CN102235642A - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN102235642A CN102235642A CN2010101524294A CN201010152429A CN102235642A CN 102235642 A CN102235642 A CN 102235642A CN 2010101524294 A CN2010101524294 A CN 2010101524294A CN 201010152429 A CN201010152429 A CN 201010152429A CN 102235642 A CN102235642 A CN 102235642A
- Authority
- CN
- China
- Prior art keywords
- lgp
- light
- solid luminescent
- module backlight
- incidence surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Planar Illumination Modules (AREA)
Abstract
The invention relates to a backlight module. The backlight module comprises a light guide plate and a light source module, wherein the light guide plate is provided with an incident surface and an emergent surface opposite to the incident surface; the light source module is arranged opposite to the incident surface of the light guide plate, and comprises at least one light-emitting unit which comprises a solid-state light-emitting chip and a package; the package encloses the solid-state light-emitting chip, and is provided with a light emergent surface; and the light emergent surface is closely contacted with the incident surface of the light guide plate. The light emergent surface of the package of the backlight module is closely contacted with the incident surface of the light guide plate, so that the light loss in the air in a spreading process is reduced. Therefore, the backlight module has higher emergent efficiency.
Description
Technical field
The present invention relates to a kind of module backlight, relate in particular to a kind of down straight aphototropism mode set than high light-emitting efficiency.
Background technology
(Liquid Crystal Display, LCD) technology has been widely used in electronic products such as computer screen, mobile phone, digital camera, DV, PDA in liquid crystal display.Liquid crystal panel (LCD panel) is crucial display module, yet itself is not luminous, one module backlight (Backlight Module) need be set just can be shown, module backlight and liquid crystal panel fit together and form a complete liquid crystal display module (Liquid Crystal Module, LCM).
LED straight-down negative (Direct type) module backlight generally comprises LGP and led light source, and LGP comprises an incidence surface and the exiting surface relative with incidence surface, and led light source and incidence surface are oppositely arranged.Usually, have the gap between the incidence surface of led light source and LGP, the light that led light source sends reenters through air earlier and is incident upon LGP, and the light loss consumption is more, causes light extraction efficiency low.And led light source is when luminous, and about 80～90% of its received energy is converted into heat, and remaining energy is a luminous energy by true translation.Therefore, the luminous heat that produces of led light source must be evacuated to guarantee the normal operation of led light source.In the general down straight aphototropism mode set, the heat that led light source sent relies on the electrode pin of led light source to pass, and therefore, the thermal resistance of entire aphototropism mould is bigger, causes the led light source temperature too high easily, can't operate as normal.And, influence luminous efficiency, stability and the working life of led light source.
Summary of the invention
To a kind of down straight aphototropism mode set than high light-emitting efficiency be described with embodiment below.
A kind of module backlight, it comprises a LGP and a light source module.This LGP has an incidence surface and an exiting surface relative with this incidence surface, and the incidence surface of this light source module and this LGP is oppositely arranged.This light source module comprises at least one luminescence unit, and this at least one luminescence unit comprises: a solid luminescent chip and a packaging body.This packaging body is around this solid luminescent chip, and this packaging body has a light-emitting face, and this light-emitting face closely contacts with the incidence surface of this LGP.
With respect to prior art, the light-emitting face of the packaging body of described module backlight closely contacts with the incidence surface of LGP, thereby has reduced aerial loss in the light communication process.Therefore, this module backlight has higher light-emitting efficiency.
Further, the luminescence unit of this module backlight also comprises a heat dissipating layer that is connected with this solid luminescent chip heat conduction; Two electrode pins that are connected with this solid luminescent chip conduction; One electric insulation layer of isolating this heat dissipating layer and this electrode pin.
Further the heat dissipating layer in the improved module backlight is isolated mutually by electric insulation layer with the electrode pin, thereby the heat of generation is separated from each other when making this solid luminescent chip operation power supply with work.Therefore, this module backlight has good performance of heat dissipation.
Description of drawings
Fig. 1 is the schematic cross-section of the module backlight of first embodiment of the invention.
Fig. 2 is the schematic cross-section of the module backlight of second embodiment of the invention.
Fig. 3 is the schematic cross-section of the module backlight of third embodiment of the invention.
