TWM524763U - Grinding apparatus - Google Patents

Description

Grinding device

The present invention relates to a grinding apparatus, and more particularly to a grinding apparatus for improving the shape of a grinding tooth to reduce the grinding ratio.

Grinding is one of the most important steps in the wafer fabrication or precision grinding industry, and the grinding balance of the wheel holder used in the grinding process is more related to the precision of the workpiece grinding.

Generally, the conventional wheel base is combined with grinding teeth to form a grinding wheel set, and the grinding wheel set is connected to the grinding wheel rotating motor through a grinding wheel rotating shaft to perform a grinding operation, and the grinding teeth correspond to the center of the grinding wheel seat and are arranged in a radial shape. However, since the displacement direction of the grinding tooth and the extending direction of the grinding side of the grinding tooth are perpendicular to each other, the debris of the workpiece is likely to accumulate in the grinding side of the grinding tooth with respect to the displacement direction, thereby causing chipping, Therefore, the quality of the grinding is generally not high. In addition, the ground debris is likely to accumulate due to accumulation on the side of the grinding tooth, which greatly reduces the lack of grinding ability and service life.

Another commonly used wheel wheel seat is combined with grinding teeth to form a grinding wheel set, and the grinding wheel set is connected to the grinding wheel rotating motor through a grinding wheel rotating shaft for grinding operation, and the grinding teeth have a specific grinding angle. Such a knot Although it is conducive to the removal of debris, it is often caused by the imbalance of wear, which causes the grinding end to have different grinding loss at the proximal end and the distal end. It not only increases the grinding ratio, but also reduces the grinding efficiency and quality, and causes the total thickness variation. (Total Thickness Variation, TTV) is too large to meet the needs of the manufacturer.

From the above, it is known that there is a lack of a grinding device that can balance the amount of wear of the grinding teeth, reduce the grinding ratio, and reduce the variation in the total thickness after grinding. Therefore, the relevant companies are seeking solutions.

Therefore, the present invention provides a grinding device that utilizes a special shape of the inner and outer narrowness of the grinding tooth to compensate for the difference in the near end wear of the grinding tooth compared to the distal end, which can effectively lower the ground grinding ratio and reduce the polished wafer. The total thickness variation, which in turn reduces the fragmentation rate. Furthermore, the arrangement of the swirling grinding teeth in combination with the wide and narrow inner shape of the grinding teeth itself enables the grinding device to smoothly chip the chips during the grinding process. In addition, the present polishing apparatus can simultaneously grind a plurality of objects to be polished, which can greatly increase the yield.

One embodiment of the present invention is a polishing apparatus comprising a carrier disk, at least one object to be polished, a grinding wheel, and a plurality of grinding teeth. The object to be ground is connected to the carrier. The grinding wheel is displaced relative to the carrier disk and has a center. Each of the grinding teeth is connected to the grinding wheel, and the grinding teeth contact the abrasive object. Additionally, the abrasive tooth includes a proximal end and a distal end, the proximal end having a proximal end width and the distal end having a distal end width. The proximal end is separated from the center of the grinding wheel by a proximal distance, and the distal end is separated from the center of the grinding wheel by a distal distance from. The proximal end distance is less than the distal end distance and the proximal end width is greater than the distal end width.

Therefore, the grinding device of the present invention compensates for the difference in the near-end wear amount of the grinding tooth by the special shape of the inner and outer narrowness of the grinding tooth, thereby effectively reducing the low grinding ratio and greatly reducing the size of the polished wafer. The total thickness variation, which in turn reduces the fragmentation rate. In addition, by radially arranging the swirling grinding teeth and arranging the special shape of the grinding teeth themselves, the grinding device can smoothly remove chips during the grinding process.

