CN102234791A - Gas distribution shower module and coating equipment - Google Patents
Gas distribution shower module and coating equipment Download PDFInfo
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- CN102234791A CN102234791A CN2010101726188A CN201010172618A CN102234791A CN 102234791 A CN102234791 A CN 102234791A CN 2010101726188 A CN2010101726188 A CN 2010101726188A CN 201010172618 A CN201010172618 A CN 201010172618A CN 102234791 A CN102234791 A CN 102234791A
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Abstract
The invention discloses a gas distribution shower module and coating equipment. The gas distribution shower module comprises a first diffusion plate, a second diffusion plate, a third diffusion plate and a fourth diffusion plate, wherein the second diffusion plate is positioned below the first diffusion plate; the third diffusion plate is positioned below the second diffusion plate; the fourth diffusion plate is positioned below the third diffusion plate and is separated from the third diffusion plate at a certain interval; the third diffusion plate is divided into an internal area and an external area which have the area ratio of 1:1-1:5 and is provided with a plurality of air holes which are distributed in the internal area and the external area; and the area ratio of the air holes in the internal area to the air holes in the external area is 1:1-1:5. The gas distribution shower module and the coating equipment make gas fully mixed and solve the problem of the nonuniformity of the gas showered on a substrate. The gas distribution shower module is easy to assemble and maintain and has low manufacturing cost.
Description
Technical field
The present invention relates to a kind of coating technique, and relate in particular to a kind of gas distribution sprinkling module (gasdistribution shower module) and filming equipment.
Background technology
Along with the progress of coating process, in the coating process of chemical vapor deposition (CVD), how can evenly spray gas has become one of design focal point of filming equipment in the CVD cavity.Be the most frequently used member that improves the gas uniformity coefficient with the sprinkler head in the CVD filming equipment (shower head) at present.And the design of general sprinkler head, as shown in Figure 1.The tabular sprinkler head of one round metal 102 is arranged in CVD cavity 100, wherein be drilled with many symmetrical pores 104, its objective is, can evenly be sprayed onto the substrate of being placed on its beneath substrate holder 108 110 in order to make gas after air intake 106 process sprinkler heads 102.
But the pore 104 that is bored in the sprinkler head 102 is dark more, and material and processing and manufacturing cost will increase.So increase for fear of cost, then, that the gas that enters air intake 106 at the beginning is first after buffer zone 200 is stablized to increase the mode of buffer zone 200, evenly giving vent to anger via sprinkler head 102, as shown in Figure 2.
Because the CVD filming equipment of Fig. 1 and Fig. 2 all is a plated film under the situation of low flow,, be not enough only respectively with one deck buffer zone 200 and a sprinkler head 102 in case coating process uses when high flow capacity.This be because the air inlet area be fixed, flow soon then gas velocity will accelerate, cause sprinkler head 102 middle portion speed very fast, and the speed of both sides is slow, shown in the arrow among Fig. 2.Therefore, the CVD filming equipment of Fig. 2 will cause gas buildup in substrate 110 position intermediate, cause being deposited on the membrane thickness unevenness of substrate 110.
In order to prevent the inconsistent situation of gas flow, there is the gaseous diffusion board component of similar U.S. Pat 7,2700,713 to be suggested.Please refer to Fig. 3, this gaseous diffusion board component 300 comprises a diffuser plate 302, an adjustment plate 304 and a liner plate 306.In diffuser plate 302, adjustment plate 304 and liner plate 306, gas passage 308 is arranged.In this part United States Patent (USP), gas passage 308 is made of a gross blow hole 310, a spilehole 312, one horn-like end 314, another gross blow hole 316 and another horn-like end 318.Wherein, spilehole 312 couples with gross blow hole 310,316, so that allow enough gas streams through diffuser plate 302, provides enough resistance to flows that gas is slack-off simultaneously, and the gas that is sprayed onto cavity is become evenly.But this design not only has the problem of the difficulty made, and related its cost is also higher.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of gas distribution sprinkling module, and gas is mixed fully, solves the ununiformity that gas is sprayed onto substrate.
The present invention also provides a kind of filming equipment, wherein is provided with the above-mentioned gas distribution sprinkling module.
