CN102243519B

CN102243519B - Heat dissipation module

Info

Publication number: CN102243519B
Application number: CN 201010172436
Authority: CN
Inventors: 郑浩德
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2010-05-14
Filing date: 2010-05-14
Publication date: 2013-08-28
Anticipated expiration: 2030-05-14
Also published as: CN102243519A

Abstract

The invention provides a heat dissipation module. The heat dissipation module comprises a fixing base and a radiator, wherein the fixing base comprises a base board and two opposite first side boards vertical to the base board; each first side board is convexly provided with at least one fastener; the radiator comprises a substrate and fins vertical to the substrate; the substrate comprises two first side rims; and the fasteners of the two first side boards are clamped on the two first side rims of the substrate respectively, so that the radiator is fixed on the fixing base. Compared with the prior art, the heat dissipation module is simple in structure and convenient to assemble.

Description

The heat radiation module

Technical field

The present invention relates to a kind of heat radiation module.

Background technology

The heat radiation module that is applied on the computer motherboard mostly comprises heating radiator, base and fastener.Fastener is mounted on base rotationally so that heating radiator is fixed in base, and base normally is fixed in mainboard by screw.Yet, above-mentioned heat radiation modular structure complexity, assembling inconvenience.

Summary of the invention

In view of this, be necessary to provide a kind of heat radiation module simple in structure and easy to assembly.

A kind of heat radiation module, comprise a holder and a heating radiator, described holder comprises that a base plate reaches perpendicular to two of the described base plate first relative side plates, each first side plate is dashed forward and is established at least one buckle, described heating radiator comprises that a substrate reaches the fin perpendicular to described substrate, described substrate comprises two first lateral margins, and the buckle of two first side plates two first lateral margins of the described substrate of block respectively makes described heating radiator be fixed in described holder.

Compare prior art, the present invention is dispelled the heat module by the buckle of the substrate of block heating radiator is set at two first side plates of holder, makes heating radiator be fixed in holder, and is not only simple in structure but also easy to assembly.

Description of drawings

Fig. 1 is the dispel the heat exploded view of preferred embodiments of module of the present invention.

Side view when Fig. 2 is initial for Fig. 1 assembles.

Side view when Fig. 3 finishes for Fig. 2 assembles.

Fig. 4 is the three-dimensional assembly diagram of Fig. 1.

Fig. 5 is the vertical view of Fig. 4.

Fig. 6 is the view of another state of Fig. 5.

The main element symbol description

Holder 10

Base plate 12

First side plate 14

Second side plate 16

Opening 120

Fixed leg 122

Buckle 140

Heating radiator 20

Substrate 22

Radiating fin 24

Projection 26

Lateral margin 220

Ora terminalis 222

Otch 224

Mainboard 100

Heater element 101

Fixed orifice 102

Embodiment

See also Fig. 1, the dispel the heat preferred embodiments of module of the present invention comprises a holder 10 and a heating radiator 20.

Holder 10 comprises a square base plate 12, two parallel first side plate 14 and two second parallel side plates 16.Second side plate 16 is lower than first side plate 14.Two first side plates 14 vertically are based in the both side edges of the end face of base plate 12, and two second side plates 16 vertically are based in two ora terminalis of the end face of base plate 12.Two first side plates 14 and two second side plates, 16 compartment of terrains join end to end, and form a square frame.Described base plate 12 is offered an opening 120, and in the Si Jiaochu of the bottom surface prominent fixed leg 122 of establishing separately.Each inside pleurapophysis in first side plate, 14 tops is established two wedge shape buckles 140.Each buckle 140 comprises that the stopping surface and of vertical corresponding first side plate 14 is the guiding face of a fixed inclination with corresponding first side plate 14.The stopping surface of two buckles 140 is positioned at sustained height and is parallel to base plate 12.

Heating radiator 20 comprises a substrate 22 and some radiating fins 24.Radiating fin 24 is based in the end face of substrate 22.Substrate 22 is prominent protruding 26 (see figure 2)s of establishing in the bottom surface.Substrate 22 comprises two parallel lateral margin 220 and two parallel ora terminalis 222.Each lateral margin 220 is offered two otch 224 and is passed for the buckle 140 of holder 10.

