CN102291930A - Circuit board adhesive structure and manufacturing method thereof - Google Patents
Circuit board adhesive structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN102291930A CN102291930A CN2011102241780A CN201110224178A CN102291930A CN 102291930 A CN102291930 A CN 102291930A CN 2011102241780 A CN2011102241780 A CN 2011102241780A CN 201110224178 A CN201110224178 A CN 201110224178A CN 102291930 A CN102291930 A CN 102291930A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- substrate
- diaphragm
- hot melt
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a circuit board adhesive structure and a manufacturing method thereof. The structure comprises a circuit board substrate, a non-hot melt adhesive layer and a protective film, wherein the protective film is fixedly adhered to the circuit board substrate by using the non-hot melt adhesive layer. The manufacturing method comprises the following steps: A. manufacturing circuit board lines; B. adhering the non-hot melt adhesive layer to the protective film; and C. adhering the protective film to the circuit board. The circuit board adhesive structure and the manufacturing method have the following beneficial effects: the special structure form is adopted to adhere the protective layer to the circuit board substrate, thus greatly simplifying the production process and lowering the production cost; and the hot pressing process is not needed in the production process of the circuit board, the dimension and dimension precision of the produced circuit board can be strictly ensured and adhesive overflow and harms of adhesive overflow to the circuit board are fundamentally eradicated.
Description
Technical field
The present invention discloses a kind of circuit board and manufacture method thereof, particularly a kind of circuit board glued construction and manufacture method thereof.
Background technology
Circuit board is in manufacturing process; after its circuit is made; need on substrate, adhere to layer protecting film; prevent the circuit oxidation or to special process requirements such as regional area welding resistances to reach; ordinary circuit board, aluminium base circuit board, copper base circuit board and FPC etc. are not always the case, and especially FPC is all the more so.FPC is called flexible PCB or flexible circuit board again, its in the prior art be electrically connected or circuit plays very important effect in connecting.In the prior art, FPC when producing, made the FPC matrix after, need on substrate, adhere to a side protective layer usually, to play protective effect to circuit.The circuit board diaphragm adopts the hot melt glue bond usually on circuit board substrate at present; this kind manufacturing process and circuit structure exist certain defective; as: when bonding; need send into circuit board substrate, PUR and diaphragm in the hot plate together; carry out hot pressing; FPC and protective layer are pressed together, and it is the manufacturing process complexity not only, and production cost is higher.Simultaneously, in hot pressing, hot melt glue is under the environment of high temperature, high pressure, be easy to generate the glue phenomenon of overflowing, the circuit board size there is the use occasion of strict demand, adopts the circuit board of existing explained hereafter to be easy to produce defective products, and through hole on some circuit board or fabrication hole etc., with obstructions such as through hole or fabrication holes, influence the use of circuit board because overflowing glue easily.Simultaneously, circuit board is in hot pressing, and its internal wiring produces deformation because expanding with heat and contract with cold effect easily, and its size is changed, when it is applied to that the circuit board size had the applicable situation of strict demand, also produce bad product easily because of dimensional problem.
Summary of the invention
Adopt the hot pressing form to adhere to protective layer at the above-mentioned circuit board of mentioning of the prior art; the production cost height; and be easy to generate shortcomings such as deformation; the invention provides a kind of new circuit board glued construction and manufacture method thereof; it adopts non-PUR that protective layer is bonded on the circuit board substrate; simplify production stage, saved production cost.
The technical scheme that the present invention solves its technical problem employing is: a kind of circuit board glued construction, and glued construction comprises circuit board substrate, non-hot melt adhesive layer and diaphragm, diaphragm fixedly is bonded on the circuit board substrate by non-hot melt adhesive layer.
The present invention also provides a kind of manufacture method of above-mentioned circuit board diaphragm glued construction simultaneously, and this manufacture method comprises the steps:
A, circuit board manufacturing circuit;
B, with non-hot melt adhesive layer attached on the diaphragm;
C, diaphragm is sticked on the circuit board.
The technical scheme that the present invention solves its technical problem employing further comprises:
Described non-hot melt adhesive layer adopts high temperature resistant adhesive sticker or high temperature resistance diaphragm.