According to another embodiment of the foregoing embodiment, the grinding teeth may include a first side and a second side, and the first side corresponds to the second side. The proximal end and the distal end are planar or curved, and the first side and the second side may also be planar or curved. The side length of the first side is less than or equal to the side length of the second side, and the side length of the first side is greater than the width of the proximal end. Furthermore, the carrier disk and the grinding wheel disk may be circular, the grinding teeth are arranged in a spiral shape, and the object to be polished may be circular, elliptical, square, triangular or other polygonal shape. The aforementioned carrier disk can be rotated clockwise or counterclockwise, and the grinding wheel can be rotated clockwise or counterclockwise. The disk surface of the carrier disk and the disk surface of the grinding wheel are parallel to each other. In addition, the foregoing grinding device may include a bearing rotating motor and a grinding wheel rotating motor, wherein the rotating motor rotates the carrier, and the carrying rotating motor controls the carrier to rotate at a bearing speed. As for the grinding wheel rotating motor, the grinding wheel can be rotated, and the grinding wheel rotating motor can control the grinding wheel to rotate at a grinding wheel speed. In addition, each of the grinding teeth intersects with a corresponding virtual radiation at a grinding angle, and the virtual radiation intersects the center of the grinding wheel and intersects with the corresponding grinding tooth, and the grinding angle is greater than 0 degrees and less than 90 degrees.

Another embodiment of the present invention is a polishing apparatus including a carrier, a plurality of objects to be polished, a wheel holder, and a plurality of grinding teeth. The carrier includes a carrier tray and a bearing shaft, and the carrier tray is coupled to the bearing shaft, and the carrier tray rotates around the bearing shaft. Each object to be ground is positioned on a carrier tray. The grinding wheel seat comprises a grinding wheel and a grinding wheel rotating shaft, the grinding wheel is connected with the grinding wheel rotating shaft, and the grinding wheel rotates around the rotating shaft of the grinding wheel. Further, each of the grinding teeth is positioned on the grinding wheel, and each of the grinding teeth contacts the abrasive object. Each of the grinding teeth includes a proximal end and a distal end, the proximal end having a proximal end width and the distal end having a distal end width. The proximal end is separated from the center of the grinding wheel by a proximal distance, and the distal end is separated from the center of the grinding wheel by a distal distance. The proximal end distance is less than the distal end distance and the proximal end width is greater than the distal end width.

Thereby, the grinding device of the present invention can simultaneously grind a plurality of objects to be ground, which not only can greatly increase the yield, but also can increase the economic effect and reduce the production cost. In addition, the special shape of the inner and outer narrowness of the grinding tooth can compensate for the difference in the near end wear of the grinding tooth compared with the distal end, which can greatly reduce the low grinding ratio and effectively reduce the total thickness variation of the object after grinding, and When the object to be polished is a wafer, the fragmentation rate can be greatly reduced.

According to another embodiment of the foregoing embodiment, the grinding teeth may include a first side and a second side, and the first side corresponds to the second side. The proximal end and the distal end are planar or curved, and the first side and the second side may also be planar or curved. The side length of the first side is less than or equal to the side length of the second side, and the side length of the first side is greater than the width of the proximal end. Furthermore, the carrier disk and the grinding wheel disk may have a circular shape, and the grinding teeth may be arranged in a spiral shape, and each of the objects to be polished may have a circular shape, an elliptical shape, a square shape, a triangular shape or the like. Edge shape. The aforementioned carrier disk can be rotated clockwise or counterclockwise, and the grinding wheel can be rotated clockwise or counterclockwise. The bearing shaft and the grinding wheel shaft are parallel to each other, and the disk surface of the carrier disk and the disk surface of the grinding wheel are parallel to each other, and the bearing shaft and the disk surface of the carrier disk are perpendicular to each other. In addition, the foregoing grinding device may include a bearing rotation motor and a grinding wheel rotation motor, wherein the bearing rotation motor is coupled to the bearing shaft to rotate the carrier plate, and the bearing rotation motor controls the carrier plate to rotate at a bearing speed. As for the grinding wheel rotation motor, the grinding wheel rotating shaft is connected to rotate the grinding wheel disc, and the grinding wheel rotating motor can control the grinding wheel to rotate at a grinding wheel speed. In addition, each of the grinding teeth intersects with a corresponding virtual radiation at a grinding angle, and the virtual radiation intersects the center of the grinding wheel and intersects with the corresponding grinding tooth, and the grinding angle is greater than 0 degrees and less than 90 degrees.