The present invention proposes a kind of gas distribution sprinkling module, comprises the first, second, third and the 4th diffuser plate.Wherein, second diffuser plate is positioned under first diffuser plate, the 3rd diffuser plate is positioned under second diffuser plate and the 4th diffuser plate is positioned under the 3rd diffuser plate and with the 3rd diffuser plate spacing of being separated by.It is 1: 1 to 1: 5 a interior region and an external region that described the 3rd diffuser plate is divided into the area ratio, and the 3rd diffuser plate has a plurality of gas cell distribution in interior region and external region, wherein in the interior region with the external region in the area ratio of pore be 1: 1 to 1: 5.
In one embodiment of this invention, the thickness of the 3rd diffuser plate in the above-mentioned gas distribution sprinkling module is between 0.1cm～0.2cm.
In one embodiment of this invention, this spacing in the above-mentioned gas distribution sprinkling module is between 0.1cm～3cm.
In one embodiment of this invention, the 4th diffuser plate in the above-mentioned gas distribution sprinkling module has a plurality of pores, and those pore misalignment are in those pores of the 3rd diffuser plate.
In one embodiment of this invention, the 4th diffuser plate in the above-mentioned gas distribution sprinkling module has a plurality of pores, and each pore is in alignment with those pores of part of the 3rd diffuser plate.
In one embodiment of this invention, those pores in this interior region of the 3rd diffuser plate in the above-mentioned gas distribution sprinkling module are arranged in a plurality of first figures respectively, and those pores in this external region of the 3rd diffuser plate are arranged in a plurality of second graphs respectively.Wherein, those first figures are different from those second graphs.
In one embodiment of this invention, the first, second, third and the 4th diffuser plate in the above-mentioned gas distribution sprinkling module is the metal diffusing plate.
In one embodiment of this invention, the above-mentioned gas distribution sprinkling module also comprises a supporting structure, in order to support this first, second, third and the 4th diffuser plate in a cavity.
The present invention proposes a kind of filming equipment in addition, comprises cavity at least, is arranged in the intravital gas distribution sprinkling module in chamber, is positioned at the substrate holder of cavity and relatively gas distribution sprinkling module configuration and in order to form plasma in the radio frequency power source of cavity.Gas distribution sprinkling module wherein comprises the first, second, third and the 4th diffuser plate.
The present invention can make the distance between gas distribution sprinkling module and the aforesaid substrate seat further, increase plated film efficient.
In another embodiment of the present invention, the substrate holder in the above-mentioned filming equipment comprises hot-plate.
In another embodiment of the present invention, the thickness of the 3rd diffuser plate in the above-mentioned filming equipment is between 0.1cm～0.2cm.
In another embodiment of the present invention, the 4th diffuser plate in the above-mentioned filming equipment and the spacing between the 3rd diffuser plate are between 0.1cm～3cm.
In another embodiment of the present invention, the 4th diffuser plate in the above-mentioned filming equipment has a plurality of pores, and these pore misalignment are in the pore of the 3rd diffuser plate.
In another embodiment of the present invention, the 4th diffuser plate in the above-mentioned filming equipment has a plurality of pores, and each pore is in alignment with the part pore of the 3rd diffuser plate.
In another embodiment of the present invention, the pore in the interior region of the 3rd diffuser plate in the above-mentioned filming equipment is arranged in a plurality of first figures respectively, and the pore in the external region of the 3rd diffuser plate is arranged in a plurality of second graphs respectively.First figure is different from second graph.
In another embodiment of the present invention, the first, second, third and the 4th diffuser plate in the above-mentioned filming equipment is the metal diffusing plate.
In another embodiment of the present invention, the gas distribution sprinkling module in the above-mentioned filming equipment more comprises a supporting structure, in order to support the first, second, third and the 4th diffuser plate.
