CN102268719B - Vertical plating equipment and plating method thereof - Google Patents
Vertical plating equipment and plating method thereof Download PDFInfo
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- CN102268719B CN102268719B CN 201010196199 CN201010196199A CN102268719B CN 102268719 B CN102268719 B CN 102268719B CN 201010196199 CN201010196199 CN 201010196199 CN 201010196199 A CN201010196199 A CN 201010196199A CN 102268719 B CN102268719 B CN 102268719B
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- crystal cup
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Abstract
The invention provides vertical plating equipment and a plating method thereof. The vertical plating equipment is used for plating a wafer and comprises a plating tank, a crystal cup and a magnetic actuating unit, wherein the plating tank is filled with a plating solution; the crystal cup clamps the wafer and immerses the wafer into the plating solution; and the magnetic actuating unit drives the crystal cup to rotate so as to lead the wafer to be rotated in the plating solution to homogenize the plating effect of the wafer. According to the vertical plating equipment provided by the embodiment of the invention, the problem that the plating effect is influenced due to non-uniform concentration distribution of the plating solution can be avoided by adopting the way that the wafer rotates on a vertical plane during plating, thus further improving the product reliability, and solving the problems of irregular bumps, broken bumps, low dielectric delamination and the like.
Description
Technical field
The present invention relates to a kind of electroplating device, particularly a kind of vertical type electroplating device.
Background technology
In known vertical type electroplating device, owing to be subject to the factor affecting such as flow field in the plating tank and gravity, cause the skewness of electroplating ionic concn, thereby so that the electroplating effect of wafer surface is uneven.With reference to Fig. 1, it shows the electroplating effect of known vertical type electroplating device, by among the figure as can be known, see through known vertical type electroplating device and electroplate, the plating concentration level that wafer surface can produce horizontal direction distributes.Inhomogeneous electroplating effect will reduce the reliability of product, and produce irregular salient point (irregular bump), salient point breaks (bump crack) and the problem such as low dielectric layering (ELK delamination).
Summary of the invention
A kind of vertical type electroplating device that the present invention namely provides for wish solves the problem of known technology in order to a wafer is electroplated, comprises a plating tank, a crystal cup, a magnetic actuation unit and a bearing.Plating tank is puts an electroplate liquid.This wafer of crystal cup clamping, and this wafer immersed among this electroplate liquid.This crystal cup of magnetic actuation finite element rotation is whereby with this wafer of rotation in this electroplate liquid, with the electroplating effect of this wafer of homogenizing.This crystal cup is located on this bearing in rotating mode.
In one embodiment, this magnetic actuation unit comprises that a permanent magnetism element and a plurality of electricity cause magnetics, this permanent magnetism element ring is around this crystal cup, described a plurality of electricity causes magnetics and is located among this crystal cup, and described a plurality of electricity cause that magnetics provides changes of magnetic field so that this crystal cup rotates on this bearing.
In another embodiment, this magnetic actuation unit comprises that a permanent magnetism element and a plurality of electricity cause magnetics, this permanent magnetism element is located at this bearing, described a plurality of electricity causes magnetics and is located among this crystal cup, this permanent magnetism element ring causes magnetics around described a plurality of electricity, and described a plurality of electricity cause that magnetics provides changes of magnetic field so that this crystal cup rotates on this bearing.
In another embodiment, this magnetic actuation unit comprises that a permanent magnetism element and a plurality of electricity cause magnetics, described a plurality of electricity causes magnetics and is located at this bearing, this permanent magnetism element is located at this crystal cup, this permanent magnetism element ring causes magnetics around described a plurality of electricity, and described a plurality of electricity cause that magnetics provides changes of magnetic field so that this crystal cup rotates on this bearing.
In one embodiment, this electroplate liquid comprises silver ions, and its concentration is 0.1～5.0wt%.This magnetic actuation unit rotates this crystal cup with the speed of 1～50rpm.
The present invention also relates to a kind of electro-plating method, in one embodiment, in order to a wafer is electroplated, comprise the steps.At first, provide a plating tank, be in this plating tank and put an electroplate liquid.Again, provide a crystal cup, with this wafer of clamping.Then, this wafer is immersed among this electroplate liquid.At last, rotate this crystal cup, whereby with this wafer of rotation in this electroplate liquid, with the electroplating effect of this wafer of homogenizing.
Use the vertical type electroplating device of the embodiment of the invention, wafer is rotated in a vertical plane when electroplating, whereby to avoid electroplate liquid concentration distribution inequality on impact that electroplating effect was caused.And then the reliability of improving product, solve irregular salient point (irregular bump), salient point breaks (bump crack) and the problem such as low dielectric layering (ELK delamination).
Description of drawings
Fig. 1 shows the electroplating effect of known vertical type electroplating device;
Fig. 2 A shows the vertical type electroplating device of first embodiment of the invention;
Fig. 2 B shows the frontview of crystal cup and magnetic actuation unit;
Fig. 3 shows the vertical type electroplating device of second embodiment of the invention;
Fig. 4 shows the vertical type electroplating device of third embodiment of the invention; And
Fig. 5 shows electro-plating method of the present invention.
