CN102294659A - Grinding wheel adjustable in dynamic balance and capable of removing chips - Google Patents

Grinding wheel adjustable in dynamic balance and capable of removing chips Download PDF

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Publication number
CN102294659A
CN102294659A CN201010214368XA CN201010214368A CN102294659A CN 102294659 A CN102294659 A CN 102294659A CN 201010214368X A CN201010214368X A CN 201010214368XA CN 201010214368 A CN201010214368 A CN 201010214368A CN 102294659 A CN102294659 A CN 102294659A
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CN
China
Prior art keywords
grinding wheel
chip removal
dynamic equilibrium
adjustable dynamic
rotating disk
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Pending
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CN201010214368XA
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Chinese (zh)
Inventor
林心正
蔡德育
鄂忠信
张孝国
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CHINA EMERG WHEEL ENTERPRISE Co Ltd
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CHINA EMERG WHEEL ENTERPRISE Co Ltd
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Priority to CN201010214368XA priority Critical patent/CN102294659A/en
Publication of CN102294659A publication Critical patent/CN102294659A/en
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Abstract

A grinding wheel adjustable in dynamic balance and capable of removing chips is arranged on a rotating axis having a cutting fluid outlet. The grinding wheel adjustable in dynamic balance and capable of removing chips comprises a turntable, wherein a plurality of grinding pieces and a groove are annularly formed on the turntable; and the groove is used for receiving a plurality of balance weights. The balance weights have the characteristic of movable adjustment. The turntable is capable of adjusting the center of gravity by adjusting the positions of the balance weights in the groove, so that the grinding wheel adjustable in dynamic balance and capable of removing chips can keep stable rotation while executing a grinding procedure, thus improving the grinding quality of the grinding wheel adjustable in dynamic balance and capable of removing chips. Moreover, in the grinding process, the cutting fluid can be quickly supplied to each grinding piece and the chip removal effect can be enhanced based on the rotation of the grinding wheel adjustable in dynamic balance and capable of removing chips and the guidance of an inclined side surface and/or a flow guide piece thereof; therefore, the grinding efficiency of the grinding wheel adjustable in dynamic balance and capable of removing chips is enhanced.

Description

The grinding wheel of adjustable dynamic equilibrium and chip removal
Technical field
The present invention relates to a kind of grinding wheel, particularly a kind of have movable balancing weight, but and normality is kept the grinding wheel of gravity balance.
Background technology
In as processing of stone industry or accurate grinding industry, attrition process is one of considerable step, and the rotary balance of employed grinding wheel is more concerning the accuracy that processing object grinds in the attrition process program.Existing grinding wheel is to become the emery wheel group with a holder structural group in the use, and these abrasive sand wheels are fixed on the swivel bearing that grinds support to carry out grinding operation, holder structure in the middle of this emery wheel group mainly comprises a main folder dish and a holder, the main folder dish has the recess of ring-type, can place a plurality of balancing weights in the recess.Simultaneously between inferior holder and main folder dish, be formed with the gap, use for grinding wheel to be placed between inferior holder and the main folder seat, grinding wheel is installed in by the emery wheel holder on the swivel bearing of grinder station for grinding operation.And in process of lapping, dynamic equilibrium that can be when changing the position of balancing weight in main folder dish recess and reach grinding wheel accompanying rotation bearing and rotate, the problem of damaging with the vibration avoiding being caused and swivel bearing because of the distribution of weight inequality of abrasive sand wheels on swivel bearing.
Though yet the mode that balancing weight is set on this main folder seat can be improved the stability of grinding wheel when rotating, but but still there is following shortcoming: at first, being provided with of abrasive sand wheels, grinding wheel is to fix by the main folder dish and the clipping of time holder, therefore along with the increase of grinding operation time, to the bonding tightness between grinding wheel and main folder dish and time holder be reduced, causing grinding wheel to produce between main folder dish and time holder gets loose, even this moment is by adjusting the mode of main folder dish balancing weight, also can't carry out balance correction, and then influence the usefulness of grinding operation grinding wheel.Moreover, because balancing weight is to be arranged on the main folder dish, it is in the adjustment process of carrying out the balancing weight position, be to adjust for the center of gravity of grinding wheel stand integral body, therefore must consider the distribution of weight that caused because of the composition material otherness between main folder dish, grinding wheel and time chuck and the problem of dimensional accuracy simultaneously, and then the position of centre of gravity of emery wheel group be become be difficult to grasp and needs are finely tuned spend the reasonable time.
Though the set-up mode that balancing weight directly is disposed at grinding wheel is arranged at present, such as Japan Patent No. 10286770 (JP10286770A) announcement, it is to offer a plurality of screws on the abrasive disk of grinding wheel, and be provided with the balancing weight that matches with screw, then in the operation of grinding wheel balance correction, be fixed in these screws balancing weight is sealed on demand.This grinding wheel is carried out the mode of balance correction,, therefore can't adjust the center of gravity of grinding wheel accurately on abrasive disk because the position that screw is offered is restricted the locking position of balancing weight for fixing.And owing to need use a considerable amount of balancing weights to be locked in the screw, the problem that the balancing weight loss is dropped takes place in regular meeting in the time of therefore in the process of adjusting the grinding wheel center of gravity.
