CN102271465B - Method for manufacturing PCB (printed circuit board) with hot-pluggable golden fingers - Google Patents
Method for manufacturing PCB (printed circuit board) with hot-pluggable golden fingers Download PDFInfo
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- CN102271465B CN102271465B CN 201110178016 CN201110178016A CN102271465B CN 102271465 B CN102271465 B CN 102271465B CN 201110178016 CN201110178016 CN 201110178016 CN 201110178016 A CN201110178016 A CN 201110178016A CN 102271465 B CN102271465 B CN 102271465B
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Abstract
The invention discloses a method for manufacturing a PCB (printed circuit board) with hot-pluggable golden fingers. When the method is used for manufacturing the PCB with golden fingers of different lengths, a through hole is arranged at the tail end of each of all golden fingers, electroplating leads are arranged on an inner layer of the PCB and the golden fingers are connected with an external electroplating side of the PCB through the through holes and the electroplating leads so as to realize electroplating processing of the golden fingers; and then holes are drilled 10-50 mm away from a visible line to cut off the electroplating leads which are located in the inner layer, forming is carried out according to a forming size and the whole electroplating process of the golden fingers is finished. Compared with the prior art, the invention solves the problem that a manner that the golden fingers are nickel-electroplated by adding leads at a periphery of a plane where the golden fingers are located cannot be adopted to manufacture the PCB when the lengths of the golden fingers of the PCB are different, avoids the problems of high production cost caused by etching the leads of the golden fingers through adopting a plurality of times of pattern-transferring and the damage caused by etching the leads of the golden fingers and exposing copper on side walls of the golden fingersand ensures the practicability and the reliability of the whole board.
Description
Technical field
The present invention relates to the PCB manufacturing technology, particularly a kind of manufacture method of warm swap golden finger pcb board.
Background technology
Along with the development of electronic technology, the electronic equipment of the long-time energisings of some needs has appearred, and these electronic equipments even break down, do not allow outage in order to guarantee user's use needs yet.For this reason, need in this case to adopt charged hot plug technology.
When carrying out charged hot plug, the plug circuit board can not destroy wiring board under the open state in order to make, and need to adopt warm swap golden finger pcb board, and golden finger is different in size in this golden finger pcb board.
Manufacturing and designing of conventional golden finger is when making circuit all golden finger plane peripheries to be linked to each other by lead-in wire, after roasting after welding resistance leaded golden finger is carried out the electronickelling gold, but not the golden finger part then adopts blue adhesive tape to seal, and after the electronickelling gold is finished the lead-in wire on the golden finger is excised.
But for pcb board golden finger situation different in size, just can not adopt and add the mode that lead-in wire carries out the electronickelling gold at golden finger plane periphery and make, this is because the pcb board golden finger is different in size, carry out the electronickelling gold if add lead-in wire at golden finger plane periphery, gold finger lead is removed and is had certain difficulty, if it is flat directly to adopt chamfering that lead-in wire is cut, can cause the isometric problem of all golden finger length, can't meet design requirement.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of manufacture method of warm swap golden finger pcb board, when solving present making golden finger pcb board different in size, adopt to add lead-in wire at golden finger plane periphery and carry out the problem that the large and golden finger length violation of the existing removal lead-in wire of electronickelling gold difficulty closes designing requirement.
For achieving the above object, the present invention is mainly by the following technical solutions:
A kind of manufacture method of warm swap golden finger pcb board comprises step:
A, make multilayer circuit board by the figure trans-printing, and form at the internal layer of multilayer circuit board and to electroplate gold finger lead, this plating gold finger lead one end extends to the skin of multilayer circuit board and electroplates under the limit, and the described outer inboard, limit of electroplating is provided with object line;
B, via hole is set under electroplating the limit multi-layer sheet is outer, makes multi-layer sheet internal layer gold finger lead electroplate the limit conducting with outer;
C, the end of all golden fingers arranges network conductors and the corresponding via hole of via hole or setting and golden finger conducting on multilayer circuit board, makes golden finger pass through described via hole and is connected with the other end of above-mentioned internal layer electroplate lead wire;
D, above-mentioned multilayer circuit board is carried out outer-layer circuit make, after it is finished, carry out roasting curing after the welding resistance, carry out afterwards the electrogilding finger and process;
E, on multilayer circuit board, hole from above-mentioned object line distance 10～50mm place, the internal layer electroplate lead wire is bored break.