Wherein, description of reference numerals is as follows:
10～wafer
100,100 ', 100 "～the vertical type electroplating device
101～electroplate liquid
110～plating tank
120～crystal cup
121～flange
122～crystal cup body
123～rotating shaft
130～magnetic actuation unit
131～alnico magnets
132～electricity causes magnetics
140～bearing
S1, S2, S3, S4～electro-plating method step
Embodiment
With reference to Fig. 2 A, it shows the vertical type electroplating device 100 of first embodiment of the invention, in order to wafer 10 is electroplated.This vertical type electroplating device 100 comprises a plating tank 110, crystal cup 120, magnetic actuation unit 130 and bearing 140.Be in the plating tank 110 and put an electroplate liquid 101.Crystal cup 120 holding chips 10, and with among wafer 10 these electroplate liquids 101 of immersion.Magnetic actuation unit 130 these crystal cups 120 of rotation are whereby with this wafer 10 of rotation in this electroplate liquid 101, with the electroplating effect of this wafer 10 of homogenizing.
By crystal cup 120 clampings, crystal cup 120 can be exerted profit (Bernoulli) formula carrier for hundred to wafer 10 in the mode that is adsorbed.
Crystal cup 120 is located on the bearing 140 in rotating mode.Crystal cup 120 comprises a flange 121, a crystal cup body 122 and a rotating shaft 123, and this flange 121 connects this crystal cup body 122, and this crystal cup body 122 connects this rotating shaft 123.Rotating shaft 123 is rotated in bearing 140.
Collocation is with reference to Fig. 2 B, and it shows the frontview of crystal cup 120 and magnetic actuation unit 130, and wherein, described a plurality of electricity cause magnetics 132 and arrange in the mode of circular permutation, and this permanent magnetism element 131 is ring texture.This permanent magnetism element 131 can be permanent magnet, and described a plurality of electricity cause magnetics 132 can be electro-magnet.
In the above-described embodiments, this magnetic actuation unit rotates this crystal cup with the speed of 1～50rpm, and this electroplate liquid comprises silver ions, and its concentration is 0.1～5.0wt%.So, above-described embodiment does not limit the present invention, for different electroplating solutions and plating concentration, can arrange in pairs or groups and adjust the speed of rotation of crystal cup, to reach best electroplating effect.
Use the vertical type electroplating device of the embodiment of the invention, wafer is rotated in a vertical plane when electroplating, whereby to avoid electroplate liquid concentration distribution inequality on impact that electroplating effect was caused.And then the reliability of improving product, solve irregular salient point (irregular bump), salient point breaks (bump crack) and the problem such as low dielectric layering (ELK delamination).
With reference to Fig. 3, it shows the vertical type electroplating device 100 ' of second embodiment of the invention, wherein, this permanent magnetism element 131 is located in this bearing 140, described a plurality of electricity causes magnetics 132 and is located in the rotating shaft 123 of this crystal cup 120, this permanent magnetism element 131 causes magnetics 132 around described a plurality of electricity, and described a plurality of electricity cause that magnetics 132 provides changes of magnetic field so that this crystal cup 120 rotates on this bearing 140.
With reference to Fig. 4, it shows the vertical type electroplating device 100 of third embodiment of the invention "; wherein; this magnetic actuation unit 130 comprises that a permanent magnetism element 131 and a plurality of electricity cause magnetics 132; described a plurality of electricity cause magnetics 132 and are located among this bearing 140; this permanent magnetism element 131 is located on this crystal cup 120; this permanent magnetism element 131 causes magnetics 132 around described a plurality of electricity, described a plurality of electricity cause that magnetics 132 provides changes of magnetic field so that this crystal cup 120 rotates on this bearing 140.In this embodiment, this permanent magnetism element 131 is located at an inner surface of this flange 121, and this inner surface is towards this bearing 140.
In the above-described embodiments, this permanent magnetism element 131 can be exchanged mutually with the position that described a plurality of electricity cause magnetics 132, and it does not limit the present invention.In addition, this permanent magnetism element 131 causes magnetics 132 with described a plurality of electricity and can be located at respectively among bearing 140 or the crystal cup 120 or its surface, and it does not limit the present invention.
With reference to Fig. 5, the present invention also relates to a kind of electro-plating method, in order to a wafer is electroplated, comprise the steps.At first, provide a plating tank, be in this plating tank and put an electroplate liquid (S1).Again, provide a crystal cup, with this wafer of clamping (S2).Then, this wafer is immersed (S3) among this electroplate liquid.At last, rotate this crystal cup, whereby with this wafer of rotation in this electroplate liquid, with the electroplating effect (S4) of this wafer of homogenizing.
Although the present invention discloses as above with concrete preferred embodiment; yet it is not to limit the present invention; any those of ordinary skills; without departing from the spirit and scope of the present invention; still can do a little change and retouching, so protection scope of the present invention is as the criterion when looking the claim limited range of enclosing.