100, 100a‧‧‧ grinding device

200‧‧‧ bearing seat

210‧‧‧ Carrying tray

220‧‧‧bearing shaft

300‧‧‧Abrased objects

400‧‧‧ wheel seat

410‧‧‧ grinding wheel

412‧‧‧Central Slope

420‧‧‧ grinding wheel shaft

430‧‧‧ Center

440‧‧‧Virtual radiation

500, 500a‧‧‧ grinding teeth

500b, 500c‧‧‧ grinding teeth

510‧‧‧ proximal end

520‧‧‧ distal

530‧‧‧ first side

540‧‧‧ second side

610‧‧‧bearing rotating motor

620‧‧‧Wheel wheel turning motor

Θ‧‧‧ grinding angle

T1‧‧‧ proximal width

T2‧‧‧ distal width

D1‧‧‧ proximal distance

D2‧‧‧Remote distance

FIG. 1 is a perspective view of a polishing apparatus according to an embodiment of the present invention.

Fig. 2A is a plan view showing the grinding wheel of Fig. 1.

2B is a cross-sectional view of the grinding wheel of FIG. 2A.

FIG. 2C is a schematic view showing the grinding teeth of FIG. 2A.

Fig. 3 is a plan view showing the phase grinding of the carrier disk and the grinding wheel disk of Fig. 1.

4 is a top plan view of a grinding wheel and grinding teeth of another embodiment of the present invention.

5A-5C are schematic views of grinding teeth of other various embodiments of the present invention.

FIG. 6 is a schematic perspective view of a polishing apparatus according to another embodiment of the present invention.

Figure 7 is a graph showing the grinding ratio of the grinding wheel diameter of 254 mm corresponding to the tooth profile of the grinding tooth.

Figure 8 is a graph showing the grinding ratio of the grinding wheel diameter of 304 mm corresponding to the tooth profile of the grinding tooth.

Hereinafter, a plurality of embodiments of the present invention will be described with reference to the drawings. For the sake of clarity, many practical details will be explained in the following description. However, it should be understood that these practical details are not intended to limit the novel. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are illustrated in the drawings in a simplified schematic manner, and the repeated elements may be represented by the same reference numerals. Furthermore, the grinding ratio described herein represents the average thickness of the abrasive tooth 500 divided by the percentage of the unit grinding amount.

Please refer to FIG. 1 to FIG. 3 together. FIG. 1 is a perspective view of a polishing apparatus 100 according to an embodiment of the present invention. FIG. 2A is a plan view showing the grinding wheel 410 of FIG. 1. 2B is a cross-sectional view of the grinding wheel 410 of FIG. 2A. FIG. 2C is a schematic view showing the grinding tooth 500 of FIG. 2A. FIG. 3 is a plan view showing the cross-phase grinding of the carrier 210 and the grinding wheel 410 of FIG. 1 . As shown, the polishing apparatus 100 includes a carrier 200, five objects to be polished 300, a wheel holder 400, and a plurality of The grinding teeth 500, a carrying rotation motor 610, and a grinding wheel rotation motor 620.

The carrier 200 includes a carrier tray 210 and a carrier shaft 220. The carrier tray 210 is coupled to the carrier shaft 220, and the carrier tray 210 rotates around the bearing shaft 220. The carrier tray 210 can be rotated in a clockwise direction or a counterclockwise direction, and from the top view of FIG. 3, the carrier tray 210 of the present embodiment is rotated in a clockwise direction. Further, in the polishing apparatus 100, the disk surface of the carrier disk 210 has an oblique angle with respect to the horizontal mask, which exhibits a slight bulge in the inner high and the outer low, and the present embodiment utilizes such a shape structure to increase the effect of chip evacuation. In addition, the extending direction of the bearing shaft 220 is perpendicular to the disk surface of the carrier tray 210, and the carrier tray 210 has a circular shape, and the bearing shaft 220 has a cylindrical shape. When the circular carrier disk 210 is ground and rotated, the center of gravity of the carrier disk 210 is not offset, which has a relatively high degree of stability.

