CN102285704A - Ion exchange resin arsenic removal method for acidic etching liquid, resin regeneration method and treatment system thereof - Google Patents

Ion exchange resin arsenic removal method for acidic etching liquid, resin regeneration method and treatment system thereof Download PDF

Info

Publication number
CN102285704A
CN102285704A CN201010242923XA CN201010242923A CN102285704A CN 102285704 A CN102285704 A CN 102285704A CN 201010242923X A CN201010242923X A CN 201010242923XA CN 201010242923 A CN201010242923 A CN 201010242923A CN 102285704 A CN102285704 A CN 102285704A
Authority
CN
China
Prior art keywords
exchanger
ion
resin
hydrochloric acid
acidic etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201010242923XA
Other languages
Chinese (zh)
Other versions
CN102285704B (en
Inventor
许世爱
兰永辉
孙荣斌
肖华
邝国生
高仁富
彭韬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Dongjiang Feed Additives Co., Ltd.
Original Assignee
SHENZHEN DONGJIANG HUARUI TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN DONGJIANG HUARUI TECHNOLOGY CO LTD filed Critical SHENZHEN DONGJIANG HUARUI TECHNOLOGY CO LTD
Priority to CN 201010242923 priority Critical patent/CN102285704B/en
Publication of CN102285704A publication Critical patent/CN102285704A/en
Application granted granted Critical
Publication of CN102285704B publication Critical patent/CN102285704B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Treatment Of Water By Ion Exchange (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention relates to an ion exchange resin arsenic removal method for acidic etching liquid, which comprises the steps of: A) placing extraction resin in an ion exchanger; B) pumping acidic etching liquid waste into the ion exchanger, controlling the flow rate of the acidic etching liquid waste in the ion exchanger and then letting the acidic etching liquid waste flow out of the ion exchanger to obtain arsenic-removed printed circuit board acidic etching liquid waste; and C) when the adsorbing capacity of the extraction resin is saturated, conducting regeneration treatment to the extraction resin, and after the treatment is completed, using the extraction resin to continuously treat the acidic etching liquid waste; and when the removal rate of arsenic in the acidic etching liquid waste after the arsenic is removed through the ion exchanger is lower than 60 percent, replacing the extraction resin, emptying the ion exchanger at the moment and repeating the step A. Since the resin used by the ion exchange resin arsenic removal method is the extraction resin, the extraction resin is simple to regenerate, the operation is convenient, the cost is low and the ion exchange resin arsenic removal method is suitable for the arsenic removal of large-scale printed circuit board acidic etching liquid waste.