Described circuit board substrate forms for by high temperature resistant adhesive sticker or high temperature resistant double faced adhesive tape conductive foil being bonded on the substrate.
In the described steps A, circuit board substrate adopts high temperature resistant adhesive sticker or high temperature resistant double faced adhesive tape that conductive foil is bonded on the substrate, is being pasted with circuit board manufacturing circuit on the substrate of conductive foil.
Among the described step B, non-hot melt adhesive layer attached to after on the diaphragm, is offered the hole corresponding to pad, via hole, fabrication hole position on the circuit board.
Described circuit board is single face pcb board, single face FPC plate, two-sided pcb board, two-sided FPC plate, multi-layer PCB board or multi-layer FPC plate.
The invention has the beneficial effects as follows: the present invention adopt special version with protective layer attached on the circuit board substrate, make production technology simplify greatly, production cost reduces.The present invention does not need to carry out heat pressing process and handles in the production process of circuit board, the size and the dimensional accuracy of the circuit board size of can strict guarantee producing, and the harm of fundamentally having stopped excessive glue phenomenon and circuit board being caused.
The present invention will be further described below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a part section structural representation of the present invention.
Among the figure, 1-circuit board substrate, the non-PUR of 2-, 3-protective layer.
Embodiment
Present embodiment is the preferred embodiment for the present invention, and other all its principles are identical with present embodiment or approximate with basic structure, all within protection range of the present invention.
Please referring to accompanying drawing 1 and accompanying drawing 2; the present invention mainly comprises circuit board substrate 1 and diaphragm 3, and diaphragm 3 is bonded on the circuit board substrate 1, in the present embodiment by non-PUR 2; the high temperature resistant adhesive sticker of non-PUR 2 preferred employings; diaphragm 3 adopts high temperature resistance diaphragms, when specifically implementing, can be earlier with non-PUR 2 attached on the diaphragm 3; stick release liners at non-PUR 2 opposite sides then; during use, the release liners on top layer is torn, circuit board substrate 1 and diaphragm 3 can be bonded together.For easy to use, in the present embodiment, can on the diaphragm 3 that is attached with non-PUR 2 corresponding to circuit board on position such as pad, via hole, fabrication hole offer the hole, during stickup, the hole on the diaphragm 3 alignd with the relevant position on the circuit board to get final product.In the present embodiment, circuit board can be ordinary circuit board (being PCB), FPC circuit board, in the present embodiment, circuit board substrate adopts non-PURs 2 such as double faced adhesive tape or adhesive sticker that conductive foil is bonded in substrate (substrate is circuit board substrates such as PI) and goes up formation, with common PCB is example, promptly copper-foil conducting electricity is bonded on the PI sheet material and forms, and then on Copper Foil, adopt mode such as etching to produce circuit to get final product by non-PUR 2.Structure of the present invention has been saved the step of hot pressing, thereby has simplified production technology, and, when diaphragm 3 infringements, can also tear replacing at any time, thus prolongation product useful life that can be indirect.
Circuit board among the present invention is single face pcb board, single face FPC plate, two-sided pcb board, two-sided FPC plate, multi-layer PCB board or multi-layer FPC plate.
The present invention mainly comprises following three steps when producing:
A, circuit board manufacturing circuit, in the present embodiment, circuit board substrate 1 can be PCB, FPC etc., can be single sided board, double sided board, or even multi-layer sheet all can.In the present embodiment, circuit board substrate 1 can adopt resistant to elevated temperatures double faced adhesive tape or adhesive sticker conductive foil to be sticked on the substrates such as PI, is being pasted with circuit board manufacturing circuit on the substrate of conductive foil then;
B, with non-hot melt adhesive layer 2 attached on the diaphragm 1, in the present embodiment, can directly non-PUR 2 be coated on the diaphragm 3, non-hot melt adhesive layer 2 is attached to after on the diaphragm 3, attach release liners on the top layer, on the diaphragm 3 that is attached with non-hot melt adhesive layer 2 corresponding to circuit board on pad, via hole, fabrication hole position offer the hole;
C, diaphragm 3 is sticked on the circuit board, in the present embodiment, during stickup, the release liners on top layer is torn,, paste and get final product the relevant position on the hole alignment circuit plate on the diaphragm 3 (being positions such as pad on the circuit board, via hole, fabrication hole).