The main element symbol description
LGP 11,21,31
Incidence surface 116,216,316
Exiting surface 117
Luminescence unit 126,226
Through hole 142
Loading end 151
Two electrode pins 16,26
The 3rd surface 161
Solid luminescent chip 17,27,37
Reflector 181,281,381
Light transmission protective layer 182
Light-emitting face 183,283
Fin 29
The specific embodiment
Below in conjunction with accompanying drawing the embodiment of the invention is described in further detail.
See also Fig. 1, first embodiment of the invention provides a kind of module backlight 10, and it comprises: a LGP 11 and a light source module 12.
This LGP 11 comprises the exiting surface 117 that an incidence surface 116 and and this incidence surface 116 are relative.In the present embodiment, this incidence surface 116 is parallel to each other with this exiting surface 117, and promptly this module 10 backlight is a direct-type backlight module.
This light source module 12 is oppositely arranged with this incidence surface 116.In the present embodiment, this light source module 12 comprises a plurality of luminescence units 126.Each luminescence unit 126 comprises 17, one packaging bodies 18 of 16, one solid luminescent chips of two electrode pins.This solid luminescent chip 17 is attached on the heating column 15.These two electrode pins 16 are attached on the electric insulation layer 14.This heating column 15 passes this electric insulation layer 14 and is connected with a heat dissipating layer 13.
This heat dissipating layer 13 is used for above-mentioned a plurality of luminescence units 126 are dispelled the heat.In the present embodiment, this heat dissipating layer 13 is a platy structure, and has a first surface 136 and and this first surface opposing second surface (indicating).The material of this heat dissipating layer 13 can be metal, as copper, and aluminium, magnesium, molybdenum, tungsten etc., or the alloy of above-mentioned at least two kinds of metals, perhaps silicon nitride (Si
3N
4), carborundum (SiC), zirconia (ZrO
2), boron carbide (B
4C), titanium diboride (TiB
2), aluminium oxide (Al
XO
y), aluminium nitride (AlN), beryllium oxide (BeO), Sialon (Sialon), perhaps pottery.
In the present embodiment, this heat dissipating layer 13 is a solid construction, is a heat transfer plate.Be understandable that this heat dissipating layer 13 also can be loose structure (porous structure), it can have a plurality of irregular holes, and this hole can strengthen the circulation of gas, makes this heat dissipating layer 13 obtain preferable radiating effect.Certainly, this heat dissipating layer 13 also can comprise inner heat pipe or soaking plate of filling phase-transition material.
This electric insulation layer 14 is arranged on the first surface 136 of this heat dissipating layer 13, it can specifically adopt the preferable material of electrical insulation capability, as polyester, pi film (PI), polycarbonate (PC), acryl (PMMA), polymer, silica gel (silicone), epoxy resin (epoxy), revolve oxygenerating silicon (spin on glass, SOG), silica (SiO
2), silicon nitride (Si
XN
y), silicon oxynitride (SiON), titanium oxide (TiO
2), titanium nitride (TiN), and aluminium oxide (Al
XO
y) at least one.This electric insulation layer 14 have contact heat dissipating layer 13 first surface (indicate) and away from this heat dissipating layer 13, with this first surface opposing second surface 141.The central region of this electric insulation layer 14 offers the through hole 142 of its first surface of a plurality of perforations and second surface 141.These through holes 142 are corresponding with a plurality of luminescence units.
These heating column 15 correspondences are arranged in this through hole 142, and the one end is connected with this heat dissipating layer 13, and the other end is away from this heat dissipating layer 13 and protrude out through hole 142.These heating column 15 other ends are corresponding to the loading end 151 that is used to carry solid luminescent chip 17 that is formed with of this through hole 142.This heating column 15 can be the entity heat carrier, also can fill the heat pipe of phase-transition material for inside.
These two electrode pin 16 polarity are opposite, isolate mutually and are separately positioned on the second surface 141 of this electric insulation layer 14.In the present embodiment, these two electrode pins 16 are positioned at the both sides of the corresponding through hole 142 of this electric insulation layer 14, and have the 3rd surface 161 away from this electric insulation layer 14 respectively.Be understandable that these two electrode pins 16 also can be arranged on this through hole 142 the same sides, it is not limited to specific embodiment.In the present embodiment, these two electrode pin 16 thickness are identical, and it all can specifically adopt metal material such as copper, gold, aluminium, indium, tin, and the alloy of above-mentioned metal, and certainly, it also can adopt other material, as tin indium oxide (ITO) etc.