Description

Be used for the ion exchange resin dearsenicating method of acidic etching liquid, the method and the treatment system thereof of resin regeneration
[technical field]
The present invention relates to remove in the waste water multiple-stage treatment of specific solute, particularly waste printed circuit board etching liquid is removed the method for arsenic, relates in particular to the ion exchange resin dearsenicating method of the printed circuit board acidic etching waste liquor that is used to produce basic copper chloride; The invention still further relates to the method for resin regeneration in the ion exchange resin arsenic removal process of printed circuit board acidic etching waste liquor, and the treatment system of arsenic removal and resin regeneration.
[background technology]
Waste printed circuit board etching liquid (also claiming the PCB etching waste liquor) comprises alkaline etching waste liquid for producing and acidic etching waste liquid, and wherein copper and chloride ion content height in the printed circuit board acidic etching waste liquor belong to acidity, contain impurity such as arsenic; The basic copper chloride of being produced by printed circuit board acidic etching waste liquor has strict demand to the content of arsenic, arsenic content is low more good more, generally before producing basic copper chloride, need carry out the processing in early stage of arsenic removal to printed circuit board acidic etching waste liquor with printed circuit board acidic etching waste liquor.
Prior art method of arsenic removal from printed circuit board acidic etching waste liquor comprises neutralization precipitation method, sulphide precipitation, the ferrite precipitator method and flocculent precipitation, and the effect of removing arsenic that these methods have is bad, and the meeting that has causes secondary pollution, and the cost that has is higher; The method of prior art arsenic removal from printed circuit board acidic etching waste liquor also comprises ion-exchange resin, this method treatment capacity is big, simple to operate and good separating effect, help the recycling of various materials in the acidic etching waste liquid, it is a kind of good dearsenicating method, but the used resin of this method comprises the gac exchange resin, the regenerating resin of sulfide, mineral ion exchange resin and selective chelating resin, after the acidic etching waste liquid arsenic removal is handled, these resin regenerations are difficulty, and the resin regeneration processing cost is higher, the cost that causes adopting ion-exchange resin to handle arsenic removal in the printed circuit board acidic etching waste liquor increases, and the popularization of this ion exchange resin dearsenicating method also is restricted.
[summary of the invention]
The technical problem to be solved in the present invention is to avoid above-mentioned the deficiencies in the prior art part and proposes a kind of ion exchange resin dearsenicating method that is used for acidic etching waste liquid, the resin of this ion exchange resin dearsenicating method adopts extration resin, this extration resin regeneration is simple, easy to operate and cost is lower, is fit to the arsenic removal of printed circuit board acidic etching waste liquor in enormous quantities is handled.The invention allows for the method for the used ion exchange resin regeneration of a kind of acidic etching liquid arsenic removal.The present invention has also proposed a kind of ion exchange resin arsenic removal treatment system that is used for acidic etching liquid.
The technical scheme that the present invention solve the technical problem employing is:
A kind of ion exchange resin dearsenicating method that is used for acidic etching liquid is the treating processes in early stage that is used for producing from printed circuit board acidic etching waste liquor basic copper chloride, comprises the steps:
A, fresh extration resin is packed in the ion-exchanger;
B, pending printed circuit board acidic etching waste liquor pumped into from the inlet of described ion-exchanger carry out arsenic removal in this ion-exchanger and handle, control the velocity of flow of described acidic etching waste liquid in described ion-exchanger, be allowed to condition at that the mobile time remained on 20~40 minutes in this ion-exchanger, flow out from the outlet of described ion-exchanger then, obtain the printed circuit board acidic etching waste liquor after the arsenic removal;
When the volume of C, the acidic etching waste liquid handled when described extration resin was 390~410 times of volume of this extration resin, the adsorptive power of this extration resin reached capacity, and then described extration resin need carry out manipulation of regeneration, and its steps in sequence is as follows:
C 1The inlet of hydrochloric acid from described ion-exchanger pumped in this ion-exchanger, make this hydrochloric acid, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 2After described hydrochloric acid has washed described extration resin, then allow tap water flow in this ion-exchanger, make this tap water, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin from the inlet of described ion-exchanger;
C 3After described tap water has cleaned described extration resin, the inlet of sodium hydroxide solution from described ion-exchanger pumped in this ion-exchanger, make this sodium hydroxide solution, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 4After described sodium hydroxide solution has washed described extration resin, then allow tap water flow in this ion-exchanger once more from the inlet of described ion-exchanger, make this tap water by described extration resin, it is washed, and flow out from the outlet of described ion-exchanger;
Through above C 1~C 4Each step, described extration resin manipulation of regeneration finishes, and available its continues to handle printed circuit board acidic etching waste liquor;
Repeating step B, adsorptive power to described extration resin reaches capacity, operation steps C again, and then the acidic etching waste liquid of repeating step B...... after handling through described ion-exchanger arsenic removal, after the clearance of arsenic is lower than 60%, described extration resin needs to change, and should empty described ion-exchanger this moment, repeats implementation step A.
