CN102271464B - 电路板品质的追踪方法 - Google Patents
电路板品质的追踪方法 Download PDFInfo
- Publication number
- CN102271464B CN102271464B CN201010193724.4A CN201010193724A CN102271464B CN 102271464 B CN102271464 B CN 102271464B CN 201010193724 A CN201010193724 A CN 201010193724A CN 102271464 B CN102271464 B CN 102271464B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- identification code
- product area
- substrate
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010330 laser marking Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 claims 1
- 238000004148 unit process Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 58
- 239000010410 layer Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000005755 formation reaction Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010193724.4A CN102271464B (zh) | 2010-06-07 | 2010-06-07 | 电路板品质的追踪方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010193724.4A CN102271464B (zh) | 2010-06-07 | 2010-06-07 | 电路板品质的追踪方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102271464A CN102271464A (zh) | 2011-12-07 |
CN102271464B true CN102271464B (zh) | 2014-11-26 |
Family
ID=45053585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010193724.4A Expired - Fee Related CN102271464B (zh) | 2010-06-07 | 2010-06-07 | 电路板品质的追踪方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102271464B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103118482B (zh) * | 2012-12-28 | 2015-08-05 | 威力盟电子(苏州)有限公司 | 具有质量辨识标记的电路板及其辨识方法 |
CN104299106A (zh) * | 2014-11-03 | 2015-01-21 | 叶校然 | 一种pcb企业产品追踪查询系统 |
CN104582328B (zh) * | 2014-12-22 | 2017-09-29 | 东莞美维电路有限公司 | 防排板错误的pcb板生产工艺 |
CN105208803A (zh) * | 2015-09-24 | 2015-12-30 | 高德(无锡)电子有限公司 | 一种多层板层次放错的防呆方法 |
CN106373904B (zh) * | 2016-09-29 | 2019-07-12 | 广州兴森快捷电路科技有限公司 | Ic载板生产标记方法 |
CN106686894B (zh) * | 2016-11-04 | 2019-07-09 | 厦门利德宝电子科技股份有限公司 | 适用于线路板蚀刻加工高效率智能化提升的方法及系统 |
CN110321749B (zh) | 2018-03-28 | 2022-05-13 | 奥特斯(中国)有限公司 | 用于部件承载件的双重编码可追踪系统 |
CN110400152A (zh) * | 2018-04-17 | 2019-11-01 | 鹏鼎控股(深圳)股份有限公司 | 用于印刷电路板的品质追溯系统 |
CN108830347B (zh) * | 2018-05-31 | 2022-03-22 | Oppo广东移动通信有限公司 | 电路板的跟踪管理方法、装置及电子设备 |
CN112584601B (zh) * | 2019-09-27 | 2022-07-01 | 深南电路股份有限公司 | 一种电路板及其防呆方法、电子装置 |
CN113766724B (zh) * | 2020-06-01 | 2024-04-12 | 南通深南电路有限公司 | 一种线路板及其制作方法、追溯方法 |
CN112990407A (zh) * | 2021-04-16 | 2021-06-18 | 万安裕维电子有限公司 | 一种适用于pcb板的追溯系统及方法 |
CN114872452B (zh) * | 2022-05-25 | 2023-06-27 | Tcl华星光电技术有限公司 | 打码方法和打码装置 |
CN117651373A (zh) * | 2023-12-12 | 2024-03-05 | 健鼎(湖北)电子有限公司 | 一种有助源头追溯的电路板制作方法及其制作系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1641852A (zh) * | 2004-01-13 | 2005-07-20 | 自由度半导体公司 | 电子封装测试结果的标记方法 |
CN101471328A (zh) * | 2007-12-25 | 2009-07-01 | 力成科技股份有限公司 | 基板面板 |
CN101610642A (zh) * | 2008-06-20 | 2009-12-23 | 富葵精密组件(深圳)有限公司 | 覆铜基板裁切方法 |
-
2010
- 2010-06-07 CN CN201010193724.4A patent/CN102271464B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1641852A (zh) * | 2004-01-13 | 2005-07-20 | 自由度半导体公司 | 电子封装测试结果的标记方法 |
CN101471328A (zh) * | 2007-12-25 | 2009-07-01 | 力成科技股份有限公司 | 基板面板 |
CN101610642A (zh) * | 2008-06-20 | 2009-12-23 | 富葵精密组件(深圳)有限公司 | 覆铜基板裁切方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102271464A (zh) | 2011-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 223005 Foxconn Road, Huaian Economic Development Zone, Jiangsu, No. 168 Applicant after: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 223005 Foxconn Road, Huaian Economic Development Zone, Jiangsu, No. 168 Applicant before: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170329 Address after: Guangdong Province, Jiangmen Jianghai Keyuan Road No. 11 Building 1 layer (by H01) Patentee after: Jiangmen Cheng Xun Electronics Co., Ltd. Address before: 223005 Foxconn Road, Huaian Economic Development Zone, Jiangsu, No. 168 Patentee before: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20180607 |
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CF01 | Termination of patent right due to non-payment of annual fee |