The present invention adopt special version with protective layer attached on the circuit board substrate, make production technology simplify greatly, production cost reduces.The present invention does not need to carry out heat pressing process and handles in the production process of circuit board, the size and the dimensional accuracy of the circuit board size of can strict guarantee producing, and the harm of fundamentally having stopped excessive glue phenomenon and circuit board being caused.
Claims (8)
1. circuit board glued construction, it is characterized in that: described glued construction comprises circuit board substrate, non-hot melt adhesive layer and diaphragm, diaphragm fixedly is bonded on the circuit board substrate by non-hot melt adhesive layer.
2. circuit board glued construction according to claim 1 is characterized in that: described non-hot melt adhesive layer adopts high temperature resistant adhesive sticker or high temperature resistance diaphragm.
3. circuit board glued construction according to claim 1 and 2 is characterized in that: described circuit board substrate forms for by high temperature resistant adhesive sticker or high temperature resistant double faced adhesive tape conductive foil being bonded on the substrate.
4. circuit board glued construction according to claim 1 and 2 is characterized in that: described circuit board is single face pcb board, single face FPC plate, two-sided pcb board, two-sided FPC plate, multi-layer PCB board or multi-layer FPC plate.
5. manufacture method as any described circuit board glued construction in the claim 1 to 4, it is characterized in that: described manufacture method comprises the steps:
A, circuit board manufacturing circuit;
B, with non-hot melt adhesive layer attached on the diaphragm;
C, diaphragm is sticked on the circuit board.
6. manufacture method according to claim 5 is characterized in that: in the described steps A, circuit board substrate adopts high temperature resistant adhesive sticker or high temperature resistant double faced adhesive tape that conductive foil is bonded on the substrate, is being pasted with circuit board manufacturing circuit on the substrate of conductive foil.
7. manufacture method according to claim 5 is characterized in that: among the described step B, non-hot melt adhesive layer attached to after on the diaphragm, is offered the hole corresponding to pad, via hole, fabrication hole position on the circuit board.
8. according to claim 5 or 6 or 7 described manufacture methods, it is characterized in that: described circuit board is single face pcb board, single face FPC plate, two-sided pcb board, two-sided FPC plate, multi-layer PCB board or multi-layer FPC plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102241780A CN102291930A (en) | 2011-08-06 | 2011-08-06 | Circuit board adhesive structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102241780A CN102291930A (en) | 2011-08-06 | 2011-08-06 | Circuit board adhesive structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102291930A true CN102291930A (en) | 2011-12-21 |
Family
ID=45337955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102241780A Pending CN102291930A (en) | 2011-08-06 | 2011-08-06 | Circuit board adhesive structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102291930A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163097A (en) * | 2016-08-31 | 2016-11-23 | 珠海市联健电子科技有限公司 | A kind of anti-creeping aluminium base and method thereof |
| CN112533354A (en) * | 2020-11-04 | 2021-03-19 | 昆山丘钛微电子科技有限公司 | PCB protection structure, material belt and PCB protection structure attaching method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1507076A (en) * | 2002-12-13 | 2004-06-23 | ������������ʽ���� | Solar cell assembly |
| CN2663794Y (en) * | 2003-04-14 | 2004-12-15 | 台州立发电子有限公司 | Paster light-emitting diode lamp strip |
| CN1984526A (en) * | 2005-12-15 | 2007-06-20 | 古河电路铜箔株式会社 | Ultrathin copper foil with carrier and printed circuit board |
| CN101704312A (en) * | 2009-11-06 | 2010-05-12 | 电子科技大学 | Composite electromagnetic shield materials and method for preparing same |