The invention allows for the method for the used ion exchange resin regeneration of a kind of acidic etching liquid arsenic removal, used resin is an extration resin, when the volume of the acidic etching waste liquid of handling when described extration resin is 390~410 times of volume of this extration resin, the adsorptive power of this extration resin reaches capacity, then described extration resin need carry out manipulation of regeneration, comprises the steps: according to this
C 1The inlet of hydrochloric acid from described ion-exchanger pumped in this ion-exchanger, make this hydrochloric acid, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 2After described hydrochloric acid has washed described extration resin, then allow tap water flow in this ion-exchanger, make this tap water, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin from the inlet of described ion-exchanger;
C 3After described tap water has cleaned described extration resin, the inlet of sodium hydroxide solution from described ion-exchanger pumped in this ion-exchanger, make this sodium hydroxide solution, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 4After described sodium hydroxide solution has washed described extration resin, then allow tap water flow in this ion-exchanger once more from the inlet of described ion-exchanger, make this tap water by described extration resin, it is washed, and flow out from the outlet of described ion-exchanger;
Through above C 1~C 4Each step, described extration resin manipulation of regeneration finishes, and can be reused for the processing printed circuit board acidic etching waste liquor.
Above-mentioned steps C 1In, the concentration of described hydrochloric acid is 7~10%, and the consumption of this hydrochloric acid is 1.5~2.5 times of described extration resin volume, and this hydrochloric acid is 1.5~2.5 hours by the time of described ion-exchanger.
Above-mentioned steps C 2In, the consumption of described tap water is 1.5~2.5 times of described extration resin volume, this tap water is 20~40 minutes by the time of described ion-exchanger.
Above-mentioned steps C 3In, the concentration of described sodium hydroxide solution is 7~10%, and the consumption of this sodium hydroxide is 1.5~2.5 times of described extration resin volume, and this sodium hydroxide is 1.5~2.5 hours by the time of described ion-exchanger.
Above-mentioned steps C 4In, the consumption of described tap water is 1.5~2.5 times of described extration resin volume, this tap water is 20~40 minutes by the time of described ion-exchanger.
The present invention has proposed a kind of ion exchange resin arsenic removal treatment system that is used for acidic etching liquid again, it is the treatment system in early stage that is used for producing basic copper chloride from printed circuit board acidic etching waste liquor, comprise ion-exchanger and liquid absorbing pump that resin is housed, and be arranged on the inlet of described ion-exchanger and the feed valve between the drawing liquid pump outlet; Described liquid absorbing pump pumps into pending acidic etching liquid and carries out arsenic removal in this ion-exchanger and handle from the inlet of described ion-exchanger, the acidic etching liquid after arsenic removal is handled flows out through bleeder valve from the outlet of described ion-exchanger.
Described resin is an extration resin; Described ion exchange resin arsenic removal treatment system also comprises the extration resin regenerating unit, and this extration resin regenerating unit comprises the hydrochloric acid pond, takes out the hydrochloric acid pump, hydrochloric acid feed valve, hydrochloric acid pond for recovering, hydrochloric acid bleeder valve, sodium hydroxide pond, take out hydroxide sodium pump, sodium hydroxide feed valve, sodium hydroxide pond for recovering, sodium hydroxide bleeder valve, tap water feed valve, tap water pond for recovering and tap water bleeder valve.
The outlet in described hydrochloric acid pond is connected with the inlet of described ion-exchanger after taking out hydrochloric acid pump and hydrochloric acid feed valve through described, the outlet of described ion-exchanger is connected with the inlet of described hydrochloric acid pond for recovering behind described hydrochloric acid bleeder valve, the described hydrochloric acid pump of taking out pumps into described ion-exchanger with the hydrochloric acid in the described hydrochloric acid pond and flows through behind the described extration resin, from the outlet of described ion-exchanger in described hydrochloric acid bleeder valve flow into described hydrochloric acid pond for recovering.
The outlet in described sodium hydroxide pond is connected with the inlet of described ion-exchanger after taking out hydroxide sodium pump and sodium hydroxide feed valve through described, the outlet of described ion-exchanger is connected with the inlet of described sodium hydroxide pond for recovering behind described sodium hydroxide bleeder valve, the described hydroxide sodium pump of taking out pumps into described ion-exchanger with the sodium hydroxide solution in the described sodium hydroxide pond and flows through behind the described extration resin, from the outlet of described ion-exchanger in described sodium hydroxide bleeder valve flow into described sodium hydroxide pond for recovering.
Described tap water feed valve is arranged on the inlet of described ion-exchanger and from the beginning between the water source, the outlet of described ion-exchanger is connected with the inlet of described tap water pond for recovering behind described tap water bleeder valve, described tap water after described tap water feed valve flows into the extration resin of described ion-exchanger, from the outlet of described ion-exchanger in described tap water bleeder valve flow into described tap water pond for recovering.
Compare with prior art, the present invention is used for the ion exchange resin dearsenicating method of acidic etching liquid, the method for resin regeneration and the beneficial effect of treatment system thereof and is:
1, the required material of arsenic removal adopts extration resin, and this extration resin regeneration is simple, easy to operate and cost is lower, is fit to the arsenic removal of printed circuit board acidic etching waste liquor in enormous quantities is handled;
2, whole arsenic removal operating process is simple, and good separating effect is easy to control, helps keeping the various valuable components in the acidic etching waste liquid;