See also Fig. 2 to Fig. 4, during use, holder 10 is positioned over heater element 101 tops of mainboard 100, and opening 120 is over against heater element 101.In the present embodiment, heater element 101 is north bridge chips, and in other embodiments, heater element 101 can be central processing unit.The fixed leg 122 of holder 10 is fixed in the fixed orifice 102 of mainboard 100.Coat thermal grease on the projection 26 of heating radiator 20.Then with heating radiator 20 1 lateral margins 220 butt one first side plate 14 and be positioned at the below of the stopping surface of corresponding buckle 140 obliquely.Again the guiding face downslide of another lateral margin 220 along the buckle 140 of another first side plate 14 entered in the holder 10,220 while of both side edges butt two first side plates 14 of heating radiator 20 and block are in the stopping surface of buckle 140, and otch 224 departs from buckle 140 (as shown in Figure 5).Projection 26 contact heating elements, 101, two ora terminalis 222 and two second side plates 16 keep at a certain distance away, and second side plate 16 is lower than first side plate 14, is convenient to ventilation and heat.

When assembling heating radiator 20, the buckle 140 that also otch 224 of heating radiator 20 1 lateral margins 220 can be faced toward one first side plate 14 glides and enters in the holder 10.The direction of the ora terminalis 222 of the vertical heating radiator 20 in edge promotes heating radiator 20 then, makes otch 224 depart from buckle 140, so that both side edges 220 blocks of heating radiator 20 are in the stopping surface of the buckle 140 of two first side plates 14.

See also Fig. 5 and Fig. 6, during dismounting, along promoting heating radiator 20 perpendicular to the direction of two ora terminalis 222, make the buckle 140 of otch 224 on two first side plates 14 on the both side edges 220.Along perpendicular to the direction of base plate 12, upwards pull out heating radiator 20 then, make otch 224 relative buckles 140 slips and separate, so that heating radiator 20 is pulled down from holder 10.At last holder 10 is pulled down from mainboard 100.

The dispel the heat substrate 22 of buckle 140 block heating radiators 20 of first side plate 14 of holder 10 of module of the present invention makes heating radiator 20 be fixed in holder 10; Promote heating radiator 20 and make otch 224 over against buckle 140, so that heating radiator 20 is pulled down from holder 10, the present invention's module that dispels the heat has the characteristics of simple in structure and easy accessibility.

Claims

One kind the heat radiation module, comprise a holder and a heating radiator, described holder comprises that a base plate reaches perpendicular to two of the described base plate first relative side plates, each first side plate is dashed forward and is established at least one buckle, described heating radiator comprises that a substrate reaches the fin perpendicular to described substrate, described substrate comprises two first lateral margins, each of described substrate first lateral margin offers the otch that can pass for the buckle of the first corresponding side plate, described heating radiator be installed on this holder and relatively this holder between primary importance and the second place, slide, when described heating radiator is positioned at primary importance, the otch of two first lateral margins of described substrate departs from the buckle of the first corresponding side plate, make two first side plates buckle respectively two first lateral margins of the described substrate of block make described heating radiator be fixed in described holder, when described heating radiator is positioned at the second place, the otch of two first lateral margins of described substrate aligns the buckle of the first corresponding side plate, make heating radiator can be operated and certainly this holder pull down.
2. heat radiation module as claimed in claim 1, it is characterized in that: described base plate comprises an opening, and the bottom surface of described substrate is prominent establishes a projection, and described projection is passed described opening and is contacted with a heater element of a mainboard.
3. heat radiation module as claimed in claim 1 is characterized in that: each first side plate is prominent establishes two buckles, and each of described substrate first lateral margin is offered two otch and passed for described two buckles.
4. heat radiation module as claimed in claim 3, it is characterized in that: described holder also comprises perpendicular to two of the described base plate second relative side plates, two second side plates join end to end into a square frame with two first side plate compartment of terrains, described substrate also comprises the two second relative lateral margins, and two second lateral margins and two second side plates of described substrate keep at a certain distance away respectively.
5. heat radiation module as claimed in claim 4, it is characterized in that: two second side plates are lower than two first side plates.
6. heat radiation module as claimed in claim 1, it is characterized in that: described buckle is wedge shape.
7. heat radiation module as claimed in claim 1 is characterized in that: described base plate is prominent establishes some fixed legs so that described holder is fixed in a mainboard.