Each of the objects to be polished 300 is equally spaced and positioned on the carrier tray 210. The object to be polished 300 of the present embodiment is a wafer and has a circular shape. Of course, the object to be polished 300 may be other materials, and its shape may be a circle, an ellipse, a square, a triangle or other polygons. Furthermore, under the condition of the known carrier disk 210 and the object to be polished 300, the user can determine the number of the object 300 to be placed on the carrier disk 210 through the position of the object to be polished 300, and by the number. Increase to increase production. As for the connection method in which the object to be polished 300 is fixed to the carrier tray 210, it is a conventional technique, and therefore will not be described again. In addition, each of the objects 300 has a thickness, and generally the advantages and disadvantages of the grinding technique are utilized to utilize the total thickness variation (Total Thickness Variation (TTV) is determined by the size, which represents the difference between the maximum thickness and the minimum thickness of the object 300 to be polished. This minimization of total thickness variation is the key to determining the quality of the final product, and this value is directly related to achieving thinner wafers and components.

The wheel head 400 includes a grinding wheel 410 and a grinding wheel shaft 420. The grinding wheel 410 is coupled to the grinding wheel shaft 420 and the grinding wheel 410 is circular, and the extending direction of the grinding wheel shaft 420 is perpendicular to the disk surface of the grinding wheel 410. The grinding wheel 410 rotates about the grinding wheel shaft 420, and the grinding wheel 410 is displaced relative to the carrier disk 210. The grinding wheel 410 has a center 430 and a virtual radiation 440. The center 430 of the grinding wheel 410 intersects the virtual radiation 440, and the virtual radiation 440 intersects the corresponding grinding tooth 500. Further, the grinding wheel 410 can be rotated in a clockwise direction or a counterclockwise direction, and in the present embodiment, the grinding wheel 410 is rotated in the clockwise direction, and the carrier disk 210 is also rotated in the clockwise direction. In other words, the carrier disk 210 and the grinding wheel disk 410 operate in opposite directions with respect to the abrasive surface. Further, the bearing shaft 220 and the grinding wheel shaft 420 are parallel to each other, and the disk surface of the carrier disk 210 and the disk surface of the grinding wheel disk 410 are parallel to each other and have a plan view area of the same size. The edge of the carrier tray 210 of the present embodiment is aligned with the center 430 of the grinding wheel 410, and the center of the carrier tray 210 is just aligned with the edge of the grinding wheel 410. Furthermore, the grinding wheel 410 has a hollow annular structure and has a middle ring slope 412. This structure can reduce the weight of the grinding wheel 410, and the grinding wheel 410 can be stably connected to the grinding wheel shaft 420 through a screw lock, and the connection is a conventional technique. Therefore, it will not be repeated.