3, it is low to be used for the hydrochloric acid and the sodium hydroxide solution cost of extration resin manipulation of regeneration;
4, arsenic removal treatment system is cleaned easily, and cost is low.
[description of drawings]
Fig. 1 is the rough schematic view that the present invention is used for the ion exchange resin arsenic removal treatment system of acidic etching liquid.
[embodiment]
Below in conjunction with each accompanying drawing the present invention is described in further detail.
A kind of ion exchange resin dearsenicating method that is used for acidic etching liquid is the treating processes in early stage that is used for producing from printed circuit board acidic etching waste liquor basic copper chloride, comprises the steps:
A, fresh extration resin is packed in the ion-exchanger, the chemical name classification of this extration resin is a strongly acidic styrene type cation exchange resin;
B, referring to Fig. 1, pending printed circuit board acidic etching waste liquor pumped into from the inlet of described ion-exchanger carry out arsenic removal in this ion-exchanger and handle, control the velocity of flow of described acidic etching waste liquid in described ion-exchanger, be allowed to condition at that the mobile time remained on 20~40 minutes in this ion-exchanger, flow out from the outlet of described ion-exchanger then, obtain the printed circuit board acidic etching waste liquor after the arsenic removal; Flow when the feed valve 30 among Fig. 1 can be controlled described acidic etching waste liquid and pumps into, just can control the velocity of flow of described acidic etching waste liquid in described ion-exchanger, usually described acidic etching waste liquid mobile time in described ion-exchanger remained on 30 minutes;
When the volume of C, the acidic etching waste liquid handled when described extration resin was 390~410 times of volume of this extration resin, the adsorptive power of this extration resin reached capacity, and then described extration resin need carry out manipulation of regeneration, and its steps in sequence is as follows:
C 1Referring to Fig. 1, the inlet of hydrochloric acid from described ion-exchanger pumped in this ion-exchanger, make this hydrochloric acid by described extration resin, it is washed, and flow out from the outlet of described ion-exchanger; Washing with hydrochloric acid mainly is that impurity such as the arsenic that will stay described extration resin surface, copper rinse out; Flow when the flow when the hydrochloric acid feed valve 43 among Fig. 1 can be controlled hydrochloric acid and pumps into, hydrochloric acid bleeder valve 45 then can be controlled hydrochloric acid and flow out;
C 2After described hydrochloric acid has washed described extration resin,, then allow tap water flow in this ion-exchanger, make this tap water, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin from the inlet of described ion-exchanger referring to Fig. 1; Washing with tap water mainly is further described extration resin to be rinsed well; Flow when the flow when the tap water feed valve 51 among Fig. 1 can be controlled the tap water inflow, tap water bleeder valve 53 then can be controlled the tap water outflow;
C 3After described tap water has cleaned described extration resin, referring to Fig. 1, the inlet of sodium hydroxide solution from described ion-exchanger pumped in this ion-exchanger, make this sodium hydroxide solution by described extration resin, it is washed, and flow out from the outlet of described ion-exchanger; Washing with sodium hydroxide solution mainly is to stay the hydrochloric acid neutralization on described extration resin surface, makes described extration resin be neutral; Flow when the flow when the sodium hydroxide feed valve 48 among Fig. 1 can be controlled sodium hydroxide solution and pumps into, sodium hydroxide bleeder valve 50 then can be controlled sodium hydroxide solution and flow out;
C 4After described sodium hydroxide solution has washed described extration resin, referring to Fig. 1, then allow tap water flow in this ion-exchanger once more from the inlet of described ion-exchanger, make this tap water by described extration resin, it is washed, and flow out from the outlet of described ion-exchanger; Washing with tap water once more mainly is further described extration resin to be rinsed well; Flow when the flow when the tap water feed valve 51 among Fig. 1 can be controlled the tap water inflow, tap water bleeder valve 53 then can be controlled the tap water outflow;
Through above C 1~C 4Each step, described extration resin manipulation of regeneration finishes, and available its continues to handle printed circuit board acidic etching waste liquor;
Repeating step B, adsorptive power until described extration resin reaches capacity, operation steps C again, and then the acidic etching waste liquid of repeating step B...... after handling through described ion-exchanger arsenic removal, after the clearance of arsenic is lower than 60%, described extration resin needs to change, and should empty described ion-exchanger this moment, repeats implementation step A.Experience according to the applicant's long-term disposal, when the volume of the acidic etching waste liquid of handling when described extration resin is 1900~2100 times of volume of this extration resin, this moment the acidic etching waste liquid after described ion-exchanger arsenic removal is handled, the clearance of arsenic generally can be lower than 60%, just needs to have changed extration resin.
Above-mentioned steps C 1In, the concentration of described hydrochloric acid is 7~10%, and the consumption of this hydrochloric acid is 1.5~2.5 times of described extration resin volume, and this hydrochloric acid is 1.5~2.5 hours by the time of described ion-exchanger.As the concentration that adopts hydrochloric acid is 8%, and the consumption of hydrochloric acid is 2 times of described extration resin volume, and hydrochloric acid is 2 hours by the time of described ion-exchanger.
Above-mentioned steps C 2In, the consumption of described tap water is 1.5~2.5 times of described extration resin volume, this tap water is 20~40 minutes by the time of described ion-exchanger.As described in as the consumption of tap water being 2 times of the extration resin volume, tap water is 30 minutes by the time of described ion-exchanger.
