CN102306708B - Object linking and embedding denial of service (OLEDoS) micro display device - Google Patents
Object linking and embedding denial of service (OLEDoS) micro display device Download PDFInfo
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- CN102306708B CN102306708B CN 201110259764 CN201110259764A CN102306708B CN 102306708 B CN102306708 B CN 102306708B CN 201110259764 CN201110259764 CN 201110259764 CN 201110259764 A CN201110259764 A CN 201110259764A CN 102306708 B CN102306708 B CN 102306708B
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Abstract
The invention relates to an object linking and embedding denial of service (OLEDoS) micro display device, in particular to a glass plate used by the display device. In the device, the glass plate used in the OLEDoS micro display device comprises the following components in percentage by weight: 58 to 64 percent of SiO2, 8 to 15 percent of B2O3, 12 to 16 percent of Al2O3, 5 to 9 percent of MgO, 6 to 8 percent of CaO, 2 to 4 percent of BaO, 1 to 4 percent of Y2O3, 0 to 2 percent of SnO2, 0 to 0.5 percent of CeO2, 0 to 1 percent of C1 and 0.005 to 0.1 percent of R2O. The glass plate used for the OLEDoS micro play device is aluminoborosilicate glass which has high strain points, low expansion coefficient and high elastic modulus and does not have alkali basically, and can make the OLEDoS micro display device have extremely high thermal stability and high reliability when applied to the OLEDoS micro display device.
Description
Technical field
The present invention relates to a kind of OLEDoS micro-display device, relate in particular to this display device glass plate used.
Background technology
In advanced information society, the little Display Technique role of OLEDoS is more and more important, and than the liquid crystal flat-panel Display Technique, the little Display Technique of OLEDoS is the active illuminating device, has the advantages such as brightness is high, fast response time, and is lightweight, low in energy consumption.Therefore, be widely used at aspects such as military helmet, medical treatment and consumer electronics.
The OLEDoS micro-display device is comprised of silicon-based substrate and glass plate.These glass plates must satisfy high standard: (1) has higher glass strain temperature, glass substrate is changed into have high thermostability; (2) with silicon crystal, more approaching thermal coefficient of expansion is arranged, the possibility of closing silicon to be open at energy edge on glass; (3) chemical resistance can be carried out manufacture craft under harsh etching condition; (4) not having alkali ion movement goes out glass surface and destroys the assemblies such as transistor; (5) higher ratio modulus of elasticity.
Summary of the invention
The glass plate that the present invention is directed to the OLEDoS micro-display device must satisfy above-mentioned high-level demand, and a kind of OLEDoS micro-display device is provided.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of OLEDoS micro-display device is by the anode of the driving chip for preparing based on CMOS technique as device; At chip surface growth luminous organic material, the capping top device, have the glass plate of ITO layer as the negative electrode of device, each weight percentages of components of this device glass plate consists of: 58%～64% SiO
2, 8%～15% B
2O
3, 12%～16% Al
2O
3, 5%～9% MgO, 6%～8% CaO, 2%～4% BaO, 1%～4% Y
2O
3, 0%～2% SnO
2, 0～0.5% CeO
2, 0～1% Cl, 0.005%～0.1% R
2O, wherein, R=Li, Na or K, described SnO
2, CeO
2With the percentage by weight of Cl be not 0 simultaneously.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described SiO
2Weight percent content be 59%～60%.
Further, described B
2O
3Weight percent content be 9%～11%.
Further, described Al
2O
3Weight percent content be 14%～15%.
Further, the weight percent content of described MgO is 5%～7%.
Further, the weight percent content of described CaO is 6%～7%.
Further, described Y
2O
3Weight percent content be 2%～3%.
Further, described R
2The weight percent content of O is 0.01%～0.6%.
The invention has the beneficial effects as follows: the glass plate that the present invention is used for the OLEDoS micro-display device is the aluminium borosilicate glass with high elastic modulus of high strain-point, low-expansion coefficient, high elastic modulus, basic alkali-free, is applied in to make OLEDoS micro-display device spare have extraordinary thermal stability and high reliability on OLEDoS micro-display device spare.
Embodiment
Below principle of the present invention and feature are described, example only be used for to be explained the present invention, is not be used to limiting scope of the present invention.
The present invention is used for the density of glass plate of OLEDoS micro-display device less than 2.38g/cm
3, the average coefficient of linear expansion of 20～300 ℃ of scopes is greater than 31 * 10
-7/ ℃, less than 39 * 10
-7/ ℃, preferably less than 38 * 10
-7/ ℃; Strain point preferably is not less than 660 ℃ greater than 650 ℃; Modulus of elasticity is greater than 7.3kg/mm
2, be preferably greater than 7.4kg/mm
2, more preferably greater than 7.5kg/mm
2, this glass applications can improve the brightness of device in the OLEDoS micro-display device, improves thermal stability and the reliability of device, improves the anti-Vacuum Pressure intensity of force of device.