The via hole that wherein the golden finger end arranges on the multilayer circuit board among the step C forms when file process.
Wherein on multilayer circuit board, hole from object line 10～50mm place in the step e, described bore position be positioned at electroplate lead wire directly over.
Wherein hole from object line 10～50mm place on multilayer circuit board in the step e, the diameter of holing is than the large 0.5mm of electroplate lead wire diameter.
Wherein step e specifically comprises:
Golden finger different in size institute correspondence position is holed apart from object line 10～50mm place on multilayer circuit board, the internal layer electroplate lead wire is bored disconnected.
Wherein also comprise after the step e:
With the corresponding electroplate lead wire excision of the identical golden finger of length on the multilayer circuit board.
The present invention is when making golden finger pcb board different in size, end at all golden fingers arranges a via hole, and the internal layer at this pcb board arranges electroplate lead wire, by via hole, electroplate lead wire golden finger being electroplated the limit with the skin of pcb board is connected, realization is holed at pcb board afterwards to the electroplating processes of golden finger, and the electroplate lead wire that will be arranged in internal layer bores disconnected, the electroplate lead wire of then brill being had no progeny excises, and finishes the electroplating processes of whole golden finger.
Compared with prior art, the invention solves the pcb board golden finger when different in size, can not adopt at golden finger plane periphery and add the problem that mode that lead-in wire carries out electrogilding finger nickel gold is made, avoid simultaneously or adopt repeatedly figure to shift and carry out the high production cost that the etching gold finger lead causes, also to removing the problem that gold finger lead exposes golden finger sidewall copper institute injury because of etching, guaranteed practicality and the reliability of whole plate.
Description of drawings
Fig. 1 is the vertical view of warm swap golden finger pcb board of the present invention.
Fig. 2 is the cutaway view of warm swap golden finger pcb board of the present invention.
Fig. 3 is workflow diagram of the present invention.
Embodiment
For setting forth thought of the present invention and purpose, the present invention is described further below in conjunction with the drawings and specific embodiments.
See also Fig. 1, shown in Figure 2, Fig. 1 is the vertical view of warm swap golden finger pcb board of the present invention; Fig. 2 is the cutaway view of warm swap golden finger pcb board of the present invention.
Warm swap golden finger pcb board of the present invention is multilayer circuit board, include a plurality of golden fingers different in size, inner cord is provided with the internal layer electroplate lead wire, and the corresponding golden finger of each root electroplate lead wire, the end of described golden finger is provided with network conductors and the corresponding via hole of a via hole or setting and golden finger conducting.Be provided with around peripheral on the multilayer circuit board and electroplate the limit, this inboard, plating limit is provided with object line, one end of above-mentioned internal layer electroplate lead wire is connected to this plating limit by via hole, and be connected to electroplate the limit and be provided with boring from object line 10～50mm place, described boring correspondence be positioned at the internal layer electroplate lead wire directly over.
The other end of internal layer electroplate lead wire be positioned at golden finger terminal via hole under, and be connected with golden finger by this via hole.
As shown in Figure 3, Fig. 3 is workflow diagram of the present invention.The present invention also provides a kind of manufacture method of warm swap golden finger pcb board, and it comprises that specifically step is as follows:
A, make multilayer circuit board by the figure trans-printing, and form at the internal layer of multilayer circuit board and to electroplate gold finger lead, this plating gold finger lead one end extends to the skin of multilayer circuit board and electroplates under the limit, and the described outer inboard, limit of electroplating is provided with object line;
Wherein carry out each layer of inner figure trans-printing circuit, and press layer formation multilayer circuit board, wherein when carrying out the figure trans-printing, need to form corresponding plating gold finger lead at internal layer, the plating gold finger lead here is according to user's design needs, the position that is needing in advance; Be provided with around the periphery of multilayer circuit board and electroplate the limit, this inboard, plating limit is provided with object line.
