CN102243254A - Test board - Google Patents
Test board Download PDFInfo
- Publication number
- CN102243254A CN102243254A CN201010176979XA CN201010176979A CN102243254A CN 102243254 A CN102243254 A CN 102243254A CN 201010176979X A CN201010176979X A CN 201010176979XA CN 201010176979 A CN201010176979 A CN 201010176979A CN 102243254 A CN102243254 A CN 102243254A
- Authority
- CN
- China
- Prior art keywords
- test board
- support member
- thickness
- test
- testing host
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a test board which is used for installing an electronic component to be used for carrying out electrical property test. The test board comprises a test mainboard and a support member, wherein the support member is connected to the needle surface of the test mainboard, the test mainboard has a first thickness, the support member has a second thickness, and the sum of the first thickness and the second thickness accords with the preset distance. The test board has larger effective space application.
Description
Technical field
The present invention refers to the test board that at least two kinds of plate bodys of a kind of utilization are constituted especially relevant for a kind of test board.
Background technology
In semiconductor applications, no matter be the semiconductor test of IC or chip, the different phase in manufacture process all is necessary, and each IC must be through test to guarantee its function at wafer and structure dress kenel, and complicated along with chip functions, accurate testing requirement also just becomes more important.
In practical application, be equiped with a measurement jig on the testing electrical property board, to be used for fixing test board, at this moment, the testing electrical property board can utilize the stationary installation that presses down to be resisted against this test board upper surface, to utilize the position of stationary installation and measurement jig fixing test plate, in other words, when being pressed on test board under the stationary installation and arrive a stable contact position, the testing electrical property board can firmly be held on test board between the two by stationary installation and measurement jig.Therefore, for the testing electrical property board, the thickness of test board must meet certain thickness specification, carries out the action of clamping in order to stationary installation and measurement jig.
Yet traditional test board but may produce following shortcoming in order to reach the requirement of above-mentioned thickness:
1. the viewpoint of considering with technology: must be on the test board through interlayers such as boring, plated through-hole connection technologies, but the thickness of traditional test board is excessive, make that the depth-width ratio of boring is excessive, therefore in carrying out metallized technology, can cause the characteristic of the coat of metal not good, and then have influence on the performance of test board on electric characteristics.
2. with the consideration of application: in response to the complexity of operational data, the application of high frequency is also important gradually, yet the thickness of traditional test plate is excessive, makes the traditional test plate can't be applied in the field of high frequency.
3. owing to directly being positioned over, traditional test board carries out electrical metrology operation on the measurement jig, and the traditional test plate is made through general base material pressing, so the flatness of traditional test plate can't effectively be controlled, therefore, under the not good situation of the flatness of traditional test plate, may occur that uneven pin is visited the effect of pressure and the error that causes electrical measurement.
This case inventor is because the shortcoming of the above-mentioned technology of commonly using when actual using, and the accumulation individual is engaged on the related industry exploitation practice experience for many years, studies intensively, and proposes a kind of reasonable in design and effectively improve the structure of the problems referred to above finally.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of test board, and it is made up of a testing host and a support member, and the summation of testing host and support member thickness meets the thickness specification requirement of tester table.By this, the thickness of testing host of the present invention can dwindle further, makes the testing host of above-mentioned thin typeization have preferable electrical effect, more can be applicable to the operation of high frequency condition.
Fundamental purpose of the present invention, be to provide a kind of test board, it is made up of a testing host and a support member, and can further be provided with a plurality of holding parts in this support member, to hold the electronic component of testing host,, test board of the present invention uses aspect so having high efficiency space.
In order to achieve the above object, the invention provides a kind of test board, it is used to install at least one electronic package to carry out testing electrical property, this test board is positioned on the supporting surface of a measurement jig, and utilize a piece under pressure to be resisted against the upper surface of this test board, and the contact position of this piece under pressure to the distance of the supporting surface of this measurement jig is a preset distance; This test board is made up of a testing host and a support member, this support member is connected in the dial of this testing host, and this testing host has one first thickness, and this support member has one second thickness, and the summation of this first thickness and this second thickness meets this preset distance.
The integral thickness of test board of the present invention can meet the specification requirement of tester table, the testing host that has electrical functionality in fact then is thin structure for a kind of more traditional test board, so in boring, metallized technology, have advantage, so that preferable electrical effect to be provided; In addition, thin testing host is also applicable to the test of high frequency condition.On the one hand, support member has preferable flatness, can make the testing host on it have identical probe contact conditions, to improve the accuracy of electrical measurement again.
And this support member that does not have electrical functionality more can have different aspects, for example in another specific embodiment, the plastic space that the holding electronic part is arranged in this support member, so can put than the traditional test plate on the testing host is many electronic components, therefore, test board of the present invention has bigger useful space application.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and explanation usefulness, be not to be used for to the present invention's limitr in addition.
Description of drawings
Fig. 1 is the three-dimensional exploded view of test board of the present invention and measurement jig.
Fig. 2 is that test board of the present invention is positioned over the cut-open view on the measurement jig.
Fig. 3 is that the test board for second embodiment of the invention is positioned over the cut-open view on the measurement jig.