Above-mentioned steps C 3In, the concentration of described sodium hydroxide solution is 7~10%, and the consumption of this sodium hydroxide is 1.5~2.5 times of described extration resin volume, and this sodium hydroxide is 1.5~2.5 hours by the time of described ion-exchanger.As the concentration that adopts sodium hydroxide solution is 8%, and the consumption of sodium hydroxide is 2 times of described extration resin volume, and sodium hydroxide is 2 hours by the time of described ion-exchanger.
Above-mentioned steps C 4In, the consumption of described tap water is 1.5~2.5 times of described extration resin volume, this tap water is 20~40 minutes by the time of described ion-exchanger.As described in as the consumption of tap water being 2 times of the extration resin volume, tap water is 30 minutes by the time of described ion-exchanger.
Referring to Fig. 1, a kind of ion exchange resin arsenic removal treatment system that is used for acidic etching liquid, it is the treatment system in early stage that is used for producing basic copper chloride from printed circuit board acidic etching waste liquor, comprise ion-exchanger 10 and liquid absorbing pump 20 that resin is housed, and be arranged on the feed valve 30 between the outlet of the inlet 11 of described ion-exchanger 10 and liquid absorbing pump 20; Described liquid absorbing pump 20 pumps into the pending acidic etching liquid in the treating pond and carries out arsenic removal in this ion-exchanger 10 and handle from the inlet 11 of described ion-exchanger 10, the acidic etching liquid after arsenic removal is handled is from outlet 12 pond in the middle of bleeder valve 31 flows out to of described ion-exchanger 10; Described resin is an extration resin, and the chemical name classification of this extration resin is a strongly acidic styrene type cation exchange resin; Described arsenic removal treatment system also comprises the extration resin regenerating unit, and this extration resin regenerating unit comprises hydrochloric acid pond 41, takes out hydrochloric acid pump 42, hydrochloric acid feed valve 43, hydrochloric acid pond for recovering 44, hydrochloric acid bleeder valve 45, sodium hydroxide pond 46, take out hydroxide sodium pump 47, sodium hydroxide feed valve 48, sodium hydroxide pond for recovering 49, sodium hydroxide bleeder valve 50, tap water feed valve 51, tap water pond for recovering 52 and tap water bleeder valve 53.
The outlet in described hydrochloric acid pond 41 is connected with the inlet 11 of described ion-exchanger 10 after taking out hydrochloric acid pump 42 and hydrochloric acid feed valve 43 through described, the outlet 12 of described ion-exchanger 10 is connected with the inlet of described hydrochloric acid pond for recovering 44 behind described hydrochloric acid bleeder valve 45, the described hydrochloric acid pump 42 of taking out pumps into described ion-exchanger 10 with the hydrochloric acid in the described hydrochloric acid pond 41 and flows through behind the described extration resin, from the outlet 12 of described ion-exchanger 10 in described hydrochloric acid bleeder valve 45 flow into described hydrochloric acid pond for recovering 44.
The outlet in described sodium hydroxide pond 46 is connected with the inlet 11 of described ion-exchanger 10 after taking out hydroxide sodium pump 47 and sodium hydroxide feed valve 48 through described, the outlet 12 of described ion-exchanger 10 is connected with the inlet of described sodium hydroxide pond for recovering 49 behind described sodium hydroxide bleeder valve 50, the described hydroxide sodium pump 47 of taking out pumps into described ion-exchanger 10 with the sodium hydroxide solutions in the described sodium hydroxide pond 46 and flows through behind the described extration resin, from the outlet 12 of described ion-exchanger 10 in described sodium hydroxide bleeder valve 50 flow into described sodium hydroxide pond for recovering 49.
Described tap water feed valve 51 is arranged on the inlet 11 of described ion-exchanger 10 and from the beginning between the water source, the outlet 12 of described ion-exchanger 10 is connected with the inlet of described tap water pond for recovering 52 behind described tap water bleeder valve 53, described tap water after described tap water feed valve 51 flows into the extration resin of described ion-exchanger 10, from the outlet 12 of described ion-exchanger 10 in described tap water bleeder valve 53 flow into described tap water pond for recovering 52.
One of preferred embodiment:
A kind of pending printed circuit board acidic etching waste liquor, its arsenic content is 4ppm, i.e. 4 mg/litre, make its present invention that flows through be used for the ion exchange resin arsenic removal treatment system of acidic etching liquid, the ion exchange resin dearsenicating method that adopts the present invention to be used for acidic etching liquid is handled, and obtains the printed circuit board acidic etching waste liquor after the arsenic removal, and its arsenic content is reduced to 1.2ppm, i.e. 1.2 mg/litre, the clearance of arsenic is 70%; The model of used extration resin is extration resin 941 types; In the arsenic removal treating processes, the feed valve of regulating among Fig. 1 30 is controlled the velocity of flow of described acidic etching waste liquid in described ion-exchanger, described acidic etching waste liquid mobile time in described ion-exchanger was remained on 30 minutes, and the volume of the acidic etching waste liquid of handling when described extration resin just need carry out manipulation of regeneration to described extration resin when being 400 times of volume of this extration resin; Usually, when the volume of the acidic etching waste liquid of handling when described extration resin is 2000 times of volume of this extration resin, this moment the acidic etching waste liquid after described ion-exchanger arsenic removal is handled, the clearance of arsenic generally can be lower than 60%, just needs to have changed extration resin.
Be used to produce basic copper chloride, very low, the up to specification technological standard of arsenic content of products obtained therefrom basic copper chloride through the printed circuit board acidic etching waste liquor after the arsenic removal processing of the present invention.
The above embodiment has only expressed preferred implementation of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention; Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention; Therefore, all equivalents and modifications of being done with claim scope of the present invention all should belong to the covering scope of claim of the present invention.