Simultaneously; carry out in the process of attrition process at grinding wheel; usually the lubricity in the time of can using cutting fluid to increase grinding together between processing object and the grinding wheel; to improve the grainding capacity of grinding wheel; cutting fluid is also removed the abrasive dust and the impurity that are produced in the process of lapping simultaneously from grinding wheel; avoiding these abrasive dusts and impurity to block around the abrasive sheet of grinding wheel, and influence the grinding usefulness of grinding wheel.General in the use of cutting fluid, when grinding wheel grinds, the side of cutting fluid from grinding wheel is sprayed on the abrasive sheet, so as to washing away near abrasive dust and the impurity that is positioned at the abrasive sheet by a cutting fluid conveying device.Because the supply mode of this cutting fluid need use extra conveying device, causes the increase of equipment cost.And, cutting fluid enters because being a side by grinding wheel, can't spread rapidly and flow on all abrasive sheets, and make the supply inequality of cutting fluid for abrasive sheet, cause regional area on the grinding wheel still to have the accumulation of abrasive dust and impurity and then the grinding usefulness and the quality of impairment grinding wheel easily.
Summary of the invention
In view of above problem, the invention provides the grinding wheel of a kind of adjustable dynamic equilibrium and chip removal, so as to improving existing grinding wheel in the process of grinding operation, cause because of the abrasion of abrasive sheet grinding wheel center of gravity skew and to commonly use the employed balance correction mode of grinding wheel too numerous and diverse, and can't grasp problems such as grinding wheel position of centre of gravity really.And the present invention improves existing grinding wheel simultaneously when grinding operation, and cutting fluid can't be directly and is supplied to rapidly on all abrasive sheets, causes the problem that regional area is piled up abrasive dust and impurity easily on the grinding wheel.
To achieve these goals, the present invention discloses the grinding wheel of a kind of adjustable dynamic equilibrium and chip removal, be set on the swivel bearing, this swivel bearing and delivery port with a cutting fluid, in order to supply with cutting fluid to grinding wheel, the grinding wheel of disclosed adjustable dynamic equilibrium of the present invention and chip removal includes a rotating disk, a plurality of abrasive sheet and a plurality of balancing weight.Have an axis hole, a groove, two relative first side and second side and sides on the rotating disk, side is between two side faces and be located on the two side faces periphery, and the axis hole of rotating disk runs through first side and second side, and shaft hole sleeve is located on the swivel bearing.A plurality of abrasive sheets are located on the outer rim of first side, and groove then is located on the rotating disk.A plurality of balancing weights are arranged in the groove versatilely, make the rotating disk can be by adjusting the position of each balancing weight in groove, with the center of gravity of keeping rotating disk on certain position and keep the poised state of the grinding wheel of adjustable dynamic equilibrium and chip removal.
Disclosed another kind of the enforcement in the aspect of the present invention, the grinding wheel of adjustable dynamic equilibrium and chip removal is set on the swivel bearing, this swivel bearing and the delivery port with a cutting fluid are in order to supply with cutting fluid to the grinding wheel of adjustable dynamic equilibrium and chip removal.The grinding wheel of adjustable dynamic equilibrium and chip removal includes a rotating disk, a plurality of abrasive sheet, a plurality of balancing weight and a plurality of flow deflector.Have an axis hole, a groove, two relative first side and second side and sides on the rotating disk, side is between two side faces and be located on the two side faces periphery, and the axis hole of rotating disk runs through first side and second side, and shaft hole sleeve is located on the swivel bearing.A plurality of abrasive sheets are located on the outer rim of first side, and groove then is located on the rotating disk.A plurality of balancing weights are arranged in the groove versatilely, make the rotating disk can be by adjusting the position of each balancing weight in groove, with the center of gravity of keeping rotating disk on certain position and keep the poised state of the grinding wheel of adjustable dynamic equilibrium and chip removal.A plurality of flow deflectors are arranged in equally spaced mode on first side of rotating disk, in order to guide the cutting fluid diffuses flow to each abrasive sheet.
Effect of the present invention is, the grinding wheel of disclosed adjustable dynamic equilibrium and chip removal is provided with a plurality of movable balancing weights in the groove of rotating disk, by adjust balancing weight in groove the position and make the position of centre of gravity of the grinding wheel of adjustable dynamic equilibrium and chip removal be consistent, make the grinding wheel of adjustable dynamic equilibrium and chip removal can keep good static balancing and dynamic equilibrium.Therefore when the grinding wheel of adjustable dynamic equilibrium and chip removal when carrying out grinding operation, can directly adjust the distribution of weight on the grinding wheel of adjustable dynamic equilibrium and chip removal by balancing weight, make stable on swivel bearing, the rotating of grinding wheel of adjustable dynamic equilibrium and chip removal, make and grind usefulness acquisition lifting, simultaneously can avoid the grinding wheel of adjustable dynamic equilibrium and chip removal to produce vibration because of centre-of gravity shift makes the axis deviation of swivel bearing, the situation of damaging takes place, and because balancing weight directly is arranged on the grinding wheel of adjustable dynamic equilibrium and chip removal, therefore balancing weight is directly adjusted the position of centre of gravity of the grinding wheel of adjustable dynamic equilibrium and chip removal, and the balance of the grinding wheel of adjustable dynamic equilibrium of grasp that can be fast and accurately and chip removal.
