CN102242383B - 一种太阳能焊带电镀的后处理方法 - Google Patents
一种太阳能焊带电镀的后处理方法 Download PDFInfo
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CN201110183231.7A CN102242383B (zh) | 2011-06-30 | 2011-06-30 | 一种太阳能焊带电镀的后处理方法 |
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CN201110183231.7A CN102242383B (zh) | 2011-06-30 | 2011-06-30 | 一种太阳能焊带电镀的后处理方法 |
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CN102242383A CN102242383A (zh) | 2011-11-16 |
CN102242383B true CN102242383B (zh) | 2014-04-16 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102443831B (zh) * | 2011-12-26 | 2014-05-14 | 上海华友金裕微电子有限公司 | 太阳能电池片焊带的电镀工艺及流水线 |
CN105624743A (zh) * | 2016-03-02 | 2016-06-01 | 无锡华友微电子有限公司 | 一种低温高速镀锡添加剂的制备方法 |
CN114606542A (zh) * | 2022-03-24 | 2022-06-10 | 无锡华友微电子有限公司 | 一种多功能锡保护剂及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1757715A2 (en) * | 2005-08-22 | 2007-02-28 | Rohm and Haas Electronic Materials LLC | Aqueous solution for surface treatment of tin films and method for preventing discoloration of a tin film surface |
TW200831716A (en) * | 2007-01-31 | 2008-08-01 | Wen-Chen Chiu | A composition of tin electroplating bath |
CN101509141A (zh) * | 2008-11-19 | 2009-08-19 | 无锡华友微电子有限公司 | 一种电镀锡铜金属的方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1757715A2 (en) * | 2005-08-22 | 2007-02-28 | Rohm and Haas Electronic Materials LLC | Aqueous solution for surface treatment of tin films and method for preventing discoloration of a tin film surface |
TW200831716A (en) * | 2007-01-31 | 2008-08-01 | Wen-Chen Chiu | A composition of tin electroplating bath |
CN101509141A (zh) * | 2008-11-19 | 2009-08-19 | 无锡华友微电子有限公司 | 一种电镀锡铜金属的方法 |
Non-Patent Citations (2)
Title |
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安美特化学有限公司.高速光亮纯锡PL.《http://wenku.baidu.com/view/86b27d6727d3240c8447efcf.html》.2011,第3-4页. |
高速光亮纯锡PL;安美特化学有限公司;《http://wenku.baidu.com/view/86b27d6727d3240c8447efcf.html》;20110208;第3-4页 * |
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Address after: 201700, No. 6666 Ying Tung Road, Qingpu District, Shanghai Applicant after: SHANGHAI WELNEW MICRO-ELECTRONICS CO., LTD. Address before: 201700 No. 101, No. 5500, Pine Road, Qingpu Industrial Zone, Qingpu District, Shanghai Applicant before: Shanghai Huayou Gilding Microelectronics Co., Ltd. |
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Inventor after: Tu Libin Inventor after: Xiao Di Inventor after: Ping Xiaolei Inventor before: Tu Libin |
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Free format text: CORRECT: INVENTOR; FROM: TU LIBIN TO: TU LIBIN XIAO DI PING XIAOLEI Free format text: CORRECT: APPLICANT; FROM: SHANGHAI HUAYOU GILDING MICROELECTRONICS CO., LTD. TO: SHANGHAI WELNEW MICRO-ELECTRONICS CO., LTD. |
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