In the present invention, SiO
2Weight percent be 58～64%.SiO
2Be main glass network forming agent, can reduce thermal coefficient of expansion and the density of glass, improve strain point of glass, but increase the glass fusing point.SiO
2Content is difficult for obtaining the glass of low bulk, low-density and high strain-point during lower than 58wt%, can reduce the chemical stabilities such as acid resistance of glass; SiO
2Content is when 64wt% is above, and the high temperature viscosity of glass increases, and causes the glass smelting excess Temperature, and the glass smelting difficulty preferably controls 58～62%, more preferably is controlled at 59～60%.
B
2O
3Being glass network former, is again a kind of flux, and it can reduce glass viscosity and improve stability, glass, in the present invention, and B
2O
3Weight percent be 8～15%, B
2O
3Content can't play fluxing action lower than 8wt%, is unfavorable for reducing glass density, and the ability of the anti-buffered hydrofluoric acid solution of glass is relatively poor simultaneously, B
2O
3When content surpassed 15wt%, strain point of glass reduced too large, and reduced the acid-resisting of glass, and the phase-splitting tendency of glass is increased, and reduced stability, glass, preferably was controlled at 8～12%, more preferably was controlled at 9～11%.
Al
2O
3Can significantly improve strain point and the modulus of elasticity of glass, increase the chemical stability of glass, can also increase stability, glass, reduce the thermal coefficient of expansion of glass, Al
2O
3Another advantage be to improve the modulus of elasticity of glass.Al
2O
3Content is difficult for obtaining the alkali-free glass of high strain-point lower than 12wt%, and chemical durability of glass is not enough, is unfavorable for improving the modulus of elasticity of glass; Al
2O
3Content can significantly increase the high temperature viscosity of glass greater than 16wt%, and glass melting temperature is raise, and preferably is controlled at 13～16%, more preferably is controlled at 14～15%.
MgO has the effect that reduces the glass high temperature viscosity, increases low temperature viscosity, also can obviously improve the modulus of elasticity of glass.In the present invention, its content is limited to 5～9wt%, and MgO content can reduce stability, glass higher than 9wt%, increases liquidus temperature, and glass devitrification resistance ability is descended.For improving the modulus of elasticity of glass, preferably be controlled at 5～8%, more preferably be controlled at 5～7%.
CaO has the effect that reduces the glass high temperature viscosity, increases low temperature viscosity equally, plays the flux effect, and can increase the glass acid resistance.In the present invention, CaO content is limited between 6～8wt%, and CaO content can make the glass swelling coefficient increase excessive greater than 8wt%, and the anti-impact hydrofluoric acid solution ability of glass descends, and reduces stability, glass, and the glass devitrification tendency is increased; CaO content is less than 6wt%, and is unfavorable to reducing the glass smelting temperature and improving the glass acid-resisting, preferably is controlled at 6～7%.
BaO has the effect that increases chemical durability of glass and improve the glass devitrification resistance, the present invention finds by add barium monoxide when there is no strontium oxide strontia, on the one hand, can reach very low density, on the other hand, can reach high ratio modulus of elasticity, also satisfy the special needs for viscograph and high transition temperature.
Y
2O
3The modulus of elasticity of glass can be improved significantly, and the fusion temperature of glass can be reduced, in the present invention, Y
2O
3Content be 1～4wt%.Y
2O
3Content when surpassing 4wt%, unfavorable to devitrification of glass stability, and too increase the glass cost, preferably be controlled at 2～4%, more preferably be controlled at 2～3%.
Alkali metal oxide R
2O (R=Li, Na or K) can reduce the fusion temperature of glass significantly, can also suppress the phase-splitting of glass, thereby improve the crystallization stability of glass, but in the liquid crystal panel manufacture process, due to the performance of alkali metal oxide infringement semiconductor film, its content is restricted.In the present invention, alkali metal oxide R
2The content of O is no more than 0.08wt%, better is no more than 0.06wt%; Due to the alkali metal oxide R in glass
2O is unavoidable, preferably is controlled at 0.01～0.6%.
Also contain at least a fining agent that is selected from following component in glass of the present invention: 0～2% SnO
2, 0～0.5% CeO
2, 0～1% Cl.The content of fining agent is mainly in order to improve the melting quality of glass, reduces the bubble in glass, but too much fining agent can cause stability, glass to descend, and also can cause adverse influence to other character of glass.Cl in glass can be by the chloride corresponding with oxide in glass ingredient, CaCl
2, MgCl
2, BaCl
2Deng.
Embodiment 1
The float glass technology moulding of glass applications routine.Concrete operations are: the glass batch of this OLEDoS micro-display device glass substrate contains quartz sand, aluminium oxide, boric acid, calcium carbonate, brium carbonate and mixed rare-earth oxide, and the weight percentage of its basic glass oxide is: 60% SiO
2, 9% B
2O
3, 12% Al
2O
3, 7% MgO, 6% CaO, 3% BaO, 1.5% Y
2O
3, 1% SnO
2, 0.05% R
2O (R=Li, Na or K), 0.45% CeO
2Controlling glass metal stream fusing time is about 6～8 hours, and in this melting tank, fusion temperature is 1550 ℃, and the clarification homogenization temperature is 1590 ℃, and forming temperature is 1240 ℃, and liquidus temperature is 1130 ℃, and annealing temperature is 710 ℃.Use vacuum pump that the pressure of glass metal upper space is controlled at below 200 torrs, glass metal can access sufficient clarification homogenizing, then enters work pool.Utilize the performance index of OLEDoS micro-display device base plate glass of said method machine-shaping as follows: (1) strain temperature: 680 ℃; (2) mean coefficient of linear thermal expansion (20～300 ℃ of α): 38 * 10
-7/ ℃; (3) density: 2.375g/cm
3(4) modulus of elasticity is 7.4kg/mm
2, the application of this glass makes OLEDoS micro-display device spare have higher brightness and extraordinary thermal stability and high reliability.
Embodiment 2
The preparation method of glass is with embodiment one, and its difference is in the basic oxide component content of OLEDoS micro-display device glass different, and the weight percentage of its basic glass oxide is: 58% SiO
2, 10% B
2O
3, 13% Al
2O
3, 6% MgO, 7% CaO, 2.5% BaO, 2% Y
2O
3, 1% SnO
2, 0.1% R
2O (R=Li, Na or K), 0.4% CeO
2The performance index of the OLEDoS micro-display device base plate glass for preparing are as follows: (1) strain temperature: 670 ℃; (2) mean coefficient of linear thermal expansion (20～300 ℃ of α): 37 * 10
-7/ ℃; (3) density: 2.377g/cm
3(4) modulus of elasticity is 7.5kg/mm
2, this glass is particularly suitable for making flat panel display glass substrate.
Wherein, the density p of glass adopts Archimedes's method to measure; The thermal coefficient of expansion of 20～300 ℃ adopts dilatometer to measure, and represents with average coefficient of expansion; The strain point of glass adopts the camber beam method of ASTMC598 defined to measure; Measure modulus of elasticity by resonance method.
By embodiment 1 and 2 every physicochemical property requirements, can satisfy the requirement of OLEDoS micro-display device display screen substrate technology for making glass fully, compare with existing base plate glass, technique is simple, glass metal is easy to fusing, clarification, homogenizing, glass density is lower, and modulus of elasticity is higher, is to be fit to the OLEDoS micro-display device base plate glass that extensive floating process is produced.
The above is only preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, is equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. OLEDoS micro-display device is by based on the driving chip of the CMOS technique preparation anode as device; At chip surface growth luminous organic material, the capping top device, has the glass plate of ITO layer as the negative electrode of device, it is characterized in that, each weight percentages of components of described glass plate consists of: 58%～64% SiO2,8%～15% B2O3,12%～16% Al2O3,6%～7% MgO, 6%～8% CaO, 2%～4% BaO, 1%～4% Y2O3,0%～2% SnO2,0～0.5% CeO2,0～1% Cl, 0.005%～0.1% R2O, wherein, R=Li, Na or K, the percentage by weight of described SnO2, CeO2 and Cl are not 0 simultaneously.
2. according to claim 1ly it is characterized in that described glass plate SiO for the OLEDoS micro-display device
2Weight percent content be 59%～60%.
3. OLEDoS micro-display device according to claim 1, is characterized in that, described glass plate B
2O
3Weight percent content be 9%～11%.
4. according to claim 1ly it is characterized in that described glass plate Al for the OLEDoS micro-display device
2O
3Weight percent content be 14%～15%.
5. according to claim 1ly it is characterized in that for the OLEDoS micro-display device, the weight percent content of described glass plate CaO is 6%～7%.
6. according to claim 1ly it is characterized in that described glass plate Y for the OLEDoS micro-display device
2O
3Weight percent content be 2%～3%.
7. according to claim 1ly it is characterized in that described glass plate R for the OLEDoS micro-display device
2The weight percent content of O is 0.01%～0.06%.
Priority Applications (1)
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|---|---|---|---|
| CN 201110259764 CN102306708B (en) | 2011-09-05 | 2011-09-05 | Object linking and embedding denial of service (OLEDoS) micro display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110259764 CN102306708B (en) | 2011-09-05 | 2011-09-05 | Object linking and embedding denial of service (OLEDoS) micro display device |
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| CN102306708A CN102306708A (en) | 2012-01-04 |
| CN102306708B true CN102306708B (en) | 2013-11-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016040425A1 (en) | 2014-09-09 | 2016-03-17 | Ppg Industries Ohio, Inc. | Glass compositions, fiberizable glass compositions, and glass fibers made therefrom |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5914453B2 (en) * | 2012-12-28 | 2016-05-11 | ＡｖａｎＳｔｒａｔｅ株式会社 | Glass substrate for display and manufacturing method thereof |
| CN112490386A (en) * | 2020-11-26 | 2021-03-12 | 中国科学院微电子研究所 | OLEDoS micro-display device and preparation method thereof |
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| US6417124B1 (en) * | 1999-08-21 | 2002-07-09 | Schott Glas | Alkali-free aluminoborosilicate glass, and uses thereof |
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| WO2016040425A1 (en) | 2014-09-09 | 2016-03-17 | Ppg Industries Ohio, Inc. | Glass compositions, fiberizable glass compositions, and glass fibers made therefrom |
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