Moreover, the grinding wheel of disclosed adjustable dynamic equilibrium of the present invention and chip removal, when carrying out grinding operation, supply with cutting fluid by the center of the grinding wheel of adjustable dynamic equilibrium and chip removal, centrifugal force during by the rotation of the grinding wheel of adjustable dynamic equilibrium and chip removal diffuses on each abrasive sheet rapidly, and cooperate first side be inclined to set and/or the guiding of flow deflector, make cutting fluid quick and average be scattered in abrasive sheet, therefore effectively promote the efficient of cutting fluid band from abrasive dust and impurity, and the lubricity of the grinding wheel of adjustable dynamic equilibrium and chip removal when grinding.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the solid combination schematic diagram of first embodiment of the invention;
Fig. 2 is the structural representation of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal;
Fig. 3 A, Fig. 3 B are that the abrasive sheet of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal is equidistant structure arranged schematic diagram;
Fig. 3 C is the structural representation that the abrasive sheet of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal is obliquely installed in the same direction;
Fig. 3 D is the structural representation that the abrasive sheet of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal is obliquely installed in the opposite direction;
Fig. 4 A is the generalized section of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal;
Fig. 4 B is the local enlarged diagram of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal;
Fig. 4 C is the partial exploded view of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal;
Fig. 5 A is that the abrasive sheet of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal is arranged at the generalized section between axis hole and the groove;
Fig. 5 B is the generalized section that the balancing weight of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal is arranged at the grinding wheel side;
Fig. 5 C is the generalized section that the balancing weight of the grinding wheel of adjustable dynamic equilibrium of first embodiment of the invention and chip removal is arranged at grinding wheel second side;
Fig. 6 is the solid combination schematic diagram of second embodiment of the invention;
Fig. 7 is the structural representation of the grinding wheel of adjustable dynamic equilibrium of second embodiment of the invention and chip removal;
Fig. 8 is the partial cutaway schematic of the grinding wheel of adjustable dynamic equilibrium of second embodiment of the invention and chip removal;
Fig. 9 has the structural representation of first side that is inclined to set for the rotating disk of the grinding wheel of adjustable dynamic equilibrium of second embodiment of the invention and chip removal;
Figure 10 A is that the flow deflector of grinding wheel of adjustable dynamic equilibrium of second embodiment of the invention and chip removal is perpendicular to abrasive sheet structure arranged schematic diagram; And
Figure 10 B is the structural representation that the flow deflector of the grinding wheel of adjustable dynamic equilibrium of second embodiment of the invention and chip removal is obliquely installed in the opposite direction.
Wherein, Reference numeral
The grinding wheel of 10 adjustable dynamic equilibrium and chip removal
11 rotating disks
111 axis holes
112 screws
113 first sides
114 second sides
115 sides
116 calibrated scale
12 abrasive sheets
13 grooves
131 internal faces
14 balancing weights
141 bolts
142 balls
143 fixing holes
144 perforation
145 surfaces
146 sidewalls
15 flow deflectors
20 swivel bearings
21 cutting fluid delivery ports
30 screws
The specific embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
The grinding wheel of disclosed adjustable dynamic equilibrium of the present invention and chip removal is to be arranged at one to grind on the support, in order to a processing object, as stone material, semiconductor crystal wafer or grinding pad etc. carry out attrition process, and in the process of attrition process, cooperate the abrasion of abrasive sheet of the grinding wheel of adjustable dynamic equilibrium and chip removal, and the position of balancing weight on the grinding wheel of adjustable dynamic equilibrium of adjustment of mobility ground and chip removal, the center of gravity of the grinding wheel of adjustable dynamic equilibrium and chip removal is consistent, so as to the grinding usefulness and the quality of the grinding wheel that promotes adjustable dynamic equilibrium and chip removal.
Please consult illustrated in figures 1 and 2ly simultaneously, the grinding wheel 10 of disclosed adjustable dynamic equilibrium of first embodiment of the invention and chip removal includes a rotating disk 11, a plurality of abrasive sheet 12 and a plurality of balancing weight 14.Have an axis hole 111, a plurality of screw 112, two relative first side 113 and second side 114 on the rotating disk 11, an and side 115, side 115 is between first side 113 and second side 114, and ring is located at the periphery of first side 113 and second side 114.On the rotating disk 11 and have a groove 13, be located on first side 113 of rotating disk 11, and be opened between axis hole 111 and the abrasive sheet 12.Axis hole 111 is through first side 113 and second side 114, and a plurality of screws 112 similarly run through first side 113 and second side 114, and equidistantly are located on around the axis hole 111.Rotating disk 11 is sheathed on one with axis hole 111 and grinds on the swivel bearing 20 of support (not shown), and wore screw 112 on the rotating disk 11 with screw 30, the grinding wheel 10 of adjustable dynamic equilibrium and chip removal is locked on the swivel bearing 20, rotate with the grinding wheel 10 that drives adjustable dynamic equilibrium and chip removal by swivel bearing 20, and processing object is carried out the grinding operation program.
Simultaneously in order in process of lapping, to increase adjustable dynamic equilibrium and the grinding wheel 10 of chip removal and the lubricity between the processing object, and the abrasive dust that is produced when avoiding grinding and impurity be piled up in adjustable dynamic equilibrium and chip removal grinding wheel 10 on, cause the grinding of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, cutting power to descend.Therefore wore an end of axis hole 111 at swivel bearing 20, have a plurality of cutting fluid delivery ports 21, in order to supply with cutting fluid to the grinding wheel 10 of adjustable dynamic equilibrium and chip removal to increase the lubricity when grinding, and wash away abrasive dust and impurity on the grinding wheel 10 of removing adjustable dynamic equilibrium and chip removal, make the grinding wheel 10 of adjustable dynamic equilibrium and chip removal can keep stable Grinding Quality.
Please continue to consult Fig. 1 and Fig. 2, a plurality of abrasive sheets 12 of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal are located on the outer rim of first side 113 of rotating disk 11, and abrasive sheet 12 is to arrange along the circumferencial direction that is parallel to rotating disk 11, between the two adjacent abrasive sheets 12 and have a gap, so that cutting fluid and the abrasive dust of being carried under one's arms and impurity thereof are discharged from the grinding wheel 10 of adjustable dynamic equilibrium and chip removal.Therefore, can discharge grinding wheel 10 smoothly in order to make abrasive dust that cutting fluid carries under one's arms and impurity in adjustable dynamic equilibrium and chip removal, as shown in Figure 2, a plurality of equally spaced abrasive material teeth can be set on abrasive sheet 12 reach this purpose, or shown in Fig. 3 A and Fig. 3 B, abrasive sheet 12 is located on first side, 113 outer rims of rotating disk 11 in the mode of equidistant arrangement, and respectively the size of single mill sheet 12 is shortened or adopt columned abrasive sheet 12 (shown in Fig. 3 B), to increase the gap between adjacent two abrasive sheets 12, or shown in Fig. 3 C, with abrasive sheet 12 inclinations one angle, and be obliquely installed in the same direction in the outer rim of rotating disk first side 113, or shown in the image pattern 3D, make two adjacent abrasive sheets 12 with mutual vertical or equally spaced in the opposite direction being obliquely installed on the outer rim of rotating disk first side 113, cutting fluid and the abrasive dust of being carried under one's arms and impurity thereof are discharged outside the grinding wheel 10 of adjustable dynamic equilibrium and chip removal by the gap between the abrasive sheet 12.
Please consult Fig. 2, Fig. 4 A and Fig. 4 B simultaneously, a plurality of balancing weights 14 are arranged in the groove 13 of rotating disk 11, three balancing weights 14 of general employing are movably set in the groove 13 in the mode that can slide relatively, and on first side 113 of rotating disk 11, edge ring along groove 13 is provided with a plurality of calibrated scale 116 that are equidistant arrangement, in order to the telltale mark as balancing weight 14, the handled easily personnel are fixed in the equilbrium position with balancing weight 14 fast.Please cooperate Fig. 4 C, balancing weight 14 has a bolt 141 and a ball 142, and have a fixing hole 143 and a perforation 144 on the balancing weight 14 on the adjacent two side faces respectively, perforation 144 is to connect to fixing hole 143, in the time of in balancing weight 14 is arranged at groove 13, the side surface 145 that balancing weight 14 has fixing hole 143 is exposed to groove, and balancing weight 14 to have a perforation sidewall 146 of 144 corresponding with the internal face 131 of groove 13.
See also Fig. 4 A to Fig. 4 C, the ball 142 of balancing weight 14 is located in the perforation 144 (shown in Fig. 4 C), and bolt 141 is screwed together in fixing hole 143, and is resisted against ball 142 in fixing hole 143.Therefore when rotating bolt 141 pushes against in ball 142, the internal face 131 that causes ball 142 towards groove 13 is moved also urgent on the internal face 131 of groove 13, and balancing weight 14 is fixed in the groove 13.On the contrary, when backward rotation bolt 141, remove between bolt 141 and the ball 142 push against state the time, remove the urgent state of the internal face 131 of ball 142 and groove together, make ball 142 break away from internal face 131 in groove, this moment, balancing weight 14 promptly obtained release and slidably in groove 13.