Based on above-mentioned, gas distribution sprinkling module of the present invention and filming equipment can make gas mix fully, and thereby solve the ununiformity that gas is sprayed onto substrate.And gas distribution sprinkling module of the present invention is made up of multi-layered sheet, not only is easy to assembling, and its processing and manufacturing cost is also low, and related have a simple effect that is easy to of maintenance.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the diagrammatic cross-section of existing a kind of CVD filming equipment;
Fig. 2 is the diagrammatic cross-section of existing another kind of CVD filming equipment;
Fig. 3 is a U.S. Pat 7,2700, the schematic perspective view of 713 gaseous diffusion board component;
Fig. 4 is the diagrammatic cross-section according to a kind of gas distribution sprinkling module of the first embodiment of the present invention;
Fig. 5 is the sectional view of the 3rd and the 4th diffuser plate of Fig. 4;
Fig. 6 is the top view of the 3rd diffuser plate of Fig. 4;
Fig. 7 is the diagrammatic cross-section according to a kind of filming equipment of the second embodiment of the present invention;
Fig. 8 is the interelectrode distance of experiment two and the graph of a relation of plated film percent crystallization in massecuite and sedimentation rate.
Wherein, Reference numeral:
The 100:CVD cavity
102: sprinkler head
104,402a, 404a, 406a, 406b, 408a: pore
106: air intake
108,704: substrate holder
110,708: substrate
200: buffer zone
300: the gaseous diffusion board component
302: diffuser plate
304: adjust plate
306: liner plate
308: gas passage
310,316: gross blow hole
312: spilehole
314,318: horn-like end
400: gas distribution sprinkling module
402: the first diffuser plates
404: the second diffuser plates
406: the three diffuser plates
408: the four diffuser plates
410: supporting structure
412,414,416,418: the space
420: interior region
422: the external region
500: outlet
600: the first figures
602: second graph
700: filming equipment
702: cavity
706: radio frequency power source
710: jacking system
D: spacing
D: distance
T: thickness
Embodiment
Below please refer to graphic so that understand technology of the present invention more fully.Show embodiments of the invention though this sentences accompanying drawing, the present invention still can be with multiple multi-form the practice, and it should be interpreted as being limited to embodiment as herein described.And in the accompanying drawings for for the purpose of clear and definite, not according to the size and the relative dimension thereof in true each layer of scale and zone.
Fig. 4 is the diagrammatic cross-section according to a kind of gas distribution sprinkling module of the first embodiment of the present invention.
Please refer to Fig. 4, the gas distribution sprinkling module 400 in the present embodiment comprises first diffuser plate 402, second diffuser plate 404, the 3rd diffuser plate 406 and the 4th diffuser plate 408.Though do not illustrate the opening that gas enters at accompanying drawing, those skilled in the art should know that gas is normally down poured into by the top of figure.Therefore, the first, second, third and the 4th diffuser plate 402～408th is arranged from top to bottom, and each diffuser plate 402～408 have allow gas passes through pore.External form as for gas distribution sprinkling module 400 then can change according to its substrate shape of placing down.For instance, if substrate to be coated is a semiconductor wafer, then gas distribution sprinkling module 400 can be circular; If substrate to be coated is a flat display panel, then gas distribution sprinkling module 400 can be polygonal, as rectangle.Generally speaking, the first, second, third and the 4th diffuser plate 402～408 is the metal diffusing plate, as aluminum or stainless steel, so that be connected to a radio frequency (RF) power source.In addition, gas distribution sprinkling module 400 also can comprise a supporting structure 410, is used for supporting the first, second, third and the 4th diffuser plate 402～408.
Please continue with reference to Fig. 4, gas in present embodiment hypothesis is that the top by figure down pours into, and therefore can cushion slightly through the space 412 of first diffuser plate, 402 tops earlier.If enter not only a kind of gas of gas distribution sprinkling module 400, but then these space 412 supplied gas are mixed.Then, gas can arrive space 414 and the distribution of past second diffuser plate, 404 edges between first diffuser plate 402 and second diffuser plate 404 by the pore 402a of first diffuser plate 402.Then, gas can arrive the space 416 between second diffuser plate 404 and the 3rd diffuser plate 406 by the pore 404a of second diffuser plate 404.Subsequently, gas can arrive the space 418 between the 3rd diffuser plate 406 and the 4th diffuser plate 408 by pore 406a, the 406b of the 3rd diffuser plate 406, wherein the 3rd diffuser plate 406 is divided into an interior region 420 and an external region 422, and the area ratio of interior region 420 and external region 414 is 1: 1 to 1: 5.And the pore 406a that is distributed in interior region 420 is 1: 1 to 1: 5 with the area ratio of the pore 406b that is distributed in external region 422.According to previous designs, can improve the problem of gas flow inequality, be particularly suitable for being applied in large-area coating film.And the spacing d of being separated by between the 3rd diffuser plate 406 and the 4th diffuser plate 408 is for example between 0.1cm～3cm, in order to the coating process that carries out under the high pressure about 3Torr～10Torr.At last, gas can scatter and pass through the pore 408a of the 4th diffuser plate 408 equably.