The grinding tooth 500 is coupled to the grinding wheel 410, and the grinding tooth 500 can contact the abrasive object 300. The grinding wheel 410 of the embodiment is provided with 36 grinding teeth 500, these grinding teeth 500 are equally spaced and arranged in a spiral shape. Additionally, each of the abrasive teeth 500 includes a proximal end 510, a distal end 520, a first side 530, and a second side 540, the proximal end 510 having a proximal end width T1 and the distal end 520 having a distal end width T2. The proximal end 510 is spaced apart from the center 430 of the grinding wheel 410 by a proximal distance D1, and the distal end 520 is spaced from the center 430 of the grinding wheel 410 by a distal distance D2. The proximal distance D1 is less than the distal distance D2, that is, the distal end 520 of the abrasive tooth 500 is closer to the outer edge of the grinding wheel 410. The proximal end width T1 is greater than the distal end width T2, that is, the grinding tooth 500 has a shape that is narrow inside and wide. In this embodiment, the inner width and the outer narrow shape of the grinding tooth 500 can compensate the difference between the grinding device 100 and the distal end 520 of the grinding tooth 500 during the grinding process, which can effectively reduce the polished wafer. Total thickness variation. Carefully speaking, in the case of the grinding tooth 500, when the grinding tooth 500 grinds the object 300, the closer to the center 430 of the grinding wheel 410, the more the amount of grinding, that is, the greater the amount of wear, which is due to the distal end. The distance 520 is longer than the displacement of the proximal end 510, and the cooling effect of the distal end 520 is better, resulting in less grinding, and the proximal end 510 is less likely to be cooled and cooled, resulting in more grinding. In other words, if the proximal end width T1 of the proximal end 510 having a large amount of polishing is increased to balance the amount of polishing with the amount of polishing of the distal end 520, the object to be polished 300 is polished under the conditions. The total thickness variation will be reduced, thereby improving the quality of the abrasive and the effectiveness of the workpiece 300.

In addition, each of the grinding teeth 500 intersects the corresponding virtual radiation 440 with a grinding angle θ, the virtual radiation 440 intersects the center 430 of the grinding wheel 410, and the virtual radiation 440 and the corresponding grinding The teeth 500 also intersect. Since the grinding angle θ is larger than 0 degrees and smaller than 90 degrees, the grinding apparatus 100 can smoothly discharge chips. In addition, the polishing surface of each of the polishing teeth 500 and the disk surface of the carrier disk 210 are parallel to each other, and the polishing surface of the polishing tooth 500 is parallel to the disk surface of the grinding wheel 410 and the surface of the workpiece 300. This structure can further reduce the workpiece 300. Total thickness variation. Furthermore, the proximal end 510 and the distal end 520 can be planar or curved. The first side 530 corresponds to the second side 540, and the first side 530 and the second side 540 may also be planar or curved. The side length of the first side 530 is less than or equal to the side length of the second side 540, and the side length of the first side 530 is greater than the proximal width T1. Regardless of the shape of the proximal end 510, the distal end 520, the first side 530 or the second side 540, as long as the proximal end width T1 is greater than the distal end width T2, the balance of wear of the entire grinding tooth 500 can be achieved, thereby reducing the grinding The total thickness variation.

The load-bearing rotation motor 610 is coupled to the carrier shaft 220, and the load-rotation motor 610 controls the carrier tray 210 to rotate at a load-carrying speed. The grinding wheel rotation motor 620 is connected to the grinding wheel shaft 420, and the grinding wheel rotation motor 620 controls the grinding wheel disk 410 to rotate at a grinding wheel speed. By carrying the rotation motor 610 and the grinding wheel rotation motor 620, the frequency of the grinding of the grinding tooth 500 and the workpiece 300 can be accurately controlled. As for the structure and driving method of the motor, it is a conventional technique, and therefore will not be described again.

Please refer to FIG. 2C and FIG. 3 together. FIG. 4 is a plan view showing the grinding wheel 410 and the grinding tooth 500a according to another embodiment of the present invention. 5A-5C are schematic views of grinding teeth 500a, 500b, 500c of other various embodiments of the present invention. As shown, when the first side 530 and the first When the two side edges 540 are all planar, like the grinding teeth 500, 500c, the top view is tapered; when the first side 530 and the second side 540 are curved, like the grinding teeth 500a, the top view It is crescent shaped. In the course of the grinding, the debris of the workpiece 300 is likely to accumulate on the side corresponding to the traveling direction of the grinding teeth 500, 500a, 500b, 500c. Taking FIG. 3 as an example, the grinding wheel 410 travels clockwise, and the debris of the workpiece 300 is easily deposited on the second side 540. To improve the accumulation phenomenon, the extending direction of the second side 540 must correspond to The virtual radiation 440 intersects an angle of a certain size. In other words, as long as the extending direction of the second side 540 is not parallel to the corresponding virtual radiation 440, the grinding apparatus 100 can smoothly remove the chips during the grinding process, and the debris is directed to the outside or the inside of the grinding wheel 410. discharge. It is worth mentioning that the grinding teeth 500, 500a, 500b, 500c of the present invention have a tapered or crescent shape, and the first side 530 or the second side 540 has an angle with respect to the virtual radiation 440 itself. The grinding angle θ can produce a larger angular change, so that the structure is more conducive to chip removal, resulting in more smooth chip removal.