Therefore, please consult Fig. 1 simultaneously, Fig. 2, Fig. 4 A and Fig. 4 B, when the 10 pairs one processing object (not shown) of grinding wheel that use brand-new adjustable dynamic equilibrium and chip removal carry out grinding operation, owing to the abrasive sheet 12 on first side 113 that is arranged at rotating disk 11 is not worn as yet, therefore under initial state, balancing weight 14 is provided with the position on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, be to be fixed in the groove 13 with the symmetrical relation of (uniformly-spaced), with the center of gravity of the grinding wheel 10 of keeping adjustable dynamic equilibrium and chip removal, the grinding wheel 10 that makes adjustable dynamic equilibrium and chip removal being arranged on the swivel bearing 20 evenly.
When the grinding wheel 10 of adjustable dynamic equilibrium and chip removal grinds processing object along with the running of swivel bearing 20, increase along with the operating time, abrasive sheet 12 on first side 113 of rotating disk 11 is satisfied being worn gradually, and because the suffered extent of deterioration difference of each abrasive sheet 12, cause the distribution of weight inequality of abrasive sheet 12 on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, and then make the center of gravity of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal produce skew.This moment can be by adjusting each balancing weight 14 position in groove 13, directly make the grinding wheel 10 of adjustable dynamic equilibrium and chip removal keep the position of centre of gravity identical with initial state, with the rotational stabilization of grinding wheel 10 on swivel bearing 20 of keeping adjustable dynamic equilibrium and chip removal, make attrition process quality and usefulness obtain to promote, and can avoid crank because of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, cause swivel bearing 20 to rock and make and grind the situation that support damages and take place.
The present invention is provided with adjustable balancing weight 14 on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, by changing the distributing position of balancing weight 14 on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, directly the grinding wheel 10 to adjustable dynamic equilibrium and chip removal carries out the adjustment of center of gravity, therefore can accurately make the grinding wheel 10 of adjustable dynamic equilibrium and chip removal keep good static balancing and dynamic equilibrium.And the set-up mode of balancing weight 14 on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, except as shown in Figure 2, be assemblied in first side 113 of rotating disk 11, and outside the set-up mode between axis hole 111 and abrasive sheet 12, also can be shown in Fig. 5 A, groove 13 annulars are arranged at the outer rim of first side 113 on the rotating disk 11, make abrasive sheet 12 between axis hole 111 and balancing weight 14.Or shown in Fig. 5 B and Fig. 5 C, respectively groove 13 annulars are arranged on the side 115 and second side 114 of rotating disk 11, same can reach the purpose of grinding wheel 10 centers of gravity of keeping adjustable dynamic equilibrium and chip removal by adjusting the position of balancing weight 14 in groove 13.
Be the structural representation of the grinding wheel of adjustable dynamic equilibrium of second embodiment of the invention and chip removal as shown in Figure 6 and Figure 7.Disclosed second embodiment of the present invention and first embodiment are structurally roughly the same, below only just between the two difference be illustrated.The grinding wheel 10 of disclosed adjustable dynamic equilibrium of second embodiment of the invention and chip removal includes a rotating disk 11, a plurality of abrasive sheet 12, a plurality of balancing weight 14, reaches a plurality of flow deflectors 15.Have an axis hole 111, a plurality of screw 112, two relative first side 113 and second side 114 on the rotating disk 11, an and side 115, side 115 is between first side 113 and second side 114, and ring is located at the periphery of first side 113 and second side 114.On the rotating disk 11 and have a groove 13, be located on first side 113 of rotating disk 11, and be opened between axis hole 111 and the abrasive sheet 12.Its central axis hole 111 is through first side 113 and second side 114, and a plurality of screws 112 similarly run through first side 113 and second side 114, and equidistantly are located on around the axis hole 111.Rotating disk 11 is sheathed on the swivel bearing 20 with axis hole 111, and wore screw 112 on the rotating disk 11 with screw 30, the grinding wheel 10 of adjustable dynamic equilibrium and chip removal is locked on the swivel bearing, rotate with the grinding wheel 10 that drives adjustable dynamic equilibrium and chip removal by swivel bearing 20, and processing object is carried out the grinding operation program.
Simultaneously in order in process of lapping, to increase adjustable dynamic equilibrium and the grinding wheel 10 of chip removal and the lubricity between the processing object, and the abrasive dust that is produced when avoiding grinding and impurity be piled up in adjustable dynamic equilibrium and chip removal grinding wheel 10 on, cause the grinding of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, cutting power to descend.Therefore wore an end of axis hole 111 at swivel bearing 20, have a plurality of cutting fluid delivery ports 21, in order to supply with cutting fluid to the grinding wheel 10 of adjustable dynamic equilibrium and chip removal to increase the lubricity when grinding, and wash away abrasive dust and impurity on the grinding wheel 10 of removing adjustable dynamic equilibrium and chip removal, make the grinding wheel 10 of adjustable dynamic equilibrium and chip removal can keep stable Grinding Quality.
A plurality of abrasive sheets 12 of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal are located on the outer rim of first side 113 of rotating disk 11, and abrasive sheet 12 is to arrange along the circumferencial direction that is parallel to rotating disk 11, between the two adjacent abrasive sheets 12 and have a gap, and a plurality of tooth lappings on the abrasive sheet 12 are provided with in equally spaced mode, so that make cutting fluid and abrasive dust of being carried under one's arms and impurity, discharge outside the grinding wheel 10 of adjustable dynamic equilibrium and chip removal via these gaps and interval.