In the present embodiment, the thickness t of the 3rd diffuser plate 406 for example between 0.1cm～0.2cm, therefore can be taked fast and accurate laser processing cutting, will use the plank boring of about 2cm～5cm more to save cost and process period than tradition thus.Can be circular hole or other shape that is fit to of aperture unanimity as for pore 402a, 404a, 406a, 406b, 408a.In addition, in first embodiment, but the pore 408a misalignment of the 4th diffuser plate 408 is in the pore 406a/406b of the 3rd diffuser plate 406, as: part holes is aimed at the pore of the 3rd diffuser plate among the pore 408a of the 4th diffuser plate 408, and the pore misalignment of part holes and the 3rd diffuser plate is not exclusively aimed at the pore 406a/406b of the 3rd diffuser plate 406 on the whole and form; Perhaps each pore 408a can be in alignment with the part pore 406a/406b of the 3rd diffuser plate 406, that is, each pore 408a of the 4th diffuser plate 408 aims at a part of pore in most pores of the 3rd diffuser plate 406, as shown in Figure 5.Generally speaking, each pore 408a of the 4th diffuser plate 408 is the pore 406a/406b in alignment with the 3rd diffuser plate 406, the pressure of excessive coating process is not under the high pressure about 3Torr～10Torr, the pore 408a of the 4th diffuser plate 408 and the pore 406a/406b of the 3rd diffuser plate 406 are staggered, can reduce electric arc (arc) and produce isoionic probability in the outlet 500 of pore 408a.Because in case plasma produces in outlet 500, deposition may take place herein or destroy the 4th diffuser plate 408 (being electrode ionization), cause deposition plating contaminated.
In addition, in first embodiment, because the area ratio of the pore 406b in pore 406a in the interior region of the 3rd diffuser plate 406 420 and the external region 422 is 1: 1 to 1: 5, so pore 406a and pore 406b can be designed to different graphic, as shown in Figure 6.Pore 406a in the interior region 420 of the 3rd diffuser plate 406 can be arranged in a plurality of first figures 600 respectively, and the pore 406b in the external region 422 then can be arranged in a plurality of second graphs 602 respectively.First figure 600 is different from second graph 602.Certainly the pore 406a and the pore 406b of the 3rd diffuser plate in the present embodiment also can be arranged in figure miscellaneous, and are not limited to the design of Fig. 6.In the present embodiment, can use airflow field simulation (CFD), understand the distribution scenario of gas velocity and pressure in the cavity, and adjust the design of gas distribution sprinkling module 400 by these two kinds of factors.
Fig. 7 is the diagrammatic cross-section according to a kind of filming equipment of the second embodiment of the present invention, wherein uses the element numbers representative identical member identical with first embodiment.
Please refer to Fig. 7, the filming equipment 700 of present embodiment comprises a cavity 702 at least, be arranged in the gas distribution sprinkling module 400 of cavity 700, be positioned at the substrate holder 704 of cavity 702 and gas distribution sprinkling modules 400 configurations relatively and in order to form plasma in the radio frequency power source 706 of cavity 702.Gas distribution sprinkling module 400 wherein please refer to the description of first embodiment, and substrate holder 704 is to be used for placing substrate 708, the invention enables the gas homogenizing, so can shorten the distance D between gas distribution sprinkling module 400 and the substrate holder 704.And the distance D between gas distribution sprinkling module 400 and the aforesaid substrate seat 704 can effectively improve sedimentation rate as shortening between 0.5cm～2cm.In the present embodiment, aforesaid substrate seat 704 comprises hot-plate, can heat substrate placed on it 708 to one preset temperatures thus.In addition, the downside of substrate holder 704 generally can couple a jacking system 710, and it can and help moving substrate seat 704 between the lower position of substrate 708 turnover cavitys 702 in a higher plated film position (as shown in Figure 7).