| CN101747854A (en) * | 2008-12-04 | 2010-06-23 | 比亚迪股份有限公司 | Adhesive combination, covering film and flexible circuit board |
| CN101746098A (en) * | 2009-12-04 | 2010-06-23 | 夏超华 | Adhesive block film for flexible printed circuit board fast compression technology |
| CN202160336U (en) * | 2011-08-06 | 2012-03-07 | 何忠亮 | Circuit board bonding structure |
-
2011
- 2011-08-06 CN CN2011102241780A patent/CN102291930A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1507076A (en) * | 2002-12-13 | 2004-06-23 | ������������ʽ���� | Solar cell assembly |
| CN2663794Y (en) * | 2003-04-14 | 2004-12-15 | 台州立发电子有限公司 | Paster light-emitting diode lamp strip |
| CN1984526A (en) * | 2005-12-15 | 2007-06-20 | 古河电路铜箔株式会社 | Ultrathin copper foil with carrier and printed circuit board |
| CN101747854A (en) * | 2008-12-04 | 2010-06-23 | 比亚迪股份有限公司 | Adhesive combination, covering film and flexible circuit board |
| CN101704312A (en) * | 2009-11-06 | 2010-05-12 | 电子科技大学 | Composite electromagnetic shield materials and method for preparing same |
| CN101746098A (en) * | 2009-12-04 | 2010-06-23 | 夏超华 | Adhesive block film for flexible printed circuit board fast compression technology |
| CN202160336U (en) * | 2011-08-06 | 2012-03-07 | 何忠亮 | Circuit board bonding structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163097A (en) * | 2016-08-31 | 2016-11-23 | 珠海市联健电子科技有限公司 | A kind of anti-creeping aluminium base and method thereof |
| CN106163097B (en) * | 2016-08-31 | 2018-11-09 | 珠海市联健电子科技有限公司 | A kind of anticreep aluminum substrate and its method |
| CN112533354A (en) * | 2020-11-04 | 2021-03-19 | 昆山丘钛微电子科技有限公司 | PCB protection structure, material belt and PCB protection structure attaching method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105813392B (en) | A kind of preparation method of flexible LED substrate | |
| CN102404933A (en) | Printed circuit board applying metal substrate to penetrate heat path and method for making printed circuit board | |
| WO2009057332A1 (en) | Circuit connecting method | |
| WO2011060600A1 (en) | Double-faced circuit board with element and its interconnecting conduction method | |
| JP2013520807A (en) | Manufacturing method and product of surface mount power LED support | |
| CN202160336U (en) | Circuit board bonding structure | |
| WO2012009841A1 (en) | Single-sided circuit board made by bonding juxtaposition flat wiring with thermosetting glue film | |
| WO2015000248A1 (en) | Chip on glass bonding method and structure | |
| CN105045449A (en) | Touch panel structure and manufacturing method therefor | |
| CN102291930A (en) | Circuit board adhesive structure and manufacturing method thereof | |
| CN103108502A (en) | Method for laminating cover film in soft board | |
| TW202212129A (en) | Functional laminated glass articles and methods of making the same | |
| WO2012009842A1 (en) | Method of manufacturing single sided circuit board by using carrier glue film and juxtaposition flat wiring | |
| JP2005347770A5 (en) | ||
| WO2012172937A1 (en) | Wiring body and method for making wiring body | |
| TWI425900B (en) | Method for fabricating a coreless substrate and method for forming a thin circuit board | |
| CN105916291A (en) | Method for manufacturing high-density interconnected printed circuit board | |
| CN101746098A (en) | Adhesive block film for flexible printed circuit board fast compression technology | |
| CN113488520B (en) | OLED display device and manufacturing method thereof | |
| TWI393494B (en) | Substrate strip with wiring and method for fabricating the same | |
| CN103192563A (en) | Composite double-faced copper foil substrate for flexible printed circuit board | |
| CN204046940U (en) | The encapsulating structure of novel embedded type component and circuit board | |
| WO2012009839A1 (en) | Single-sided circuit board and manufacturing method thereof | |
| CN110880544B (en) | Chip for glass substrate and manufacturing method thereof | |
| CN114615804B (en) | Manufacturing method of flexible circuit board with 180-degree bending single-sided golden finger and two-sided plugging function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111221 |