And, as shown in Figure 7, in order to make the cutting fluid can be fast and be delivered to abrasive sheet 12 uniformly, first side 113 of rotating disk 11 is provided with a plurality of flow deflectors 15, flow deflector 15 is between abrasive sheet 12 and axis hole 111, and the two ends of flow deflector 15 correspond respectively to abrasive sheet 12 and axis hole 111, and towards same direction being arranged on first side 113 of an angle of tilting.
See also Fig. 7 to Fig. 8, a plurality of balancing weights 14 are arranged in the groove 13 of rotating disk 11.The general mode of three balancing weights 14 that adopt sliding relatively, movable is arranged in the groove 13, and on first side 113 of rotating disk 11, edge ring along groove 13 is provided with a plurality of calibrated scale 116 that are equidistant arrangement, in order to the telltale mark as balancing weight 14, the handled easily personnel are fixed in the equilbrium position with balancing weight 14 fast.As shown in Figure 8, balancing weight 14 has a bolt 141 and a ball 142, in the time of in balancing weight 14 is arranged at groove 13, bolt 141 is for being arranged in the surface 145 that balancing weight 14 is exposed to groove 13, ball 142 is then on the sidewall that is arranged in balancing weight 14 146 of activity, and corresponding with the internal face 131 of groove 13.
When rotating bolt 141 pushes against in ball 142, the internal face 131 that causes ball 142 towards groove 13 is moved and urgent on the internal face 131 of groove 13, and balancing weight 14 is fixed in the groove 13.On the contrary, when backward rotation bolt 141, remove between bolt 141 and the ball 142 push against state the time, remove the urgent state of the internal face 131 of ball 142 and groove 13 together, make ball 142 break away from internal face 131 in groove 13, this moment, balancing weight 14 promptly obtained release and slidably in groove 13.
Therefore, please consult Fig. 6 to Fig. 8 simultaneously, when the 10 pairs one processing object (not shown) of grinding wheel that use brand-new adjustable dynamic equilibrium and chip removal carry out grinding operation, owing to the abrasive sheet 12 on first side 113 that is arranged at rotating disk 11 is not worn as yet, therefore under initial state, balancing weight 14 is provided with the position on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, be to be fixed in the groove 13 with the symmetrical relation of (uniformly-spaced), with the center of gravity of the grinding wheel 10 of keeping adjustable dynamic equilibrium and chip removal, the grinding wheel 10 that makes adjustable dynamic equilibrium and chip removal being arranged on the swivel bearing 20 evenly.
When the grinding wheel 10 of adjustable dynamic equilibrium and chip removal grinds processing object along with the running of swivel bearing 20, the cutting fluid (not shown) is delivered on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal via the cutting fluid delivery port 21 that is arranged on the swivel bearing 20, and the centrifugal force that is produced when being subjected to grinding wheel 10 rotation of adjustable dynamic equilibrium and chip removal and the guiding of flow deflector 15, make cutting fluid from the middle position of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal quick and average be dispersed to each abrasive sheet 12.Therefore, in process of lapping, abrasive dust and impurity that chip that comes off from abrasive sheet 12 and processing object break away from, be subjected to washing away of cutting fluid and flow out outside the grinding wheel 10 of adjustable dynamic equilibrium and chip removal from the gap between the abrasive sheet 12, the problem of avoiding abrasive sheet 12 to be subjected to the accumulation of these abrasive dusts and impurity and the grinding usefulness of abrasive sheet 12 being reduced, and the grinding wheel 10 that effectively prevents adjustable dynamic equilibrium and chip removal is because the distribution of weight inequality, and the situation that produces centre-of gravity shift takes place.
As shown in Figure 9, in the grinding wheel 10 of disclosed adjustable dynamic equilibrium of second embodiment of the invention and chip removal, in order to make cutting fluid diffuse to speeding up of abrasive sheet 12 from the center of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, first side 113 on the rotating disk 11 of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal can be set to towards the tilt guiding incline of an angle of axis hole, formed incline structure on the grinding wheel 10 by first side 113 in adjustable dynamic equilibrium and chip removal, make cutting fluid in the rotary course of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, can be directly and flow to the position of each abrasive sheet 12 rapidly, with band from the abrasive dust and the impurity that concentrate near the abrasive sheet 12.In addition, the arrangement mode that also can cooperate flow deflector 15 to be arranged on first side 113 reaches this purpose.Shown in Figure 10 A, be orthogonal relation between a plurality of flow deflectors 15 and the abrasive sheet 12 and be arranged on first side 113.Or shown in Figure 10 B, a plurality of flow deflectors 15 are in the mode of the angle that tilts, and oblique arrangement and is to be obliquely installed towards rightabout between the two adjacent flow deflectors 15 on first side 113.