Below utilize and verify effect of the present invention, but the present invention is not limited to following application.
Experiment one
At first prepare a filming equipment as Fig. 7, the area ratio that the area ratio of the interior region of the 3rd diffuser plate of gas distribution sprinkling module wherein and external region is 1: 5, be distributed in the pore of interior region and be distributed in the pore of external region is that the distance that the spacing of being separated by between 1: 5, the 3rd and the 4th diffuser plate is about between 1.5cm, gas distribution sprinkling module and the substrate holder is about 1.9cm.
Then, on a silicon wafer, carry out the coating process of microcrystal silicon.Be to cooperate high-frequency RF in coating process, and the gas that uses is SiH
4And H
2, SiH wherein
4/ H
2=200/2000sccm (11.76%).Operation pressure P=5Torr, power (Power)=900W.
Technology finishes the back and takes out silicon wafer, and measures the microcrystal silicon thickness of the different positions of silicon wafer, obtains following table one.
Table one
| Measurement point | X-axis | Y-axis | Thickness (dust) |
| 1 | 121.91 | 95.78 | 1043 |
| 2 | 121.91 | 454.22 | 1064.5 |
| 3 | 235.95 | 185.38 | 1181 |
| 4 | 235.95 | 364.62 | 1047.8 |
| 5 | 350 | 275 | 1383.4 |
| 6 | 464.04 | 185.4 | 1084.1 |
| 7 | 464.04 | 364.6 | 1106.4 |
| 8 | 578.08 | 95.8 | 1214.5 |
| 9 | 578.08 | 454.2 | 1029 |
Can calculate the microcrystal silicon uniformity coefficient from table one is 14.7%.
Experiment two
Utilize and test an identical filming equipment and identical technology and experimentize, but the distance between gas distribution sprinkling module and the substrate holder (interelectrode distance) then changes 1.5cm, 1.7cm and 1.9cm into.
Technology finishes the back and takes out silicon wafer, and measures the percent crystallization in massecuite and the estimation sedimentation rate of microcrystal silicon, obtains Fig. 8.As can be seen from Figure 8, the distance between gas distribution sprinkling module and substrate holder shortens, and the percent crystallization in massecuite of plated film can improve and sedimentation rate can rise.Can't shorten the spacing of gaseous diffusion module and substrate holder in the employed board design of the technology of existing high pressure deposition plating, and can be when using high-frequency RF because plasma is in case produce in the diffuser plate outlet, to deposition or destruction diffuser plate (being electrode ionization) take place in herein, cause the contaminated problem of deposition plating to produce.Therefore, experiment one and two used filming equipments not only do not have pollution problems, and can improve the percent crystallization in massecuite and the sedimentation rate of film by shortening the distance between gas distribution sprinkling module and the substrate holder.
In sum, gas distribution sprinkling module of the present invention and filming equipment are made up of multi-layered sheet, be easy to assembling, and the processing and manufacturing cost of the pore of diffuser plate are low, and related have maintenance simply to be easy to effect.As for the gas cell distribution design of diffuser plate of the present invention, be with the area ratio distribution of the pore of Internal and external cycle, make gas enter cavity, so that just enter in the cavity behind the gas uniform mixing via a plurality of diffuser plates.So not only can make plated film even, and, can not produce plasma in the outlet of the 4th diffuser plate of gas distribution sprinkling module at high-pressure process and closely in the deposition.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (19)
1. a gas distribution sprinkling module is characterized in that, comprising:
One first diffuser plate;
One second diffuser plate is positioned under this first diffuser plate;
One the 3rd diffuser plate is positioned under this second diffuser plate; And
One the 4th diffuser plate, be positioned under the 3rd diffuser plate and with the 3rd diffuser plate spacing of being separated by, wherein:
The 3rd diffuser plate is divided into an interior region and an external region, and this interior region is 1: 1 to 1: 5 with the area ratio of this external region, and
The 3rd diffuser plate has a plurality of gas cell distribution in this interior region and this external region, in this interior region with this external region in the area ratio of those pores be 1: 1 to 1: 5.
