CN102248572A - Method for manufacturing high-strength environmentally-friendly binderless particle board - Google Patents
Method for manufacturing high-strength environmentally-friendly binderless particle board Download PDFInfo
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- CN102248572A CN102248572A CN2011102008023A CN201110200802A CN102248572A CN 102248572 A CN102248572 A CN 102248572A CN 2011102008023 A CN2011102008023 A CN 2011102008023A CN 201110200802 A CN201110200802 A CN 201110200802A CN 102248572 A CN102248572 A CN 102248572A
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- particieboard
- particle board
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Abstract
The invention provides a method for manufacturing a high-strength environmentally-friendly binderless particle board. In the method, paper-making black liquor is applied to a particle board preparation process, abundant lignin, hemicellulose and other chemical components in the paper-making black liquor are utilized to prepare the high-strength environmentally-friendly binderless particle board; in the particle board hot-pressing process, the lignin and the hemicellulose in the black liquor and a part of lignin and hemicellulose of wood shavings perform a chemical reaction under the action of thermal moisture to generate massive components similar to binders, therefore the mechanical performance of the particle board is remarkably increased, and the size stability of the particle board is improved.
Description
Technical field
The invention belongs to wood-based plate and make the field, specifically is that a kind of high-strength environment-friendly type does not have glue particieboard manufacture method.
Background technology
Particieboard is one of important member of wood-based plate family, can be widely used in fields such as furniture and interior decoration.Particieboard can be divided into glue particieboard and no glue particieboard.There is the glue particieboard to be meant the particieboard that has added adhesive such as urea-formaldehyde resin adhesive in the preparation process, can discharges toxic gases such as a certain amount of formaldehyde in this particieboard preparation and the use.No glue particieboard is meant and do not add any adhesive in the sheet material preparation process, only relies on a kind of particieboard of the similar adhesive component glue molding that wooden or non-wood particle self chemical change in hot pressing produces.This particieboard is not owing to apply any adhesive, and preparation discharges with the formaldehydeless toxic gas of use, is a kind of environmental type particieboard, therefore enjoys people to favor.But the similar adhesive component that produces in the conventional no glue particieboard hot pressing is less relatively, and there are problems such as mechanical property and poor dimensional stability in no glue particieboard, and use is restricted, and has seriously restricted the development of no glue particieboard.
Summary of the invention
Technical problem solved by the invention is to provide a kind of high-strength environment-friendly type not have glue particieboard manufacture method, to solve the shortcoming in the above-mentioned background technology.
Technical problem solved by the invention realizes by the following technical solutions:
A kind of high-strength environment-friendly type does not have glue particieboard manufacture method, the notable feature that is different from other manufacture method is: black liquid is applied in the particieboard preparation process part lignin in chemical composition such as abundant lignin, hemicellulose and the wood shavings, the composition that hemicellulose can generate a large amount of similar adhesive in hydrothermal common down reaction in the black liquid in the hot pressing.Therefore, the timber intensity of this method preparation and the sheet material that does not use black liquid mutually specific strength obviously improve.
Concrete grammar is as follows:
(1) the wood-based plate sanding powder is carried out broken processing again, make 100 purpose sanding powder;
(2) the sanding powder is immersed soak laggard promoting the circulation of qi fluidized drying in 30 minutes in the black liquid to obtain moisture content be about 25% sanding powder;
(3) mat formation into certain density, certain thickness slab after being about 25% sanding powder with moisture content with moisture content to be about 25% wood shavings according to the ratio of 1:9 fully mix;
(4) adopt conventional no glue particieboard heat pressing process compacting high-strength environment-friendly type not have the glue particieboard.
Utilize part lignin, hemicellulose common chemical reaction that takes place under the wet effect of heat of lignin, hemicellulose and the wood shavings in the black liquid self in the particieboard hot pressing of the present invention to generate the composition that is similar to adhesive in a large number, thereby obviously improve the particieboard mechanical property, improve the particieboard dimensional stability.
Beneficial effect:Making sheet process of the present invention has not only effectively utilized the waste liquid of paper-making process generation and the sanding waste material that the wood-based plate process produces, improved no glue particieboard mechanical property, and there is not the formaldehyde toxic gas in the particieboard of preparation, therefore, this high-strength environment-friendly type does not have glue particieboard manufacture method and has significant market and environment-friendly advantage.
The specific embodiment
Give an actual example below and describe the present invention.
Embodiment one:
At first, the wood-based plate sanding powder is carried out broken processing again, make 100 purpose sanding powder, the sanding powder is immersed soak laggard promoting the circulation of qi fluidized drying in 30 minutes in the black liquid again, obtain the sanding powder of moisture content 25%.
Mat formation into the thick slab of 10mm after the moisture content that previous step is obtained is about 25% sanding powder with moisture content to be about 25% wood shavings according to the ratio of 1:9 fully mix, sheet material design density is 0.8g/m
3Adopt conventional no glue particieboard heat pressing process compacting again, 190 ℃ of hot pressing temperatures, hot pressing time 13 minutes.