Claims (10)

1. an ion exchange resin dearsenicating method that is used for acidic etching liquid is the treating processes in early stage that is used for producing from printed circuit board acidic etching waste liquor basic copper chloride, comprises the steps:
A, fresh extration resin is packed in the ion-exchanger;
B, pending printed circuit board acidic etching waste liquor pumped into from the inlet of described ion-exchanger carry out arsenic removal in this ion-exchanger and handle, control the velocity of flow of described acidic etching waste liquid in described ion-exchanger, be allowed to condition at that the mobile time remained on 20~40 minutes in this ion-exchanger, flow out from the outlet of described ion-exchanger then, obtain the printed circuit board acidic etching waste liquor after the arsenic removal;
When the volume of C, the acidic etching waste liquid handled when described extration resin was 390~410 times of volume of this extration resin, the adsorptive power of this extration resin reached capacity, and then described extration resin need carry out manipulation of regeneration, and its steps in sequence is as follows:
C 1The inlet of hydrochloric acid from described ion-exchanger pumped in this ion-exchanger, make this hydrochloric acid, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 2After described hydrochloric acid has washed described extration resin, then allow tap water flow in this ion-exchanger, make this tap water, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin from the inlet of described ion-exchanger;
C 3After described tap water has cleaned described extration resin, the inlet of sodium hydroxide solution from described ion-exchanger pumped in this ion-exchanger, make this sodium hydroxide solution, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 4After described sodium hydroxide solution has washed described extration resin, then allow tap water flow in this ion-exchanger once more from the inlet of described ion-exchanger, make this tap water by described extration resin, it is washed, and flow out from the outlet of described ion-exchanger;
Through above C 1~C 4Each step, described extration resin manipulation of regeneration finishes, and available its continues to handle printed circuit board acidic etching waste liquor;
Repeating step B, adsorptive power to described extration resin reaches capacity, operation steps C again, and then the acidic etching waste liquid of repeating step B...... after handling through described ion-exchanger arsenic removal, after the clearance of arsenic is lower than 60%, described extration resin needs to change, and should empty described ion-exchanger this moment, repeats implementation step A.
2. the ion exchange resin dearsenicating method that is used for acidic etching liquid according to claim 1 is characterized in that:
Step C 1In, the concentration of described hydrochloric acid is 7~10%, and the consumption of this hydrochloric acid is 1.5~2.5 times of described extration resin volume, and this hydrochloric acid is 1.5~2.5 hours by the time of described ion-exchanger.
3. the ion exchange resin dearsenicating method that is used for acidic etching liquid according to claim 1 is characterized in that:
Step C 2In, the consumption of described tap water is 1.5~2.5 times of described extration resin volume, this tap water is 20~40 minutes by the time of described ion-exchanger.
4. the ion exchange resin dearsenicating method that is used for acidic etching liquid according to claim 1 is characterized in that:
Step C 3In, the concentration of described sodium hydroxide solution is 7~10%, and the consumption of this sodium hydroxide is 1.5~2.5 times of described extration resin volume, and this sodium hydroxide is 1.5~2.5 hours by the time of described ion-exchanger.
5. the ion exchange resin dearsenicating method that is used for acidic etching liquid according to claim 1 is characterized in that:
Step C 4In, the consumption of described tap water is 1.5~2.5 times of described extration resin volume, this tap water is 20~40 minutes by the time of described ion-exchanger.
6. the method for the used ion exchange resin regeneration of acidic etching liquid arsenic removal, it is characterized in that: used resin is an extration resin, when the volume of the acidic etching waste liquid of handling when described extration resin is 390~410 times of volume of this extration resin, the adsorptive power of this extration resin reaches capacity, then described extration resin need carry out manipulation of regeneration, comprises the steps: according to this
C 1The inlet of hydrochloric acid from described ion-exchanger pumped in this ion-exchanger, make this hydrochloric acid, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 2After described hydrochloric acid has washed described extration resin, then allow tap water flow in this ion-exchanger, make this tap water, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin from the inlet of described ion-exchanger;
C 3After described tap water has cleaned described extration resin, the inlet of sodium hydroxide solution from described ion-exchanger pumped in this ion-exchanger, make this sodium hydroxide solution, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin;
C 4After described sodium hydroxide has washed described extration resin, then allow tap water flow in this ion-exchanger once more, make this tap water, it is washed, and flow out from the outlet of described ion-exchanger by described extration resin from the inlet of described ion-exchanger;
Through above C 1~C 4Each step, described extration resin manipulation of regeneration finishes, and can be reused for the processing printed circuit board acidic etching waste liquor.
7. the method for the used ion exchange resin regeneration of acidic etching liquid arsenic removal according to claim 6 is characterized in that:
Described step C 1In, the concentration of described hydrochloric acid is 7~10%, and the consumption of this hydrochloric acid is 1.5~2.5 times of described extration resin volume, and this hydrochloric acid is 1.5~2.5 hours by the time of described ion-exchanger.
8. the method for the used ion exchange resin regeneration of acidic etching liquid arsenic removal according to claim 6 is characterized in that:
Described step C 2And C 4In, the consumption of described tap water is 1.5~2.5 times of described extration resin volume, this tap water is 20~40 minutes by the time of described ion-exchanger.
9. the method for the used ion exchange resin regeneration of acidic etching liquid arsenic removal according to claim 6 is characterized in that:
Described step C 3In, the concentration of described sodium hydroxide solution is 7~10%, and the consumption of this sodium hydroxide is 1.5~2.5 times of described extration resin volume, and this sodium hydroxide is 1.5~2.5 hours by the time of described ion-exchanger.
10. ion exchange resin arsenic removal treatment system that is used for acidic etching liquid, it is the treatment system in early stage that is used for producing basic copper chloride from printed circuit board acidic etching waste liquor, comprise ion-exchanger (10) and liquid absorbing pump (20) that resin is housed, and be arranged on the feed valve (30) between the outlet of the inlet (11) of described ion-exchanger (10) and liquid absorbing pump (20); Described liquid absorbing pump (20) pumps into pending acidic etching liquid and carries out arsenic removal in this ion-exchanger (10) and handle from the inlet (11) of described ion-exchanger (10), the acidic etching liquid after arsenic removal is handled flows out through bleeder valve (31) from the outlet (12) of described ion-exchanger (10); It is characterized in that:
Described resin is an extration resin; Described ion exchange resin arsenic removal treatment system also comprises the extration resin regenerating unit, and this extration resin regenerating unit comprises hydrochloric acid pond (41), takes out hydrochloric acid pump (42), hydrochloric acid feed valve (43), hydrochloric acid pond for recovering (44), hydrochloric acid bleeder valve (45), sodium hydroxide pond (46), take out hydroxide sodium pump (47), sodium hydroxide feed valve (48), sodium hydroxide pond for recovering (49), sodium hydroxide bleeder valve (50), tap water feed valve (51), tap water pond for recovering (52) and tap water bleeder valve (53);
The outlet in described hydrochloric acid pond (41) is connected with the inlet (11) of described ion-exchanger (10) after taking out hydrochloric acid pump (42) and hydrochloric acid feed valve (43) through described, the outlet (12) of described ion-exchanger (10) is connected with the inlet of described hydrochloric acid pond for recovering (44) behind described hydrochloric acid bleeder valve (45), the described hydrochloric acid pump (42) of taking out pumps into described ion-exchanger (10) with the hydrochloric acid in the described hydrochloric acid pond (41) and flows through behind the described extration resin, from the outlet (12) of described ion-exchanger (10) in described hydrochloric acid bleeder valve (45) flow into described hydrochloric acid pond for recovering (44);
The outlet in described sodium hydroxide pond (46) is connected with the inlet (11) of described ion-exchanger (10) after taking out hydroxide sodium pump (47) and sodium hydroxide feed valve (48) through described, the outlet (12) of described ion-exchanger (10) is connected with the inlet of described sodium hydroxide pond for recovering (49) behind described sodium hydroxide bleeder valve (50), the described hydroxide sodium pump (47) of taking out pumps into described ion-exchanger (10) with the sodium hydroxide solution in the described sodium hydroxide pond (46) and flows through behind the described extration resin, from the outlet (12) of described ion-exchanger (10) in described sodium hydroxide bleeder valve (50) flow into described sodium hydroxide pond for recovering (49);
Described tap water feed valve (51) is arranged on the inlet (11) of described ion-exchanger (10) and from the beginning between the water source, the outlet (12) of described ion-exchanger (10) is connected with the inlet of described tap water pond for recovering (52) behind described tap water bleeder valve (53), described tap water after described tap water feed valve (51) flows into the extration resin of described ion-exchanger (10), from the outlet (12) of described ion-exchanger (10) in described tap water bleeder valve (53) flow into described tap water pond for recovering (52).
CN 201010242923 2010-07-30 2010-07-30 Ion exchange resin arsenic removal method for acidic etching liquid, resin regeneration method and treatment system thereof Active CN102285704B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010242923 CN102285704B (en) 2010-07-30 2010-07-30 Ion exchange resin arsenic removal method for acidic etching liquid, resin regeneration method and treatment system thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201010242923 CN102285704B (en) 2010-07-30 2010-07-30 Ion exchange resin arsenic removal method for acidic etching liquid, resin regeneration method and treatment system thereof