Symbol description
10 test boards, 101 testing hosts
102 support members, 1,021 second naked empty portions
1022 holding parts, 103 electronic components
20 measurement jigs, 201 supporting surfaces
202 first naked empty portions, 30 test probes
H predetermined thickness H1 first thickness
H2 second thickness
Embodiment
See also Fig. 1, it is the synoptic diagram of the test board 10 of first embodiment of the invention, test board 10 is by at least two kinds of plate bodys, for example utilize testing host 101 and support member 102 to form test board 10, test board 10 mainly is to be applied on the tester table, and its thickness can meet the requirement of tester table, in other words, the summation of first thickness H1 of testing host 101 and the second thickness H2 of support member 102 can meet the specification requirement (i.e. a predetermined thickness H) of tester table for the thickness of test board 10, to reach preferable accurate testing degree.
Below will describe the corresponding relation of the thickness of test board 10 and the desired thickness of tester table in detail.Please cooperate Fig. 2, in this specific embodiment, be equiped with a measurement jig 20 (the Ring Insert that for example is commonly called as) on the tester table, it is in order to installing test board 10, particularly, this test board 10 is to be positioned on the supporting surface 201 of this measurement jig 20, and tester table can utilize piece under pressure 21, for example the fixed leg of press-down type (POGO PIN) is resisted against the upper surface of this test board 10, therefore, when piece under pressure is pressed on test board 10 for 21 times and arrives a contact position, tester table can be held on test board 10 between the two by the supporting surface 201 of piece under pressure 21 with measurement jig 20, test board 10 is fixed the operation that electrically measures in order to later use test probe 30.Therefore, at tester table, piece under pressure 21 is resisted against between the supporting surface 201 of the position of this test board 10 and measurement jig 20 a default distance (predetermined thickness H, and different tester tables may have different distances), the present invention promptly utilizes the combination aspect of testing host 101 and support member 102, to reach the requirement of above-mentioned default distance; That is the present invention can use than the support member 102 of traditional structure for the various differing heights of thin testing host 101 cooperations, meets the tester table of various preset distances with formation.
For instance, be applied to when test board 10 of the present invention be the tester table of 6.5mm (being that predetermined thickness H is 6.5mm) between the supporting surface 201 of a kind of contact position of piece under pressure 21 and measurement jig 20, with the traditional test plate, must use the test plate structure of 6.5mm, can reach best test condition, yet, the content of stating as prior art of the present invention, blocked up traditional test plate may have problems in the technology of boring, plating, cause the not good of electrical functionality, also or be not suitable for test under the high frequency condition.Compared to the traditional test plate, the present invention can utilize the testing host 101 of the first thin thickness H1, for example the first thickness H1 is that 0.4 to 6.0mm testing host 101 is cooperated with the support member 102 of corresponding thickness, make the integral thickness of test board 10 meet the application of the tester table of present embodiment, and above-mentioned thin testing host 101 is not only being holed, is being had higher technological quality in the metallized process, more applicable to the range of application of high-frequency operation.
On the other hand, in this specific embodiment, this support member 102 is the dials (being lower surface) that are fixedly connected to this testing host 101, for example glue together methods such as gluing, screw lock, testing host 101 can be a circuit board with electronic circuit, as printed circuit board (PCB), flexible circuit board, soft/rigid circuit board, ceramic wafer, component palette, multi-chip module plate or general motherboard or the like, and more be provided with a slot (figure does not show) on the testing host 101, be inserted in wherein in order to electronic package to be tested; This support member 102 is preferably constituted by rigidity, insulating material, for example glass, the pottery or the like, make support member 102 be difficult for stress deformation, more can keep the flatness of its upper and lower surface so that be positioned at support member 102 on testing host 101 can be preferable parallel nature carry out the metrology operation of electrical functionality.Therefore, the user can be installed at least one electronic package to be tested (figure does not show) on the test board 10, and test board 10 of the present invention is positioned on the supporting surface 201 of measurement jig 20 of tester table, the centre of this measurement jig 20 can have one first naked empty portion 202, similarly, this support member 102 has the second naked empty portion 1021 that should the first naked empty portion 202, this the first naked empty portion 202 and the second naked empty portion 1021 can allow at least one test probe 30 pass through, contacting the dial of this testing host 101, and then the operation that electrically measures.
And in the second embodiment of the present invention, this support member 102 further is formed with at least one holding part 1022.As shown in Fig. 2, this support member 102 has three holding parts 1022 of the aspect of hollowing out, holding part 1022 can be in order to the electronic component 103 of the dial that is installed with testing host 101, therefore, testing host 101 of the present invention still can be provided with electronic component 103 on the zone that the supporting surface 201 with measurement jig 20 overlaps, and the consideration can not have influence on the horizontal aspect of test board 10 and other and measure the time; In other words, the electronic component 103 of the dial of testing host 101 can be placed in the holding part 1022 of support member 102, so can increase the actual usable area of testing host 101.