Please refer to FIG. 1 together. FIG. 6 is a perspective view of a polishing apparatus 100a according to another embodiment of the present invention. As can be seen from FIG. 6, the axial direction of the bearing shaft 220 of the carrier 200 is parallel to the axial direction of the grinding wheel shaft 420 of the wheel head 400, and the bearing shaft 220 and the grinding wheel shaft 420 are both parallel to the X-axis direction. Further, the carrier disk 210, the grinding wheel 410, and the Z-axis direction are parallel. Whether it is the lateral grinding of FIG. 1 or the longitudinal grinding of FIG. 6, the grinding device 100 can be made lateral or longitudinal by using the inner wide and outer narrow grinding teeth 500, 500a, 500b, 500c of the present invention. During the grinding process, the difference between the wear of the proximal end 510 of the grinding tooth 500 and the distal end 520 is compensated, thereby effectively reducing the total thickness variation of the polished wafer.

Fig. 7 is a graph showing the grinding ratio of the diameter of the grinding wheel 410 of 254 mm corresponding to the tooth profile of the grinding tooth 500. Figure 8 is a graph showing the ratio of the grinding ratio of the diameter of the 304 mm grinding wheel 410 to the tooth profile of the grinding tooth 500. The object to be polished 300 in FIGS. 7 and 8 is a wafer. The number of wafers tested in Figure 7 is 3, 4, and 5; the number of wafers tested in Figure 8 is 5 and 7. The grinding ratio described in the present invention is the average thickness of the grinding tooth 500 divided by the percentage of the unit grinding amount, and it can be seen from the figure that regardless of the number of wafers, the new inner width and outer narrow grinding tooth 500 tooth type is obtained. The grinding ratio is smaller than the conventional grinding ratio of the same width. In other words, the average thickness of the grinding tooth 500 of the present invention is smaller than the average wear thickness of the conventional same-width tooth type, so the grinding tooth 500 compensates for the difference in the wear amount of the proximal end 510 compared with the distal end 520 and balances the wear of the entire grinding surface. , thereby reducing the total thickness variation and fragmentation rate.

It can be seen from the above embodiments that the present invention has the following advantages: First, the special shape of the inner and outer narrowness of the grinding tooth is used to compensate for the difference in the near end wear of the grinding tooth compared with the far end, which can effectively reduce the total amount of the wafer after grinding. Variation in thickness, which in turn reduces fragmentation rates. Secondly, through the radial arrangement of the swirling grinding teeth, and the wide and narrow shape of the grinding teeth itself, the chip removal can be smoother. Third, the polishing apparatus can simultaneously grind a plurality of objects to be ground, which can greatly increase the yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and anyone skilled in the art can In the spirit and scope, the various modifications and refinements may be made, and the scope of protection of the present invention is subject to the definition of the scope of the patent application.

500‧‧‧ grinding teeth

510‧‧‧ proximal end

520‧‧‧ distal

530‧‧‧ first side

540‧‧‧ second side

T1‧‧‧ proximal width

T2‧‧‧ distal width

Claims (12)