2. gas distribution sprinkling module according to claim 1 is characterized in that the thickness of the 3rd diffuser plate is between 0.1cm～0.2cm.
3. gas distribution sprinkling module according to claim 1 is characterized in that this spacing is between 0.1cm～3cm.
4. gas distribution sprinkling module according to claim 1, it is characterized in that, the 4th diffuser plate has a plurality of pores, and part holes is aimed at the pore of the 3rd diffuser plate in a plurality of pores of this of the 4th diffuser plate, the pore misalignment of part holes and the 3rd diffuser plate.
5. gas distribution sprinkling module according to claim 1 is characterized in that the 4th diffuser plate has a plurality of pores, and each pore of the 4th diffuser plate is aimed at a part of pore in most pores of the 3rd diffuser plate.
6. gas distribution sprinkling module according to claim 1, it is characterized in that, those pores in this interior region of the 3rd diffuser plate are arranged in a plurality of first figures respectively, and those pores in this external region of the 3rd diffuser plate are arranged in a plurality of second graphs respectively.
7. gas distribution sprinkling module according to claim 6 is characterized in that, those first figures are different from those second graphs.
8. gas distribution sprinkling module according to claim 1 is characterized in that, this first, second, third and the 4th diffuser plate is the metal diffusing plate.
9. gas distribution sprinkling module according to claim 1 is characterized in that, also comprises a supporting structure, in order to support this first, second, third and the 4th diffuser plate in a cavity.
10. a filming equipment is characterized in that, comprising:
One cavity;
One gas distribution sprinkling module is positioned at this cavity;
One substrate holder is positioned at this cavity and this gas distribution sprinkling module configuration relatively; And
One radio frequency power source is in order to form a plasma in this cavity, wherein
This gas distribution sprinkling module comprises:
One first diffuser plate;
One second diffuser plate is positioned under this first diffuser plate;
One the 3rd diffuser plate is positioned under this second diffuser plate; And
One the 4th diffuser plate, be positioned under the 3rd diffuser plate and with the 3rd diffuser plate spacing of being separated by, wherein:
The 3rd diffuser plate is divided into an interior region and an external region, and this interior region is 1: 1 to 1: 5 with the area ratio of this external region, and
The 3rd diffuser plate has a plurality of gas cell distribution in this interior region and this external region, in this interior region with this external region in the area ratio of those pores be 1: 1 to 1: 5.
11. filming equipment according to claim 10 is characterized in that, the thickness of the 3rd diffuser plate is between 0.1cm～0.2cm.
12. filming equipment according to claim 10 is characterized in that, this spacing between the 4th diffuser plate and the 3rd diffuser plate is between 0.1cm～3cm.
13. filming equipment according to claim 10 is characterized in that, the 4th diffuser plate has a plurality of pores, and part holes is aimed at the pore of the 3rd diffuser plate in a plurality of pores of this of the 4th diffuser plate, the pore misalignment of part holes and the 3rd diffuser plate.
14. filming equipment according to claim 10 is characterized in that, the 4th diffuser plate has a plurality of pores, and each pore of the 4th diffuser plate is aimed at a part of pore in most pores of the 3rd diffuser plate.
15. filming equipment according to claim 10, it is characterized in that, those pores in this interior region of the 3rd diffuser plate are arranged in a plurality of first figures respectively, and those pores in this external region of the 3rd diffuser plate are arranged in a plurality of second graphs respectively.
16. filming equipment according to claim 15 is characterized in that, those first figures are different from those second graphs.
17. filming equipment according to claim 10 is characterized in that, this first, second, third and the 4th diffuser plate is the metal diffusing plate.
18. filming equipment according to claim 10 is characterized in that, this gas distribution sprinkling module also comprises a supporting structure, in order to support this first, second, third and the 4th diffuser plate.
19. filming equipment according to claim 10 is characterized in that, this substrate holder comprises hot-plate.