In sum, test board 10 of the present invention is the subassembly of testing host 101 and support member 102, it can use thin testing host 101, with the quality of technologies such as raising boring, metallization, and then improves the electrical effect of testing host 101 and being suitable for of high-frequency operation; In addition, utilize support member 102 to supply the thickness of test board 10 again, so that the thickness of test board 10 integral body can meet the specification requirement of tester table, and this support member 102 has preferable flatness, to promote the accuracy of electrical measurement.On the one hand, the present invention can utilize support member 102 to produce the space of holding electronic part 103 (being holding part 1022) again, so can put more electronic component 103 on the testing host 101, therefore, test board 10 of the present invention has the bigger useful space.
The above only is a preferable possible embodiments of the present invention, and non-so limitation protection scope of the present invention so the equivalence techniques that uses instructions of the present invention and accompanying drawing content to do such as changes, all is contained in the scope of claim protection of the present invention.
Claims (8)
1. test board, it is characterized in that, be used to install at least one electronic package to carry out testing electrical property, this test board is positioned on the supporting surface of a measurement jig, and utilize a piece under pressure to be resisted against the upper surface of this test board, be a predetermined thickness and this piece under pressure is resisted against contact position to the distance of the supporting surface of this measurement jig of the upper surface of this test board; This test board is made up of a testing host and a support member, this support member is the dial that is connected in this testing host, and this testing host has one first thickness, and this support member has one second thickness, and the summation of this first thickness and this second thickness meets this predetermined thickness.
2. test board according to claim 1 is characterized in that, this testing host is a circuit board.
3. test board according to claim 2 is characterized in that, this measurement jig has one first naked empty portion, contacts the dial of this circuit board in order at least one test probe.
4. test board according to claim 3 is characterized in that, this support member has the second naked empty portion that should the first naked empty portion.
5. test board according to claim 1 is characterized in that this support member is formed with at least one holding part, so that the electronic component of the dial of this testing host is placed in wherein.
6. test board according to claim 1 is characterized in that this support member is constituted by rigid material.
7. test board according to claim 1 is characterized in that this support member is fixedly connected to the dial of this testing host.
8. test board according to claim 7 is characterized in that, this support member is fixed in the dial of this testing host with gummed mode or screw lock method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010176979XA CN102243254A (en) | 2010-05-11 | 2010-05-11 | Test board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010176979XA CN102243254A (en) | 2010-05-11 | 2010-05-11 | Test board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102243254A true CN102243254A (en) | 2011-11-16 |
Family
ID=44961419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010176979XA Pending CN102243254A (en) | 2010-05-11 | 2010-05-11 | Test board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102243254A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001096894A1 (en) * | 2000-06-12 | 2001-12-20 | Phicom Corp. | Compliant probe apparatus |
| WO2003075024A1 (en) * | 2002-03-06 | 2003-09-12 | Advantest Corporation | Insert and electronic component handler comprising it |
| CN200989909Y (en) * | 2006-11-20 | 2007-12-12 | 深圳麦逊电子有限公司 | Vernier adjustable PCB test device |
-
2010
- 2010-05-11 CN CN201010176979XA patent/CN102243254A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001096894A1 (en) * | 2000-06-12 | 2001-12-20 | Phicom Corp. | Compliant probe apparatus |
| WO2003075024A1 (en) * | 2002-03-06 | 2003-09-12 | Advantest Corporation | Insert and electronic component handler comprising it |
| CN200989909Y (en) * | 2006-11-20 | 2007-12-12 | 深圳麦逊电子有限公司 | Vernier adjustable PCB test device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW423121B (en) | Packaging and interconnection of contact structure | |
| US6343940B1 (en) | Contact structure and assembly mechanism thereof | |
| CN100498344C (en) | Universal system for testing different semiconductor device | |
| TWI447414B (en) | Test apparatus and test method | |
| US6861858B2 (en) | Vertical probe card and method for using the same | |
| US7129730B2 (en) | Probe card assembly | |
| KR20030029797A (en) | Test Systems for Wireless-Communications Devices | |
| JP6525831B2 (en) | Contact unit and inspection jig | |
| WO1999032895A1 (en) | Apparatus and method for testing a device | |
| KR20090120513A (en) | Connecting board, probe card and electronic component testing apparatus provided with the probe card | |
| KR20100041029A (en) | Test probe | |
| TW574507B (en) | Arrangement to test the chips by means of a printed circuit plate | |
| KR20100055911A (en) | Probe and menufacturing method of the same | |
| KR100582925B1 (en) | Jig for testing of printed circuit board | |
| JP2010025765A (en) | Contact structure for inspection | |
| JP2017036997A (en) | Inspection device and inspection method of double-sided circuit board | |
| CN102243254A (en) | Test board | |
| KR101199016B1 (en) | Probe card for led inspection | |
| CN113341360B (en) | Radio frequency calibration device for chip test and calibration method thereof | |
| TWI415204B (en) | Testing board | |
| KR20090029337A (en) | Apparatus for testing a semiconductor device | |
| CN215641649U (en) | Test circuit board structure | |
| CN109683077A (en) | Wafer scale multi-point sampler structure | |
| JP2011038930A (en) | Probe card and test method of device to be inspected | |
| JP2016186484A (en) | Contact unit and inspection jig |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111116 |