In the present embodiment, this solid luminescent chip 17 is a led chip, and it is arranged on the loading end 151 of this heating column 15.Particularly, the loading end 151 of the bottom surface of this solid luminescent chip 17 and this heating column 15 is by heat-conducting glue, and (Agepoxy) connects as elargol, contacts thereby make this solid luminescent chip 17 form heat conduction with this heating column 15.Be understandable that, this solid luminescent chip 17 also can use common burn-back legal (solder bonding process) to be connected with this heating column 15, be specially between this solid luminescent chip 17 and this heating column 15 the tin ball is set, under temperature environment, make the fusion of tin ball, and make that after cooling solid luminescent chip 17 and heating column 15 are connected together.Certainly, this solid luminescent chip 17 also can be connected by eutectic bonding method (eutectic process) with this heating column 15, be specially at high temperature and ultrasonic wave (ultrasonic) environment presses down should solid luminescent chip 17, make this solid luminescent chip 17 and these heating column 15 bondings (bonding).In addition, the positive and negative electrode of this solid luminescent chip 17 connects (wire bonding) to these two electrode pins 16 by routing.In the present embodiment, this solid luminescent chip 17 is connected to respectively on the 3rd surface 161 of these two electrode pins 16 by two plain conductors.
This packaging body 18 comprises a reflector (molding cup) 181 and is filled in light transmission protective layer 182 in the reflector 181.These reflector 181 parts coat these two electrode pins 16 and are positioned at the side of electric insulation layer 14 away from heat dissipating layer 13, and are provided with around solid luminescent chip 17.The inner surface of this reflector 181 is a reflecting surface.This light transmission protective layer 182 is fully filled this reflector 181 and is sealed this solid luminescent chip 17.This packaging body 18 has a light-emitting face 183.In the present embodiment, this light-emitting face 183 is the plane with the incidence surface 116 of this LGP 11, and this light-emitting face 183 closely contacts with the incidence surface 116 of this LGP 11.And the incidence surface 116 of this LGP 11 covers the overall optical exit facet 183 of this packaging body 18.The material of this light transmission protective layer 182 can be resin (resin), silicones (silicone), epoxy resin (epoxy resin), polymethyl methacrylate (PMMA), or glass etc.
During work, external power source (figure does not show) is powered to solid luminescent chip 17 by two electrode pins 16 and plain conductor.On the one hand, the light of solid luminescent chip 17 emissions sees through this light transmission protective layer 182 and is incident to this LGP 11.On the other hand, the heat that this solid luminescent chip 17 sends is sent to this heat dissipating layer 13 via this heating column 15, and exports to the external world.
Owing to thereby the both sides of two electrode pins 16 with heat dissipating layer 13 office electric insulation layers 14 are separated from each other, make the path of these solid luminescent chip 17 conductions and heat conduction to isolate mutually, therefore, solid luminescent chip 17 is powered so that under its luminous prerequisite, the heat that this solid luminescent chip 17 sends can preferably be derived by this heating column 15 and through this heat dissipating layer 13 in guarantee.Therefore, this module 10 backlight has good radiating efficiency.And; because the light-emitting face 183 of luminescence unit 126 closely contacts with the incidence surface 116 of this LGP 11; and at grade; therefore; the light that solid luminescent chip 17 sends need not pass through air borne, but sees through light transmission protective layer 182 directly into being incident upon LGP, thereby has reduced aerial loss in the light communication process; therefore, this module 10 backlight has higher light-emitting efficiency.
Above-mentioned heat dissipating layer 13 can with the outer member thermally coupled, be distributed to the external world with the heat that solid luminescent chip 17 work is advanced to distribute by outer member.
Be appreciated that ground, the electric insulation layer 14 in the present embodiment can be divided into the corresponding electric insulation individuality of a plurality of and above-mentioned a plurality of luminescence unit 126.Heat dissipating layer 13 also may be partitioned into the corresponding heat radiation individuality of a plurality of and above-mentioned a plurality of luminescence unit 126, and these a plurality of heat radiation individualities can be separated from one another or be in contact with one another, and also can interconnect by heat conducting elements such as heat pipes.