Publications (2)

Publication Number Publication Date
CN102285704A true CN102285704A (en) 2011-12-21
CN102285704B CN102285704B (en) 2013-07-03

Family

ID=45332493

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201010242923 Active CN102285704B (en) 2010-07-30 2010-07-30 Ion exchange resin arsenic removal method for acidic etching liquid, resin regeneration method and treatment system thereof

Country Status (1)

Country Link
CN (1) CN102285704B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103230892A (en) * 2013-04-07 2013-08-07 北京工业大学 Self-cleaning system for hydrophilicity and hydrophobicity analysis resin and cleaning method
CN106115982A (en) * 2016-08-29 2016-11-16 湖南艾布鲁环保科技有限公司 A kind of antimony and the processing means of association slag landfill percolate and method
CN106587263A (en) * 2016-12-19 2017-04-26 广州达意隆包装机械股份有限公司 Water treatment device, ion exchanger decontamination method and water treatment method
CN109133497A (en) * 2018-08-02 2019-01-04 深圳市华星光电技术有限公司 Liquid waste treating apparatus and method for treating waste liquid
CN110095331A (en) * 2018-01-29 2019-08-06 中国辐射防护研究院 A kind of the experiment pretreatment unit and preprocess method of unused resin
CN114180672A (en) * 2021-04-22 2022-03-15 江苏和达电子科技有限公司 Etching solution recovery system and application thereof
CN114308142A (en) * 2022-01-05 2022-04-12 韶关绿鑫环保技术有限公司 Copper ion exchange column analysis process

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640481A (en) * 1979-09-13 1981-04-16 Kumamotoken Treating method for exhaust water
WO2004007372A1 (en) * 2002-07-15 2004-01-22 Magnesium Elektron, Inc Hydrous zirconium oxide, hydrous hafnium oxide and method of making same
CN1544347A (en) * 2003-11-19 2004-11-10 �Ϻ���ͨ��ѧ Processing method of cupric ion of phthalocyanine green waste water using 335 type alkalescence anion resin
US20090020477A1 (en) * 2007-07-20 2009-01-22 Thermax Limited Medium for removal of arsenic from water
CN201770518U (en) * 2010-07-30 2011-03-23 深圳东江华瑞科技有限公司 Ion-exchange resin dearsenifying treatment system for acidic etching solution

