CN102229737B - Packaging material for high-blockage organic electronic device - Google Patents
Packaging material for high-blockage organic electronic device Download PDFInfo
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- CN102229737B CN102229737B CN 201110153162 CN201110153162A CN102229737B CN 102229737 B CN102229737 B CN 102229737B CN 201110153162 CN201110153162 CN 201110153162 CN 201110153162 A CN201110153162 A CN 201110153162A CN 102229737 B CN102229737 B CN 102229737B
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Abstract
The invention discloses a packaging material for a high-blockage organic electronic device. The material mainly comprises 100 parts by mass of macromolecular resin and 20-100 parts by mass of inorganic filler, wherein the inorganic filler is platelike and has the surface length diameter/thickness ratio of 1.5-50 and the average particle size of 1.0-5.0; after the packaging material disclosed by the invention is cured through cross-linking reaction, XRD (X-Ray Diffraction) based structure analysis on the packaging material shows that the crystallization surface interval of the packaging material is between 0.1 nanometer and 3 nanometers which is far smaller than the size of a water molecule aggregation, therefore, the packaging material can block the permeability and diffusion paths of moisture and gas and can be applied to the high-blockage organic electronic device. The packaging material can be used for greatly inhibiting the permeability of moisture and gas and preventing ionic components from corroding electrodes and the like, has a lower coefficient of thermal expansion. By the adoption of the packaging material, the service life of the organic device can be prolonged, and the packaging cost can be reduced by the reduction in packaging width and packaging material consumption.
Description
Technical field
The present invention relates to a kind of packaged material of electron device, specifically a kind of packaging material for high-blockage organic electronic device.
Background technology
In recent years, utilize the organic electronic devices of organic film, the device such as the expression such as optical inductor, organic electroluminescent, biosensor, Electronic Paper, organic triode, organic solar batteries, organic semiconductor memory device, communication device etc. more and more receive publicity.But owing to organic film is easy to be produced deteriorated and phenomenon of phase separation by gases affects such as moisture and oxygen, there are the needs of the packaged material of blocking more by force performance also more urgent for moisture and gas.
High-blockage means can fully suppress the water vapour that brings from the device outside atmosphere and oxygen to the intrusion of organic assembly.As a kind of method of the performance of packaged material being given high-blockage, circuitous theory is extensively approved by the professional person.Circuitous theory is thought, in the polymer lattice nework, inorganic filler is disperseed, the path that can block moisture and oxygen molecule, moisture and oxygen can only the slit between inorganic filler by (from circuitous between the inorganic filler), so the moisture in the unit time or the throughput of oxygen can be inhibited.
Japanese Patent (JP 2006-291072 number bulletin) introduced use on the organic electroluminescence device be difficult to permeable and ultraviolet light polymerization class packaged material moisture-proof.But, use averaged particles directly to surpass 5 microns inorganic filler in the middle of this resin combination, although can play certain inhibition to seeing through of moisture and oxygen, very limited.
Summary of the invention
The purpose of this invention is to provide a kind of packaging material for high-blockage organic electronic device, in the macromolecule resin network, disperse the inorganic filler of specific dimensions and shape, make it have good barrier, prevent that effectively moisture and oxygen from passing through.
Technical scheme of the present invention is achieved in that packaging material for high-blockage organic electronic device, mainly formed by macromolecule resin and inorganic filler, take its content of mass fraction as, 100 parts of macromolecule resins, inorganic filler 20-100 part, described inorganic filler is tabular, and the ratio of major diameter and thickness is between 1.5-50 on its face, and median size is at the 1.0-5.0 micron.
Described macromolecule resin is Resins, epoxy, modified epoxy, polyurethanes resin, polycarbonate resin, polyacrylate resinoid or modified polyolefin resin.
Described tabular inorganic filler is clay, mica, silica or talcum.
Also contain initiator, lotus root connection agent, solubilizing agent and defoamer in the described packaged material, its total addition level is 0.2-20 part.
Described initiator is the peroxide initiator, carboxylic-acid initiator, benzophenone class initiator, borate family initiator, organophosphorus acids initiator, triazines initiator, phosphonates initiator or guanamine class initiator.
The agent of described lotus root connection is the connection agent of silicane lotus root and the agent of organic titanium class lotus root connection.
Described solubilizing agent is aliphatics dienes polymer solubilizing agent, polyolefins solubilizing agent, alicyclic ring type dienes solubilizing agent, the mixture of inferior vinyl solubilizing agent or vinyl acetate and fatty alcohol.
Described defoamer is the acrylate defoamer, silicone oil with low viscosity defoamer, alcohol defoaming agent, fatty acid ester defoamer or polyethers defoamer.
The preferred median size of described inorganic filler is between the 1.5-4.0 micron.
The preferred addition of described inorganic filler is 40-80 part.