Referring to Fig. 2, second embodiment of the invention provides a kind of module backlight 20, and the module backlight 10 that itself and first embodiment are provided is basic identical, and difference is: the incidence surface 216 of the LGP 21 of this module 20 backlight is provided with circuit layer (figure does not show).Preferably, this circuit layer is a light transmission conductive layer, and the material of this light transmission conductive layer can be metal oxide, as: tin indium oxide (ITO), gallium oxide zinc (Ga doped ZnO; GZO), aluminum zinc oxide (Al doped ZnO; AZO) etc.These two electrode pins 26 are arranged on the electric insulation layer 24, and be bent to the incidence surface 216 of this LGP 21 respectively away from an end of this solid luminescent chip 27, and extend to the direction of this reflector 281 respectively along this LGP 21, and be electrically connected with external power source by this circuit layer.In the present embodiment, the light-emitting face 283 of the incidence surface 216 of the outer surface of these two electrode pins 26, this LGP 21 and luminescence unit 226 at grade.And the light-emitting face 283 of the outer surface of these two electrode pins 26 and luminescence unit 226 closely contacts with the incidence surface 216 of this LGP 21 respectively.And the incidence surface 216 of this LGP 21 covers the overall optical exit facet 283 of this luminescence unit 226.The electric insulation layer 24 of each luminescence unit 226 correspondence is separate.This heat dissipating layer 23 comprises along extending a plurality of fin spaced apart 29 away from a side of this electric insulation layer 24.
Be understandable that in the present embodiment, the electric insulation layer 24 that each luminescence unit 226 comprises also can interconnect, and is perhaps one-body molded.Certainly, what these two electrode pins 26 were also passable also can only be bent to the incidence surface 216 of this LGP 21 away from an end of this solid luminescent chip 27, to be electrically connected with circuit layer on this incidence surface 216.
Referring to Fig. 3, third embodiment of the invention provides a kind of module backlight 30, the module backlight 20 that itself and second embodiment are provided is basic identical, difference is: the incidence surface 316 of this LGP 31 is provided with circuit layer (figure does not show), these two electrode pins 36 are arranged on the electric insulation layer 34, and be bent to the incidence surface 316 of this LGP 31 respectively away from an end of this solid luminescent chip 37, and extend to direction respectively along this LGP 31, and be electrically connected with external power source by this circuit layer away from this reflector 381.This heat dissipating layer 33 is a tabular.
Be understandable that, the heat dissipating layer that module backlight comprises in above-mentioned each enforcement, electric insulation layer, the structure of electrode pin can be according to actual conditions, and combination is not limited to shown in the embodiment mutually.And those skilled in the art also can do other variation in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (11)
1. module backlight, it comprises: a LGP and a light source module, this LGP has an incidence surface and an exiting surface relative with this incidence surface, the incidence surface of this light source module and this LGP is oppositely arranged, it is characterized in that: this light source module comprises at least one luminescence unit, and this at least one luminescence unit comprises:
A solid luminescent chip;
A packaging body, it is around this solid luminescent chip, and this packaging body has a light-emitting face, and this light-emitting face closely contacts with the incidence surface of this LGP.
2. module backlight as claimed in claim 1 is characterized in that, also comprises:
A heat dissipating layer that is connected with this solid luminescent chip heat conduction;
Two electrode pins that are connected with this solid luminescent chip conduction;
One electric insulation layer of isolating this heat dissipating layer and this electrode pin.
3. module backlight as claimed in claim 2 is characterized in that, this heat dissipating layer is connected with the solid luminescent chip by a heating column, and this heating column has a loading end, and this solid luminescent chip is attached on the loading end of this heating column.
4. module backlight as claimed in claim 3 is characterized in that, this heat dissipating layer has a first surface; This electric insulation layer is arranged on the first surface of this heat dissipating layer, and this electric insulation layer has a second surface away from a side of this heat dissipating layer, and this electric insulation layer is inwardly offered a through hole by this second surface; This heating column is arranged in this through hole, and these two electrode pins are isolated mutually and are separately positioned on the second surface of this electric insulation layer.
5. as each described module backlight of claim 2-4, it is characterized in that, these two electrode pins be bent to the incidence surface of this LGP away from an end of this solid luminescent chip, and the end of two electrode pins closely contacts with the incidence surface of this LGP.
6. module backlight as claimed in claim 5 is characterized in that the incidence surface of this LGP is provided with circuit layer, and these two electrode pins are electrically connected with this circuit layer respectively.
7. module backlight as claimed in claim 3 is characterized in that, this solid luminescent chip is arranged on the loading end of this heating column by eutectic bond mode or the common burn-back mode of closing.
8. as each described module backlight of claim 1-4, it is characterized in that this packaging body comprises a reflector and is arranged on the interior transparent packed layer of this reflector.