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640481A (en) * 1979-09-13 1981-04-16 Kumamotoken Treating method for exhaust water
WO2004007372A1 (en) * 2002-07-15 2004-01-22 Magnesium Elektron, Inc Hydrous zirconium oxide, hydrous hafnium oxide and method of making same
CN1544347A (en) * 2003-11-19 2004-11-10 �Ϻ���ͨ��ѧ Processing method of cupric ion of phthalocyanine green waste water using 335 type alkalescence anion resin
US20090020477A1 (en) * 2007-07-20 2009-01-22 Thermax Limited Medium for removal of arsenic from water
CN201770518U (en) * 2010-07-30 2011-03-23 深圳东江华瑞科技有限公司 Ion-exchange resin dearsenifying treatment system for acidic etching solution

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
周锦帆: "溶剂浸渍树脂与萃淋树脂", 《化学世界》 *
彭福全等: "离子交换法除砷", 《湖南科技学院学报》 *
许玉宇等: "铁铅砷镍钴在CL-TBP萃淋树脂柱上的分离性能及其分配系数的测定和应用", 《理化检验-化学分册》 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103230892A (en) * 2013-04-07 2013-08-07 北京工业大学 Self-cleaning system for hydrophilicity and hydrophobicity analysis resin and cleaning method
CN106115982A (en) * 2016-08-29 2016-11-16 湖南艾布鲁环保科技有限公司 A kind of antimony and the processing means of association slag landfill percolate and method
CN106587263A (en) * 2016-12-19 2017-04-26 广州达意隆包装机械股份有限公司 Water treatment device, ion exchanger decontamination method and water treatment method
CN110095331A (en) * 2018-01-29 2019-08-06 中国辐射防护研究院 A kind of the experiment pretreatment unit and preprocess method of unused resin
CN109133497A (en) * 2018-08-02 2019-01-04 深圳市华星光电技术有限公司 Liquid waste treating apparatus and method for treating waste liquid
CN114180672A (en) * 2021-04-22 2022-03-15 江苏和达电子科技有限公司 Etching solution recovery system and application thereof
CN114180672B (en) * 2021-04-22 2024-03-19 江苏和达电子科技有限公司 Etching solution recovery system and application thereof
CN114308142A (en) * 2022-01-05 2022-04-12 韶关绿鑫环保技术有限公司 Copper ion exchange column analysis process

Also Published As

Publication number Publication date
CN102285704B (en) 2013-07-03

Similar Documents

Publication Publication Date Title
CN102285704B (en) Ion exchange resin arsenic removal method for acidic etching liquid, resin regeneration method and treatment system thereof
CN102703703B (en) Continuous ion exchange device and method for removing boron from salt lake magnesium chloride brine
CN104129831B (en) Method for simultaneous removal and recovery of heavy metal ions and organic acid by using chelating resin
CN105439326A (en) Treatment method of chemical nickel-plating wastewater
CN103086545A (en) Method and device for removing and recovering heavy metal in waste water through regenerated active carbon
CN103553249A (en) Method for acid separation and heavy metal recovery in electroplating waste liquor
CN103693773A (en) Chromium-containing waste water reuse treatment method
CN105174577A (en) Coal chemical wastewater pretreatment process and device
CN202705485U (en) Cyclic regeneration system for alkaline etching solution
CN201770518U (en) Ion-exchange resin dearsenifying treatment system for acidic etching solution
CN102649608B (en) Process method for treating mine acidic waste water
RU2489510C2 (en) Extraction method of natural uranium concentrate from sulphuric acid solutions of underground leaching, and plant for its implementation
CN114159835A (en) Automatic circulating cadmium removal device and method for cobalt chloride solution
CN103043834A (en) Rear earth smelting wastewater treatment process
CN207567053U (en) A kind of packaged type fluorine-containing waste water processing apparatus
CN105293745B (en) Cold-rolling pickling wastewater recycling treatment process system
CN217015415U (en) Automatic circulating cadmium removing device for cobalt chloride solution
CN212127781U (en) Nickel recovery device for waste battery wastewater
CN204981457U (en) Coal chemical wastewater preprocessing device
CN104973710A (en) Method of treating high-concentration arsenic and cadmium in acidic waste water with granular titanium dioxide
CN209872557U (en) System for separating acid and salt in wastewater
CN204111462U (en) New water treatment for reuse device
CN202744362U (en) Wastewater deacidifying and recovery equipment
CN109761383B (en) Recycling and treating method and recycling and treating system for heavy metal wastewater
CN104418446B (en) The processing method of low concentration lead waste water and equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 518104 Dongjiang Environmental Protection Workshop, Gonghe Fifth Industrial Zone, Shajing Street, Baoan District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen Dongjiang Feed Additives Co., Ltd.

Address before: 518104 Dongjiang Environmental Protection Workshop, Gonghe Fifth Industrial Zone, Shajing Street, Baoan District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen Dongjiang Huarui Technology Co.,Ltd.

CP01 Change in the name or title of a patent holder