The invention has the beneficial effects as follows: the packaged material that the present invention relates to uses XRD that its structure is analyzed through after the cross linking reaction and solidification, and crystal plane is spaced apart within the 0.1-3 nanometer.Much smaller than the water molecules size of (especially gathering the attitude water molecules), can blocks moisture and the seeing through and the evolving path of gas, can be used as the packaged material with the organic assembly that highly interdicts performance.This packaged material can fully suppress moisture and gas permeability, prevent that ionic composition is for the corrosion of electrode etc., and thermal expansivity is lower, really realizes the long lifetime of organic assembly, and reduces package width, reduces the packaged material consumption and realize cheapization of packaging cost.
Embodiment
Embodiment 1
100 parts of bisphenol A type epoxy resins, sheet mica (median size 5um, face length/thickness=25) 50 parts, iodine is 5 parts of light cationic polymerization initiators, and 10 parts of mixing of long chain alkyl silane lotus root connection agent are with three-roll rolling machine blending dispersion, pressure filtration, then being coated in device with the machine that minute is coated with need to encapsulation place, and cap and substrate are pressed and afterwards, used ultraviolet lamp 10J/cm
2Irradiation, the encapsulation of device is finished in then thermal treatment under the condition of 80C*1hr.
Embodiment 2
100 parts of bisphenol f type epoxy resins, foliated talc (median size 3um, face length/thickness=20) 60 parts, 10 parts of additives (Sb is the light cationic polymerization initiators), 6 parts of additives (epoxide modified silane couplent), use the internal mixer blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Embodiment 3
100 parts of matrix polymer Acrylate Modified Epoxy resins, sheet mineral compound (silica, median size 2um, face length/thickness=5) 55 parts, 5 parts of additives (imidazoles is curing initiator), 10 parts of additives (epoxide modified silane couplent) are used the internal mixer blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.This constituent adopts the screen press coating in the place that device need to encapsulate, and after cap and the base plate bonding, the encapsulation of device is carried out in thermofixation under the condition of 70C*2hr+130C*4hr.
Embodiment 4
100 parts of matrix polymer bisphenol f type epoxy resins, sheet mineral compound (talcum, median size 2.5um, face length/thickness=15) 60 parts, 5 parts of additives (Sb is the light cationic polymerization initiators), 8 parts of additives (epoxide modified silane couplent) are used the ball mill blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Embodiment 5
100 parts of matrix polymer acrylate type carbamate resins, sheet mineral compound (talcum, median size 3um, face length/thickness=2) 65 parts, 5 parts of additives (alkyl phenones is the optical free radical polymerization starter), 13 parts of additives (epoxide modified silane couplent) are used the internal mixer blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Comparative example 1
100 parts of matrix polymer bisphenol f type epoxy resins, sheet mineral compound (talcum, median size 10um, face length/thickness=100) 40 parts, 5 parts of additives (Sb is the light cationic polymerization initiators), 15 parts of additives (epoxide modified silane couplent) are used the kneader blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Comparative example 2
100 parts of matrix polymer bisphenol A type epoxy resins, sheet mineral compound (mica, median size 10um, face length/thickness=20) 55 parts, 5 parts of additives (Sb is the light cationic polymerization initiators), 20 parts of additives (epoxide modified silane couplent) are with equal mixing machine blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Comparative example 3
100 parts of matrix polymer bisphenol A type epoxy resins, sheet mineral compound (talcum, median size 5um, face length/thickness=80) 50 parts, 3 parts of additives (triphenyl silicic-boric acid ester salt), 10 parts of additives (epoxide modified silane couplent) are with three-roll rolling machine blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Comparative example 4
100 parts of matrix polymer bisphenol f type epoxy resins, (the polynite of sheet mineral compound, median size 0.8um, face length/thickness=20) 30 parts, 10 parts of additives (Sb is the light cationic polymerization initiators), 10 parts of additives (long chain alkyl silane coupling molecule) are used the kneader blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Comparative example 5
100 parts of matrix polymer acrylate type carbamate resins, sheet mineral compound (talcum, median size 30um, face length/thickness=20) 60 parts, 5 parts of additives (alkyl phenones is the optical free radical polymerization starter), 12 parts of additives (epoxide modified silane couplent) are used the ball mill blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Comparative example 6
100 parts of matrix polymer bisphenol f type epoxy resins, sheet mineral compound (silicon-dioxide, median size 15um, face length/thickness=50) 50 parts, 10 parts of additives (imidazoles is curing initiator), 10 parts of additives (epoxide modified silane couplent) are used the ball mill blending dispersion, pressure filtration obtains encapsulating material composition of the present invention.
Employing and above-described embodiment 1 same condition are carried out the encapsulation of organic assembly.
Adopt following testing method that packaged material of the present invention is tested.
Under the condition of life experiment: 60C, 90%RH, the durability experiment of the organic film solar cell that has encapsulated.
Thermal expansivity: adopt the apparatus for thermal analysis TMA6300 of SII company to carry out.
Being determined under the 110C of gas of leaking carried out with GC/MS, and the data correction that obtains is the toluene scaled value.