Above-mentioned plating gold finger lead is when designing, and the one end is to be connected to the skin that is positioned at multilayer circuit board to electroplate under the limit, and it mainly is to carry out electroplating processes by this plating limit.
Because above-mentioned plating gold finger lead is positioned at the wiring board internal layer, not in PCB surface, therefore whole plating and processing afterwards can not affect the profile of product.
B, via hole is set under electroplating the limit multi-layer sheet is outer, makes multi-layer sheet internal layer gold finger lead electroplate the limit conducting with outer;
Also correspondence arranges porose on skin plating limit, these holes corresponding be arranged on the outer via hole of electroplating under the limit of multi-layer sheet, be connected with via hole by this hole and realize being communicated with of hole on electroplate lead wire and the outer plating limit, its main purpose is that the plating gold finger lead that is positioned at internal layer is communicated with the outer limit of electroplating, and is convenient to follow-up electroplating processes.
C, the end of all golden fingers arranges network conductors and the corresponding via hole of via hole or setting and golden finger conducting on multilayer circuit board, makes golden finger pass through described via hole and is connected with the other end of above-mentioned internal layer electroplate lead wire;
Network conductors and the corresponding via hole of via hole or setting and golden finger conducting are set at the end of all golden fingers of multilayer circuit board, it mainly is when making graphic file, network conductors and the corresponding via hole of a via hole or setting and golden finger conducting are set at all golden finger terminal positions in advance, in the conducting transmission line plate manufacturing process, form via hole or network conductors in the position that is provided with via hole, this via hole links together with the lead-in wire that is positioned at internal layer.
D, above-mentioned multilayer circuit board is carried out outer-layer circuit make, after it is finished, carry out roasting curing after the welding resistance, carry out afterwards the electrogilding finger and process;
When golden finger is electroplated the limit when being communicated with by the skin of electroplate lead wire and multilayer circuit board, at first above-mentioned multilayer circuit board is carried out roasting curing after the welding resistance, then golden finger is carried out electroplating processes, make its surface formation nickel-gold layer.
E, on multilayer circuit board, hole from above-mentioned object line distance 10～50mm place, the internal layer electroplate lead wire is bored break.
The golden finger that wherein differs for those length, need on multilayer circuit board, hole from object line 10～50mm place at these golden finger positions, described bore position be positioned at electroplate lead wire directly over, and the diameter of holing is than the large 0.5mm of electroplate lead wire diameter, when holing, can directly directly bore the electroplate lead wire that is positioned at the boring below disconnected like this.
And for the same golden finger of those length, directly get final product from the excision of internal layer gold finger lead in the time of then its lead-in wire can being passed through shape molding.
More than be that manufacture method to a kind of warm swap golden finger pcb board provided by the present invention is described in detail, used specific case herein structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (6)
1. the manufacture method of a warm swap golden finger pcb board is characterized in that comprising step:
A, make multilayer circuit board by the figure trans-printing, and form at the internal layer of multilayer circuit board and to electroplate gold finger lead, this plating gold finger lead one end extends to the skin of multilayer circuit board and electroplates under the limit, and the described outer inboard, limit of electroplating is provided with object line;
B, via hole is set under electroplating the limit multi-layer sheet is outer, makes multi-layer sheet electroplate gold finger lead and electroplate the limit conducting with outer;
C, the end of all golden fingers arranges network conductors and the corresponding via hole of via hole or setting and golden finger conducting on multilayer circuit board, and golden finger is connected by the other end of described via hole with above-mentioned plating gold finger lead;
D, above-mentioned multilayer circuit board is carried out outer-layer circuit make, after it is finished, carry out roasting curing after the welding resistance, carry out afterwards the electrogilding finger and process;
E, on multilayer circuit board, hole from above-mentioned object line distance 10～50mm place, will electroplate the gold finger lead brill and break.
2. the manufacture method of warm swap golden finger pcb board according to claim 1 is characterized in that the via hole that the golden finger end arranges on the multilayer circuit board among the step C forms when file process.
3. the manufacture method of warm swap golden finger pcb board according to claim 1 is characterized in that holing from object line 10～50mm place on multilayer circuit board in the step e, described bore position be positioned at electroplate gold finger lead directly over.
