN102313157A (en) | 2010-06-30 | 2010-06-30 | Light emitting diode lamp module with high radiating efficiency and manufacturing method thereof |
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| CN2010102192101A CN102313157A (en) | 2010-06-30 | 2010-06-30 | Light emitting diode lamp module with high radiating efficiency and manufacturing method thereof |
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| CN1436374A (en) * | 2001-04-12 | 2003-08-13 | 松下电工株式会社 | Light source device using LED, and method of producing same |
| CN2598151Y (en) * | 2003-01-09 | 2004-01-07 | 一诠精密工业股份有限公司 | Structure of high power LED |
| CN1617362A (en) * | 2003-02-28 | 2005-05-18 | 株式会社西铁城电子 | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element |
| CN201443693U (en) * | 2008-11-25 | 2010-04-28 | 董丽霞 | LED light source module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1436374A (en) * | 2001-04-12 | 2003-08-13 | 松下电工株式会社 | Light source device using LED, and method of producing same |
| CN2598151Y (en) * | 2003-01-09 | 2004-01-07 | 一诠精密工业股份有限公司 | Structure of high power LED |
| CN1617362A (en) * | 2003-02-28 | 2005-05-18 | 株式会社西铁城电子 | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element |
| CN201443693U (en) * | 2008-11-25 | 2010-04-28 | 董丽霞 | LED light source module |
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Application publication date: 20120111 |