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| CN201010172618.8A CN102234791B (en) | 2010-05-05 | 2010-05-05 | Gas distribution shower module and coating equipment |
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|---|---|---|---|
| CN201010172618.8A CN102234791B (en) | 2010-05-05 | 2010-05-05 | Gas distribution shower module and coating equipment |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103184433A (en) * | 2012-05-24 | 2013-07-03 | 北京普纳森电子科技有限公司 | Gas diffusion homogenization device and plasma process equipment using same |
| CN106571319A (en) * | 2015-10-09 | 2017-04-19 | 应用材料公司 | Showerhead assembly with multiple fluid delivery zones |
| CN107012447A (en) * | 2017-04-20 | 2017-08-04 | 京东方科技集团股份有限公司 | A kind of disperser and deposition chambers |
| CN107062812A (en) * | 2017-04-26 | 2017-08-18 | 京东方科技集团股份有限公司 | One kind is dried under reduced pressure chamber and vacuum decompression drying equipment |
| WO2019011060A1 (en) * | 2017-07-13 | 2019-01-17 | 江苏鲁汶仪器有限公司 | Plasma etching system spray head |
| CN112899638A (en) * | 2019-12-04 | 2021-06-04 | 江苏菲沃泰纳米科技股份有限公司 | Air inlet system of coating device |
| CN115206841A (en) * | 2022-07-04 | 2022-10-18 | 北京中科科美科技股份有限公司 | Partitioned pressure control spray head |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH043417A (en) * | 1990-04-19 | 1992-01-08 | Mitsubishi Electric Corp | Method and apparatus for plasma processing |
| JPH1154440A (en) * | 1997-07-31 | 1999-02-26 | Nec Corp | Semiconductor manufacturing device |
| WO2002058126A1 (en) * | 2001-01-22 | 2002-07-25 | Tokyo Electron Limited | Device and method for treatment |
-
2010
- 2010-05-05 CN CN201010172618.8A patent/CN102234791B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH043417A (en) * | 1990-04-19 | 1992-01-08 | Mitsubishi Electric Corp | Method and apparatus for plasma processing |
| JPH1154440A (en) * | 1997-07-31 | 1999-02-26 | Nec Corp | Semiconductor manufacturing device |
| WO2002058126A1 (en) * | 2001-01-22 | 2002-07-25 | Tokyo Electron Limited | Device and method for treatment |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103184433A (en) * | 2012-05-24 | 2013-07-03 | 北京普纳森电子科技有限公司 | Gas diffusion homogenization device and plasma process equipment using same |
| CN106571319A (en) * | 2015-10-09 | 2017-04-19 | 应用材料公司 | Showerhead assembly with multiple fluid delivery zones |
| CN106571319B (en) * | 2015-10-09 | 2022-06-24 | 应用材料公司 | Showerhead assembly with multiple fluid delivery zones |
| US11293099B2 (en) | 2015-10-09 | 2022-04-05 | Applied Materials, Inc. | Showerhead assembly with multiple fluid delivery zones |
| CN107012447B (en) * | 2017-04-20 | 2019-09-17 | 京东方科技集团股份有限公司 | A kind of disperser and deposition chambers |
| CN107012447A (en) * | 2017-04-20 | 2017-08-04 | 京东方科技集团股份有限公司 | A kind of disperser and deposition chambers |
| CN107062812B (en) * | 2017-04-26 | 2019-09-03 | 京东方科技集团股份有限公司 | One kind being dried under reduced pressure chamber and vacuum decompression drying equipment |
| CN107062812A (en) * | 2017-04-26 | 2017-08-18 | 京东方科技集团股份有限公司 | One kind is dried under reduced pressure chamber and vacuum decompression drying equipment |
| WO2019011060A1 (en) * | 2017-07-13 | 2019-01-17 | 江苏鲁汶仪器有限公司 | Plasma etching system spray head |
| CN112899638A (en) * | 2019-12-04 | 2021-06-04 | 江苏菲沃泰纳米科技股份有限公司 | Air inlet system of coating device |
| CN112899638B (en) * | 2019-12-04 | 2022-11-29 | 江苏菲沃泰纳米科技股份有限公司 | Air inlet system of film coating device |
| CN115206841A (en) * | 2022-07-04 | 2022-10-18 | 北京中科科美科技股份有限公司 | Partitioned pressure control spray head |
| CN115206841B (en) * | 2022-07-04 | 2023-10-20 | 北京中科科美科技股份有限公司 | Partition pressure control spray header |
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