9. as each described module backlight of claim 1-4, it is characterized in that the incidence surface of this LGP covers the overall optical exit facet of this packaging body.
10. as each described module backlight of claim 1-4, it is characterized in that the light-emitting face of this packaging body and the incidence surface of this LGP are the plane, and at grade.
11., it is characterized in that this solid luminescent chip comprises light-emitting diode chip for backlight unit as each described module backlight of claim 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101524294A CN102235642A (en) | 2010-04-22 | 2010-04-22 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101524294A CN102235642A (en) | 2010-04-22 | 2010-04-22 | Backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102235642A true CN102235642A (en) | 2011-11-09 |
Family
ID=44886549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101524294A Pending CN102235642A (en) | 2010-04-22 | 2010-04-22 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102235642A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904068A (en) * | 2012-12-25 | 2014-07-02 | 展晶科技(深圳)有限公司 | Light emitting diode luminescence apparatus |
| CN105782780A (en) * | 2014-12-26 | 2016-07-20 | 映瑞光电科技(上海)有限公司 | Integrated high-power LED type lamp |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925182A (en) * | 2005-09-01 | 2007-03-07 | E.I.内穆尔杜邦公司 | Low temperature co-fired ceramic tape compositions, light emitting diode modules, lighting devices and method of forming thereof |
| CN101545587A (en) * | 2009-06-08 | 2009-09-30 | 刘素霞 | A preparation method of high-performance heat-radiating semiconductor planar light source |
| CN101603636A (en) * | 2008-06-10 | 2009-12-16 | 展晶科技(深圳)有限公司 | Light supply apparatus |
-
2010
- 2010-04-22 CN CN2010101524294A patent/CN102235642A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925182A (en) * | 2005-09-01 | 2007-03-07 | E.I.内穆尔杜邦公司 | Low temperature co-fired ceramic tape compositions, light emitting diode modules, lighting devices and method of forming thereof |
| CN101603636A (en) * | 2008-06-10 | 2009-12-16 | 展晶科技(深圳)有限公司 | Light supply apparatus |
| CN101545587A (en) * | 2009-06-08 | 2009-09-30 | 刘素霞 | A preparation method of high-performance heat-radiating semiconductor planar light source |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904068A (en) * | 2012-12-25 | 2014-07-02 | 展晶科技(深圳)有限公司 | Light emitting diode luminescence apparatus |
| CN103904068B (en) * | 2012-12-25 | 2017-01-25 | 展晶科技(深圳)有限公司 | Light emitting diode luminescence apparatus |
| CN105782780A (en) * | 2014-12-26 | 2016-07-20 | 映瑞光电科技(上海)有限公司 | Integrated high-power LED type lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101603636B (en) | Light source device | |
| CA2624507C (en) | Led with light transmissive heat sink | |
| US8455895B2 (en) | LED-based light source utilizing asymmetric conductors | |
| CN100449801C (en) | Semiconductor luminescent element composition | |
| CN100414698C (en) | Power surface mount light emitting die package | |
| CN101645478A (en) | Light emitting diode (LED) radiating structure | |
| CN102130268A (en) | Solid-state light-emitting component and light source module | |
| CN102347418A (en) | Light-emitting diode packaging structure and manufacturing method thereof | |
| JP2009033081A (en) | Light emitting diode device | |
| CN102222625A (en) | Manufacturing method of light-emitting diode (LED) packaging structure and base thereof | |
| CN102130269B (en) | Solid-state luminous element and light source module | |
| CN102237471B (en) | Light-emitting diode packaging structure and manufacturing method thereof | |
| US20120049204A1 (en) | Led module | |
| CN101350390B (en) | LED encapsulation structure | |
| CN101740678A (en) | Solid state light-emitting element and light source module | |
| CN101777549B (en) | Packaging module structure of compound semiconductor elements and production method thereof | |
| CN102235643A (en) | Backlight module | |
| CN105098031A (en) | Chip-on-board (COB) light source of flip chip mining lamp | |
| CN102235642A (en) | Backlight module | |
| US8692274B2 (en) | Light emitting diode package structure | |
| US8247247B2 (en) | Method of manufacturing LED module | |
| CN101586795B (en) | Light source device | |
| CN202905029U (en) | Light-emitting diode (LED) full-color display screen | |
| CN204303867U (en) | A kind of chip and fluorophor separate heat pipe manage structure | |
| CN102332526B (en) | Flip-chip light-emitting diode (LED) packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111109 |