4. the manufacture method of warm swap golden finger pcb board according to claim 1 is characterized in that holing from object line 10～50mm place on multilayer circuit board in the step e, and the diameter of holing is than the large 0.5mm of electrogilding finger diameter wire.
5. the manufacture method of warm swap golden finger pcb board according to claim 1 is characterized in that step e specifically comprises:
Golden finger different in size institute correspondence position is holed apart from object line 10～50mm place on multilayer circuit board, will electroplate gold finger lead and bore disconnected.
6. the manufacture method of warm swap golden finger pcb board according to claim 1 is characterized in that also comprising after the step e:
With the corresponding plating gold finger lead excision of the identical golden finger of length on the multilayer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110178016 CN102271465B (en) | 2011-06-28 | 2011-06-28 | Method for manufacturing PCB (printed circuit board) with hot-pluggable golden fingers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110178016 CN102271465B (en) | 2011-06-28 | 2011-06-28 | Method for manufacturing PCB (printed circuit board) with hot-pluggable golden fingers |
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| Publication Number | Publication Date |
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| CN102271465A CN102271465A (en) | 2011-12-07 |
| CN102271465B true CN102271465B (en) | 2013-01-02 |
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| CN 201110178016 Active CN102271465B (en) | 2011-06-28 | 2011-06-28 | Method for manufacturing PCB (printed circuit board) with hot-pluggable golden fingers |
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Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548206B (en) * | 2012-02-20 | 2014-07-09 | 华为技术有限公司 | Golden finger, terminal and communication equipment mainboard |
| CN104300245A (en) * | 2013-07-15 | 2015-01-21 | 华为技术有限公司 | Pluggable equipment |
| CN105813397A (en) | 2016-04-11 | 2016-07-27 | 广州兴森快捷电路科技有限公司 | Method for improving corrosion resistance of golden finger |
| CN105932447B (en) | 2016-06-01 | 2018-03-20 | 华为技术有限公司 | golden finger connector, circuit board and connector assembly |
| CN106455343B (en) * | 2016-11-30 | 2019-02-05 | 深圳市景旺电子股份有限公司 | A kind of minimizing technology of gold finger lead |
| CN106852025A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of preparation method of golden finger |
| CN108882558A (en) * | 2017-05-15 | 2018-11-23 | 北大方正集团有限公司 | The gold plating method and golden finger circuit board of golden finger |
| CN107241874B (en) * | 2017-08-09 | 2021-07-20 | 博敏电子股份有限公司 | Manufacturing method of printed circuit board adopting inner lead gold immersion and gold plating composite process |
| CN107484354A (en) * | 2017-08-15 | 2017-12-15 | 胜宏科技（惠州）股份有限公司 | A kind of method for manufacturing gold finger of no lead residual |
| CN108260291A (en) * | 2017-11-30 | 2018-07-06 | 深圳崇达多层线路板有限公司 | It is a kind of based on filling holes with resin and back drill technique without the remaining electro-plating method of lead |
| CN108925034A (en) * | 2018-07-09 | 2018-11-30 | 湖北金禄科技有限公司 | A kind of processing method and golden finger multilayer circuit board of golden finger |
| CN109121289A (en) * | 2018-08-13 | 2019-01-01 | 鹤山市中富兴业电路有限公司 | A kind of PCB and its cabling mode with gold plated lead internal layer Wiring structure |
| CN111031674B (en) * | 2019-11-21 | 2023-04-21 | 惠州美锐电子科技有限公司 | Method for removing selective electroplating edge at specific position on PCB |
| CN113271726B (en) * | 2021-05-18 | 2022-03-04 | 广州广合科技股份有限公司 | Three-side gold plating method for gold finger |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI397358B (en) * | 2008-02-14 | 2013-05-21 | Nan Ya Printed Circuit Board | Wire bonding substrate and fabrication thereof |
| CN101643927B (en) * | 2008-08-05 | 2011-04-20 | 北大方正集团有限公司 | Method for manufacturing printed circuit board gold finger |
| CN101795543B (en) * | 2010-03-25 | 2011-12-21 | 淳华科技(昆山)有限公司 | Method for manufacturing gold finger |
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