Please consult Fig. 6 and Fig. 7 once more, similarly, increase along with the operating time, abrasive sheet 12 loss gradually on first side 113 of rotating disk 11, and because the suffered extent of deterioration difference of each abrasive sheet 12, cause the distribution of weight inequality of abrasive sheet 12 on the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, and then make the center of gravity of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal produce skew.This moment can be by adjusting each balancing weight 14 position in groove 13, with the position of centre of gravity of grinding wheel 10 on swivel bearing 20 that keeps adjustable dynamic equilibrium and chip removal, make the grinding wheel 10 of adjustable dynamic equilibrium and chip removal on swivel bearing 20, keep stability of rotation, and then make attrition process quality and usefulness obtain to promote, and avoid crank because of the grinding wheel 10 of adjustable dynamic equilibrium and chip removal, cause swivel bearing 20 to rock and make and grind the situation that support damages and take place.
Offer a groove on the grinding wheel of disclosed adjustable dynamic equilibrium of the present invention and chip removal, and a plurality of movable balancing weights are set in groove, by adjusting the position of balancing weight in groove the position of centre of gravity of the grinding wheel of adjustable dynamic equilibrium and chip removal is consistent, make the grinding wheel of adjustable dynamic equilibrium and chip removal keep good static balancing and dynamic equilibrium, therefore when the grinding wheel of adjustable dynamic equilibrium and chip removal when carrying out grinding operation, can directly adjust the actual weight distribution of the grinding wheel of adjustable dynamic equilibrium and chip removal by balancing weight, position of centre of gravity with the grinding wheel of adjustable dynamic equilibrium of certain grasp and chip removal, and stable on swivel bearing, the rotating of the grinding wheel that makes adjustable dynamic equilibrium and chip removal, make and grind usefulness acquisition lifting, can avoid the grinding wheel of adjustable dynamic equilibrium and chip removal to produce vibration simultaneously because of centre-of gravity shift makes the axis deviation of swivel bearing, the situation of damaging takes place.
And, when the grinding wheel of adjustable dynamic equilibrium and chip removal carries out grinding operation, supply with cutting fluid by swivel bearing from the center of the grinding wheel of adjustable dynamic equilibrium and chip removal, the centrifugal force that when swivel bearing rotates, is produced, make cutting fluid diffuse to the abrasive sheet of the grinding wheel of adjustable dynamic equilibrium and chip removal, to wash away and to be with abrasive dust and the impurity that when grinding, is produced, can prevent that abrasive dust and impurity are piled up in the grinding efficiency that abrasive sheet influences abrasive sheet on every side, first side that further is provided with flow deflector and/or is obliquely installed on the grinding wheel of this external adjustable dynamic equilibrium and chip removal, make cutting fluid in diffusing to the process of abrasive sheet, the guiding of first side that is subjected to flow deflector and/or is obliquely installed, can flow to abrasive sheet more fast, with the lubricity of grinding wheel when grinding that increases adjustable dynamic equilibrium and chip removal, and with abrasive dust and impurity from the grinding wheel band of adjustable dynamic equilibrium and chip removal from, make the grinding wheel of adjustable dynamic equilibrium and chip removal have good grinding usefulness and quality.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (19)

1. the grinding wheel of adjustable dynamic equilibrium and chip removal, the grinding wheel of this adjustable dynamic equilibrium and chip removal is sheathed on the swivel bearing, and this swivel bearing has a cutting fluid delivery port, in order to supply with a cutting fluid to the grinding wheel of this adjustable dynamic equilibrium and chip removal, it is characterized in that the grinding wheel of this adjustable dynamic equilibrium and chip removal includes:
One rotating disk, this rotating disk has an axis hole, a groove, two relative one first sides and one second side, and between this two side faces and be located on a side of this two side faces periphery, this axis hole runs through this first side and this second side, and this shaft hole sleeve is located on this swivel bearing;
A plurality of abrasive sheets, these a plurality of abrasive sheets are located on the outer rim of this first side; And
A plurality of balancing weights, these a plurality of balancing weights are movably set in this groove, and this rotating disk is by adjusting the position of each balancing weight in this groove, to keep the center of gravity of this rotating disk.
2. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, respectively this balancing weight is arranged in this groove symmetrically, to keep the center of gravity of this rotating disk.
3. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal, it is characterized in that, respectively this balancing weight also has a bolt and a ball, this bolt is arranged in the surface that this balancing weight is exposed to this groove, this ball is movably set on the sidewall of relative this groove of this balancing weight, this bolt is oppressed in this ball, makes this ball push against a internal face in this groove, and this balancing weight is fixed in this groove.
4. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, this groove is located on this first side of this rotating disk, and this groove is between this axis hole and this a plurality of abrasive sheets.
5. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, this groove is located on this first side of this rotating disk, and these a plurality of abrasive sheets are located between this axis hole and this groove.
6. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, this groove is located on this side of this rotating disk.
7. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, this groove is located on the outer rim of this second side of this rotating disk.
8. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, this rotating disk is provided with a plurality of calibrated scale adjacent to a side ring of this groove, and these a plurality of calibrated scale are with on this first side that equidistantly is arranged in this rotating disk.
9. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal, it is characterized in that, also comprise a plurality of flow deflectors, these a plurality of flow deflectors are located on this rotating disk, and between these a plurality of abrasive sheets and this axis hole, this cutting fluid is supplied to this a plurality of abrasive sheets via the guiding of this flow deflector.
10. the grinding wheel of adjustable dynamic equilibrium according to claim 9 and chip removal is characterized in that, respectively the two ends of this flow deflector are respectively to should a plurality of abrasive sheets and this axis hole.
11. the grinding wheel of adjustable dynamic equilibrium according to claim 10 and chip removal is characterized in that, these a plurality of flow deflectors are mutual vertical relation with these a plurality of abrasive sheets, are located on this rotating disk.
12. the grinding wheel of adjustable dynamic equilibrium according to claim 10 and chip removal is characterized in that, these a plurality of flow deflectors are in the angle setting that tilts of this rotating disk, and are located on obliquely on this rotating disk.
13. the grinding wheel of adjustable dynamic equilibrium according to claim 12 and chip removal is characterized in that, these a plurality of flow deflectors on this rotating disk towards same direction oblique arrangement.
14. the grinding wheel of adjustable dynamic equilibrium according to claim 12 and chip removal is characterized in that, two adjacent in these a plurality of flow deflectors these flow deflectors are towards the rightabout oblique arrangement.
15. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, this of this rotating disk first side is towards the angle setting of tilting of this axis hole, and this cutting fluid is supplied to this a plurality of abrasive sheets via the guiding of this first side.
16. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, these a plurality of abrasive sheets are located on the outer rim of this first side in the mode of equidistant arrangement.
17. the grinding wheel of adjustable dynamic equilibrium according to claim 1 and chip removal is characterized in that, the angle setting that tilts of the outer rim of these a plurality of abrasive sheets in this first side, and be arranged at obliquely on the outer rim of this first side.
18. the grinding wheel of adjustable dynamic equilibrium according to claim 17 and chip removal is characterized in that, these a plurality of abrasive sheets on the outer rim of this first side towards same direction oblique arrangement.
19. the grinding wheel of adjustable dynamic equilibrium according to claim 17 and chip removal is characterized in that, two adjacent in these a plurality of abrasive sheets these abrasive sheets are towards the rightabout oblique arrangement.
CN201010214368XA 2010-06-25 2010-06-25 Grinding wheel adjustable in dynamic balance and capable of removing chips Pending CN102294659A (en)

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CN201010214368XA CN102294659A (en) 2010-06-25 2010-06-25 Grinding wheel adjustable in dynamic balance and capable of removing chips

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Application Number Priority Date Filing Date Title
CN201010214368XA CN102294659A (en) 2010-06-25 2010-06-25 Grinding wheel adjustable in dynamic balance and capable of removing chips

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CN102294659A true CN102294659A (en) 2011-12-28

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104175243A (en) * 2014-08-14 2014-12-03 天津贝利泰陶瓷有限公司 Formation grinding wheel, grinding bed and grinding formation arc edge ceramic tiles
CN109099112A (en) * 2018-10-08 2018-12-28 东北大学 Wheel balance shock-absorbing means and method based on EAP driving
CN110319977A (en) * 2018-03-30 2019-10-11 鼎灿企业有限公司 Means for correcting for grinding wheel
CN112757177A (en) * 2021-01-11 2021-05-07 中铁隆昌铁路器材有限公司 Steel rail milling and grinding vehicle grinding wheel unbalance amount adjusting hole filling glue and using method thereof

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CN201158002Y (en) * 2008-01-08 2008-12-03 准力机械股份有限公司 Flange of grinding wheel of processor and pullback weight block structure improvement
JP2010094789A (en) * 2008-10-20 2010-04-30 Disco Abrasive Syst Ltd Grinding wheel

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US2958165A (en) * 1958-05-24 1960-11-01 Hofmann Dionys Balancing device
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JPH10286770A (en) * 1997-04-09 1998-10-27 Nikon Corp Grinding stone and grinding stone set
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104175243A (en) * 2014-08-14 2014-12-03 天津贝利泰陶瓷有限公司 Formation grinding wheel, grinding bed and grinding formation arc edge ceramic tiles
CN110319977A (en) * 2018-03-30 2019-10-11 鼎灿企业有限公司 Means for correcting for grinding wheel
CN109099112A (en) * 2018-10-08 2018-12-28 东北大学 Wheel balance shock-absorbing means and method based on EAP driving
CN112757177A (en) * 2021-01-11 2021-05-07 中铁隆昌铁路器材有限公司 Steel rail milling and grinding vehicle grinding wheel unbalance amount adjusting hole filling glue and using method thereof
CN112757177B (en) * 2021-01-11 2022-06-28 中铁隆昌铁路器材有限公司 Steel rail milling and grinding vehicle grinding wheel unbalance amount adjusting hole filling glue and using method thereof

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Application publication date: 20111228