Under the present embodiment condition, the parameter of the no glue particieboard that obtains is: MOR reaches 10.2MPa, and internal bond strength reaches 0.52MPa, and the 24h thickness swelling rate reaches 13.7%.
Embodiment two:
At first, the wood-based plate sanding powder is carried out broken processing again, make 100 purpose sanding powder, the sanding powder is immersed soak laggard promoting the circulation of qi fluidized drying in 30 minutes in the black liquid again, obtain moisture content and be about 25% sanding powder.
Mat formation into the thick slab of 8mm after the moisture content that previous step is obtained is about 25% sanding powder with moisture content to be about 25% wood shavings according to the ratio of 1:9 fully mix, sheet material design density is 0.9g/m
3Adopt conventional no glue particieboard heat pressing process compacting again, 200 ℃ of hot pressing temperatures, hot pressing time 10 minutes.
Under the present embodiment condition, the parameter of the no glue particieboard that obtains is: MOR reaches 11.7MPa, and internal bond strength reaches 0.59MPa, and thickness swelling rate reaches 10.2%.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof
Claims (1)
1. a high-strength environment-friendly type does not have glue particieboard manufacture method, it is characterized in that, black liquid is applied in the particieboard preparation process, utilizes chemical compositions such as lignin abundant in the black liquid and hemicellulose to prepare the high-strength environment-friendly type and do not have the glue particieboard, its concrete grammar is as follows:
One, the wood-based plate sanding powder is carried out broken processing again, make 100 purpose sanding powder;
Two, the sanding powder is immersed soak laggard promoting the circulation of qi fluidized drying in 30 minutes in the black liquid to obtain moisture content be about 25% sanding powder;
Three, mat formation into certain thickness slab after being about 25% sanding powder with moisture content with moisture content to be about 25% wood shavings according to the ratio of 1:9 fully mix;
Four, adopt conventional no glue particieboard heat pressing process compacting high-strength environment-friendly type not have the glue particieboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102008023A CN102248572A (en) | 2011-07-19 | 2011-07-19 | Method for manufacturing high-strength environmentally-friendly binderless particle board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102008023A CN102248572A (en) | 2011-07-19 | 2011-07-19 | Method for manufacturing high-strength environmentally-friendly binderless particle board |
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| CN102248572A true CN102248572A (en) | 2011-11-23 |
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| CN2011102008023A Pending CN102248572A (en) | 2011-07-19 | 2011-07-19 | Method for manufacturing high-strength environmentally-friendly binderless particle board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102862208A (en) * | 2012-09-13 | 2013-01-09 | 中南林业科技大学 | Processing method of bamboo wood compound material |
| CN103029196A (en) * | 2012-12-13 | 2013-04-10 | 宁波大世界家具研发有限公司 | Method for manufacturing rubber-free high-density fiberboard |
| CN103358385A (en) * | 2012-04-01 | 2013-10-23 | 中国科学院过程工程研究所 | Method for producing non-formaldehyde environment-friendly particle boards by utilizing alkali lignin as binder |
| CN114290468A (en) * | 2022-01-14 | 2022-04-08 | 浙江省林业科学研究院 | Glue-free fiber board raw material and preparation method thereof and glue-free fiber board |
| CN114368053A (en) * | 2022-01-25 | 2022-04-19 | 浙江省林业科学研究院 | High-viscosity flowing state fiber suspension and preparation method and application thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358385A (en) * | 2012-04-01 | 2013-10-23 | 中国科学院过程工程研究所 | Method for producing non-formaldehyde environment-friendly particle boards by utilizing alkali lignin as binder |
| CN103358385B (en) * | 2012-04-01 | 2015-07-01 | 中国科学院过程工程研究所 | Method for producing non-formaldehyde environment-friendly particle boards by utilizing alkali lignin as binder |
| CN102862208A (en) * | 2012-09-13 | 2013-01-09 | 中南林业科技大学 | Processing method of bamboo wood compound material |
| CN102862208B (en) * | 2012-09-13 | 2015-04-08 | 中南林业科技大学 | Processing method of bamboo wood compound material |
| CN103029196A (en) * | 2012-12-13 | 2013-04-10 | 宁波大世界家具研发有限公司 | Method for manufacturing rubber-free high-density fiberboard |
| CN103029196B (en) * | 2012-12-13 | 2014-12-10 | 宁波大世界家具研发有限公司 | Method for manufacturing rubber-free high-density fiberboard |
| CN114290468A (en) * | 2022-01-14 | 2022-04-08 | 浙江省林业科学研究院 | Glue-free fiber board raw material and preparation method thereof and glue-free fiber board |
| CN114290468B (en) * | 2022-01-14 | 2022-11-15 | 浙江省林业科学研究院 | Glue-free fiber board raw material and preparation method thereof and glue-free fiber board |
| CN114368053A (en) * | 2022-01-25 | 2022-04-19 | 浙江省林业科学研究院 | High-viscosity flowing state fiber suspension and preparation method and application thereof |
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Application publication date: 20111123 |