Corrosion experiment adopts the envelope before the crosslinking reaction to end material, and coating is in the potted ends of organic assembly, and 110C heats 2h, observes the shape of the metal electrode of device under opticmicroscope.
The moisture transmitance is measured and is adopted cup envelope method to carry out, and measuring method is according to JISZ0208(Japanese Industrial Standards), condition determination 40C, 90%RH.
The above; only be the better embodiment of the present invention; but protection scope of the present invention is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to replacement or change according to technical scheme of the present invention and inventive concept thereof, all should be encompassed within protection scope of the present invention.
Claims (8)
1. packaging material for high-blockage organic electronic device, mainly formed by macromolecule resin and inorganic filler, it is characterized in that, take its content of mass fraction as, 100 parts of macromolecule resins, inorganic filler 20-100 part, described inorganic filler is tabular, the ratio of length and thickness is between 1.5-50 on its face, and median size is at the 1.0-5.0 micron, described macromolecule resin is Resins, epoxy, modified epoxy, the polyurethanes resin, polycarbonate resin, polyacrylic ester resinoid or modified polyolefin resin, described tabular inorganic filler is clay, mica, silica or talcum.
2. packaging material for high-blockage organic electronic device according to claim 1 is characterized in that, also contains initiator, coupling agent, solubilizing agent and defoamer in the described packaged material, and its total addition level is 0.2-20 part.
3. packaging material for high-blockage organic electronic device according to claim 2, it is characterized in that, described initiator is the peroxide initiator, the carboxylic-acid initiator, benzophenone class initiator, borate family initiator, organophosphorus acids initiator, triazines initiator, phosphonates initiator or guanamine class initiator.
4. packaging material for high-blockage organic electronic device according to claim 2 is characterized in that, described coupling agent is silane coupling agent and organic titanium class coupling agent.
5. packaging material for high-blockage organic electronic device according to claim 2, it is characterized in that, described solubilizing agent is aliphatics dienes polymer solubilizing agent, polyolefins solubilizing agent, alicyclic ring type dienes solubilizing agent, the mixture of inferior vinyl solubilizing agent or vinyl acetate and fatty alcohol.
6. packaging material for high-blockage organic electronic device according to claim 2 is characterized in that, described defoamer is the acrylate defoamer, silicone oil with low viscosity defoamer, alcohol defoaming agent, fatty acid ester defoamer or polyethers defoamer.
7. packaging material for high-blockage organic electronic device according to claim 1 is characterized in that, the median size of described inorganic filler is between the 1.5-4.0 micron.
8. according to claim 1 or 7 described packaging material for high-blockage organic electronic devices, it is characterized in that described inorganic filler is 40-80 part.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110153162 CN102229737B (en) | 2011-06-09 | 2011-06-09 | Packaging material for high-blockage organic electronic device |
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| CN 201110153162 CN102229737B (en) | 2011-06-09 | 2011-06-09 | Packaging material for high-blockage organic electronic device |
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| CN102229737B true CN102229737B (en) | 2013-01-16 |
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| CN105111714B (en) * | 2015-08-20 | 2017-12-15 | 巢湖子阳电器有限公司 | Water-level sensor for full-automatic washing machine coil encapsulation modified polyurethane |
| CN105368000A (en) * | 2015-11-26 | 2016-03-02 | 芜湖金牛电气股份有限公司 | Epoxy resin encapsulating material for dry type transformer and preparation method for epoxy resin encapsulating material |
| CN105367999A (en) * | 2015-11-26 | 2016-03-02 | 芜湖金牛电气股份有限公司 | Transformer encapsulating material and preparation method therefor |
| CN105400137A (en) * | 2015-11-26 | 2016-03-16 | 芜湖金牛电气股份有限公司 | Epoxy resin packaging material for dry-type transformer and preparation method thereof |
| CN105400138A (en) * | 2015-11-26 | 2016-03-16 | 芜湖金牛电气股份有限公司 | Epoxy resin packaging material for dry-type transformer and preparation method thereof |
| CN106243679A (en) * | 2016-07-29 | 2016-12-21 | 华蓥友达精密模具制造有限公司 | A kind of charger encapsulating material |
| CN107541017A (en) * | 2017-09-01 | 2018-01-05 | 张峰 | A kind of encapsulating material with radiation-screening effect and its preparation method and application |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4618528A (en) * | 1982-08-05 | 1986-10-21 | Allied Corporation | Polymer films containing platelet particles |
| CN101107321A (en) * | 2005-01-18 | 2008-01-16 | 旭化成化学株式会社 | Thermoplastic resin composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7352070B2 (en) * | 2003-06-27 | 2008-04-01 | Delphi Technologies, Inc. | Polymer encapsulated electrical devices |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4618528A (en) * | 1982-08-05 | 1986-10-21 | Allied Corporation | Polymer films containing platelet particles |
| CN101107321A (en) * | 2005-01-18 | 2008-01-16 | 旭化成化学株式会社 | Thermoplastic resin composition |
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