A grinding device comprising: a carrier disk; at least one object to be grounded, connecting the carrier disk; a grinding wheel disk displaced relative to the carrier disk and having a center; and a plurality of grinding teeth connected to the grinding wheel disk, the grinding tooth contacts Grinding the object to be polished, each of the grinding teeth comprising a proximal end and a distal end, the proximal end having a proximal end width, the distal end having a distal end width, the proximal end being spaced apart from the center by a proximal end distance, The distal end is separated from the center by a distal distance that is less than the distal distance and the proximal width is greater than the distal width. The grinding device of claim 1, wherein each of the grinding teeth further comprises a first side and a second side, the first side corresponding to the second side, the proximal end and the far side The first side edge and the second side edge are planar or arcuate, and the side length of the first side edge is less than or equal to the side length of the second side edge, and the first side The side length of one side is greater than the width of the proximal end. The grinding device of claim 1, wherein the carrier disk and the grinding wheel are circular, and the grinding teeth are arranged in a spiral shape, and the object to be polished is circular, elliptical, square or triangular. The grinding apparatus of claim 1, wherein the carrier disk rotates in a clockwise direction or a counterclockwise direction, the grinding wheel Rotating in a clockwise or counterclockwise direction, the disk surface of the carrier disk and the disk surface of the grinding wheel disk are parallel to each other. The grinding device of claim 1, further comprising: a carrying rotating motor, rotating the carrying plate, the carrying rotating motor controlling the carrying plate to rotate at a bearing speed; and a grinding wheel rotating motor to rotate the grinding wheel The grinding wheel rotation motor controls the grinding wheel to rotate at a grinding wheel speed. The polishing apparatus of claim 1, wherein each of the grinding teeth intersects a corresponding one of the virtual radiation lines at a grinding angle, the virtual radiation intersecting the center of the grinding wheel and intersecting one of the grinding teeth, The grinding angle is greater than 0 degrees and less than 90 degrees. A grinding device comprising: a carrier, comprising a carrier disk and a bearing rotating shaft, the carrier disk is connected to the bearing rotating shaft, the carrier disk rotates around the bearing rotating shaft; and a plurality of objects to be ground are positioned on the carrier disk; a grinding wheel seat comprising a grinding wheel and a grinding wheel rotating shaft, the grinding wheel is connected to the grinding wheel shaft, the grinding wheel rotates around the rotating shaft of the grinding wheel; and a plurality of grinding teeth are positioned on the grinding wheel, the grinding teeth contact grinding Each of the abrasive objects includes a proximal end and a distal end, the proximal end having a proximal end width, the distal end having a distal end width, the proximal end being spaced apart from the center of the grinding wheel disc by a proximal end Distance, the distal end and the center of the grinding wheel A proximal distance is less than the distal distance and the proximal width is greater than the distal width. The grinding device of claim 7, wherein each of the grinding teeth further comprises a first side and a second side, the first side corresponding to the second side, the proximal end and the far side The first side edge and the second side edge are planar or arcuate, and the side length of the first side edge is less than or equal to the side length of the second side edge, and the first side The side length of one side is greater than the width of the proximal end. The grinding device of claim 7, wherein the carrier disk and the grinding wheel are circular, and the grinding teeth are arranged in a spiral shape, and each of the objects is circular, elliptical, square or triangular. . The grinding apparatus of claim 7, wherein the carrier disk rotates in a clockwise direction or a counterclockwise direction, the grinding wheel disk rotates in a clockwise direction or a counterclockwise direction, and the bearing rotating shaft and the grinding wheel rotating shaft are parallel to each other and The disk surface of the carrier disk and the disk surface of the grinding wheel disk are parallel to each other, and the bearing rotating shaft and the disk surface of the carrier disk are perpendicular to each other. The grinding device of claim 7, further comprising: a carrying rotating motor coupled to the carrying shaft, the carrying rotating motor controlling the carrying tray to rotate at a bearing speed; A grinding wheel rotates the motor to connect the grinding wheel shaft, and the grinding wheel rotation motor controls the grinding wheel to rotate at a grinding wheel speed. The grinding apparatus of claim 7, wherein each of the grinding teeth intersects a corresponding one of the virtual radiation lines at a grinding angle, the virtual radiation intersecting the center of the grinding wheel and intersecting with the corresponding grinding teeth, the grinding angle More than 0 degrees and less than 90 degrees.