Claims (8)
1. vertical type electroplating device in order to a wafer is electroplated, comprising:
One plating tank is and puts an electroplate liquid;
One crystal cup, this wafer of clamping, and this wafer immersed among this electroplate liquid; And
One magnetic actuation unit rotates this crystal cup, whereby with this wafer of rotation in this electroplate liquid, with the electroplating effect of this wafer of homogenizing.
2. vertical type electroplating device as claimed in claim 1, wherein, this wafer is rotated on a vertical plane.
3. vertical type electroplating device as claimed in claim 1, it also comprises a bearing, wherein, this crystal cup is to be located on this bearing in rotating mode.
4. vertical type electroplating device as claimed in claim 3, wherein, this magnetic actuation unit comprises that a permanent magnetism element and a plurality of electricity cause magnetics, this permanent magnetism element ring is around this crystal cup, described a plurality of electricity causes magnetics and is located among this crystal cup, and described a plurality of electricity cause that magnetics provides changes of magnetic field so that this crystal cup rotates on this bearing.
5. vertical type electroplating device as claimed in claim 3, wherein, this magnetic actuation unit comprises that a permanent magnetism element and a plurality of electricity cause magnetics, this permanent magnetism element is located at this bearing, described a plurality of electricity causes magnetics and is located among this crystal cup, this permanent magnetism element ring causes magnetics around described a plurality of electricity, and described a plurality of electricity cause that magnetics provides changes of magnetic field so that this crystal cup rotates on this bearing.
6. vertical type electroplating device as claimed in claim 5, wherein, this crystal cup comprises a rotating shaft, and this rotating shaft is inserted among this bearing, and described a plurality of electricity cause magnetics and are located among this rotating shaft.
7. vertical type electroplating device as claimed in claim 3, wherein, this magnetic actuation unit comprises that a permanent magnetism element and a plurality of electricity cause magnetics, described a plurality of electricity causes magnetics and is located at this bearing, this permanent magnetism element is located at this crystal cup, this permanent magnetism element ring causes magnetics around described a plurality of electricity, and described a plurality of electricity cause that magnetics provides changes of magnetic field so that this crystal cup rotates on this bearing.
8. vertical type electroplating device as claimed in claim 7, wherein, this crystal cup comprises a flange and a crystal cup body, and this flange connects this crystal cup body, and this permanent magnetism element is located at a surface of this flange, and this surface is towards this bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010196199 CN102268719B (en) | 2010-06-03 | 2010-06-03 | Vertical plating equipment and plating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010196199 CN102268719B (en) | 2010-06-03 | 2010-06-03 | Vertical plating equipment and plating method thereof |
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| Publication Number | Publication Date |
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| CN102268719A CN102268719A (en) | 2011-12-07 |
| CN102268719B true CN102268719B (en) | 2013-10-30 |
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| CN 201010196199 Active CN102268719B (en) | 2010-06-03 | 2010-06-03 | Vertical plating equipment and plating method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110644038A (en) * | 2019-10-31 | 2020-01-03 | 曹晓东 | Manufacturing process of aluminum gearbox shell |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180047911A (en) * | 2016-11-01 | 2018-05-10 | 삼성전자주식회사 | Electroplating apparatus and electroplating method |
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| JP2002220700A (en) * | 2001-01-26 | 2002-08-09 | Dainippon Screen Mfg Co Ltd | Substrate plating equipment |
| US6500316B1 (en) * | 1999-08-30 | 2002-12-31 | International Business Machines Corporation | Apparatus for rotary cathode electroplating with wireless power transfer |
| CN1630739A (en) * | 2001-12-24 | 2005-06-22 | 皇家飞利浦电子股份有限公司 | Apparatus and method for electroplating a wafer surface |
| CN101265606A (en) * | 2007-03-15 | 2008-09-17 | 台湾积体电路制造股份有限公司 | Apparatuses for electrochemical deposition, and method for forming conductive layer |
| TW201016900A (en) * | 2008-10-30 | 2010-05-01 | All Ring Tech Co Ltd | Electroplating apparatus for chips |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005089812A (en) * | 2003-09-17 | 2005-04-07 | Casio Comput Co Ltd | Plating apparatus, and method for plating semiconductor substrate |
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- 2010-06-03 CN CN 201010196199 patent/CN102268719B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6500316B1 (en) * | 1999-08-30 | 2002-12-31 | International Business Machines Corporation | Apparatus for rotary cathode electroplating with wireless power transfer |
| JP2002220700A (en) * | 2001-01-26 | 2002-08-09 | Dainippon Screen Mfg Co Ltd | Substrate plating equipment |
| CN1630739A (en) * | 2001-12-24 | 2005-06-22 | 皇家飞利浦电子股份有限公司 | Apparatus and method for electroplating a wafer surface |
| CN101265606A (en) * | 2007-03-15 | 2008-09-17 | 台湾积体电路制造股份有限公司 | Apparatuses for electrochemical deposition, and method for forming conductive layer |
| TW201016900A (en) * | 2008-10-30 | 2010-05-01 | All Ring Tech Co Ltd | Electroplating apparatus for chips |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110644038A (en) * | 2019-10-31 | 2020-01-03 | 曹晓东 | Manufacturing process of aluminum gearbox shell |
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| CN102268719A (en) | 2011-12-07 |
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