CN102244832A - 电容式传声器芯片 - Google Patents
电容式传声器芯片 Download PDFInfo
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- CN102244832A CN102244832A CN2010102563671A CN201010256367A CN102244832A CN 102244832 A CN102244832 A CN 102244832A CN 2010102563671 A CN2010102563671 A CN 2010102563671A CN 201010256367 A CN201010256367 A CN 201010256367A CN 102244832 A CN102244832 A CN 102244832A
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- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000002787 reinforcement Effects 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000000605 extraction Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 3
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 12
- 239000012528 membrane Substances 0.000 abstract description 7
- 230000003014 reinforcing effect Effects 0.000 abstract description 4
- 210000003462 vein Anatomy 0.000 abstract 3
- 230000002708 enhancing effect Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
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CN201010256367.1A CN102244832B (zh) | 2010-05-12 | 2010-08-18 | 电容式传声器芯片 |
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CN201010169586.6 | 2010-05-12 | ||
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CN201010256367.1A CN102244832B (zh) | 2010-05-12 | 2010-08-18 | 电容式传声器芯片 |
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CN102244832A true CN102244832A (zh) | 2011-11-16 |
CN102244832B CN102244832B (zh) | 2014-07-09 |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103508408A (zh) * | 2012-06-14 | 2014-01-15 | 罗伯特·博世有限公司 | 混合集成部件及其制造方法 |
CN104105040A (zh) * | 2014-07-31 | 2014-10-15 | 歌尔声学股份有限公司 | 一种mems麦克风 |
CN104602173A (zh) * | 2013-10-30 | 2015-05-06 | 北京卓锐微技术有限公司 | 一种硅电容麦克风及其制备方法 |
CN104796831A (zh) * | 2014-01-22 | 2015-07-22 | 无锡华润上华半导体有限公司 | 一种电容式麦克风及其制造方法 |
CN105492373A (zh) * | 2014-07-15 | 2016-04-13 | 歌尔声学股份有限公司 | 具有高深厚比褶皱振膜的硅麦克风和有该硅麦克风的封装 |
CN107529121A (zh) * | 2017-09-28 | 2017-12-29 | 歌尔股份有限公司 | 电容式麦克风及电子装置 |
WO2021056607A1 (zh) * | 2019-09-29 | 2021-04-01 | 潍坊歌尔微电子有限公司 | 一种mems芯片以及电子设备 |
WO2021056606A1 (zh) * | 2019-09-29 | 2021-04-01 | 潍坊歌尔微电子有限公司 | 一种mems芯片以及电子设备 |
CN114630244A (zh) * | 2022-03-28 | 2022-06-14 | 歌尔微电子股份有限公司 | 传感器及可穿戴设备 |
WO2022156329A1 (zh) * | 2021-01-19 | 2022-07-28 | 潍坊歌尔微电子有限公司 | 感测芯片及mems传感器 |
WO2024045283A1 (zh) * | 2022-09-02 | 2024-03-07 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1874616A (zh) * | 2005-06-03 | 2006-12-06 | 瑞声声学科技(深圳)有限公司 | 电容式微机电结构声音传感器 |
CN101076206A (zh) * | 2007-06-16 | 2007-11-21 | 郑润远 | 一种新型电容传声器振膜及其电容传声器 |
CN201345727Y (zh) * | 2008-12-26 | 2009-11-11 | 瑞声声学科技(常州)有限公司 | 振膜 |
CN201860448U (zh) * | 2010-05-12 | 2011-06-08 | 歌尔声学股份有限公司 | 电容式传声器芯片 |
-
2010
- 2010-08-18 CN CN201010256367.1A patent/CN102244832B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1874616A (zh) * | 2005-06-03 | 2006-12-06 | 瑞声声学科技(深圳)有限公司 | 电容式微机电结构声音传感器 |
CN101076206A (zh) * | 2007-06-16 | 2007-11-21 | 郑润远 | 一种新型电容传声器振膜及其电容传声器 |
CN201345727Y (zh) * | 2008-12-26 | 2009-11-11 | 瑞声声学科技(常州)有限公司 | 振膜 |
CN201860448U (zh) * | 2010-05-12 | 2011-06-08 | 歌尔声学股份有限公司 | 电容式传声器芯片 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103508408B (zh) * | 2012-06-14 | 2016-12-28 | 罗伯特·博世有限公司 | 混合集成部件及其制造方法 |
CN103508408A (zh) * | 2012-06-14 | 2014-01-15 | 罗伯特·博世有限公司 | 混合集成部件及其制造方法 |
CN104602173A (zh) * | 2013-10-30 | 2015-05-06 | 北京卓锐微技术有限公司 | 一种硅电容麦克风及其制备方法 |
CN104796831A (zh) * | 2014-01-22 | 2015-07-22 | 无锡华润上华半导体有限公司 | 一种电容式麦克风及其制造方法 |
US9930453B2 (en) | 2014-07-15 | 2018-03-27 | Goertek Inc. | Silicon microphone with high-aspect-ratio corrugated diaphragm and a package with the same |
CN105492373A (zh) * | 2014-07-15 | 2016-04-13 | 歌尔声学股份有限公司 | 具有高深厚比褶皱振膜的硅麦克风和有该硅麦克风的封装 |
CN104105040A (zh) * | 2014-07-31 | 2014-10-15 | 歌尔声学股份有限公司 | 一种mems麦克风 |
WO2019061618A1 (zh) * | 2017-09-28 | 2019-04-04 | 歌尔股份有限公司 | 电容式麦克风及电子装置 |
CN107529121A (zh) * | 2017-09-28 | 2017-12-29 | 歌尔股份有限公司 | 电容式麦克风及电子装置 |
KR102065290B1 (ko) | 2017-09-28 | 2020-01-10 | 고어텍 인크 | 콘덴서 마이크로폰 및 전자장치 |
US10932064B2 (en) | 2017-09-28 | 2021-02-23 | Weifang Goertek Microelectronics Co., Ltd | Condenser microphone and electronic device |
WO2021056607A1 (zh) * | 2019-09-29 | 2021-04-01 | 潍坊歌尔微电子有限公司 | 一种mems芯片以及电子设备 |
WO2021056606A1 (zh) * | 2019-09-29 | 2021-04-01 | 潍坊歌尔微电子有限公司 | 一种mems芯片以及电子设备 |
WO2022156329A1 (zh) * | 2021-01-19 | 2022-07-28 | 潍坊歌尔微电子有限公司 | 感测芯片及mems传感器 |
CN114630244A (zh) * | 2022-03-28 | 2022-06-14 | 歌尔微电子股份有限公司 | 传感器及可穿戴设备 |
CN114630244B (zh) * | 2022-03-28 | 2024-04-19 | 歌尔微电子股份有限公司 | 传感器及可穿戴设备 |
WO2024045283A1 (zh) * | 2022-09-02 | 2024-03-07 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
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CN102244832B (zh) | 2014-07-09 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |